Kyushu University Academic Staff Educational and Research Activities Database
List of Papers
Satoshi Oue Last modified date:2024.04.25

Assistant Professor / Material process engineering / Department of Materials Science and Engineering / Faculty of Engineering


Papers
1. Sung Hwa BAE, Satoshi OUE, Yu-ki TANINOUCHI, Injoon SON and Hiroaki NAKANO, Corrosion Resistance of Zn–Ni Alloy Films Electroplated in Alkaline Zincate Solutions Containing a Brightener, ISIJ International, https://doi.org/10.2355/isijinternational.ISIJINT-2023-236, 63, 11, 1897-1907, 2023.11, Zn–Ni alloys were electroplated on a Fe plate with a thickness of 40 μm at 500 A·m−2 and 293 K in unagitated zincate solutions. The reaction product of epichlorohydrin and imidazole (IME) was added to the solution as a brightener at concentrations of 0–5 mL dm–3. The corrosion resistance of the obtained Zn–Ni alloy films was investigated from the polarization curve in 3 mass% NaCl solution before and after the corrosion treatment (formation of corrosion products) for 48 hours. Before the corrosion treatment, the corrosion current density of plated films rarely changed, regardless of the addition of IME into the zincate solution, because the reduction reaction of dissolved oxygen rarely changed. However, in films plated from the solution containing IME, the anode reaction was suppressed, and the corrosion potential shifted toward the noble direction. The suppression of the anode reaction with an addition of IME into the plating solution is attributed to the increase in γ-phase in the plated films. After the corrosion treatment, Zn chlo- ride hydroxide of the corrosion product uniformly formed on the surface when increasing the concentra- tion of IME. The reduction reaction of dissolved oxygen was suppressed by increasing the concentration of IME, resulting in a decrease in corrosion current density..
2. Wataru MURAKAMI, Satoshi OUE, Yu-ki TANINOUCHI, Shinya Akamatsu, Hiroaki NAKANO, Electrodeposition Behavior of Zn-Ni Alloy from Alkaline Zincate Solutions Containing Various Brighteners and its Microstructure, 鉄と鋼, https://doi.org/10.2355/tetsutohagane.TETSU-2022-110, 109, 4, 277-288, 2023.04, The effect of brighteners on the deposition behavior of Zn–Ni alloys ant its microstructure was investigat- ed. Zn–Ni alloys were electrodeposited on Cu electrode at 10–5000 A·m−2, 105 C·m−2, 308 K in unagitated zincate solutions containing various brighteners. Although the degree of suppression of hydrogen evolu- tion was different depending on the kind of brightener, the transition current density at which the depo- sition behavior shifted from normal to anomalous was almost same in solutions containing brighteners. The current efficiency for alloy deposition significantly decreased with an addition of brighteners which had suppression effect on the Zn deposition. Since the brighteners more suppressed the Ni deposition than Zn deposition, the Ni content in deposited films decreased with an addition of brighteners. When the brightener of a straight-chain polymer composed of a quaternary ammonium cation (PQ) which can suppress the diffusion of ZnO22− and Ni ions in solution was added, the Ni content in deposited films in- creased with increasing current density at high current density region. This is attributed to that Zn which is preferentially deposited over Ni earlier reached the diffusion limitation of ZnO22− ions and Ni deposi- tion didn’t reach the diffusion-limited current density. When both PQ and a quaternary ammonium salt with a benzene ring were added in solution, the films obtained at the diffusion-limited current density of ZnO22− ions exhibited the smooth surfaces composed of fine crystals. With an addition of brighteners to increase the overpotential for deposition, the γ-phase (intermetallic compound of Ni2Zn11) of the deposit- ed films was formed easily..
3. Sung Hwa BAE, Satoshi OUE, Yu-ki TANINOUCHI, Injoon SON, Hiroaki NAKANO, Corrosion Resistance of Zn-Ni Alloy FilmsElectroplated from Alkaline Zincate SolutionContaining Brightener, 鉄と鋼, https://doi.org/10.2355/tetsutohagane.TETSU-2022-110, 109, 4, 289-300, 2023.04, Zn–Ni alloys were electroplated on an Fe plate with thicknesses of 40 μm at 500 A·m−2 and 293 K in un- agitated zincate solutions. The reaction product of epichlorohydrin and imidazole (IME) was added in the solution as a brightener at the concentration of 0-5 ml/dm−3. The corrosion resistance of the obtained Zn– Ni alloys films was investigated from the polarization curve in 3 mass% NaCl solution before and after the corrosion treatment (formation of corrosion products) in NaCl solution for 48 h. Before the corrosion treatment, the corrosion current density of plated films rarely changed regardless of addition of IME into the zincate solution because the reduction reaction of dissolved oxygen rarely changed. However, in films plated from the solution containing IME, the anode reaction was suppressed and the corrosion potential shifted to noble direction. The suppression of anode reaction with an addition of IME in plating solution is attributed to the increase in γ-phase in plated films. On the other hand, after the corrosion treatment, the morphology of Zn chloride hydroxide of corrosion product was uniformly formed on the surface with increasing the concentration of IME.
The reduction reaction of dissolved oxygen was suppressed with increasing the concentration of IME, resulting in decrease in corrosion current density..
4. Kohei Mori, Yuta Yamakawa , Satoshi Oue , Yu-ki Taninouchi and Hiroaki Nakano, Effect of Impurity Ions and Additives in Solution of Copper Electrorefining on the Passivation Behavior of Low-Grade Copper Anode, Materials Transactions, doi:10.2320/matertrans.MT-M2022087, 64, 1, 242-251, 2023.01, Cu electrorefining using a low-grade copper anode is desirable from the standpoint of electric power savings. Cu electrolysis was carried out in an unagitated sulfate solution with a low-grade copper anode, and the effect of impurity ions and additives in the solution on the passivation of the anode was investigated. The time when anode passivation firstly occurs shortened significantly in a solution containing 0.596 mol·dm13 of Ni2+ ions as impurity and shortened somewhat in a solution containing As5+(0.053 mol·dm13) or Bi3+(0.0005 mol·dm13) ions. Sn2+(0.0004 mol·dm13) and As3+(0.053 mol·dm13) ions slightly decreased the time to passivation, but Sb3+(0.004 mol·dm13) ions did not. The viscosity coefficient of the solution increased when the 0.596mol·dm13 of Ni2+ ions were added to the solution, while the diffusion coefficient of Cu2+ ions decreased. The compound of the As­Sb­O or As­Bi­O system was formed in anode slime when the As5+(0.053 mol·dm13) or Bi3+(0.0005 mol·dm13) ions were added to the solution, which seemed to increase the compactness of slime. The time to passivation was slightly longer in thiourea-free solution but shortened when the concentration of thiourea was increased from 0.525 to 2.24 mmol·dm13. The time to passivation was constant in solutions containing 0 to 1.13 mmol·dm13 of Cl1 ions, but significantly decreased as the concentration of Cl1 ions increased above 1.13 mmol·dm13. Cl1 ions formed Cu­Cl at the upper area of anode slime, which increased the compactness of slime and promoted the passivation..
5. Sung Hwa BAE, Satoshi OUE, Yu-ki TANINOUCHI, Injoon SON, Hiroaki NAKANO, Synergistic Effect of Brightener and Solution Temperature on the Electrodeposition Behavior of Zn–Ni Alloy from Alkaline Zincate Solution, ISIJ International, https://doi.org/10.2355/isijinternational.ISIJINT-2022-160, 62, 9, 1918-1929, 2022.09, Zn–Ni alloys were electrodeposited on a Cu electrode at 10–5 000 A·m−2, 5 × 104 C·m−2, 293 K, 313 K, and 333 K in unagitated zincate solutions containing the reaction product of epichlorohydrin and imid- azole (IME) as a brightener. The synergistic effect of IEM and solution temperature on the deposition behavior of Zn–Ni alloys was investigated. The transition current density at which the deposition behavior shifted from normal to anomalous one decreased with IME at 293 K, but did not change regardless of IME addition at 313 K and 333 K. The suppression effect of IME on the Zn and Ni depositions during alloy deposition was observed at 293 K while at 313 K and 333 K, the suppression effect decreased on the Zn deposition but was maintained on the Ni deposition. Therefore, Ni content in deposits significantly decreased with IME as the temperature increased. The current efficiency of Zn deposition significantly decreased with IME at 293 K, with a small degree of decrease at 313 K and 333 K. The C content in deposits was the highest at 293 K and decreased with increasing solution temperature, indicating that the adsorption ability of IME on the cathode decreases with the increasing temperature. As a result, the sup- pression effect of IME on the Zn deposition decreases with the increasing temperature. The gloss of deposited films was the highest at 293 K, attributed to the IME adsorption ability being large at 293 K and deposited films with fine crystals becoming smooth..
