Kyushu University Academic Staff Educational and Research Activities Database
List of Presentations
Syuhei Kurokawa Last modified date:2018.06.21

Professor / Manufacturing Process / Department of Mechanical Engineering / Faculty of Engineering


Presentations
1. Nano particle sizing for abrasive grain in CMP slurry using fluorescent nano probe - Comparison of the geometric diameter and the Stokes diameter -.
2. Study on Laser Surface Processing with sub-picosecond Excitation by using Femtosecond Double Pulse Beam (9th report Evaluation of elemental composition in ablated crater).
3. Nano particle sizing based on Brownian motion analysis by using fluorescence nano probe - the 4th report Evaluation of diffusion efficiency for the fluorescent labelled nano particle -.
4. Multi-functionalization of CNC gear measuring machine -The influence of origin deviations on tooth profile deviations-.
5. Investigation on high efficiency and quality CMPof SiC substrate surface preprocessed by ELID grinding.
6. Influence of micro surface roughness on line laser probe measurement results.
7. High efficient deposition using resist film thickness distribution for TSV.
8. Application of precision machining for high efficiency utilization of reversible CO2 absorbent -Establishment of optimal experiment system-.
9. Polishing of Quartz Glass Substrate by Aggregated Abrasives of Colloidal CeO2 -Influence of Polishing Pressure and Slurry Concentration on Polishing Characteristics of Quartz Glass-.
10. Comparison of calibration methods for high-speed and high-precision CNC three-dimensional measuring machine.
11. Investigation for step height reduction on the CVD-SiC substrate in chemical mechanical polishing.
12. Low damage laser cleaning for SiC substrate using femto second double pulse beam.
13. A study on three dimensional processing method using optical trigger for wide band gap materials (2nd report) - Investigation of photo trigger method to process the transparent materials -.
14. Study on Laser Surface Processing using Femtosecond Double Pulse Beam (7th report) - Evaluation of the laser induced damage -.
15. Study on Laser Surface Processing using Femtosecond Double Pulse Beam (8th report) - Application of low damage laser surface cleaning -.
16. CMP Characteristics of Quartz Glass Substrates by Aggregated Colloidal Ceria Slurry.
17. Femtosecond laser processing with photo excitation for semiconductor target.
18. Development of nano partile sizing system using fluorescent nano probe.
19. The uncertainty evaluation in line laser probe measurement changing probe attitude.
20. Study on Femtosecond Laser Processing to Semiconductor Surface with Instant Surface Excitation by using Double Pulse Beam (3rd report).
21. Observational investigation of surface texture in soft type CMP pad―Evaluation of effect on pad surface texture by the high-pressure jet―
.
22. Consideration of high efficient polishing of SiC substrate with grinding process as a pre-process.
23. Polishing of Quartz grass by Using Colloidal CeO2~Survey of Substrate Surface by AFM~
.
24. In-process Detection of End mill Tool Wear-Result of wear detection on ball end mill-
.
25. Study on nanoparticle sizing measurement method using fluorescence probe―Measurement of viscosity and the temperature of the dispersion medium―.
26. Scanning measurement of helical gears including root and bottom profiles in a cross section perpendicular to the axis.
27. Study of 3D probe calibration method for the gear measuring machine with coordinate measuring function.
28. Response characteristics of waveform components divided from transmission error of gear pair on tactile sensibility of a finger.
29. Study on Femtosecond Laser Processing to Semiconductor Surface with Instant Surface Excitation by using Double Pulse Beam ―Dependency of Photo Excitation Dynamics on pulse interval.
30. Relation between Ingot Segregation Part of Large Forged Product and Quenching Crack.
31. Study on Femtosecond Laser Processing with Instant Surface Excitation by using Double Pulse Beam (2nd report)– Dependency of surface modification area for pulse interval on indirect gap semiconductor.
32. Femto second laser surface processing for semiconductor wafer with coherent phonon excitation.
33. Nano particle sizing based on Brownian motion analysis by using fluorescence polarization method (2nd report)-Analysis of translational diffusion coefficient based on a photon correlation method-.
