Kyushu University Academic Staff Educational and Research Activities Database
List of Papers
Syuhei Kurokawa Last modified date:2017.06.05

Professor / Manufacturing Process / Department of Mechanical Engineering / Faculty of Engineering


Papers
1. Syuhei KUROKAWA, Takashi TERAOKA, Yuki UTSUNOMIYA, Tetusya TAGUCHI, Terutake HAYASHI, and Yoji MATSUKAWA, Whole Outline Scanning Measurement for Helical Gears Including Root and Bottom Profiles, Proc. of the JSME International Conference on Motion and Power Transmissions MPT2017-Kyoto, USB-Storage, pp 1-4, 2017.03.
2. Tetsuo INOUE and Syuhei KUROKAWA, Effects of Pinion Gear Pressure Angle and Helix Angle Errors on Transmission Error of a Face Gear Modified with a Transmission Error Controlled Curve, Proc. of the JSME International Conference on Motion and Power Transmissions MPT2017-Kyoto, USB-Storage, pp 1-5, 2017.03.
3. Chengwu WANG, Syuhei KUROKAWA, Toshiro DOI, Julong YUAN, Yasuhisa SANO, Hideo AIDA, Kehua ZHANG, and Qianfa DENG, The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP), ECS Journal of Solid State Science and Technology, Vol. 6, Issue 4, pp P105-P112, 2017.01.
4. Tetsuo INOUE and Syuhei KUROKAWA, Proposal of a face gear which generates virtual high mesh frequencyby addition of grooves on the tooth flank, and the investigation viavibration simulator and actual samples, Precision Engineering, Vol. 47, pp 321-332, 2017.01.
5. Terutake HAYASHI, Keigo MATSUNAGA, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masaharu NISHIKINO, Takayuki KUMADA, Tomohiro OTOBE, Yoji MATSUKAWA, and Yasuhiro TAKAYA, Study on low power laser processing technique with instant surface excitation using femtosecond double pulse, Proc. of 16th International Conference on Precison Engineeering ICPE2016, C305-8183, pp 1-4, 2016.11.
6. Syuhei KUROKAWA, Leo HIRASHIMA, Terutake HAYASHI, Keiichiro WATANABE, Hiroyuki TSUJI, and Tomoki NAGAE, Planarization for Translucent Polycrystalline Alumina by Surface Polishing Technique, Proc. of 16th International Conference on Precison Engineeering ICPE2016, C111-8207, pp 1-2, 2016.11.
7. Syuhei KUROKAWA, Yuki UTSUNOMIYA, Takashi TERAOKA, and Terutake HAYASHI, Scanning Strategy of Edge Corners in Gear Outline Measurement, Proc. of the International Conference on Power Transmissions 2016, pp 917-921, 2016.10.
8. Syuhei KUROKAWA, Chengwu WANG, Toshiro DOI, Yasuhisa SANO, Hideo AIDA, Koki OYAMA, Terutake HAYASHI, and Noboru FUKIHARU, CMP Characteristics for SiC Substrates Irradiated by Femtosecond Laser, Proc. of the International Conference on Planarization/CMP Technology, ICPT2016, pp 86-89, 2016.10.
9. Terutake HAYASHI, Toshiki SERI, and Syuhei KUROKAWA, Particle Size Ddistribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe, Proc. of the International Conference on Planarization/CMP Technology, ICPT2016, pp 75-78, 2016.10.
10. Syuhei KUROKAWA, Hyomin CHA, Terutake HAYASHI, and Morihisa HOGA, Gear Metrology for Gear Meshing Accuracy and Nano-Manufacturing Application to Micro Gear Engagement, Proc. of 5th International Conference on Power Transmission BAPT2016, pp 194-198, 2016.10.
11. Amine GOUARIR, Syuhei KUROKAWA, Takao SAJIMA, and Mitsuaki MURATA, In-Process Tool Wear Detection of Uncoated Square End Mill Based on Electrical Contact Resistance, International Journal of Automation Technology, Vol. 10, No.5, pp 767-772, 2016.09.
12. Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masaru NISHIKINO, Takayuki KUMADA, Tomohito OTOBE, Yoji MATSUKAWA, and Yasuhiro TAKAYA, Study on Surface Excitation of SiC by Double Pulse Femtosecond Laser Process –Investigation of Surface Irradiation-, Proc. of the 15th International Conference on X-Ray Lasers, 2016.05.
13. Amine GOUARIR, Syuhei KUROKAWA, Takao SAJIMA, and Mitsuaki MURATA, Real-time evaluation of tool wear detection system under wet machining based on electrical contact resistance, Proc. of euspen’s 16th International Conference & Exhibition, P4.12, pp 311-312, 2016.05.
14. Syuhei KUROKAWA, Removal Rate Improvement in SiC-CMP and its Mechanisms, Proc. of Cross-Strait and Asia-Pacific Conference on Wafer Planarization/CMP Technology 2016, APWCMP2016, pp 151-156, 2016.05.
15. Yasuhisa SANO, Kousuke SHIOZAWA, Toshiro DOI, Syuhei Kurokawa, Hideo AIDA, Tadakazu MIYASHITA, Kazuto YAMAUCHI, High-efficiency Planarization Method Combining Mechanical Polishing and Atmospheric-pressure Plasma Etching for Hard-to-machine Semiconductor Substrates, Mechanical Engineering Journal, Vol. 3, No.1, pp 1-9, 2016.01.
16. Tetsuo INOUE, Syuhei Kurokawa, Takashi MAENO, Yasutoshi MAKINO, Evaluation of Handle Rotational Feeling in Fishing Reels Using a Bone Conduction Speaker Based on Transmission Error of Gear Pairs and Predication by MT System, Mechanical Engineering Journal, Vol. 2, No.6, pp 1-9, 2015.12.
17. Chengwu WANG, Syuhei Kurokawa, Toshiro DOI, Yasuhisa SANO, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Koki OYAMA, Terutake Hayashi, Ji ZHANG, Eiji ASAKAWA, Consideration of Femtosecond Laser-induced Effect on Semiconductor Material SiC Substrate for CMP Processing, Applied Mechanics and Materials, Vols. 799-800, pp.458-462, 2015.10.
18. Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, A Study on Fluorescence Polarization Method for Analyzing Diffusional Movement of Abrasive Grain in CMP Slurry, Proc. of the 8th International Conference on Leading Edge Manufacturing in 21st Century, LEM21, 2015, D07-1504, pp.1-4 , 2015.10.
19. Amine Gouarir, Syuhei Kurokawa, Mitsuaki Murata, Takao Sajima, Tetsuya Torii, In-process Tool Wear Detection of Square End mill Based on DC Two Terminal Method, Proc. of the 8th International Conference on Leading Edge Manufacturing in 21st Century, LEM21, 2015, B29-0513, pp.1-6, 2015.10.
20. Tetsuo Inoue, Syuhei Kurokawa, Proposal of a Face Gear which Generates Virtual High Mesh Frequency by Addition of Grooves on the Tooth Flank, Proc. of International Conference on Gears, VDI-Berichte Nr.2255, 2015, pp.581-590, 2015.10.
21. Yasuhisa Sano, Kousuke SHIOZAWA, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo Aida, Koki Oyama, Tadakazu Miyashita, Haruo Sumizawa, Kazuto Yamaguchi, Optimization of Machining Conditions of Basic-Type CMP/PCVM Fusion Processing Using SiC Substrate, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.302-305, 2015.09.
22. Hideaki Nishizawa, Koki Oyama, Toshiro Karaki Doi, Hideo Aida, Seongwoo Kim, Yasuhisa Sano, Syuhei Kurokawa, Chengwu Wang, Study on Innovative Plasma Fusion CMP and its Application to Processing of Diamond Substrate, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.298-301, 2015.09.
23. Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, Brownian Diffusion Analysis for Nano-Abrasives in CMP Slurry by Using Fluorescence Polarization Method, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.89-92, 2015.09.
24. Masashi Kitamura, Syuhei Kurokawa, Yuta Tokumoto, Terutake Hayashi, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh, Proposal of Cleanliness Evaluation Method of CMP Pad and Investigation of Cleaning Effect by the High-Pressure Jet, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.24-27, 2015.09.
25. Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, A Novel Measurement Method for Brownian Diffusion of Nano-abrasives in CMP Slurry, Proc. of International Symposium on Measurement Technology & Intelligent Instruments 2015, ISMTII2015, USB-Storage, pp.1-6, 2015.09.