6. 裵 聖和, 大上 悟, 谷ノ内 勇樹, 孫 仁俊, 中野 博昭, ジンケート浴からの Zn-Ni 合金電析挙動に及ぼす 光沢剤と浴温の相乗作用, 鉄と鋼, https://doi.org/10.2355/tetsutohagane.TETSU-2021-105, 108, 4, 268-281, 2022.04, Zn–Ni alloys were electrodeposited on a Cu electrode at 10–5000 A·m−2, 5 × 104 C·m−2, and 293, 313 and 333 K in unagitated zincate solutions containing the reaction product of epichlorohydrin and imidazole (IME) as a brightener. The synergistic effect of IEM and solution temperature on the deposition behavior of Zn–Ni alloy was investigated. The transition current density, at which the deposition behavior shifted from the normal type to anomalous ones, decreased with IME at 293 K, but didn’t change regardless of IME addition at 313 and 333 K. The suppression effect of IME on the Zn and Ni depositions during alloy deposition was observed at 293 K, while at 313 and 333 K, the suppression effect was decreased on the Zn deposition but was maintained on the Ni deposition. Therefore, Ni content in deposits significantly decreased with IME as temperature increased. The current efficiency for Zn deposition significantly decreased with IME at 293 K, while the degree of decrease was small at 313 and 333 K. The content of C in deposits was highest at 293 K, and decreased with increasing solution temperature, indicating that the adsorption ability of IME on the cathode decreases with increasing temperature. As a result, the sup- pression effect of IME on the Zn deposition seems to decrease with increasing temperature. The gloss of deposited films was highest at 293 K.
This is attributed to adsorption ability of IME being large at 293 K and depos- ited films with fine crystals becoming smooth..
7. Kentaro Ochi, Makoto Sekiguchi, Satoshi Oue, Hiroaki Nakano, Effect of Halide Ions on Electrodeposition Behavior and Morphology of Electrolytic Copper Powder, Materials Transaction, https://doi.org/10.2320/matertrans.MT-M2021126, 62, 11, 1647-1652, 2021.11, To investigate the effect of halide ions on the electrodeposition behavior and morphology of copper powder, polarization curves were measured and constant current electrolysis of 300 and 500 A·m−2 was conducted in an electrolytic solution containing 0.079 mol·dm−3 Cu2+ and 0.5 mol·dm−3 free H2SO4 at 293 and 303 K without stirring. Cl− promoted the deposition of copper powder, while Br− and I− suppressed deposition. The current efficiency for copper deposition increased with the addition of Cl− and decreased with the addition of Br−. The addition of Cl− reduced the average particle size of the copper powder and caused the dendrite-shaped branches and trunks to grow thinner and longer, resulting in a lower tap density. In contrast, the addition of Br− caused the average particle size, average crystallite size, and tap density of the copper powder to decrease. With increasing Cl− concentration, the current efficiency for copper deposition increased, that is, copper deposition was promoted. This even occurred in the region in which Cu2+ ion diffusion was the rate-determining process, indicating that the deposition of copper powder was affected by the charge-transfer process. The change in the morphology of the copper powder with the addition of halide ions is attributed to the change in the charge-transfer process. The deposition of copper powder appears to proceed under a mixed rate-determining process involving the diffusion of Cu2+ ions and charge transfer.

This Paper was Originally Published in Japanese in J. Japan Inst. Met. Mater. 85 (2021) 207–212. Captions of all figures and tables are slightly modified..
8. Sung Hwa BAE, Satoshi OUE,Injoon SON and Hiroaki NAKANO, Effect of Reaction Product of Epichlorohydrin and Imidazole on the Electrodeposition Behavior of Zn–Ni Alloy from Alkaline Zincate Solution, ISIJ International, https://doi.org/10.2355/isijinternational.ISIJINT-2021-080, 61, 8, 2256-2263, 2021.08, A Zn–Ni alloy was electrodeposited on a Cu electrode at a current density of 10–5 000 A·m − 2, a charge of 5 × 104 C·m−2, and temperature of 293 K in an unagitated zincate solution containing the reaction product of epichlorohydrin and imidazole (EI polymer) as a brightener. The effect of the EI polymer on the deposition behavior of the Zn–Ni alloy was investigated. The transition current densities at which the deposition behavior shifted from the normal type to anomalous were 50–100 A·m−2 and 10–20 A·m−2 in the EI polymer-free solution and polymer containing solutions, respectively, indicating that the EI polymer decreased the transition current density. The transition current density corresponded to the current density at which the potential of the total polarization curve significantly shifted from the more noble region than the equilibrium potential of Zn to the less noble region. The decrease in transition current density with EI polymer was attributed to the suppression of hydrogen evolution. In addition, the current efficiency for alloy deposition in the high-current-density region decreased due to the suppression of both Zn and Ni depositions. The Ni content of deposited films decreased with EI polymer, indicating that Ni deposition was more suppressed with the EI polymer addition than Zn deposition. With increasing current density, the crystals of the films deposited from the EI polymer-containing solution smoothened and showed sig- nificant brightness. The oxidation reaction of the films deposited from the EI polymer-containing solution was suppressed, thus causing the corrosion potential to shift to a noble direction..
9. Kenta Fukumoto, Satoshi Oue, Tsukasa Niwa, Yoshiharu Kikuchi, Shinya Akamatsu and Hiroaki Nakano, E!ect of Organic Additives on Electrodeposition Behavior of Zn from Zincate Solution Containing Potassium Hydroxide and Its Micro Structure, Materials Transactions, doi:10.2320/matertrans.MT-M2021027, 62, 6, 807-814, 2021.06, Zn was electrodeposited on an Fe electrode at a current density of 50!5000 A·m"2, charge of 4 © 104 C·m"2, and temperature of 313 K in an unagitated zincate solution containing 0.62 mol·dm"3 of ZnO, 4.0 mol·dm"3 of KOH or NaOH, and organic additives. The e!ects of KOH and NaOH on the deposition behavior of Zn in the solution containing the organic additives and on the microstructure of the deposits were investigated. In a solution containing a straight-chain polymer composed of a quaternary ammonium cation (PQ) and a quaternary ammonium salt with a benzene ring (QA), the current e"ciency for Zn deposition in a high-current-density region (1000!5000 A·m"2) to produce glossy #lms was higher with KOH than that with NaOH. At high current densities above 1000 A·m"2, the Zn deposition approached the di!usion limitation of ZnO22" ions. With the addition of PQ and QA, the di!usion of ZnO22" ions was signi#cantly suppressed, and the degree of suppression was smaller with KOH than that with NaOH. The polarization resistance at 200 A·m"2, which was investigated through alternating current impedance, revealed that the adsorption ability of PQ and QA onto the cathode was smaller with KOH than that with NaOH. Since the suppression e!ect of the additives on the Zn deposition was smaller with KOH than that with NaOH, the current e"ciency for Zn deposition in the high-current-density region was larger with KOH. The upper limit of the current density needed to produce glossy #lms was smaller with KOH than that with NaOH, and spongy thin #lms were partially observed on platelet crystals obtained at high current densities in the KOH solution. The C content resulting from the additives in the deposited Zn was smaller with KOH because the adsorption ability of PQ and QA onto the cathode was smaller with KOH than that with NaOH. .