34. A study on three dimensional processing method using impulsive optical trigger for wide band gap materials.
35. Design and Prototyping of Innovative “Plasma Fusion Machine” (12th report)-.
36. Design and Prototyping of Innovative CMP\P-CVM Fusion Processing Equipment (11th report)-.
37. Development of the Innovative CMP\P-CVM Fusion Apparatus (10th report).
38. High Efficient Precision Processing for Hard-to-process Materials (6th Report) – CMP Characteristics of Pseudo-radical Site Induced Substrates by Femtosecond Laser Irradiation.
39. Nano Particle Sizing Based on Brownian Motion Analysis by Using Fluorescence Polarization Method.
40. Femto Pulse Laser Processing for Semiconductor Surface with Oscillation of Coherent Photon (3rd Report) – Investigation of the Surface Excitation Property.
41. In-process Detection of End mill Tool Wear-Characteristics of detected signals on ball end mil.
42. Development of gear measuring machine with coordinate measuring function- Proposal for scanning measurement method in the cross section of helical gears .
43. Study on nanoparticle sizing measurement method using fluorescence probe.
44. Quantitative evaluation of cleaning effect by the high-pressure jet in CMP hard pad ―For jet pressure and standoff distance.
45. The cleaning effect of High Pressure Jet to the Soft type CMP pad -The cleaning effect to residual silica regarding rotational speed and atomizing pressure.
46. Study on Laser Surface Processing on Semiconductor with sub-picosecond Excitation by using Femtosecond Double Pulse Beam.
47. A Study of the Resist Coating for the Manufacturing Process of TSV with the Electrospray -Refinement of Resist Pattern Coating by the Counter Electrode.
48. Polishing of Quartz Glass by Colloidal CeO2 – Investigation of Aggregate State of Abrasive and Removal Rate by Adding KOH.
49. Femtosecond laser processing for enhanced semi conductor wafer surface.
50. Scanning measurement in the cross section of helical gears including tooth root and bottom(- Effect of axial displacement of the stylus by helix angle -).
51. Proposal on a Reducing Method of Pressure Angle Error of Pinion Gear on a Face Gear pair with Transmission Error Controlled Curve.
52. Study on Laser Surface Processing with Sub-Picosecond Excitation by Using FemtoSecond Double Pulse Beam.
53. Design and Prototyping of Innovative “Plasma Fusion Machine” (9th report).
54. Development of the Innovative CMP/P-CVM Fusion Apparatus (8th report).
55. Femto Pulse Laser Processing for Semiconductor Surface with Oscillation of Coherent Photon (2nd Report) – Investigation of the Damage Threshold for Double Pulse Beam Irradiation.
56. The Cleaning Effect of High Pressure Jet on the Soft Type CMP Pad.
57. Diffusional Movement Analysis of Abrasive Grains Based on Viscosity Measurement for CMP Slurry by Using Fluorescence Polarization Method.
58. Femto second laser surface processing for semiconductor wafer with coherent phonon excitation.
59. Design and prototyping of innovative CMP/P-CVM fusion processing equipment(7th report).
60. Development of innovative “plasma fusion CMP apparatus”(6th report) – The detailed evaluation of planarization characteristics of the basic type of plasma fusion CMP apparatus (Atype) -.
61. Surface characterization of semiconductor wafer by using frequency resolved optical gating.
62. A novel optical scanning system for wafer surface inspection by using hybrid X-FROG.
63. Design and prototyping of innovative CMP/P-CVM combined processing machine (5th report) – Evaluation and basic processing characteristics of hard-to process materials by B-type machine -.
64. Development of the innovative CMP/P-CVM combined apparatus (4th report) – The evaluation of planarization for silicon carbide by the basic type of the CMP/PCVM combined apparatus (A-type) -.
65. Study on Generating Mechanism and the Reducing Method of Rotational Error on a Face Gear with Transmission Error Controlled Curve.
66. Engineering Education on Machine shop Practice of the former Department of Mechanical Engineering, Production Division, Kyushu University.
67. Development of Vibration Simulator for Transmission Error Evaluation of Gear Pair Engagement.
68. Design and Prototyping of Innovative CMP / P-CVM Combined Processing Machine (3rd report)-The second generation combined processing machine and its basic characteristics-.