26. Syuhei Kurokawa, Kensuke Uesugi, Takashi Teraoka, Tetsuya Taguchi, Terutake Hayashi, Yoji Matsukawa, Comprehensive Evaluation for Individual Gear Accuracy by Whole Circumference Scanning Measurement, Proc. of International Symposium on Measurement Technology & Intelligent Instruments 2015, ISMTII2015, USB-Storage, pp.1-6, 2015.09.
27. Tetsuo Inoue, Syuhei Kurokawa, Evaluation of Handle Rotational Feeling in Fishing Reel by Coordinate Measurement and Gear Transmission Error Measurement, Proc. of International Symposium on Measurement Technology & Intelligent Instruments 2015, ISMTII2015, USB-Storage, pp.1-6, 2015.09.
28. N. Mir-Nasiri, Md. Hazrat Ali, Syuhei Kurokawa, Development of 3D Printer with Integrated Temperature Control System, Proc. of the 4th International Conference on Informatics, Electronics & Vision, ICIEV2015, CD-ROM, pp.1-6, 2015.06.
29. Tetsuo INOUE, Syuhei Kurokawa, Takashi MAENO, Yasutoshi MAKINO, Evaluation of Handle Rotational Feeling in Fishing Reels Using a Bone Conduction Speaker Based on Transmission Error of Gear Pairs, Proc. of the 6th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2015, pp.190-191, 2015.04.
30. Syuhei Kurokawa, Tomoaki HOTOKEBUCHI, Yusuke UCHIYAMA, Keiji MIYACHI, Yoshinori KOBAYASHI, Terutake Hayashi, Kazuhisa MATSUO, Conformal Resist Coating Technique for TSV Manufacturing Process by Electrostatic Spray, Proc. of the 38th Internatinal Manufacturing Automation and Systems Technology Applications Design Organisation and Management Research (MATADOR) Conference, pp.37-42, 2015.03.
31. Ji ZHANG, Syuhei Kurokawa, Terutake Hayashi, Eiji ASAKAWA, Chengwu WANG, Processing Characteristics of SiC Wafer by Consideration of Oxidation Effect in Different Atmospheric Environment, Proc. of the International Conference on Planarization/CMP Technology, ICPT2014, pp.279-282 , 2014.11.
32. Kousuke SHIOZAWA, Yasuhisa SANO, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo AIDA, Koki OYAMA, Tadakazu MIYASHITA, Haruo SUMIZAWA, Kazuto YAMAUCHI, Development of Basic-Type CMP/P-CVM Fusion Processing System (Type A) and Its Fundamental Characteristics, Proc. of the International Conference on Planarization/CMP Technology, ICPT2014, pp.275-278, 2014.11.
33. Koki OYAMA, Toshiro Karaki Doi, Yasuhisa SANO, Syuhei Kurokawa, Hideo AIDA, Tadakazu MIYASHITA, Seongwoo KIM, Tsutomu YAMAZAKI, Hideaki NISHIZAWA, Study on a Novel CMP/P-CVM Fusion Processing System (Type B) and Its Basic Characteristics, Proc. of the International Conference on Planarization/CMP Technology, ICPT2014, pp.142-146, 2014.11.
34. Terutake Hayashi, Toshiki SERI, Syuhei Kurokawa, Study on Diffusion Coefficient Evaluation for Free Abrasives and Chemicals by Using Fluorescent Anisotropy Analysis, Proc. of the 18th International Conference on Mechatronics Technology, USB-Storage, pp.1-8, 2014.10.
35. Takashi TERAOKA, Kensuke UESUGI, Syuhei Kurokawa, Tetsuya TAGUCHI, Terutake Hayashi, Yoji MATSUKAWA, Development of Gear Measuring Machine for Whole Scanning Method of Cylindrical Gear Outline and Evaluation of Tooth Root and Tooth Profile Deviations, Proc. of the 18th International Conference on Mechatronics Technology, USB-Storage, pp.1-8, 2014.10.
36. Tetsuo INOUE, Syuhei Kurokawa, Rotational Feeling Evaluation in Fishing Reel Using Vibration Simulator (Influence of Transmission Error Component of Gear Pair onTtactile Sensibility), Proc. of the International Gear Conference, pp.1120-1130 , 2014.08.
37. Syuhei Kurokawa, Kensuke UESUGI, Takashi TERAOKA, M.D. Hazrat ALI, Tetsuya TAGUCHI, Yoji MATSUKAWA, Identification of Radii of Tooth Root and Pitch Deviations from Whole Circumference Scanning Measurement of Cylindrical Gears, Proc. of the International Gear Conference, pp.924-932, 2014.08.
38. Yasuhisa SANO, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Yu OKADA, Hiroaki NISHIKAWA, Kazuto YAMAUCHI, Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface, Key Engineering Materials, Vol. 625, pp 550-553, 2014.08.
39. MD. Hazrat ALI, Syuhei Kurokawa, Kensuke UESUGI, Application of machine vision in improving safety and reliability for gear profile measurement, Machine Vision and Application, 25, 6, 1549-1559, Vol.25, Issue 6, pp.1549-1559, 2014.08.
40. Yoshiyuki SEIKE, Yasushi Koishikawa, Mikihiro KATO, Keiji MIYACHI, Syuhei Kurokawa, Akinari DOI, Hiroshi MIYAZAKI, CHIHAYA ADACHI, The Study of Film Formation Process by Electrospray Method to Manufacture High Productivity Organic Light-Emitting Diode Devices, SID 2014 Digest, pp.1593-1596, 2014.06.
41. Yasuhisa SANO, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Kousuke SHIOZAWA, Yu OKADA, Kazuto YAMAUCHI, Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage, Sensors and Materials, Vol. 26, No. 6, pp 429-434, 2014.06.
42. Toshiro Karaki Doi, Yasuhisa SANO, Syuhei Kurokawa, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Koki OHYAMA, Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining(CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts, Sensors and Materials, Vol. 26, No. 6, pp 403-415, 2014.06.
43. Amine GOUARIR, Syuhei Kurokawa, Mitsuaki MURATA, Fujiwara HIROAKI, Performance Analysis of High Speed Tool Wear Detection System based on DC Two Terminal Methods, Proc. of the 5th International Symposium on Advanced Control of Industrial Processes, USB-Storage, pp.438-443, 2014.05.
44. Syuhei Kurokawa, Toshiro Karaki Doi, Chengwu W. WANG, Yasuhisa SANO, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI, Approach to High Efficient CMP for Power Device Substrates, ECS Transactions, Vol.60, Issue1, pp.641-646, 2014.03.
45. Akira ISOBE, Kenjiro OGATA, Syuhei Kurokawa, Macromodel for Changes in Polishing Pad Surface Condition Caused by Dressing and Polishing, Japanese Journal of Applied Physics, 53, 1, Vol.53, No.1, Issue 1, pp.016501-1-016501-7, 2013.12.
46. MD. Hazrat ALI, Syuhei Kurokawa, Kensuke UESUGI, Camera Based Precision Measurement in Improving Measurement Accuracy, Measurement, 49, Vol.49, pp.138-147, 2013.12.
47. MD. Hazrat ALI, Syuhei Kurokawa, Kensuke UESUGI, Takashi TERAOKA, Camera Based 3D Probe Control in Measuring Gear Profile, Proc. of the Second International Conference on Robot, Vision and Signal Processing, CD-ROM, pp.1-5, 2013.12.
48. Akira ISOBE, Masatoshi AKAJI, Syuhei Kurokawa, Proposal of New Polishing Mechanicam Based on Feret’s Diameter of Contact Area between Polishing Pad and Wafer, Japanese Journal of Applied Physics, 52, 12, Vol.52, No.12, pp.126503-1-126503-6, 2013.11.
49. Akira ISOBE, Takashi KOMIYAMA, Syuhei Kurokawa, New Model of Defect Formation Caused by Retainer Ring in Chemical Mechanical Polishing, Japanese Journal of Applied Physics, 52, 12, Vol.52, No.12, pp.126502-1-126502-5, 2013.11.
50. Akira ISOBE, Toshiyuki YOKOYAMA, Takashi KOMIYAMA, Syuhei Kurokawa, Mechanisms of Local Planarization Improvement Using Solo Pad in Chemical Mechamical Polishing, Japanese Journal of Applied Physics, 52, 12, Vol.52, No.12, pp.126501-1-126501-6, 2013.11.
51. MD. Hazrat ALI, Akio KATSUKI, Takao Sajima, Hiroshi MURAKAMI, Syuhei Kurokawa, Control Strategy of Developed Mechanical Actuator in Measuring Hole-Surface Parameter, International Journal of Advanced Manufacturing Technology, 69, 5-8, Vol.69, Nos. 5-8, pp.1-10, 2013.11.