10. Keisuke FUKUDA, Yuki KASHIWA, Satoshi OUE, Tomio TAKASU, Hiroaki NAKANO, Effect of Additives on the Deposition Behavior and Micro Structure of Invar Fe–Ni Alloys with Low Thermal Expansion Electrodeposited from Watt’s Solution, ISIJ International, https://doi.org/10.2355/isijinternational.ISIJINT-2020-105, 1, 3, 919-928, 2021.03, The electrodeposition of Invar Fe–Ni alloy with low thermal expansion was performed at 100–5 000 A·m􏰖􏰗 and 105 C·m􏰖􏰗 in agitated Watt’s solutions containing NiSO4, NiCl2, FeSO4, malonic acid (C3H4O4), saccharin sodium (C7H4NNaO3S), and H3BO3 at 50°C. With increasing concentration of malonic acid, the Ni content in deposits formed at current densities greater than 2 000 A·m 􏰖 􏰗 decreased, whereas the Ni content increased in deposits formed at current densities less than 1 000 A·m 􏰖 􏰗. The current efficiency for alloy deposition decreased with increasing concentration of malonic acid. The deposits were com- posed of granular crystals whose size decreased with increasing concentration of malonic acid. With the addition of saccharin, the Ni content in the deposits decreased substantially, and the current efficiency for alloy deposition increased. With the addition of boric acid, the Ni content in the deposits somewhat decreased, and the current efficiency for alloy deposition increased. The surface morphology of deposits changed as the current density was varied and with the addition of saccharin, whereas it rarely changed with the addition of boric acid. The morphology was found to depend on the Ni content in the deposits. The deposits with a Ni content of 29–38 mass% were composed of granular crystals approximately 300 nm in size, whereas the deposits with a Ni content of 41–52 mass% exhibited a smooth surface that consisted of fine crystals. The effects of additives on the Ni content in deposits and current efficiency can be explained by the changes in the partial polarization curves for Fe and Ni depositions and H2 evolution during Fe–Ni alloy deposition..
11. Effect of Reaction Product of Epichlorohydrin and Imidazole on the Electrodeposition Behavior of Zn-Ni Alloy from Alkaline Zincate Solution
.
12. E!ect of Organic Additives on Electrodeposition Behavior of Zn from Zincate Solution Containing Potassium Hydroxide and Its Micro Structure.
13. Daiki Ueda , Satoshi Oue , Tomio Takasu and Hiroaki Nakano, Effect of Polyethylene Glycol on Electrodeposition of Zn Active Metal Oxide Composites from a Particle-Free Solution, Materials Transactions, doi:10.2320/matertrans.MT-M2020164, 61, 11, 2170-2177, 2020.11, Electrodeposition of Zn!Zr and Zn!V oxide composites was performed under galvanostatic conditions at 313 K on unagitated pH 2 sulfate solutions containing Zn2+ and Zr4+ or VO2+ ions and an additive such as polyethylene glycol (PEG). The e!ects of PEG addition on the co- deposition of Zr and V oxides and their polarization behavior, and on the microstructure of the deposits, were investigated. Although the Zr content in the deposits obtained from the Zn!Zr solution in the absence of PEG was approximately zero, it increased signi"cantly at a current density of above 1000A·m"2 following the addition of PEG. In the Zn!V solution, the V content in the deposits obtained from 100 to 2000 A·m"2 was higher with PEG than without it. In the presence of PEG, the cathode potential polarized, the rate of hydrogen evolution increased, and the hydrolysis reaction of Zr4+ and VO2+ ions proceeded smoothly, resulting in an increase in the Zr and V content in the deposits. Additionally, the crystal platelets of Zn in the Zn!Zr and the Zn!V oxide "lms became "ne, and the surface coverage of the spongiform Zr and "lm-like V oxides increased. Furthermore, the corrosion current densities of the Zn!Zr and Zn!V oxide "lms obtained from the solution with PEG were lower than those from the solution without it. The reduction rate of dissolved oxygen decreased in the "lms in the presence of PEG, thereby leading to a decrease in the corrosion current density..
14. Keita Uchida, Satoshi Oue, Hiroaki Nakano, Effect of Polyethylene Glycol and Glue on Electrodeposition Behavior of Zn from Electrowinning solution and its Crystal Structure, Materials Transactions, https://doi.org/10.2320/matertrans.MT-M2020182, 61, 10, 1958-1966, 2020.10, To elucidate the e!ects of polyethylene glycol (PEG) and glue on the deposition of Zn from electrowinning solution and its resulting crystal structure, Zn electrodeposition was performed at a current density of 600 A·m!2 and a charge of 8.64 © 106 C·m!2 in an agitated sulfate solution containing 1.07 and 1.8 mol·dm!3 of ZnSO4 and H2SO4, respectively, at 45°C. With the additions of PEG and glue, the evolution of hydrogen was suppressed at the current density region less than the critical current density for Zn deposition, decreasing the critical current density of Zn. The degree of decrease in the critical current density of Zn was larger with glue than that with PEG. The current e"ciency for Zn deposition was higher with PEG and glue than that without at the low current density region because the critical current density of Zn decreased with additives. Since the additives suppressed Zn deposition more than the hydrogen evolution at the high current density region, the current e"ciency of Zn decreased by increasing the additive concentration. At the high current density region, little di!erence was observed in the current e"ciency of Zn between PEG and glue. The e!ect of the molecular weight of PEG on the current e"ciency of Zn was rarely observed at the molecular weight above 2000. With the addition of PEG, the deposits became #ne platelets with preferred orientation of f101"1g and layered pyramidally, while f112"0g orientation was obtained, and the platelets grew perpendicularly to the substrate with the addition of glue. The surface roughness of deposited Zn decreased with additives, and it decreased further with PEG compared with that with glue..
15. Atsuhiro Suzuki , Satoshi Oue and Hiroaki Nakano, Synergistic Effects of Additives on the Deposition Behavior, Throwing Power and Surface Roughness of Cu Obtained from Electrorefining Solution, Materials Transactions, doi:10.2320/matertrans.M-M2020808, 61, 5, 972-979, 2020.05, To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the deposition behavior, throwing power, and surface roughness of Cu obtained from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m12 and a charge of 5 © 105 C·m12 in an unagitated sulfate solution containing 0.708 and 2.04 mol·dm13 of CuSO4 and H2SO4, respectively, at a temperature of 60°C. Gelatin and chloride ions have synergistic effects on the polarization for Cu deposition, and the polarization effect increased with each concentration. Thiourea was found to promote Cu deposition and decrease the polarization effects of gelatin and chloride ions as its concentration in the solution were increased. The throwing power and surface roughness of the deposited Cu changed depending on the concentration of the three additives. The throwing power of Cu significantly worsened with increasing concentrations of thiourea and its surface roughness decreased with decreasing concentrations of chloride ions. With increasing concentrations of gelatin, the throwing power of Cu improved and its surface roughness decreased. The correlation between the throwing power and polarization resistance of Cu deposition was observed, and the throwing power of Cu improved as its polarization resistance increased. Since the surface roughness of deposited Cu is a result of its micro deposition properties, it does not depend on polarization resistance alone. Thiourea appeared to promote Cu deposition at the concavity, and therefore, it decreased the surface roughness of the deposited copper..
16. Kenta Fukumoto, Satoshi Oue, Yoshiharu Kikuchi, Shinya Akamatsu, Tomio Takasu, Hiroaki Nakano, Effect of Organic Additives on the Electrodeposition Behavior of Zn from an Alkaline Zincate Solution and Its Microstructure, Materials Transactions, doi:10.2320/matertrans.MT-M2019316, 61, 3, 497-505, 2020.03, Electrodeposition of Zn was performed on an Fe electrode at a current density of 20­5000 A·m12 and a charge of 4 © 104 C·m12 in an unagitated zincate solution at 313 K containing 0.62 mol·dm13 of ZnO, 4.0 mol·dm13 of NaOH, and organic additives. The effects of organic additives on the deposition behavior of Zn and the microstructure of the deposits were investigated. Glossy films were obtained by depositing at current densities higher than 1000A·m12 from the solution containing additives of a straight-chain polymer composed of a quaternary ammonium cation (PQ) and a quaternary ammonium salt with a benzene ring (QA). The polarization curve was separated into partial polarization curves of Zn deposition and hydrogen evolution by using the galvanostatic data of Zn deposition. The overpotentials of the charge transfer of Zn deposition and that of ZnO221 ion diffusion increased with the addition of PQ and QA. The increase in overpotential was considerable at potentials less noble than 11.5 V. Zn deposition reached the diffusion limit of ZnO221 ions at potentials less noble than 11.5 V, indicating that the diffusion of ZnO221 ions was suppressed considerably by PQ and QA. With the addition of PQ and QA, C, N, and H were codeposited with Zn, which demonstrated that the additives of PQ and QA were incorporated into the deposited films. Zn crystallite size decreased with increasing current density. At a high current density of 5000 A·m12, the crystallite size decreased with the addition of PQ and QA, and the surface of the film was smooth. The orientation index of the f101"0g plane of Zn deposited from the solution containing PQ and QA increased with increasing current density. The changes in the crystallite size and crystal orientation of deposited Zn were explained by the deposition overpotential..