69. Design and Prototyping of Innovative CMP / P-CVM Combined Processing Machine (2nd report).
70. Design and Prototyping of Innovative CMP / P-CVM Combined Processing Machine (1st report)-Basic Concept and Prototype Machine-.
71. Syuhei Kurokawa, Chengwu WANG, Shin-ichi KOMAI, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI, Yasuhisa SANO, Keiichi TSUKAMOTO, Toshiro Karaki Doi, Approach to High Efficient CMP for Power Device Substrates, China Semiconductor Technology International Conference (CSTIC) 2014, 2014.03.
72. Nano-machining of the grating disk for the purpose of high-resolution and micro rotary encoder development-Comparison of the grating disk of 1mm and 250um in diameter.
73. Influence of chip breaker and cutting oil on in-process tool wear detection.
74. Development of gear measuring machine which has coordinate measuring system and three dimensional analysis on gear flank surface.
75. High precision CMM scanning measurement for the work with a different surface roughness.
76. Resist coating for the manufacturing process of TSV by electrostatic spray.
77. Polishing properties of the SiC wafer by manganese oxide slurry-Dependence of the off-angles to the polishing efficiency.
78. Planarization of Translucent Alumina-Investigation of influence by crystal orientation and Improvement of he surface flatness.
79. Effect of FW pattern in Multiple-supply FW method on CFRP vessel strength.
80. Influence of fiber heating Filament Winding on strength of CFRP vessel.
81. Study on improving polishing efficiency of single crystal SiC based on chemical method.
82. Development of CFRP vessel by simultaneous process of winding and heating using curvilinear heater.
83. Development of Coordinate Measuring Machine and sampling parameter of gear profile.
84. Low kerf-loss-machining results in brittle materials using femtosecond laser.
85. A Study of Conformal Coating Technique with the Electrospray-Fundamental Characteristics of Electrospray and Effects on Coating Parameters-.
86. A Fundamental Study on the Surface Durabillity of Cast Iron Gear in Long Life Region.
87. Influence of alignment and manufacturing error on transmission error of face gear with TE controlled curve.
88. MD. Hazrat Ali, 黒河 周平, 上杉 健輔, 寺岡 孝, 松川 洋二, Camera Based Automatic Stylus Tracking During Gear Profile Measurement, 一般社団法人日本機械学会 機素潤滑設計部門 運動及び動力伝達機構MPT2013シンポジウム<伝動装置>, 2013.11.
89. Scanning measurement of whole circumference of cylindrical gears including working flanks, tooth tips and bottom profiles.
90. Syuhei Kurokawa, Prototype Development of a Micro Grating Disk by Nanomanufacturing Technique for Micro Gear Metrology, The 2013 International symposium on Advanced Engineering, ISAE 2013, 2013.11.
91. Koki OYAMA, Toshiro Karaki Doi, Hideo AIDA, Syuhei Kurokawa, Yasuhisa SANO, Hidetoshi TAKEDA, Koji KOYAMA, Tsutomu YAMAZAKI, Kunimitsu TAKAHASHI, Diamond Substrate Planarization Polishing Technique
, The International Conference on Planarization/CMP Technology, ICPT2013, 2013.11.
92. Syuhei Kurokawa, Takateru EGASHIRA, Zhe TAN, Tao YIN, Toshiro Karaki Doi, Removal Rate Improvement in SiC-CMP using MnO2 Slurry with Strong Oxidant
, The International Conference on Planarization/CMP Technology, ICPT2013, 2013.10.
93. Chengwu WANG, Syuhei Kurokawa, Shin-ichi KOMAI, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI, Yasuhisa SANO, Keiichi TSUKAMOTO, Toshiro Karaki Doi, Formation and Evaluation of Quasi-radical Site Induced by Femtosecond Laser on the Surface of Diamond, The 13th International Symposium on Aerospace Technoloy, 2013.10.
94. Tetsuo INOUE, Syuhei Kurokawa, Influence of Manufacturing Error on Transmission Error of a Face Gear with Controlled Curve and Proposal of Improved Manufacturing Process, The International Conference on Gears, 2013.10.
95. Syuhei Kurokawa, Yoji Umezaki, Yoshiyuki FUNAKI, Experimental Estimation for Wear Resistance of Coating Films on High-speed Steel Hob and the Effect of Oxidization of Coating Films on Crater Wear, The International Conference on Gears, 2013.10.