52. Koki OYAMA, Toshiro Karaki Doi, Hideo AIDA, Syuhei Kurokawa, Yasuhisa SANO, Hidetoshi TAKEDA, Koji KOYAMA, Tsutomu YAMAZAKI, Kunimitsu TAKAHASHI, Diamond Substrate Planarization Polishing Technique, Proc. of the International Conference on Planarization/CMP Technology, ICPT2013, pp.307-309, 2013.11.
53. Syuhei Kurokawa, Takateru EGASHIRA, Zhe TAN, Tao YIN, Toshiro Karaki Doi, Removal Rate Improvement in SiC-CMP Using MnO2 Slurry with Strong Oxidant, Proc. of the International Conference on Planarization/CMP Technology, ICPT2013, pp.271-276, 2013.11.
54. Akio KATSUKI, M.D. Hazrat ALI, Takao Sajima, Hiroshi MURAKAMI, Osamu OHNISHI, Syuhei Kurokawa, Development of a Laser-Guided Deep-Hole Measurement System --- Adjustment to a Small Size ---, Proc. of the the Twenty-Eighth Annual Meeting of the American Society for Precision Engineering, ASPE2013, pp.431-436, 2013.10.
55. Chengwu WANG, Syuhei Kurokawa, Shin-ichi KOMAI, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI, Yasuhisa SANO, Keiichi TSUKAMOTO, Toshiro Karaki Doi, Formation and Evaluation of Quasi-radical Site Induced by Femtosecond Laser on the Surface of Diamond, Proc. of the 13th International Symposium on Aerospace Technoloy, pp.49-51, 2013.10.
56. Tetsuo INOUE, Syuhei Kurokawa, Influence of Manufacturing Error on Transmission Error of a Face Gear with Controlled Curve and Proposal of Improved Manufacturing Process, Proc. of the International Conference on Gears VDI-Berichte 2199.2, pp.1043-1054, 2013.10.
57. Syuhei Kurokawa, Yoji Umezaki, Yoshiyuki FUNAKI, Experimental Estimation for Wear Resistance of Coating Films on High-speed Steel Hob and the Effect of Oxidization of Coating Films on Crater Wear, Proc. of the International Conference on Gears VDI-Berichte 2199.2, pp.917-929, 2013.10.
58. Syuhei Kurokawa, Yoji Umezaki, Morihisa HOGA, Ryohei ISHIMARU, Osamu OHNISHI, Toshiro Karaki Doi, Application of MEMS Technique for Micro Gear Metrology, Proc. of the 4th International Conference on Power Transmissions, pp.457-466, 2013.09.
59. Syuhei Kurokawa, M.D. Hazrat ALI, Kensuke UESUGI, Tetsuya TAGUCHI, Yoji Umezaki, Yoji MATSUKAWA, Whole Circumference Scanning Measurement of Cylindrical Gears Including Working Flanks, Tooth Tip and Bottom Profiles, Proc. of the 11th International Symposium on Measurement Technology and Intelligent Instruments, ISMTII2013, USB-Storage, pp.1-5, 2013.07.
60. M.D. Hazrat ALI, Syuhei Kurokawa, A.A. SHAFIE, Autonomous Road Surveillance System: A Proposed Model for Vehicle Detection and Traffic Signal Control, Proc. of the 3rd International Symposium on Frontiers in Ambient and Mobile Systems, 19, Vol.19, pp.963-970, 2013.06.
61. MD. Hazrat Ali, Syuhei Kurokawa, Kensuke UESUGI, Vision Based Measurement System for Gear Profile, Proc. of the International Conference on Informatics, Electronics & Vision 2013, ICIEV13, CD-ROM, pp.1-6 , 2013.05.
62. Ryohei Ishimaru, Isao Sakuragi, Yasuo Yoshitake, Naoshi Izumi, Syuhei Kurokawa, A Study for Damage of Carbide Hobs, Proc. of the 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 2013.05.
63. Hyomin Cha, Syuhei Kurokawa, yoji umezaki, Yoji Matsukawa, Morihisa Hoga, Prototype of a Grating Disk of 500 μm in Diameter using Nanoimprint Technique to Evaluate the Micro Gear Engagement, Proc. of the 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 2013.05.
64. Tetsuo Inoue, Syuhei Kurokawa, Tooth Flank Modification on Face Gear with Transmission Error Controlled Curve and Investigation on Rotational Feeling in Spinning Reel, Proc. of the 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 2013.05.
65. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, Development of High Speed Tool Wear Detection System by using DC Two-Terminal Methods, Proc. of the 9th Cooperative and Joint international conference on Ultra-precision Machining Process, CJUMP2013, 2013.03.
66. Syuhei Kurokawa, Toshiro Karaki Doi, Takanori Iwahashi, Koichi Sato, Yoshinori Kobayashi, Formation of Organic EL Films by Combination of Precision Spray Deposition Method and Imprinting Technique under Atmospheric Pressure, Proc. of the 12th International Symposium on Advanced Organic Photonics ISAOP-12, 31, 2012.12.
67. Md. Hazrat Ali, Akio Katsuki, Takao Sajima, Hiroshi Murakami, Syuhei Kurokawa, Development of Mechanical Actuator for Deep-Hole Measurement System, Proc. of the First International Conference for Trends in Intelligent Robotics, Automation, and Manufacturing IRAM2012, 2012.11.
68. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, Tool Flank Wear Estimation in Face Milling by Holm's Contact Theory, Proc. of the International Conference on Manufacturing Process Technology 2012, 2012.10.
69. Takateru Egashira, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, MIchio Uneda, Isamu Koshiyama, Daizo Ichikawa, Characteristics of Sapphire CMP Under Various Gas Conditions Using Bell-Jar Type CMP Machine, Proc. of Advanced Metallization Conference 2012, 90-91, 90-90, 2012.10.
70. Shinichi Iwamoto, Syuhei Kurokawa, Toshiro Karaki Doi, MIchio Uneda, Osamu Ohnishi, Toshiyuki Suzuki, Yasuhiro Kawase, Ken Harada, Evaluation of Surface Damaged Layer Depth of Si Wafer for TSV, Proc. of Advanced Metallization Conference 2012, 88-89, 88-89, 2012.10.
71. Yoshiyuki Seike, Masanori Ohtsubo, Kenji Maruyama, Futoshi Shimai, Hiroyuki Akenaga, Hiroshi Morishita, Keiji Miyachi, Masahiko Amari, Toshiro Karaki Doi, Syuhei Kurokawa, Conformal Resist Coating Technique in the Trough-Silicon Via (TSV) with a Rotary Atomizer Aerosol Spray, Proc. of Advanced Metallization Conference 2012, 72-73, 72-73, 2012.10.
72. Zhe Tan, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Tao Yin, SiC-CMP Processing Characteristics under Different Atmospheres Using MnO2 Slurry with Strong Oxidant, Proc. of Advanced Metallization Conference 2012, 22-23, 22-23, 2012.10.
73. Tao Yin, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Zhida Wang, Zhe Tan, Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP, Proc. of International Conference on Planarization/CMP Technology 2012, 333-338, 333-338, 2012.10.
74. Tao Yin, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Zhida Wang, Zhe Tan, The Effects of Strong Oxidizing Slurry and Processing Atmosphere on Double-sided CMP of SiC Wafer, Advanced Materials Research, 591-593, 1131-1134, Vols.591-593, pp.1131-1134, 2012.10.
75. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Toshiro Karaki Doi, Real-Time Evaluation of Tool Flank Wear by In-Process Contact Resistance Measurement in Face Milling, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 6, 958-970, Vol.6, No.6, pp.958-970, 2012.08.
76. Takao Sajima, Hiroshi Murakami, Akio Katsuki, Daisuke Tabuchi, Osamu Ohnishi, Syuhei Kurokawa, Hiromichi Onikura, Toshiro Karaki Doi, Precision Profile Measurement System for Microholes Using Vibrating Optical Fiber, Sensors and Materials, 24, 7, 387-396, Vol.24, No.7, pp.387-396 , 2012.07.
77. Songchon Park, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, Optical Performance of a Laser Point Source Strongly Emitted by an Aspheric Expander, Advanced Materials Research, 497, 304-310, Vol.497, pp.304-310, 2012.04.
78. 山崎 努, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Kiyoshi Seshimo, Hideo Aida, Development of Novel Groove Pattern for CMP Pad, Advanced Materials Research, 497, 264-267, Vol.497, pp.264-267, 2012.04.
79. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro K. DOI, Mn2O3 Slurry Reuse by Circulation Achieving High Constant Removal Rate, Japanese Journal of Applied Physics, 51, 4, 04DB07-1-04DB07-5, Vol.51, No.4, pp.04DB07-1-04DB07-5, 2012.04.
80. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro K. DOI, Mn2O3 Slurry Achieving Reduction of Slurry Waste, Japanese Journal of Applied Physics, 51, 1, 046506-1-046506-6, Vol.51, No.1, pp.046506-1-046506-6, 2012.04.
81. Mitsuaki MURATA, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, and Toshiro DOI, Development of In-process Tool Flank Wear Detection System for Intermittent Cutting Process by Face Milling, Proc. of the 4th International Conference on Advanced Manufacturing, 1-6, CD-ROM pp.1-6, 2012.03.
82. Sung-Min MOON, Jae-Hwa KANG, Hiromitsu KIDO, Syuhei KUROKAWA, and Sung-Ki LYU, The Evaluation of Cylindrical Gear Measurement on Teeth Roots and Bottom Profiles in Different Sections, Journal of the Korean Society of Manufacturing Process Engineers, 11, 1, 46-49, Vol.11, No.1, pp.46-49, 2012.02.
83. Yoji UMEZAKI, Yoshiyuki FUNAKI, Syuhei KUROKAWA, Osamu OHNISHI, and Toshiro DOI, Wear Resistance of Coating Films on Hob Teeth --- Intermittent Cutting Tests with a Flytool ---, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 2, 206-221, Vol.6, No.2, pp.206-221, 2012.02.
84. Atsushi OHTAKE, Kinya KOBAYASHI, Syuhei KUROKAWA, Osamu OHNISHI, and Toshiro DOI, Fast Diffusion of Water Molecules into Chemically Modified SiO2 Films Formed by Chemical Vapor Deposition, Chemistry Letters, 41, 1, 60-61, Vol.41, No.1, pp.60-61, 2012.01.
85. Tetsuo INOUE and Syuhei KUROKAWA, Derivation of Path of Contact and Tooth Flank Modification by Minimizing Transmission Error on Face Gear, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 1, 15-22, Vol.6, No.1, pp.15-22, 2012.01.
86. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro K. DOI, Dielectric SiO2 Planarization Using MnO2 Slurry, Japanese Journal of Applied Physics, 51, 1, 016501-1-016501-5, Vol.51, No.1, pp.016501-1-016501-5, 2012.01.
87. Syuhei KUROKAWA, Morihisa Hoga, and Toshiro DOI, Nanomanufacturing of Radial Grating Patterns by Nanoimprint with a Silicon Mold for Rotational Angle Measurement of Microgears, International Journal of Nanomanufacturing, 8, 1-2, 123-139, Vol.8, Nos.1-2,pp.123-139, 2012.01.
88. Toshiro DOI, Kenji YOJIMA, Osamu OHNISHI, Michio UNEDA, Syuhei KUROKAWA, Takao SAJIMA, Tsutomu YAMAZAKI and Takahiro MIURA, Research on the electrochemical process (E-CMP) for aluminum alloy-Polishing on inside an aluminum tank for fuel system, Proc. of Fray International Symposium 2011, 122-125, pp.122-125, 2011.11.
89. Song Chon PARK, Sang Ho SEO, Toshiro DOI, Michio UNEDA, Syuhei KUROKAWA, Osamu OHNISHI, and Tsutomu YAMAZAKI, Optical Performance of a Laser Point Spurxe Strongly Emitted by an Aspheric Expander, Proc. of the 8th China-Japan International Conference on Ultra-Precision Machining, 70-73, pp.70-73, 2011.11.
90. Tsutomu YAMAZAKI, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Kiyoshi SESHIMO, and Hideo AIDA, Development of Novel Groove Pattern for CMP Pad, Proc. of the 8th China-Japan International Conference on Ultra-Precision Machining, 50-53, pp.50-53, 2011.11.
91. Masahiko MURATA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Takanori IWAHASHI, Kunihito MIYAKE, Keiji MIYACHI, and Yoshinori KOBAYASHI, Study on Formation of Films by a Spray Deposition Method for the Organic Thin Film Solar Cells, Proc. of the 6th International Conference on Leading Edge Manufacturing in 21st Century 2011,, 1-4, CD-ROM, pp.1-4, 2011.11.
92. Mitsuaki MURATA, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, and Toshiro DOI, In-process Tool Flank Wear Detection in Intermittent Cutting Process by Face Milling, Proc. of the 6th International Conference on Leading Edge Manufacturing in 21st Century 2011,, 1-6, CD-ROM, pp.1-6, 2011.11.
93. Takanori IWAHASHI, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Koichi SATO, Yoshinori KOBAYASHI, and Masahiko MURATA, Precision Deposition of Organic EL Films under the Atmosphere Pressure by Combined Processing of Spray and Nanoimprinting, Proc. of International Conference on Planarization/CMP Technology 2011, 511-514, pp.511-514, 2011.11.
94. Yu MORIWAKI, Tsutomu YAMAZAKI, Toshiro K. DOI, Syuhei KUROKAWA, Osamu OHNISHI, and Michio UNEDA, Development of Novel Pad Groove Design to Achieve High Efficiency CMP --- Friction Characteristic for Glass Polishing ---, Proc. of International Conference on Planarization/CMP Technology 2011, 494-497, pp.494-497, 2011.11.
95. Tsutomu YAMAZAKI, Toshiro K. DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Yoji UMEZAKI, Kiyoshi SESHIMO, and Hideo AIDA, Development of Novel Pad Groove Design to Achieve High Efficiency CMP --- Designing of Novel Groove Patterns Based on Image Analysis of Slurry Flow Behavior ---, Proc. of International Conference on Planarization/CMP Technology 2011, 490-493, pp.490-493, 2011.11.
96. Hiroshi IKEDA, Yoichi AKAGAMI, Michio UNEDA, Osamu OHNISHI, Syuhei KUROKAWA, and Toshiro DOI, The High-Efficiency Polishing Technology for Glass Substraight Using Electrical Controlled Slurry Polishing, Proc. of International Conference on Planarization/CMP Technology 2011, 428-431, pp.428-431, 2011.11.
97. Shinji KOGA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Yoji MATSUKAWA, Keiji MATSUHIRO, and Tsutomu YAMAZAKI, Removal Mechanism of Oxide Single Crystal in Chemical Mechanical Polishing, Proc. of International Conference on Planarization/CMP Technology 2011, 395-398, pp.395-398, 2011.11.
98. Akira ISOBE, Shinichi HABA, Hideaki NISHIZAWA, and Syuhei KUROKAWA, Numerical Discussion of Polishing Mechanism Considering Contact Area of Polishing Pad and that of Polishing Abrasives, Proc. of International Conference on Planarization/CMP Technology 2011, 252-257, pp.252-257, 2011.11.
99. Tao YIN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Michio UNEDA, Zhida WANG, Zhe TAN, and Takateru EGASHIRA, Processing Characteristics of SiC Wafer by Atmosphere-Controlled CMP Machine, Proc. of International Conference on Planarization/CMP Technology 2011, 165-168, pp.165-168, 2011.11.
100. Atsushi OHTAKE, Akihiro SANO, Kinya KOBAYASHI, Osamu OHNISHI, Syuhei KUROKAWA, and Toshiro DOI, Investigation into Mechanism of Pre-CMP Electroplated Copper Overgrowth and Various Defects of Cu on Trench and Via Holes, Proc. of International Conference on Planarization/CMP Technology 2011, 96-100, pp.96-100, 2011.11.
101. Satoshi YAMAGUCHI, Toshiro DOI, Hiroyuki KOHNO, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, and Yoji MATSUKAWA, Simplified Method of Evaluation Scratches on the Wafer Polished by Fumed Silica Slurry, Proc. of International Conference on Planarization/CMP Technology 2011, 62-65, pp.62-65, 2011.11.
102. Syuhei KUROKAWA, Hiromitsu KIDO, Tetsuya TAGUCHI, Tatsuki OKADA, Osamu OHNISHI, and Toshiro DOI, Scanning Measurement and Evaluation of Gear Tooth Root and Bottom Profiles, Proc. of Advances in Power Transmission Science and Technology, 838-841, pp.838-841, 2011.10.
103. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro DOI, Mn2O3 Slurry Reuse for SiO2 Film CMP, Proc. of the 2011 International Conference on Solid State Devices and Materials, 52-53, pp.52-53, 2011.09.
104. Syuhei KUROKAWA, Morihisa HOGA, Yoji MATSUKAWA, Osamu OHNISHI, and Toshiro DOI, Micro Radial Grating Disk Manufactured by Nanoimprinting Technique for Transmission Error Measurement of Micro Gears, Proc. of the 56th International Scientific Colloquium, 1-7, USB-Storage, pp.1-7, 2011.09.