17. Keisuke FUKUDA, Yuki KASHIWA, Satoshi OUE, Tomio TAKASU, Hiroaki NAKANO , Effects of Electrolysis Conditions on the Formation of Electrodeposited Invar Fe–Ni Alloys with Low Thermal Expansion, ISIJ International, https://doi.org/10.2355/isijinternational.ISIJINT-2019-023, 59, 9, 1632-1641, 2019.09, To elucidate the effects of the electrolysis conditions on the formation of electrodeposited invar Fe–Ni alloys with low thermal expansion, Fe–Ni electrodeposition was performed at 10–5 000 A·m − 2 and 5 × 105 C·m−2 in an agitated solution containing NiSO4, NiCl2, FeSO4, H3BO3, C7H4NNaO3S, and C3H4O4 at 40°C–60°C. In the low-current-density region, the Ni content in the deposits significantly decreased with increasing current density, reached a minimum, and then increased after reaching the diffusion-limiting current density for Fe deposition. With the increasing concentration of FeSO4 in the solution, the Ni con- tent in the deposits decreased in the lower-current-density region, reached a constant at a moderate cur- rent density, and then began to increase at higher current density. As a result, the current density range in which the Ni content in the deposits reached a minimum and remained constant became wider with increasing FeSO4 concentration. With the decreasing pH of the solution, since the partial polarization curve for H2 evolution and the total polarization curve shifted to a higher-current-density region, the curve of the Ni content in the deposits as a function of the current density shifted toward a higher current density. The change in the composition of the Fe–Ni alloy deposits because of the electrolysis conditions can be explained by the changes in the total polarization curve and the partial polarization curves for Fe and Ni deposition and H2 evolution..
18. Y. Ozaki, Y. Mugita, M. Aramaki, O. Furukimi, S. Oue, F. Jiang, T. Tsuji, A. Takeuchi, M. Uesugi and K. Ashizuka , Four-dimensional observation of ductile fracture in sintered iron using synchrotron X-ray laminography, Powder Metallurgy, https://doi.org/10.1080/00325899.2019.1585032, 2019.03, Synchrotron X-ray laminography was used to examine the time-dependent evolution of the three-dimensional (3D) morphology of micropores in sintered iron during the tensile test. 3D snapshots showed that the networked open pores grow wider than 20 μm along the tensile direction, resulting in the internal necking of the specimen. Subsequently, these pores initiated the cracks perpendicular to the tensile direction by coalescing with the surrounding pre-existing microvoids or with the secondary-generated voids immediately before fracture. Topological analysis of the barycentric positions of these microvoids showed that they form the two-dimensional networks within the ∼20 μm of radius area. These observations strongly indicate that the microvoid coalescence could occur on shear planes formed close to the enlarged open pores or between closed pores by strain accumulation and play an important role in the crack initiation..
19. Yosuke Hara, Daiki Ueda, Satoshi Oue and Hiroaki Nakano, The Effects of Additives on the Electrodeposition of a Zn-Zr Oxide Composite from Dispersed Particle-Free Solution, Materials Transactions, doi:10.2320/matertrans.M2018353, 60, 2, 297-305, 2019.02, Electrodeposition of a Zn­Zr oxide composite was performed under galvanostatic conditions from an unagitated sulfate solution containing
Zn2+ and Zr ions, as well as additives, such as NO3

1 ions and polyethylene glycol (PEG), at pH 2 and 313 K. The effect of these additives on the
codeposition of Zr oxide and its polarization behavior, as well as the microstructure of the deposits, was investigated. The Zr content in the
deposits obtained at varying current densities increased significantly with the addition of 2.0 g·dm13 of NaNO3. Zn­Zr oxide films deposited
from the NaNO3-containing solution showed a massive structure composed of fine crystals without crystalline Zn platelets, although large cracks
were observed between the large crystals. EDX analysis revealed that Zr codeposited on the massive crystals as a fine concave-convex oxide.
The corrosion current density of the Zn­Zr oxide films deposited from the NaNO3-containing solution was almost the same as that of pure Zn
deposits, showing that there is no improvement in corrosion resistance when Zn is codeposited with Zr oxide. Moreover, Zr content in the
deposits obtained from the PEG-containing solution increased significantly along with increasing current density above 1000 A·m12
. With the
addition of 1000 mg·dm13 of PEG, the crystalline Zn platelets disappeared, and the deposits were instead composed of fine mesh-like crystals
with a preferred orientation of the f1010! gZn plane, resulting in a smooth surface. The cathodic current density for the reduction of dissolved
oxygen on the Zn­Zr oxide films deposited from the PEG-containing solution was smaller than that of the pure Zn deposits, and as a result, the
corrosion current density of the Zn­Zr oxide films was smaller than that of the pure Zn deposits. The increase in Zr content in the deposits with
NO3
1 ions and PEG is attributed to the acceleration of the hydrolysis of Zr ions. [doi:10.2320/matertrans.M2018353].
20. Honami Kawano, Satoshi Oue, Takashi Futaba, Akinobu Kobayashi, Yasuto Goto, Hiroaki Nakano, Effect of Surface Textures of Steel Sheets on the Crystal Orientation of Electrodeposited Zinc, ISIJ International, https://doi.org/10.2355/isijinternational.ISIJINT-2018-429, 58, 11, 2117-2124, 2018.11, Prior to electrodeposition, steel sheets underwent polishing using emery paper, buff, and then electro-
lytic polishing. Zn deposition was performed galvanostatically at 1 500 A/m2

in an agitated sulfate solution
at 40°C to investigate the effect of the surface textures of steel sheets on the crystal orientation of Zn.
The strain of the steel surface and the decrease in Fe grain size due to this strain were largest with emery

paper polishing, then with buff polishing, then when unpolished, and were smallest after electrolytic pol-
ishing. The preferred orientation of the {0001} Zn basal plane of the hcp structure was largest with elec-
trolytic polishing, and decreased in the following order: unpolished, buff polishing, and then with emery

paper polishing. Thus, the preference of the {0001} orientation of Zn increased with decreasing the strain
of steel sheets and increasing the grain size of Fe. With electrolytic polishing, the strain applied to the
steel sheets was decreased, the grain size of Fe increased, and therefore the epitaxial growth of deposited
Zn occurred easily. The initial Zn deposits appeared to grow epitaxially as indicated by the orientation
relationship of {111}Fe//{0001}Zn because the preferred orientation of the steel substrate used in this
study is {111} Fe. The preferred orientation of {0001} Zn seems to be more common under conditions
where the epitaxial growth of deposited Zn is easy to occur..