96. Development of a Laser-Guided Deep-Small-Size Hole Measurement System: Factors to cause Measurement errors.
97. Study of a highly efficient precision processing for hard-to-process materials (5th report) – Induction of pseudo-radical site by femtosecond laser irradiation.
98. Study of a highly efficient precision processing for hard-to-process materials (4th report) .
99. Study of a highly efficient precision processing for hard-to-process materials (3rd report) .
100. Meshing on a Face Gear with Transmission Error Controlled Curve (2nd report) –Investigation on Mechanism of Interference by Alignment Error.
101. Syuhei Kurokawa, Polishing Characteristics of Manganese Slurry in Glass substrate and SiC Wafer, The 18th International Symposium on Chemical-Mechanical Planarization, 2013.08.
102. Syuhei Kurokawa, M.D. Hazrat ALI, Kensuke UESUGI, Tetsuya TAGUCHI, Yoji Umezaki, Yoji MATSUKAWA, Whole Circumference Scanning Measurement of Cylindrical Gears Including Working Flanks, Tooth Tip and Bottom Profiles, The 11th International Symposium on Measurement Technology and Intelligent Instruments, ISMTII2013, 2013.07.
103. Ryohei Ishimaru, Isao Sakuragi, Yasuo Yoshitake, Naoshi Izumi, Syuhei Kurokawa, A Study for Damage of Carbide Hobs, The 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 2013.05.
104. Hyomin Cha, Syuhei Kurokawa, yoji umezaki, Yoji Matsukawa, Morihisa Hoga, Prototype of a Grating Disk of 500 μm in Diameter using Nanoimprint Technique to Evaluate the Micro Gear Engagement, The 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 2013.05.
105. Tetsuo Inoue, Syuhei Kurokawa, Tooth Flank Modification on Face Gear with Transmission Error Controlled Curve and Investigation on Rotational Feeling in Spinning Reel, The 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 2013.05.
106. Syuhei Kurokawa, Toshiro Karaki Doi, Osamu Ohnishi, 山崎 努, Zhe Tan, Tao Yin, Characteristics in SiC-CMP Using MnO2 Slurry with Strong Oxidant under Different Atmospheric Conditions, The 2013 MRS Spring Meeting & Exibit (invited), 2013.04.
107. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, Development of High Speed Tool Wear Detection System by using DC Two-Terminal Methods, The 9th Cooperative and Joint international conference on Ultra-precision Machining Process, CJUMP2013, 2013.03, 本研究は、切削加工におけるフライス工具摩耗を加工中に高速かつ簡便に検出する手法に関するもので,工具・被削材間接触電気抵抗測定をより実用化に近づけるための検討を行なった事例である。測定装置を将来的にボールエンドミルによる3次元加工に対応させるため、新たな測定装置を開発した。この装置は、切れ刃の加工中の非常に短い時間に定電流を流すことで、工具・被削材間接触電気抵抗をリアルタイムで測定を行なうものである。測定結果が工具・被削材間熱起電力の影響を受けることが明らかとなったため、その影響をほぼリアルタイムで除去するための装置を開発し測定実験を行った。その結果、切削速度に依存せず、各切れ刃の切削開始から7msで接触電気抵抗を測定することに成功した。.
108. Development of manganese oxide slurry and the polishing mechanism in glass substrates.
109. Study of a highly efficient precision processing for hard-to-process materials (2nd report) .
110. Study of a highly efficient precision processing for hard-to-process materials (1st report) –Proposal of a polishing process with new concepts -.
111. In-process Measurement of Tool-Work Electric Contact Resistance by using DC Two-Terminal Method.
112. Fabrication of SiC Indexable Inserts, and Cutting Performance in Turning Processes.
113. Improving Wear Resistance of Coating Films on Gear Hobs.
114. Study on Suppressing Excessive Temperature Rise of CFRP Composite Hydrogen Tank.
115. Study on Wire Electric Discharge Machining for Si Using Carbon Fiber Electrode.
116. The C-face and Si-face of SiC wafer CMP Processing Characteristics under Different Atmospheres Using MnO2 Slurry with Strong Oxidant.