105. Michio UNEDA, Tatsunori OMOTE, Ken-ichi ISHIKAWA, Toshiro DOI, Syuhei KUROKAWA, and Osamu OHNISHI, Performance Evaluation Method of CMP Pad Conditioner Using Digital Image Correlation (DIC) Processing, Proc. of Advanced Metallization Conference 2011, 114-115, pp.114-115, 2011.09.
106. Tsutomu YAMAZAKI, Toshiro K. DOI, Syuhei KUROKAWA, Michio UNEDA, Osamu OHNISHI, Kiyoshi SESHIMO, and Yasunori ASO, Development of New Groove Patterns on CMP Pad --- Slurry Flow Analysis using Digital Image Processing ---, Proc. of Advanced Metallization Conference 2011, 112-113, pp.112-113, 2011.09.
107. Osamu OHNISHI, Toshiro DOI, Syuhei KUROKAWA, Tsutomu YAMAZAKI, Michio UNEDA, Kei KITAMURA, Tao YIN, Isamu KOSHIYAMA, and Koichiro ICHIKAWA, CMP Characteristics of SiC Wafers Using a Simultaneous Double-side CMP Machine ---Effects of Atmosphere and Ultraviolet Light Irradiation ---, Proc. of Advanced Metallization Conference 2011, 110-111, pp.110-111, 2011.09.
108. Syuhei KUROKAWA, Hiromitsu KIDO, Tetsuya TAGUCHI, Tatsuki OKADA, Osamu OHNISHI, and Toshiro DOI, Scanning Measurement and Evaluation of Gear Tooth Root and Bottom Profiles, Applied Mechanics and Materials, 86, 838-841, Vol.86, pp.838-841, 2011.09.
109. Mitsuaki MURATA, Syuhei KUROKAWA, Osamu OHNISHI, Toshiro DOI, and Michio UNEDA, Characteristics of Thermo-Electromotive Force, Electric Current and Electric Resistance in Intermittent Cutting Process by Face Milling, Advanced Materials Research, 314-316, 1075-1078, Vols.314-316, pp.1075-1078, 2011.09.
110. Morihisa HOGA, Kimio ITOH, Mikio ISHIKAWA, Naoko KUWAHARA, Masaharu FUKUDA, Nobuhito TOYAMA, Syuhei KUROKAWA, and Toshiro DOI, Comparison of Quartz and Silicon as a Master Mold Substrate for Patterned Media UV-NIL Replica Process, Microelectronic Engineering, 88, 8, 1975-1977, Vol.88, Issue 8, pp.1975-1977, 2011.08.
111. Sadahiro KISHII, Akiyoshi HATADA, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro DOI, Tungsten Film Chemical Mechanical Polishing using MnO2 Slurry, Japanese Journal of Applied Physics, 50, 7, 076502-1-076701-4, Vol.50, No.7, pp.076502-1-076701-4, 2011.07.
112. Daisuke TABUCHI, Takao SAJIMA, Toshiro DOI, Hiromichi ONIKURA, Osamu OHNISHI, Syuhei KUROKAWA, and Takahiro MIURA, Development of a Filament-Winding Machine Based on Internal Heating by a High-Temperature Fluid for Composite Vessels, Sensors and Materials, 23, 6, 347-358, Vol.23, No.6, pp.347-358, 2011.06.
113. Morihisa HOGA, Kimio ITOH, Mikio ISHIKAWA, Nobuhiro TOYAMA, Hiroaki KITAHARA, Tadashi FUJINAWA, Tetsuya IIDA, Syuhei KUROKAWA, and Toshiro DOI, Negative-tone E-beam Resist Patterning for more than 1 Tbit/in.2 Bit-patterned Media NIL Mold, Proc. of the 55th International Conference of Electron, Ion, and Photon Beam Technology and Nanofabrication, 25.1-25.2, pp.25.1-25.2, 2011.06.
114. Hironori NISHI, Osamu OHNISHI, Hiromichi ONIKURA, Toshiro DOI, Syuhei KUROKAWA, Michio UNEDA, Weichen KUO, and Toshihiko EGUCHI, Processing Characteristics to Grooving of Brittle Materials with Micro Ni-W Electroplated Diamond Tools ---Influence of Coolant and Tool Runout on Tool Life ---, Proc. of the 1st International Conference on Manufacturing Process Technology, 25-27, pp.25-27, 2011.05.
115. Tao YIN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Michio UNEDA, Zhida WANG, and Takateru EGASHIRA, High Efficient Processing of Si and SiC Wafer by Atmosphere-Controlled CMP Machine, Proc. of the 1st International Conference on Manufacturing Process Technology, 18-20, pp.18-20, 2011.05.
116. Syuhei KUROKAWA, Yoji UMEZAKI, Morihisa HOGA, Toshiro DOI, Osamu OHNISHI, Michio UNEDA, and Yoji MATSUKAWA, Gear Metrology and Nanomanufacturing Application for Micro Gear Measurement, Proc. of the 1st International Conference on Manufacturing Process Technology, 1-6, pp.1-6, 2011.05.
117. Tetsuo INOUE and Syuhei KUROKAWA, Derivation of Path of Contact and Tooth Flank Modification by Minimizing Transmission Error on Face Gear, Proc. of the 4th International Conference on Manufacturing, Machine Design and Tribology, 77-78, pp.77-78, 2011.04.
118. Syuhei KUROKAWA, Yasutsune ARIURA, and Toshiro DOI, Evaluation of Pitch Deviations with Comprehensive Representation Suitable for Engagement Evaluation in Different Types of Gears, International Journal of Automation Technology, 5, 2, 132-137, Vol.5, No.2, pp.132-137, 2011.03.
119. Atsushi OHTAKE, Toshiyuki ARAI, Syuhei KUROKAWA, and Toshiro DOI, Development of a Nonperiodic Boundary Practical Simulator for Oxide and Shallow Trench Isolation Chemical Mechanical Polishing Processes, Journal of the Electrochemical Society, 158, 2, H142-H145, Vol.158, No.2, pp.H142-H145, 2011.02.
120. Kazusei TAMAI, Hitoshi MORINAGA, Toshiro DOI, Syuhei KUROKAWA, and Osamu OHNISHI, Analysis of Chemical and Mechanical Factors in CMP Processes for Improving Material Removal Rate, Journal of the Electrochemical Society, 158, 3, H333-H337, Vol.158, No.3, pp.H333-H337, 2011.01.
121. Daisuke TABUCHI, Takao SAJIMA, Hiromichi ONIKURA, Osamu OHNISHI, Syuhei KUROKAWA, Toshiro DOI, and Toshiaki OHTA, Development of U-anchor CFRP Rod Manufacturing Machine, Advanced Materials Research, 168-170, 2125-2128, Vols.168-170, pp.2125-2128, 2010.12.
122. Yuki KUGIMOTO, Atsumi WAKABAYASHI, Toshiaki DOBASHI, Syuhei KUROKAWA, Osamu OHNISHI, Toshiro DOI, Preparation of Optically Transparent Anti-static Films, Proc. of 2nd International Conference on Advanced Micro-Device Engineering, 2010.12.
123. Takao FUNAKOSHI, Senri OJIMA, Yohei YAMADA, Syuhei KUROKAWA, Toshiro DOI, Osamu OHNISHI, Yoji UMEZAKI, and Yoji MATSUKAWA, Detection of Large-Sized Foreign Particles in CMP Slurry and Reduction of Micro-Scratches (II), Proc. of International Conference on Planarization/CMP Technology 2010, 356-359, pp.356-359, 2010.11.
124. Tadashi HASEGAWA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Yasuhiro KAWASE, Yasuhide YAMAGUCHI, and Sadahiro KISHII, Chemical Mechanical Polishing (CMP) of Silicon Carbide (SiC) with Manganese Oxide Slurry ---Polishing Characteristics under High Pressure Gas Atmosphere Inside the Bell-Jar (Chamber) Shaped CMP Machine---, Proc. of International Conference on Planarization/CMP Technology 2010, 328-331, pp.328-331, 2010.11.
125. Kazusei TAMAI, Akihito YASUI, Masayuki SERIKAWA, Hitoshi MORINAGA, Toshiro DOI, and Syuhei KUROKAWA, Factorial Analysis of Friction Energy for Material Removal Rate Improvement in CMP Processing, Proc. of International Conference on Planarization/CMP Technology 2010, 257-260, pp.257-260, 2010.11.