21. Kousuke Fuchi, Satoshi Oue, Yoshiharu Kikuchi, Shinya Akamatsu, Yuki Kashiwa, Hiroaki Nakano, Electrodeposition Behavior of Zn-Polyethyleneimine Composite from Sulfate Solution and Its Micro Structure, Materials Transactions, doi:10.2320/matertrans.M2018243, 59, 11, 1767-1776, 2018.11, Electrodeposition of Zn-polyethyleneimine composite was performed at 100­12000 A·m12 and 4.8 © 105 C·m12 in agitated sulfate solutions containing 1.84 mol·dm13 of ZnSO4 and 4 g·dm13 of polyethyleneimine at pH 1.8 and at 313 K: the composite’s deposition behavior and the relevant deposits’ micro-structure were investigated. The films obtained at current densities above 4000 A·m12 from solutions containing polyethyleneimine exhibited gloss, and the gloss was highest for solutions containing polyethyleneimine with the highest molecular weight (70000). The preferred orientation of deposited Zn crystals changed from {0001} to {112"0} and {101"0} in the presence of polyethyleneimine, and the size of the platelet-shaped Zn crystals decreased as the polyethyleneimine molecular weight and current density increased. The deposition of Zn was polarized in the presence of polyethyleneimine, and the degree of polarization increased with the current density and with polyethyleneimine’s molecular weight. The C and N contents in deposited films increased as the polyethyleneimine molecular weight and current density increased, indicating an increase in the tendency of polyethyleneimine to be adsorbed onto the cathode. During deposition, polyethyleneimine buffered somewhat the pH increase in the layer of the electrolyte solution in contact with the cathode. At this time, H+ ions are released from polyethyleneimine because of an increase in pH in the cathode’s vicinity, and consequently, the number of electron lone-pairs in N atoms of polyethyleneimine increased, resulting in an increase in the adsorption ability of polyethyleneimine onto the cathode..
22. Jiang, K, Nakano, H., Oue, S., Morikawa, T., Li, Z., Tian, W., Interrupted Interrupted in situ EBSD study of texture evolution and mechanism of surface grains in electroformed Ni after annealing with an initially duplex + fiber texture during uniaxial tensile deformation, MATERIALS CHARACTERIZATION, 10.1016/j.matchar.2018.05.004, 141, 238-247, 2018.07, The texture evolution process and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100⟩ + 〈111〉 fiber texture during uniaxial tensile deformation were investigated by using interrupted in situ electron backscattered diffraction. The results showed that the initially duplex 〈100〉 + 〈111〉 fiber texture evolved into the metastable Cube orientation with a weak Cu orientation during the uniaxial tensile deformation. The volume fractions of 〈100〉 and 〈111〉 fiber texture decreased from 54.0% to 29.3% and 16.6% to 6.6%, respectively. The volume of the Cube orientation remained almost stable at 12%, whereas that of the Cu orientation increased from 1% to 2.9%. A simulation of the final preferred orientation based on the Taylor model was a cubic texture, which qualitatively agreed well with the experimental result. The simulated results indicated that the formed Cube and Cu textures evolved from the initial 〈100〉 and 〈111〉 fiber textures, respectively. .
23. Electrodeposition Behavior of Zn-Polyethyleneimine Composite from Sulfate Solution and Its Micro Structure.
24. Akinori Nakamura, Satoshi Oue, Hiroki Koga, Hiroaki Nakano, Formation behavior of phosphoric acid-based chemical conversion films containing alkaline earth metals on magnesium alloy, Materials Transactions, 10.2320/matertrans.M2016463, 58, 7, 1007-1013, 2017.07, The phosphating of Mg alloy was performed in unagitated solutions containing 1 g·dm-3 of Mg, Ca, Sr, and Ba as alkaline earth metals (M) and 50 g·dm-3 of H3PO4 of pH 3 at 40°C for 3 min. The structure and formation behavior of the phosphate films were investigated. The X-ray diffraction patterns of phosphate films broadened irrespective of the type of alkaline earth metal, which was a characteristic of an amorphous structure. XPS analysis revealed that the valence of P in the phosphate films was pentavalent. The pH in the vicinity of the Mg alloy during the phosphating, as measured using an Sb microelectrode, was approximately 10.4, 11.4, 10.7, and 12.0 in the solutions containing Mg, Ca, Sr, and Ba, respectively. This shows that phosphoric acid dissociates to the third stage during the phosphating, and the phosphate films comprising M3(PO4)2 containing an alkaline earth metal are formed. The phosphating was successively performed in two types of solutions containing different alkaline earth metals, and the cross section was analyzed. As a result, it was determined that the new phosphate films were formed at the interface between the Mg alloy substrate and phosphate films, and the previously formed phosphate films were boosted in the films..
25. Yuki Sato, Satoshi Oue, Shinichi Heguri, Hiroaki Nakano, Effect of dissolved impurities on the lightness and surface morphology of nickel deposits from chloride electrowinning solutions, Materials Transactions, 10.2320/matertrans.M2016442, 58, 4, 606-612, 2017.04, This study investigated the effect of dissolved impurities on the lightness, surface morphology, and current efficiency of deposited nickel during electrowinning. Nickel electrodeposition was performed at a current density of 300 A·m-2 and 7.2 × 105 C·m-2 of charge in an unagitated chloride solution containing Mn2+, Cr3+, and SO4 2- ion impurities with a pH from 1 to 3, at a temperature of 333 K. Solutions containing 10 g·dm-3 of Mn2+ resulted in a slight decrease in current efficiency for nickel deposition and smaller crystal sizes in the deposited nickel. The lightness of deposited nickel decreased for Mn2+ concentrations exceeding 1 g·dm-3. When nickel deposition was performed using a soluble nickel anode to prevent the formation of MnO2 at the anode, greater nickel lightness resulted than with an insoluble anode, suggesting that MnO2 produced by the insoluble anode caused decreased lightness of nickel. In solutions containing Cr3+, the current efficiency of nickel gradually decreased with increasing Cr3+ concentrations and significantly decreased at Cr3+ concentrations above 0.1 g·dm-3. The lightness of deposited Ni greatly decreased with increasing concentrations of Cr3+ above 0.001 g·dm-3. Formation of Cr(OH)3 at the cathode layer is presumed to suppress nickel deposition, resulting in some codeposition of NiO and Ni(OH)2 along with Ni, which causes the nickel current efficiency and lightness to decrease. Conversely, solutions containing SO4 2- resulted in a moderate decrease in nickel current efficiency at SO4 -2 concentrations above 50 g·dm-3 and a significant decrease above 100 g·dm-3. The lightness of deposited nickel increased slightly at SO4 -2 concentrations of 20 g·dm-3 and strongly increased above 20 g·dm-3. Because the overpotential for nickel deposition increases with the concentration of SO4 2, the surface of the deposited nickel becomes smooth, resulting in greater lightness..
26. Keisuke Kashida, Satoshi Oue, Hiroaki Nakano, Effect of chloride ions in electrowinning solutions on zinc deposition behavior and crystal texture, Materials Transactions, 10.2320/matertrans.M-M2017827, 58, 10, 1418-1426, 2017.10, To clarify the effect of chloride ions on Zn electrowinning in terms of deposition behavior and crystal texture, the partial polarization curve, current efficiency, and AC impedance for Zn deposition as well as its morphology and crystal orientation were investigated. In solutions containing chloride ions, the partial polarization curve for Zn deposition was evidently depolarized, and the degree of depolarization increased when increasing the concentration of chloride ions from 300 to 6,000 mg/L. The exchange current density i0 for Zn deposition also increased with increasing chloride ion concentration, which indicates that the chloride ions promote the charge-transfer process during Zn deposition. The polarization resistance for Zn deposition measured by AC impedance decreased with increasing chloride ion concentration. Conversely, the capacity of the electric double layer increased with increasing chloride ion concentration from 300 to 1,200 mg/L; however, from 3,000 to 6,000 mg/L, the capacity decreased and approached that obtained from a chloride ion-free solution. On the other hand, the partial polarization curve for hydrogen evolution was almost unchanged by the presence of chloride ions. As a result, the current efficiency of Zn deposition increased by 5–7% and 1.7% in the initial stage of deposition (up until the thickness of Zn reached approximately 2.1 μm) and at 500 A/m2 for 6 hours (482 μm), respectively. With the addition of 300 to 1,200 mg/L of chloride ions, the deposited Zn exhibited a preferred orientation of {0001} plane, and it increased with increasing chloride ion concentration, which is attributed to a decrease in the overpotential for Zn deposition; however, no preferred orientation of a specific plane was shown in the deposits when increasing the concentration of chloride ions above 3,000 mg/L. Some spherical concavities resulting from traces of evolved hydrogen gas were observed on the surface of deposited Zn, and the size of the concavities increased with increasing chloride ion concentration. The size of platelet crystals of the deposited Zn decreased with increasing chloride ion concentration, which indicates that the chloride ions possibly promote the nucleation rate of Zn crystals due to specific adsorption onto the cathode..