117. Performance assessments of thin film organic solar cells fabricated by a spray deposition method.
118. Surface analysis by CMP pad conditioning.
119. Polishing Characteristics of Difficult-to-machine Materials Under Various Gas Conditions Controlled by High Pressure Chamber Type CMP Machine -Evaluation of Polishing Characteristics Using Elemental Analysis-.
120. Cleanability after Backside CMP of TSV.
121. Development of a grating disk for a micro rotary encoder (Prototype of the grating disk of 500 µm in diameter using nanoimprint technology).
122. Application of SiC slurry manufactured from waste of high purity of SiC to CMP.
123. Calibration of high precision large coordinate measuring machine using the super low thermal expansion block gauge.
124. Development and evaluation of whole gear shape measurement based on work-axis rotation.
125. Conformal resist coating for the TSV process~Effects on the thickness of resist films in via holes by spraying distance~.
126. Development and Evaluation of External Heating Machine in Molding CFRP Vessel.
127. Research on Machinability of Ductile Iron Gear.
128. Syuhei Kurokawa, Toshiro Karaki Doi, Takanori Iwahashi, Koichi Sato, Yoshinori Kobayashi, Formation of Organic EL Films by Combination of Precision Spray Deposition Method and Imprinting Technique under Atmospheric Pressure, The 12th International Symposium on Advanced Organic Photonics ISAOP-12 (Invited), 2012.12.
129. Md. Hazrat Ali, Akio Katsuki, Takao Sajima, Hiroshi Murakami, Syuhei Kurokawa, Development of Mechanical Actuator for Deep-Hole Measurement System, The First International Conference for Trends in Intelligent Robotics, Automation, and Manufacturing IRAM2012, 2012.11.
130. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, Tool Flank Wear Estimation in Face Milling by Holm's Contact Theory, The International Conference on Manufacturing Process Technology 2012, 2012.10.
131. Takateru Egashira, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Isamu Koshiyama, Daizo Ichikawa, Characteristics of Sapphire CMP Under Various Gas Conditions Using Bell-Jar Type CMP Machine, Advanced Metallization Conference 2012, 2012.10.
132. Shinichi Iwamoto, Syuhei Kurokawa, Toshiro Karaki Doi, Michio Uneda, Osamu Ohnishi, Toshiyuki Suzuki, Yasuhiro Kawase, Ken Harada, Evaluation of Surface Damaged Layer Depth of Si Wafer for TSV, Advanced Metallization Conference 2012, 2012.10.
133. Yoshiyuki Seike, Masanori Ohtubo, Kenji Maruyama, Futoshi Shimai, Hiroyuki Akenaga, Hirosih Morishita, Keiji Miyachi, Masahiko Amari, Toshiro Karaki Doi, Syuhei Kurokawa, Conformal Resist Coating Technique in the Trough-Silicon Via (TSV) with a Rotary Atomizer Aerosol Spray, Advanced Metallization Conference 2012, 2012.10.
134. Zhe Tan, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Tao Yin, SiC-CMP Processing Characteristics under Different Atmospheres Using MnO2 Slurry with Strong Oxidant, Advanced Metallization Conference 2012, 2012.10.
135. 尹 涛, 土肥 俊郎, 黒河 周平, 大西 修, 山崎 努, 王 智達, 譚 喆, Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP, International Conference on Planarization/CMP Technology 2012, 2012.10.
136. Development of a grating disk for a micro rotary encoder (Trial manufacturing of radial grooves for a grating disk).
137. SiC-CMP Processing Characteristics under Different Atmospheres Using MnO2 Slurry with Strong Oxidant.
138. Effects of Ultrasonic Vibration on Micro Drilling into SiC.
139. CMP processing characteristics of SiC Wafer by using Strong Oxidizing Slurry.
140. CMP Characteristics of Difficult-to-machine Material Using Gas Conditions Controllable Bell-Jar Type CMP Machine.
141. Analysis of abrasive grain arrangement of CMP conditioner and pad surface condition.
142. Evaluation of surface damaged layer depth of Si wafer.
143. Meshing on a Face Gear with Transmission Error Controlled Tooth Flank (Investigation on Alignment Error and Manufacturing Error).