126. Syuhei KUROKAWA, Toshiro DOI, Tsutomu YAMAZAKI, Yoji UMEZAKI, Osamu OHNISHI, Yoji MATSUKAWA, Kiyoshi SESHIMO, Yasuhide YAMAGUCHI, and Yasunori KAWASE, Impact of Reduction in CeO2 Slurry Consumption for Oxide CMP ---Approach from Alternative Slurries and Pad Groove Patterns---, Proc. of International Conference on Planarization/CMP Technology 2010, 244-247, pp.244-247, 2010.11.
127. Kazunori KADOMURA, Syuhei KUROKAWA, Toshiro DOI, Taro AKAMA, Yohei YAMADA, Yoji MATSUKAWA, Yoji UMEZAKI, and Osamu OHNISHI, Quantification of Asperity’s Conditions on Pad Surface with Diamond Conditioner, Proc. of Advanced Metallization Conference 2010, 168-169, pp.168-169, 2010.10.
128. Yoshiyuki SEIKE, Keiji MIYACHI, Syuhei KUROKAWA, Osamu OHNISHI, and Toshiro DOI, Semiconductor Device Cleaning with Liquid Aerosol Nozzle using Rotary Atomizer Method, Proc. of Advanced Metallization Conference 2010, 156-157, pp.156-157, 2010.10.
129. Shinichi YOSHIURA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, and Naofumi SHINYA, CMP Characteristic on Crystal Orientations of Single-Crystal Si and High-Precision Planarization CMP of Poly-Si, Proc. of Advanced Metallization Conference 2010, 144-145, pp.144-145, 2010.10.
130. Kei KITAMURA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Yoji UMEZAKI, Tsutomu YAMAZAKI, Yoji MATSUKAWA, Tadashi HASEGAWA, Isamu KOSHIYAMA, and Koichi ICHIKAWA, Characteristics of Silicon CMP Performed in Various High Pressure Atmospheres ---Development of a New Double-side Simultaneous CMP Machine Housed in a High Pressure Chamber---, Proc. of Advanced Metallization Conference 2010, 138-139, pp.138-139, 2010.10.
131. Tadashi HASEGAWA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Yasuhiro KAWASE, Yasuhide YAMAGUCHI, and Sadahiro KISHII, SiC-CMP Characteristics under High Pressure Gas Atmospheres using Manganese Slurry, Proc. of Advanced Metallization Conference 2010, 22-23, pp.22-23, 2010.10.
132. Toshiro K. DOI, Tsutomu YAMAZAKI, Syuhei KUROKAWA, Yoji UMEZAKI, Osamu OHNISHI, Yoichi AKAGAMI, Yasuhide YAMAGUCHI, and Sadahiro KISHII, Study on the Development of Resource-Saving High Performance Slurry ---Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry---, Advances in Science and Technology, 64, 65-70, Vol.64, pp.65-70, 2010.10.
133. Syuhei KUROKAWA, Atsushi BEKKI, Yoji MATSUKAWA, and Toshiro DOI, Characteristics of Sidebands of Mesh Frequency Caused by Gear Eccentricity ---Identification of Indices of Amplitude Modulation under Load by Transmission Error Measurement---, Proc. of the International Conference on Gears, VDI-Berichte 2108.1, 293-304, VDI-Berichte 2108.1, pp.293-304, 2010.10.
134. Syuhei KUROKAWA, Yasutsune ARIURA, and Toshiro DOI, Comprehensive Representation of Pitch Deviations Suitable for Engagement Evaluation in Different Types of Gears, Proc. of the 10th International Symposium on Measurement and Quality Control, B2-051-1-B2-051-4, pp.B2-051-1-B2-051-4, 2010.09.
135. Tsutomu YAMAZAKI, Toshiro DOI, Syuhei KUROKAWA, Sho ISAYAMA, Yoji UMEZAKI, Yoji MATSUKAWA, Hiroyuki KONO, Youichi AKAGAMI, Yasuhide YAMAGUCHI, and Yasuhiro KAWASE, Polishing Mechanism of Glass Substrates with Its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries, Key Engineering Materials, 447-448, 141-145, Vol.447-448, pp.141-145, 2010.07.
136. Osamu OHNISHI, Hiromichi ONIKURA, Toshihiko EGUCHI, Muhammad AZIZ, Toshiro DOI, and Syuhei KUROKAWA, Improvement in Drilling Performance of Micro Compound Tool, Key Engineering Materials, 447-448, 96-100, Vol.447-448, pp.96-100, 2010.07.
137. Kei KITAMURA, Toshiro DOI, Syuhei KUROKAWA, Yoji UMEZAKI, Yoji MATSUKAWA, Yota OOKI, Tadashi HASEGAWA, Isamu KOSHIYAMA, Koichiro ICHIKAWA, and Yoshio NAKAMURA, Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container, Key Engineering Materials, 447-448, 61-65, Vol.447-448, pp.61-65, 2010.07.
138. Akira FUKUDA, Akira KODERA, Yasushi TOMA, Tsukuru SUZUKI, Hirokuni HIAMA, Toshiro DOI, Syuhei KUROKAWA, and Osamu OHNISHI, Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing, Japanese Journal of Applied Physics, 49, 7, Vol.49,No.7, pp.076701-1-076701-8, 2010.07.
139. Yoshiyuki SEIKE, Keiji MIYACHI, Tatsuo SHIBATA, Yoshinori KOBAYASHI, Syuhei KUROKAWA, and Toshiro DOI, Silicon Wafer Cleaning Using New Liquid Aerosol with Controlled Droplet Velocity and Size by Rotary Atomizer Method, Japanese Journal of Applied Physics, 49, 6, Vol.49, No.6, pp.-, 2010.06.
140. Yoji Umezaki, Syuhei KUROKAWA, and Yasutsune ARIURA, Impact of High-Speed Image Recognition of Transition Phenomenon of Chip Formation and Chip Flow in Gear Hobbing Process, Key Engineering Materials, 437, 189-193, Vol.437, pp.189-193, 2010.03.
141. Tadashi HASEGAWA, Yoji UMEZAKI, Syuhei KUROKAWA, Ryohei ISHIMARU, Yoji MATSUKAWA, and Toshiro DOI, Characteristics of Micro Fiber Pads in Electro-Chemical Mechanical Polishing (E-CMP) of Copper Substrates, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 74-76, pp.74-76, 2010.03.
142. Kei KITAMURA, Yoji UMEZAKI, Syuhei KUROKAWA, Toshiro DOI, Yoji MATSUKAWA, and Yoshiyuki FUNAKI, Influence of Oxidization Resistance of TiAlN Coating Film on the Wear Resistance of High-Speed Steel Hobs, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 65-67, pp.65-67, 2010.03.
143. Syuhei KUROKAWA, Shinya IMAMURA and Yasutsune ARIURA, Nano Manufacturing of a Micro Rotary Grating Disk for Measurement of Rotational Accuracy of Micro-Machine Elements, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 56-64, pp.56-64, 2010.03.
144. Ryohei ISHIMARU, Yasutsune ARIURA, Syuhei KUROKAWA, and Yoji MATSUKAWA, Surface Durability of Austempered Ductile Iron (ADI) Rollers under Minimal Quantity Lubrication (MQL) Conditions, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 43-48, pp.43-48, 2010.03.
145. Hiromitsu KIDO, Syuhei KUROKAWA, Tetsuya TAGUCHI, Nagisa KOYAMA, and Toshiro DOI, Systematic Error by Temperature Transition of Gear Measuring Machine and Measurement of Tooth Root and Bottom Profiles of Cylindrical Gears, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, pp.1-4, 2010.03.
146. Hiromitsu KIDO, Syuhei KUROKAWA, Tetsuya TAGUCHI, Nagisa KOYAMA, and Toshiro DOI, Development of Gear Measuring Machine and Measurement of Tooth Root and Bottom Profiles of Cylindrical Gears, Proc. of the 3rd International Conference on Advanced Manufacture, 533-537, pp.533-537, 2010.02.
147. Kei KITAMURA, Yoji UMEZAKI, Syuhei KUROKAWA, Toshiro DOI, Yoji Matsukawa, and Yoshiyuki FUNAKI, Influence of Oxidization Resistance and Aluminum Concentrations of TiAlN Coating Film on the Wear Resistance of High-Speed Steel Hobs, Proc. of the 3rd International Conference on Advanced Manufacture, 13-16, pp.13-16, 2010.02.
148. Syuhei KUROKAWA and Yasutsune ARIURA, Development of a grating disk of a microrotary encoder for measurement of meshing accuracy of microgears, The International Journal of Advanced Manufacturing Technology, 46, 9, 931-944, Vol.46, Issue 9, pp.931-944, 2010.01.