27. Atsuhiro Suzuki, Satoshi Oue, Shigeo Kobayashi, Hiroaki Nakano, Synergistic effect of additives on the surface roughness and throwing power of copper deposited from electrorefining solution, Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, 10.2320/jinstmet.J2017015, 81, 7, 358-365, 2017.01, To elucidate the synergistic effect of gelatin, thiourea and chloride ions on the surface roughness, throwing power and polarization curves for Cu deposition from electrorefining solution, Cu electrodeposition was performed at a current density of 200 A•m-2 and 5×105 C•m-2 of charge in an unagitated sulfate solution containing 0.708 mol•dm-3 of CuSO4 and 2.04 mol•dm-3 of H2SO4 at a temperature of 60°C. In solutions containing three kinds of additives such as gelatin, thiourea and chloride ions, the surface roughness of deposited Cu decreased with increasing the concentration of thiouea and gelatin and decreasing the chloride ions. On the other hand, the throwing power of deposited Cu was improved with decrease in thiourea and increase in gelatin in solutions containing three kinds of additives. The throwing power of deposited Cu was significantly improved in solution containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solution containing both gelatin and chloride ions, which resulting in improvement of throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a leveling effect is expected owing to the promotion of deposition at recesses..
28. Atsuhiro Suzuki, Satoshi Oue, Shigeo Kobayashi, Hiroaki Nakano, Effects of additives on the surface roughness and throwing power of copper deposited from electrorefining solutions, Materials Transactions, 10.2320/matertrans.M2017215, 58, 11, 1538-1545, 2017.01, To elucidate the synergistic effects of gelatin, thiourea, and chloride ions on the surface roughness, throwing power, and polarization curves for Cu deposition from electrorefining solutions, Cu electrodeposition was performed at a current density of 200 A·m−2 and a charge of 5 × 105 C·m−2 in an unagitated sulfate solution containing 0.708 mol·dm−3 of CuSO4 and 2.04 mol·dm−3 of H2SO4 at a temperature of 60C. In solutions containing all three additives (gelatin, thiourea, and chloride ions), the surface roughness of deposited Cu decreased with increasing thiourea and gelatin concentrations and decreasing chloride ions concentration. On the other hand, the throwing power of deposited Cu improved with decreasing thiourea concentration and increasing gelatin concentration in solutions containing all three additives. The throwing power of deposited Cu was significantly improved in solutions containing both gelatin and chloride ions. The polarization resistance dE/di for Cu deposition increased in solutions containing both gelatin and chloride ions, resulting in an improvement in the throwing power of Cu deposition. As small amounts of thiourea have a depolarization effect on Cu deposition, a smoothing effect is expected to result from the promotion of deposition at recesses..
29. Osamu Furukimi, Chatcharit Kiattisaksri, Yuji Takeda, Masatoshi Aramaki, Satoshi Oue, Shinji Munetoh, Masaki Tanaka, Void nucleation behavior of single-crystal high-purity iron specimens subjected to tensile deformation, Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 10.1016/j.msea.2017.06.084, 701, 221-225, 2017.07, Void nucleation plays an important role for determining local deformation properties of ductile materials. In this study, the void nucleation behavior of single-crystal iron was examined in tensile tests. Two micrometer-size single crystals having a different type of slip extracted from electrodeposited pure iron were used to investigate the fracture mechanics during tensile deformation. Scanning electron microscopy (SEM) and high voltage electron microscopy (HVEM) images verified the existence of only a single slip system in the smaller specimen (cross-sectional area A = 16 µm2) and furthermore, no voids were observed. However, multiple slips and voids were observed in the larger specimen (A = 28 µm2). These findings allowed us to reveal that multiple slips are a necessary criterion for void nucleation in single-crystal iron..
30. Yuki Sato, Satoshi Oue, Shinichi Hegri, Hiroaki Nakano, Effect of Dissolved Impurities on the Lightness and Surface Morphology of Nickel Deposits from Chloride Electrowinning Solutions, Materials Transactions, doi:10.2320 matertrans.M2016442, 58, 4, 606-612, 2017.04, This study investigated the effect of dissolved impurities on the lightness, surface morphology, and current ef ciency of deposited nickel during electrowinning. Nickel electrodeposition was performed at a current density of 300 A m 2 and 7.2 105 C m 2 of charge in an unagitat- ed chloride solution containing Mn2+, Cr3+, and SO42 ion impurities with a pH from 1 to 3, at a temperature of 333 K. Solutions containing 10 g dm 3 of Mn2+ resulted in a slight decrease in current ef ciency for nickel deposition and smaller crystal sizes in the deposited nickel. The lightness of deposited nickel decreased for Mn2+ concentrations exceeding 1 g dm 3. When nickel deposition was performed using a soluble nickel anode to prevent the formation of MnO2 at the anode, greater nickel lightness resulted than with an insoluble anode, suggesting that MnO2 produced by the insoluble anode caused decreased lightness of nickel. In solutions containing Cr3+, the current ef ciency of nickel gradually decreased with increasing Cr3+ concentrations and signi cantly decreased at Cr3+ concentrations above 0.1 g dm 3. The lightness of deposited Ni greatly decreased with increasing concentrations of Cr3+ above 0.001 g dm 3. Formation of Cr(OH)3 at the cathode layer is presumed to suppress nickel deposition, resulting in some codeposition of NiO and Ni(OH)2 along with Ni, which causes the nickel current ef ciency and lightness to decrease. Conversely, solutions containing SO42 resulted in a moderate decrease in nickel current ef ciency at SO42 concentra- tions above 50 g dm 3 and a signi cant decrease above 100 g dm 3. The lightness of deposited nickel increased slightly at SO42 concentrations of 20 g dm 3 and strongly increased above 20 g dm 3. Because the overpotential for nickel deposition increases with the concentration of SO42 , the surface of the deposited nickel becomes smooth, resulting in greater lightness..
31. Furukimi Osamu, Hiroki Katafuchi, Masatoshi Aramaki, Muhammad Kozin, Satoshi Oue, Koki Yoshida, I. Narita, Naoya Yamada, Masayuki Yamamoto, Wear resistance of Industrial Pure Iron Treated by Nitriding and Quenching Followed by Aging Process, The Japan Society for Heat Treatment, dos:10.2320/matertrans.H-M2016825, 57, 9, 1587-1592, 2016.09.
32. Shinichiro Hayata, Satoshi Oue, Takehiro Takahashi, Hiroaki Nakano, Effect of Annealing Duration on the Structure and Hardness of Electrodeposited Ni–W Alloys, ISIJ, http://dx.doi.org/10.2355/isijinternational.ISIJINT-2016-111, 56, 7, 1248-1255, 2016.07.
33. Hiroaki Nakano, Yosuke Hara, Satoshi Oue, Electrodeposition of Zn–Zr Oxide Composite from Dispersed-Particle-Free Solution, The Japan Institute of Metals and Materials, doi:10.2320 matertrans.M2016084, 57, 7, 1165-1170, 2016.07, Electrodeposition of Zn–Zr oxide composite from an unagitated sulfate solution containing Zn2+ and Zr ions was investigated at pH 1–2 and at 313 K under galvanostatic conditions. The Zr content was higher in deposits formed from the solution at pH 2 than .
34. Shinichiro HAYATA, Satoshi Oue, Takehiro TAKAHASHI, Hiroaki Nakano, Effect of Initial Ni Plating on the Structure and Hardness of Electrodeposited Ni–W Alloys with and without Annealing, ISIJ International, http://dx.doi.org/10.2355/isijinternational.ISIJINT-2016-110, 56, 6, 1048-1056, 2016.06.