144. Engagement of micro gears and development of micro rotary encoder for transmission error measurement.
145. Brief assessment for scratches by fumed silica slurry on Cu-CMP.
146. Development of a High Pressure Chamber Type Double Side CMP machine -CMP Characteristics of Si and SiC Wafers under Various Processing Atmospheres and Potential of Photocatalyst-assisted CMP-.
147. Ultra-Precision Deposition of Organic EL Films, Using a Nanoimprinting Technology Combined with Spraying under the Atmospheric Pressure.
148. High Planarization Processing Technology of Ceramic Composite Single-Crystal Material.
149. Chemical mechanical polishing of single crystalline lithium niobate substrate -Effect of abrasive grain size and concentration-.
150. Characteristic Analysis of SiC Particles and Application Possibility to Slurry.
151. Effects of Pad Conditioning on W-CMP.
152. High Efficient Processing of SiC Wafer by Atmosphere-Controlled CMP Machine -Processing Property with Colloidal Silica and Diamond Particle Slurry-.
153. Study of Single Crystal SiC CMP Using Manganese Slurry -Polishing Under High Pressure Gas Atmospheres-.
154. Measurement evaluation of tooth root and bottom profiles of cylindrical gears in different sections.
155. Development of CNC coordinate measuring machine and influence of place to be measured in calibration.
156. Single Cristal SiC CMP using manganese oxide slurry -Characteristics under high pressure atmosphere in bell-jar type CMP machine-.
157. Polishing characteristics of new groove pattern pad for glass substrate.
158. Polishing of the glass substrate by the large grain slurries of cerium oxide and manganese oxide -Basic processing characteristics and effect of polishing in radical environment-.
159. A Study on Historical Drilling Techniques which Lead to Modern Technology -Summary on Historical Drilling Techniques and Example in Kingdom of Ito-.
160. The high efficiency polishing technologies for glass substrate using controlled slurry under AC. Electric field (I).
161. Polishing of the glass substrate and effect of radical environment -Processing property by cerium oxide and manganese oxide slurries -.
162. Study of SiC CMP using manganese oxide slurry -Characteristics under high pressure atmosphere in bell-jar type CMP machine .
163. Development of a process-atmosphere-controllable double-side simultaneous CMP machine - Characteristics of Si-CMP and SiC-CMP under various processing atmospheres-.
164. Properties of oxide film CMP with fumed silica slurry.
165. Processing caracteristics of the glass substrates by oxidation cerium and oxidation manganese slurries.
166. Ultra-precision Deposition of Organic EL Films, Using a CMP Technology Combined with Spraying Under the Atmospheric Pressure.
167. Quantitative Evaluation Method for Conditioning Characteristics of CMP Pad.
168. Relationship between dispersion condition of fumed silica CMP slurry and scratch defect generation.
169. Cu-CMP process by controlled atmosphere polishing machine with carbon dioxide.
170. Trial manufacturing of an inner atmosphere-controllable, sealed container-type double-side CMP machine and its polishing ability.
171. Study of manufacturing organic flat thin films by spray coating.
172. CMP characteristics on ctystal orientations of single-crystal Si and high-precision planarization CMP of Poly-Si.
173. Application of manganese slurry to CMP process of SiC substrate.
174. Development of CNC coordinate measuring machine.
175. Investigation on CMP for polymer thin film for OLED and to forming by spray method.
176. Research on slurry in the glass substrate for hard disk polishing.
177. Nondestructive conditioning of foamed polyurethane pad by HPMJ(High Pressure Micro Jet) used deionized water.
178. Development of CNC coordinate measuring machine and approach of scanning measurement.
179. Proposal of Cu-CMP process by controlled atmosphere polishing machine.
180. Development of CNC coordinate measuring machine and scanning measurement of tooth root and bottom profiles of cylindrical gears.
181. Transmission Error Prediction with Radial and Axial Eccentricity of a Gear Pair with Tooth Flank Topography.
182. Evaluation of tooth bearing patterns and gear engagement.
183. Brief history and progress of gears (3rd report).
184. The origin of chemical mechanical polishing (CMP) from the point of process mechanism andits effects on various manufacturing industries.