149. Akira FUKUDA, Akira KODERA, Yasushi TOMA, Tsukuru SUZUKI, Hirokuni HIYAMA, Toshiro K. DOI, and Syuhei KUROKAWA, Simulation of Electrochemical Mechanical Polishing, Proc. of International Conference on Planarization/CMP Technology 2009, 473-478, pp.473-478, 2009.11.
150. Yota OKI, Toshiro K. DOI, Syuhei KUROKAWA, Yoji UMEZAKI, Yoji MATSUKAWA, Kei KITAMURA, and Isamu KOSHIYAMA, Cu-CMP Characteristics by Controlled Atmosphere Polishing Machine and Effect of High Pressure CO2 Gas, Proc. of International Conference on Planarization/CMP Technology 2009, 416-421, pp.416-421, 2009.11.
151. Tadashi HASEGAWA, Yoji UMEZAKI, Syuhei KUROKAWA, Ryohei ISHIMARU, Yoji MATSUKAWA, and Toshiro K. DOI, Electro-Chemical Mechanical Polishing (E-CMP) of Copper Substrates with Micro Fiber Pad, Proc. of International Conference on Planarization/CMP Technology 2009, 411-415, pp.411-415, 2009.11.
152. Kazunori KADOMURA, Syuhei KUROKAWA, Toshiro K. DOI, Taro AKAMA, Yohei YAMADA, Yukio OKANISHI, Yoji MATSUKAWA, Yoji UMEZAKI, and Osamu OHNISHI, Quantification of Pad Surface Conditions with Diamond Conditioners and Polishing Characteristics in CMP Process, Proc. of International Conference on Planarization/CMP Technology 2009, 319-324, pp.319-324, 2009.11.
153. Kazusei TAMAI, Tomohiko AKATSUKA, Hitoshi MORINAGA, Toshiro K. DOI, and Syuhei KUROKAWA, Impact of SiO2 Agglomeration on surface Defectivity during CMP Process, Proc. of International Conference on Planarization/CMP Technology 2009, 296-300, pp.296-300, 2009.11.
154. Takao FUNAKOSHI, Senri OJIMA, Yohei YAMADA, Syuhei KUROKAWA, Toshiro K. DOI, Osamu OHNISHI, Yoji UMEZAKI, and Yoji MATSUKAWA, Detection of Large-Sized Foreign Particles in CMP Slurry and Reduction of Micro-scratches, Proc. of International Conference on Planarization/CMP Technology 2009, 290-295, pp.290-295, 2009.11.
155. Yoshihiko ITO, Toshiro K. DOI, Hroyuki KOHNO, Syuhei KUROKAWA, and Yoji UMEZAKI, Study on Micro-Scratches Generated in Oxide Film CMP with Fumed Silica Slurry (Effect of Slurry Dispersion Condition on Micro-Scratch Defect Generation), Proc. of International Conference on Planarization/CMP Technology 2009, 285-289, pp.285-289, 2009.11.
156. Yoshiyuki SEIKE, Tatsuo SHIBATA, Yoshinori KOBAYASHI, Keiji MIYACHI, Syuhei KUROKAWA, and Toshiro K. DOI, Development of a Revolution Atomizing Two Fluid Cleaning Nozzle (RAC nozzle) for Post-CMP Cleaning, Proc. of International Conference on Planarization/CMP Technology 2009, 273-278, pp.273-278, 2009.11.
157. Kazuasa KURIZUKA, Toshiro K. DOI, Syuhei KUROKAWA, Koichi SATO, Yoshinori KOBAYASHI, Yoshihiko TSUCHIDA, and Keiji MIYACHI, Precision Deposition of Organic EL films applying a CMP Technology Combined with Spraying under the Atmosphere Pressure, Proc. of International Conference on Planarization/CMP Technology 2009, 208-212, pp.208-212, 2009.11.
158. Takashi HYAKUSHIMA, Toshiro K. DOI, Motonobu SATO, Syuhei KUROKAWA, Mizuhisa NIHEI, and Yuji AWANO, CMP Technique for CNT/SOD Composite Using Ceria Slurry, Proc. of International Conference on Planarization/CMP Technology 2009, 197-201, pp.197-201, 2009.11.
159. Kazusei TAMAI, Akihito YASUI, Hitoshi MORINAGA, Toshiro K. DOI, and Syuhei KUROKAWA, Effect of Particle-Substrate Interaction on the Polishing Rate, Proc. of International Conference on Planarization/CMP Technology 2009, 55-59, pp.55-59, 2009.11.
160. Taro AKAMA, Keiji MIYACHI, Syuhei KUROKAWA, Toshiro DOI, Yoji UMEZAKI, Yoji MATSUKAWA, Sho ITONAGA, Yoshiyuki SEIKE, and Osamu OHNISHI, Silicon CMP Characteristics and Pad Conditioning Using a High Pressure Micro Jet (HPMJ), Proc. of the 3rd International Conference of Asian Society for Precision Engineering and Nanotechnology, USB pp.1-4, 2009.11.
161. Akira FUKUDA, Yoshihiro MOCHIZUKI, Hirokuni HIYAMA, Manabu TSUJIMURA, Toshiro DOI, and Syuhei KUROKAWA, Stress Analysis of Dielectrics Using FEM for Analyzing the Cause of Cracking Observed After W-CMP, Journal of the Electrochemical Society, 156, 9, H694-H698, Vol.156, No.9, pp.H694-H698, 2009.07.
162. Toshiro DOI and Syuhei KUROKAWA, CMP of SiC Wafers as a Post-Si Power-Device (Bell-Jar shaped CMP machine assisted by photocatalitic reactions under high pressure oxygen gas and CMP characteristics of functional materials), Proc. of the 1st International Conference on Surface and Interface Fabrication Techonologies (ICSIF), 168-174, pp.168-174, 2009.07.
163. Yoji Umezaki, Syuhei KUROKAWA, Yasutsune ARIURA, Impact of high-speed image recognition of transition phenomenon of chip formation and chip flow in gear hobbing process, Proceedings of the 9th International Symposium on Measurement Technology and Intelligent Instruments ISMTII2009, Vol.2, pp.63-67, 2009.06.
164. Syuhei KUROKAWA, Yasutsune ARIURA, Yoji MATSUKAWA, and Toshiro DOI, Evaluation of gear engagement accuracy by Transmission Error with sub-microradian resolution, International Journal of Surface Science and Engineering, Vol.3, No.3, pp.160-177, 2009.05.
165. Ryohei ISHIMARU, Yasutsune ARIURA, Syuhei KUROKAWA, Yoji MATSUKAWA, and Masahito GOKA, A Fundamental Study on the Surface Durability of Austempered Ductile Iron (ADI) Gears in Long Life Region, Proc. of the JSME International Conference on Motion and Power Transmissions, pp.418-421, 2009.05.
166. Syuhei KUROKAWA, Atsushi BEKKI, Yoji MATSUKAWA, Yoji UMEZAKI, and Toshiro DOI, Influence of Gear Eccentricity on Sidebands of Mesh Frequency ---Derivation and Detection of Amplitude Modulation by Transmission Error Measurement---, Proc. of the JSME International Conference on Motion and Power Transmissions, pp.221-226, 2009.05.
167. Yoji UMEZAKI, Yasutsune ARIURA, Syuhei KUROKAWA, and Yuho IJIMA, Transient Phenomenon of Chip Generation and Its Movement in Hobbing ---Jamming of Chip Formed in Generating of Finished Surface in Flytool Simulation Tests---, Proc. of the JSME International Conference on Motion and Power Transmissions, pp.128-133, 2009.05.
168. An Analysis of Particle in Spray Cleaning and a Study on their Cleaning Efficiency -A comparison of Cleaning Efficiency between Two Fluid Spray and High Pressure Micro Jet Spray-.
169. Development of Abrasive-Free Copper CMP Process -Reduction of Copper Residue Using Randomly Formed Polyurethanne Pad-.
170. The impact of wafer edge profile on polishing performance in silicion wafer manufacturing.
171. Study on Reduction of Micro-Scratch in Oxide CMP for Multi-Level Interconnection -Investigation of Mechanism for Micro-Scratch Formation in CMP Process-.
172. Keiji Miyachi, Taro Akama, Syuhei Kurokawa, Toshiro Doi, Kimio Nakayama, Yoshiyuki Seike, Yoji Matsukawa, Yoji Umezaki, CMP characteristics of silicon wafer with a micro-fiber pad, and pad conditioning with high pressure micro jet (HPMJ), Proc. of the 5th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium), pp.93-97, 2008.11.