35. Hiroaki NAKANO, Shingo Arakawa, Satoshi Oue, Shigeo Kobayashi, Electrodeposition Behavior of Zn–Fe Alloy from Zincate Solution Containing Triethanolamine, doi:10.2320/matertrans.M2015230, 56, 10, 1664-1669, 2015.10, The electrodeposition behavior of Zn­Fe alloys has been investigated at 308K at current densities of 10­500A·m12 and a charge of 5 © 104 C·m12 in an unagitated zincate solution containing triethanolamine, which forms a stable complex with Fe2+ ions. The content of Fe in the deposit changed significantly depending on the current density. At current densities lower than 20A·m12, the content of Fe was approximately 90mass%, that is, the Zn­Fe alloy exhibited normal co-deposition, whereby the electrochemically more noble Fe deposited preferentially. At current densities higher than 100A·m12, however, anomalous co-deposition was observed, whereby the less noble Zn deposited preferentially. The current density at which the Fe content in the deposit changed significantly corresponded to that at which the cathode potential in the total polarization curve abruptly shifted to a less noble region than the equilibrium potential for Zn deposition. Iron deposition and H2 evolution were significantly suppressed by the co-existence of Zn2+ ions in the region of anomalous co-deposition at higher current densities, showing the formation of an inhibitor to deposition arising from Zn2+ ions in the cathode layer. The current efficiency for alloy deposition was not close to zero even in the region of normal co-deposition, and the Fe content in the region of anomalous co-deposition was close to the composition reference line, which shows deposition behavior different from that in sulfate solutions. In the region of normal co- deposition at lower current densities, underpotential deposition of Zn occurred with Fe. TEM analysis revealed that Zn­Fe alloys deposited at lower current densities comprised the stable intermetallic compound Fe5Zn21. The activity coefficient of Zn in the deposit appears to remarkably decrease because of this formation of stable Fe5Zn21..
36. Effect of Initial Ni Plating on the Structure and Hardness of Electrodeposited Ni-W Alloys with and without Annealing.
37. Effect of Annealing Duration on the Structure and Hardness of Electrodeposited Ni-W alloys.
38. Ryo Takahashi, Yuki Sato, Satoshi Oue, Shinichi Heguri, Hiroaki NAKANO, Effect of Electrolysis Condition on the Lightness and Surface Morphology of Ni Deposit from Chloride Electro-winning Solutions, Materials Transactions, doi:10.2320/matertrans.M2014432, 56, 8, 1199-1206, 2015.08, To investigate the effects of current density and pH of the solution on the lightness and surface morphology of Ni deposit, Ni electrodeposition was performed at a current density of 100 to 500 A·m12 and 7.2 © 105 C·m12 of charge, in an unagitated chloride solution with pH 1 to 3, at 333 K. The composition and structure of the surface of deposits were analyzed by radio frequency glow discharge optical emission spectroscopy and three-dimensional scanning electron microscope (3D-SEM). The lightness of the Ni deposit decreased with increasing pH, and was also related to the current density with the minimum reached at 300A·m12. The concentration of the surface oxygen in the deposits increased with pH, with the highest value obtained at 300 A·m12, which shows that the concentration of surface oxygen possibly affects the lightness. On the other hand, the surface of the Ni deposit was composed of several micrometers of pyramidal microcrystals and the mound formed by the aggregation of pyramidal microcrystals. To separate the two types of structural units, the deposits were cut every 200 nm from the top in the thickness direction using 3D SEM. The number and area of the deposits in the cutting plane were measured and it was found that the lightness of the Ni deposit depended on the surface structure. Therefore, the lightness of the Ni deposit seems to depend on both the surface oxygen content and the microstructure of the deposits..
39. Hiroaki NAKANO, Syota Kataoka, Satoshi Oue, Shigeo Kobayashi, Coloration by Zinc–Nickel Composite Films Electrodeposited from a Chloride Solution, DOI: http://dx.doi.org/10.2355/isijinternational.54.1661, 54, 7, 1661-1666, 2014.07, Zn–Ni composite films were electrodeposited under coulostatic (515–5145 C⋅m−2) and galvanostatic (5 A⋅m−2) conditions onto brass plates with a Ni precoating in an unagitated chloride solution at 23°C to investigate the color and structure of the deposited films. The chromaticity of the deposited Zn–Ni com- posite films changed in a clockwise direction in each quadrant of the a*b* diagram of the L*a*b* color space with increasing amount of charge. The deposited films contained S, Zn, and Ni, and their content decreased in the order of S > Zn > Ni. X-ray photoelectron spectroscopy revealed that the deposited films were primarily composed of ZnS, ZnO, and Ni and contained small amounts of Zn(OH)2 and Zn. The color of the deposited films is attributed to interference of light, and the index of refraction of the depos- ited films composed of ZnS, ZnO, and Ni is assumed to be large. When Ni was excluded from the elec- trolytic solution, ZnS did not codeposit and the amount of Zn deposited in the metallic state increased. This result suggests that the Ni deposition induces the codeposition of ZnS..
40. 中野 博昭, 大上 悟, 案浦 康徳, 永井 啓明, 大穂 元人, 福島 久哲, Electrodeposition of Zn–V Oxide Composites from a Strongly Agitated Solution without Dispersed Particles, ISIJ International, http://dx.doi.org/10.2355/isijinternational.54.1906, 54, 8, 1906-1912, 2014.08, The electrodeposition of a Zn–V oxide composite under galvanostatic conditions from an agitated sul- fate solution without dispersed particles and containing Zn2+ and VO2+ at pH 2 and 313 K was investi- gated. Although the V content in the deposits initially decreased with increasing current density, irrespective of the flow rate of electrolyte, a further increase in the current density resulted in an increase in the V content of the deposits. The curves, which show the relationship between the V content in the deposits and the current density, shifted to the higher-current-density region with increasing flow rate of the electrolyte. Agitation of the electrolyte decreased the V content of the deposits but reduced the seg- regation of V oxide. EDX point analysis of the cross-section of the deposits revealed that the V oxide con- centrated at the surface of the deposits. The polarization curves in 3% NaCl solution revealed that the corrosion potential of the deposited Zn–V oxide films depended on the V content in the deposits, irrespec- tive of the flow rate of electrolyte, and that the corrosion potential shifted toward the more noble direction with the codeposition of V oxide when the V content in the deposits was less than 2 mass%. At V con- tents of .
41. Hiroaki NAKANO, Hiroto Yamaguchi, Youhei Yamada, Satoshi Oue, In-Joon Son, Zenji Horita, Hiroki Koga, Effects of High-Pressure Torsion on the Pitting Corrosion Resistance of Aluminum-Iron Alloys, JOURNAL OF THE JAPAN INSTITUTE OF METALS, 10.2320/jinstmet.J20130401, 77, 11, 489-496, 2013.11.
42. Hiroaki NAKANO, Hiroto Yamaguchi, Youhei Yamada, Satoshi Oue, In-Joon Son, Zenji Horita, Hiroki Koga, Effects of High-Pressure Torsion on the Pitting Corrosion Resistance of Aluminum-Iron Alloys, JOURNAL OF THE JAPAN INSTITUTE OF METALS, 10.2320/jinstmet.J20130401, 77, 11, 489-496, 2013.11.
43. Hiroaki NAKANO, Shingo Arakawa, Satoshi Oue, Shigeo Kobayashi, Electrodeposition Behavior of Zn–Ni alloys from an Alkaline Zincate Solution Containing Ethylenediamine, ISIJ international, 53, 10, 1869-1875, 2013.10.
44. Hiroaki NAKANO, Shitoku Shibata, Shingo Arakawa, Satoshi Oue, Shigeo Kobayashi, Electrodeposition Behavior of Zn–Co Alloys from an Alkaline Zincate Solution Containing Triethanolamine, ISIJ international, 53, 10, 1863-1868, 2013.10.
45. Hiroaki NAKANO, Satoshi Oue, Hisaaki FUKUSHIMA, Shigeo Kobayashi, Nobuyoshi Sogabe, Evaluation of harmful effects of impurities in Zn electrowinning solution using cyclic voltammetry, Proc. of European Metallurgical Conference 2013 (EMC2013), 2013.06.