185. Ultra-precision Deposition of Organic EL Films, Using a CMP Technology Combined with Spraying Under the Atmospheric Pressure.
186. Effect of large particles on micro scratches in oxide film CMP with fumed silica slurry.
187. Development of the Two Fluid Rotation Atomizer Nozzle for Post-CMP Cleaning.
188. Effect of large particles in CMP fumed silica slurry on oxide layer micro scratches.
189. Proposal of Cu-CMP process by controlled atmosphere polishing machine.
190. Electro Chemical Composite CMP for Cu Substrates.
191. Consideration about the atomization and the planarization of Organic Electro-Luminescence material.
192. Polishing technique and the identification of damaged layer for hard materials for semiconductor devices.
193. Wear resistance of coating films on gear hobs(Influcence on wear resistance of cutting speed and ingredient ratio of coating films).
194. Influence of conditioned pad surface topography on characteristics of CMP.
195. Electrochemical mechanical polishing (E-CMP) of Copper substrates with micro fiber pad.
196. CMP characteristics with a micro-fiber pad, and nondestructive conditioning with high pressure micro-jet(HPMJ).
197. Brief history and progress of gears.
198. Microbial Cell Growth Activity in CMP Slurry and the Detection with the Fluorescent Filter Method.
199. The influence of wafer edge profile on STI-CMP process (2nd report, Comparison between stacked pad and solo pad).
200. Trasmission Error Prediction with Radial and Axial Eccentricity
.
201. Certainty of Large Modulation Indices in Trasmission Error
.
202. Load-Carrying Caacity of High Strength Spheroidal Graphite Cast Iron Gears
(In the Case of H-FCD800 Gears).
203. A Fundamental Study on the Surface Durability of High Strength Spheroidal Graphite Cast Iron
(Influence of Copper on Surface Durability).
204. Identification of Amount of Amplitude Modulation on Transmission Error of Eccentricity of Gear by Experiment.
205. Study on processing of SiC with diamond slurry.
206. A Study on Diamnd Dressing of CMP Pad.
207. Study of pad conditioning by high pressure micro jet(HPMJ).
208. Influence on calibration and measurement error of temperature shift for development of CMM in workshop environment.
209. Relationship between oxidation and wear of hob coating films in dry machining processes.
210. The Fundamental Research on Conditioning of CMP Pad (the 3rd report)
-The investigation into the influence of the pad conditioning on the Cu-CMP-.
211. The influence of wafer edge profile on STI-CMP Process.
212. Particle Analysis and Cleaning Efficiency in Spray Cleaning.
213. A Fundamental Study on the Surface Durability of Austempered Ductile Iton (ADI) in Long Life Region.
214. Influence of Gear Eccentricity on Sidebands of Mesh Frequency.
215. Extraction of Global Parameters from Three Dimensional Tooth Flank Deviations and Meaning of Their Representation.
216. Influence of gear eccentricity on transmission error under loading condition.
217. Surface durability of high spheroidal graphite cast iron.
218. The Fundamental Research on Conditioning of CMP Pad (the 2nd report)
-The investigations into the influence of the pad conditioning on the Oxide-CMP-.
219. Microbial Cell Detection in CMP Slurry with Fluorescent Staining Filter Method.
220. The influence of axial runout on transmission error.
221. Amplitude modulation of mesh frequency of noise spectrum due to gear eccentricity.
222. Flytool simulation tests for jamming of chips on tooth surface in gear hobbing.
223. New evaluation of three-dimensional modification of gear tooth flanks using parameters for global form deviation.
224. Tooth flank topography measurement of small module gear
(Nondestructive measurement using dental impression material).
225. Nanomachining for development of micro-rotary encoder
(Trial manufacturing and evaluation of radial grating grooves).
226. Influence of Gear Eccentricity on the Characteristics of Noise Spectrum.
227. Identification of the parameters of gear eccentricity from transmission error curve without measurement of gear eccentricity.
228. Precision measurement of tooth deflection and calculation of transmission error under high loads for spur gears.
229. The New Definition of the Pitch Deviation which is widely Available for Many Different Types of Gears.
230. Derivation of an Approximate Formula of Gear Transmission Error with Radial Eccentricity.