173. Takeharu Kihara, Toshiro Doi, Syuhei KUROKAWA, Yota Oki, Yoji Umezaki, Yoji Matsukawa, Koichiro Ichikawa, Isamu Koshiyama, and Hiroyuki Kono, Si CMP with a sealed 'Bell-Jar' type CMP machine -Processing characteristics of Si-CMP, influenced by the processing atmosphere and additives dispersed in the slurry -, Proc. of the 5th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium), pp.98-102, 2008.11.
174. Study on Hard-Pad-Based CMP of Dielectric Global Planarization -Improvement of With-In-Wafer Non-Uniformity (WIWNU) in CMP Process-.
175. Toshiro K. DOI, and Syuhei KUROKAWA, CMP of SiC Wafers as a Post-Si Power-Device -Photocatalitic reaction assisted Bell-Jar shaped CMP Machine under high pressure oxygen gas-, Proc. of International Conference on Planarization/CMP Technology 2008, pp.2-7, 2008.11.
176. Yusuke Shimoda, Yoji Umezaki, Syuhei KUROKAWA, Ryohei Ishimaru, Yoji Matsukawa, Tadashi Hasegawa, and Toshiro DOI, E-CMP of Cu Substrates with Unwoven Fabric Pads, Proc. of International Conference on Planarization/CMP Technology 2008, pp.477-481, 2008.11.
177. Kazumasa Kurizuka, Kazunori Kazomura, Toshio Fukunishi, Yoji Umezaki, Yoji Matsukawa, Syuhei KUROKAWA, Yuhei Nishimori, and Toshiro DOI, Pad Conditioning with Electrodeposited Diamond Conditioners and Polishing Characteristics in Cu-CMP, Proc. of International Conference on Planarization/CMP Technology 2008, pp.392-397, 2008.11.
178. Syuhei Kurokawa, Keiji Miyachi, Yoshiyuki Seike, Shinichi Izumikawa, Shinichi Haba, and Toshiro Doi, Pad Conditioning Using a High Pressure Micro Jet (HPMJ) to Improve Life Span of Unwoven Fabric Pads in CMP for Silicon Wafers, Proc. of International Conference on Planarization/CMP Technology 2008, pp.243-249, 2008.11.
179. Kazusei Tamai, Hitoshi Morinaga, Syuhei KUROKAWA, and Toshiro DOI, Analysis of Chemical and Mechanical Factors in CMP Process, Proc. of International Conference on Planarization/CMP Technology 2008, pp.22-28, 2008.11.
180. Research on Cleaning Efficiency of High Pressure Micro Het -A Study through Analysis of Particles' Novement and Experiment on Cleaning-.
181. Syuhei Kurokawa, Yasutsune Ariura, Bekki Atsushi, Yoji Matsukawa, Toshiro Doi, Application of Angle Measurement with Sub-micro Radian Resolution to Detect Nanometer Engagement of a Gear Pair, Proc. of the International Conference on Precision Measurement, ICPM2008, DVD-ROM, pp.1-11, 2008.09.
182. Syuhei Kurokawa, Yasutsune Ariura, Tatsuyuki Yamamoto , Automatic leveling procedure by use of the spring method in measurement of three-dimensional surface roughness, Proc. of the 4th International Symposium on Precision Mechanical Measurements, ISPMM2008, Proceedings of SPIE, Vol.7130, pp.71301I-1-71301I-7, 2008.08.
183. Yohei YAMADA, Masanori KAWAKUBO, Osamu HIRAI, Nobuhiro KONISHI, Syuhei KUROKAWA, and Toshiro DOI, Frictional Characterization of Chemical-Mechanical Polishing Pad Surface and Diamond Conditioner Wear, Japanese Hournal of Applied Physics, Vol.47, No.8, pp.6282-6287, 2008.08.
184. Yohei YAMADA, Masanori Kawakubo, Osamu Hirai, Nobuhiro KONISHI, Syuhei KUROKAWA, and Toshiro DOI, Tribological Behavior of Metal CMP and Detection of Process Abnormality, Journal of The Electrochemical Society, Vol.155, No.8, pp.H569-H574, 2008.06.
185. Yohei YAMADA, Nobuhiro KONISHI, Junji NOGUCHI, Tomoko JIMBO, Syuhei KUROKAWA, and Toshiro DOI, Study on Factors in Time-Dependent Dielectric Breakdown Degradation of Cu/Low-k Integration Related to Cu Chemical-Mechanical Polishing, Japanese Journal of Applied Physics, Vol.47, No.6, pp.4469-4474, 2008.06.
186. High efficiency CMP technology with a closed atmosphere control bell-jar type polishing machine.
187. Kazunori KADOMURA, Toshio FUKUNISHI, Yoji UMEZAKI, Yoji MATSUKAWA, Syuhei KUROKAWA, and Toshiro K. DOI, Conditioning of CMP Pad to Reinstate Pad Surface Functions, Proc. of the International Conference on Planarization/CMP Technology, pp.1-5, 2007.10.
188. Keiji MIYACHI, Yoshiyuki SEIKE, Shinichi HABA, Syuhei KUROKAWA, and Toshiro K. DOI, Impact of a High Pressure Micro Jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing, Proc. of the International Conference on Planarization/CMP Technology, pp.1-6, 2007.10.
189. Syuhei KUROKAWA, and Yasutsune ARIURA, Development of a Grating Disk of a Micro Rotary Encoder for Measurement of Meshing Accuracy of Micro Gears, Proc. of the 8th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII 2007), pp.265-268, 2007.09.
190. Syuhei KUROKAWA, and Yasutsune ARIURA, Measurement of Tooth Pair Deflections With Ultra High Resolution Encoders and Prediction of Transmission Error Under Load in High Precision, Proc. of the ASME 2007 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, IDETC/CIE 2007, DVD-ROM, pp.1-10, 2007.09.
191. Transient Phenomenon of Chip Generation and Its Movement in Hobbing
(4th Report, The Relationship between the Jamming of Chips on the Finished Surface and the Chip Form in Generating in Flytool Simulation Tests).
192. Transmission Error Analysis of Involute Cylindrical Gears with Consideration of Gear Eccentricity
(Derivation of Strict Analytical Solutions of Transmission Error with Radial Eccentricity).
193. Syuhei KUROKAWA and Shinya IMAMURA, Nano Manufacturing of a Small-tipped Stylus for Measurement of Micro-Machine Elements with Concave Surfaces, Proc. of the 35th International MATADOR Conference, pp.7-10, 2007.07.
194. Syuhei KUROKAWA, Yasutsune ARIURA and Akio KAWAMOTO, Identification of the Parameters of Gear Eccentericity by Using Measured Transmission Error Curves, Proc. of the International Conference on Manufacturing, Machine Design and Tribology, ICMDT2007, CD-ROM, pp.1-6, 2007.07.
195. Ryohei ISHIMARU, Syuhei KUROKAWA, Yoji MATSUKAWA and Masashito GOKA, A Fundamental Study on Surface Durability of High Strength Spheroidal Graphite Cast Iron Gears, Proc. of the International Conference on Manufacturing, Machine Design and Tribology, ICMDT2007, CD-ROM, pp.1-6, 2007.07.
196. Syuhei KUROKAWA, and Yasutsune ARIURA, Evaluation of Peak-to-Vally Values of Transmission Error with Gear Eccentricity by Measurement and Analysis, Proc. of the International Symposium of Technology of Mechanical Engineering Design, ISTMED'2007, pp.24-29, 2007.01.
197. Syuhei KUROKAWA, and Yasutsune ARIURA, Prediction of Sidebands of Mesh Frequency with Frequency Modulation Caused by Gear Eccentricity, Proc. of the International Symposium of Technology of Mechanical Engineering Design, ISTMED'2007, pp.24-29, 2007.01.
198. Syuhei KUROKAWA, Topography measurement of gear tooth flanks with CMM and evaluation of pitch deviations with the new definition, The Journal of Chinese Society of of Mechanical Engineers, Vol.27, No.5, pp.513-518, 2006.10.
199. Syuhei KUROKAWA, and Yasutsune ARIURA, Influence of gear eccentricity on the characteristics of noise spectrum
(Frequency modulation and sidebands of mesh frequency), Proc. of the International Conference on Mechanical Transmissions, ICMT'2006, Vol.II, pp.896-901, 2006.09.
200. Syuhei KUROKAWA, and Yasutsune ARIURA, Evaluation of shot peened surfaces using characterization technique of three-dimensional surface topography, Journal of Physics, 13, Vol. 13, pp.9-12, 2005.09.
201. Syuhei KUROKAWA, and Yasutsune ARIURA, Evaluation of Transmission Error with Gear Eccentricity by Measurement and Approximate Formula, Proc. of the 1st International Conference on Manufacturing, Machine Design and Tribology, pp.1-4 CD-ROM, 2005.06.