46. Hiroaki Nakano, Shingo Arakawa, Yuya Takada, Satoshi Oue and Shigeo Kobayashi, Electrodeposition Behavior of a Zn­Ni Alloy in an Alkaline Zincate Solution, Materials Transactions, 10.2320/matertrans.M2012241, 53, 11, 1946-1951, 2012.11, Electrodeposition behavior of Zn­Ni alloys was investigated at current densities of 10­500 A·m12 and a charge of 5 © 104 C·m12 in an unagitated zincate solution containing triethanolamine, which forms a stable complex with Ni2+ ions at 308 K. At low current densities, the Zn­ Ni alloy exhibited normal codeposition, wherein electrochemically more noble Ni deposited preferentially, while at high current densities, it exhibited anomalous codeposition, wherein less noble Zn deposited preferentially. Ni deposition and H2 evolution were significantly suppressed in the region of anomalous codeposition at higher current densities, showing the formation of an inhibitor for deposition, which results from Zn2+ ions in the cathode layer. In contrast, in the region of normal codeposition at lower current densities, the underpotential deposition of Zn apparently occurred with Ni. Because Zn­Ni alloys are composed of a stable intermetallic compound of Ni5Zn21, the activity coefficient of Zn in the deposit appears to decrease remarkably..
47. Electrodeposition behavior of Zn-Ni alloys was investigated at current densities of 10 to 500 A m- 2 and at amount of charge of 5 × 10 4 Cm -2 in unagitated zincate solution containing triethanolamine to form a stable complex with Ni 2+ ions at 308 K. At low current densities, the deposition of Zn-Ni alloy showed a normal type codeposition, in which electrochemically more noble Ni deposited preferentially, while at high current densities, it showed an anomalous codeposition, in which less noble Zn deposited preferentially. The Ni deposition and H 2 evolution were significantly suppressed in the region of anomalous codeposition at high current densities, showing the formation of inhibitor of deposition resulting from Zn ions in the cathode layer. In the region of nor-mal codeposition at low current densities, the underpotential deposition of Zn apparently occurred with Ni. Because the Zn-Ni alloys are composed of stable intermetallic compound of Ni 5Zn 21, the activity coefficient of Zn in deposit seems to decrease remarkably. © 2012 The Japan Institute of Metals..
48. Shingo Arakawa, Satoshi Oue, Hiroaki Nakano and Shigeo Kobayashi, Structure of Deposits Obtained from Urea-Based Melt Bath Containing Co and La, Materials Transactions, 10.2320/matertrans.M2011379, 53, 4, 770-772, 2012.04, Electrodeposition was performed in an unagitated solution from a urea-based melt bath containing Co and La under galvanostatic (10­ 40 mA·cm12) and coulostatic (10 C·cm12) conditions at 403 K, and the structure of the deposits was investigated. Co deposited in a metallic state at 10 mA·cm12, whereas it was incorporated into deposits mainly as an oxide at high current densities of 30 and 40 mA·cm12. La codeposited with Co as an oxide irrespective of current density. The content of La2O3 increased with current density. The deposits showed a granular crystal structure and became nonuniform crystals comprising large localized granules at high current densities..
49. Synergistic Effect of Addition on Morphology and Texture of Copper Deposited from Electrorefining Solution.
50. Effect of Organic Additives on the Hardness of Ni Electrodeposited from Sulfamate and Watt's Solutions.
51. Hiroaki Nakano, Satoshi Oue, Daisuke Yoshihara, Hisaaki Fukushima, Yoshifumi Saka, Shigeru Sawada and Yasuhiro Hattori, Sn–Cu Alloy Electrodeposition and Its Connecting Reliability for Automotive Connectors, Materials Transactions, 52, 6, 1237-1243, 2011.06.
52. Effect of Current Density and Organic Additives on the Texture and Hardness of Ni Electrodeposited from Sulfamate and Watt's Solutions.
53. Effect of Preadsorption of Polyethylene Glycol on the Appearance and Morphology of Electrogalvanized Steel Sheets.
54. H. Nakano, S. Oue , H. Fukushima, S. Kobayashi and K. Tomioka, Synergistic Effects of Thiourea, Polymer Additives and Chloride Ions on Copper Electrorefining, Proc. of Copper 2010 conference, Hamburg, 1531-1544, 2010.06.
55. Feng Yang, Wenhuan Tian, Hiroaki Nakano, hideaki Tsuji, Satoshi Oue and Hisaaki Fukushima, Effect of Current Density and Organic Additives on the Texture and Hardness of Ni Electrodeposited from Sulfamate and Watt's Solutions, Materials Transactions, 51, 5, 948-956, 2010.05.
56. Hiroaki Nakano, Satoshi Oue, Masaaki Uranaka, Masataka Masuda, Hisaaki Fukushima, Yoshifumi Saka, Shigeru Sawada and Yasuhiro Hattori, Electrodeposition of Sn-Ag Alloys and Evaluation of Connection Reliability for Automotive Connectors, Materials Transactions, 51, 4, 712-719, 2010.04.
57. Hiroaki Nakano, In-Joon Son, Satoshi Oue, Shigeo Kobayashi, Hisaaki Fukushima and Zenji Horita , Effect of Equal Channel Angular Pressing on the Pitting Corrosion Resistance on the Aluminum Alloys with/without Anodization, Material Science Forum, 1989-1994, 2010.04.
58. Hiroaki Nakano, Satoshi Oue, Masaaki Uranaka, Masataka Masuda, Hisaaki Fukushima, Yoshifumi Saka, Shigeru Sawada and Yasuhiro Hattori, Electrodeposition of Sn–Ag Alloys and Evaluation of Connection Reliability for Automotive Connectors, MATERIALS TRANSACTIONS, 51, 4, 712-719, 2010.04.
59. Effect of Equal Channel Angular Pressing on the Pitting Corrosion Resistance of Aluminum-Copper Alloy.
60. Hiroaki Nakano, Satoshi Oue, Yusuke Hamaguchi, Shigeo Kobayashi and Hisaaki Fukushima, Effect of Preadsorption of Polyethylene Glycol on the Appearance and Morphology of Electrogalvanized Steel Sheets, ISIJ International, 49, 11, 1769-1775, 2009.11.
61. H. NAKANO, I.J. SON, S. OUE, S. KOBAYASHI, H. FUKUSHIMA and Z. HORITA, Pitting Corrosion Resistance of Aluminum Alloys Processed by Equal-Channel Angular Pressing, Proc. of The 11th International Symposium on Materials Science and Engineering between Chonbuk National University and Kyushu University, 19-24, 2009.11.
62. H. NAKANO, S. OUE, H. KUBOYAMA, H. FUKUSHIMA and Y. HAYASHIBE, Synergistic effect of Polymer additives and Chloride Ions and the degradation of Polymer Additives in Copper Electrorefining , Proc. of Third International Conference on Processing Materials for Properties (PMP-III), 65-70, 2009.09.
63. In-Joon SON, Hiroaki NAKANO, Satoshi OUE, Shigeo KOBAYASHI, Hisaaki FUKUSHIMA, Zenji HORITA, Effect of equal-channel angular pressing on pitting corrosion resistance of anodized aluminum-copper alloy, Trans.Nonferrous Met. Soc. China, Vol.19, p.904-908(2009), 2009.08.
64. Satoshi Oue, Hiroaki Nakano, Daisuke Kurai, Katsuaki Nakamura and Hisaaki Fukushima, Effect of Continuous Rotation Evolutional Control on the Pitting Corrosion Resistance of Anodized Al-Mg Alloys, Materials Transactions, Vol. 50,Vol.8, p.1985-1991, 2009.08.
65. H. NAKANO, I.J. SON, S. OUE, S. KOBAYASHI, H. FUKUSHIMA and Z. HORITA, Effect of Equal Channel Angular Pressing on the Pitting Corrosion Resistance on the Aluminum Alloys with/without Anodization , Proc. of International Conference on Processing & Manufacturing of Advanced Materials (THERMEC’2009), 2009.08.
66. Satoshi Oue, Hiroaki Nakano, Daisuke Kurai, Hisaaki Fukushima, Katsuaki Nakamura and Masataka Masuda, Effect of Continuous Rotation Evolutional Control on the Surface Color of Anodized Al-Mg Alloys, Materials Transactions, Vol. 50,Vol.7, p.1792-1797 , 2009.07.
67. Hiroaki Nakano, Satoshi Oue, Hisaaki Fukushima, Shigeo Kobayashi and Kazuhiko Nishina, Degradation of Polymer Additives during Long-Term Zn Electrowinning , European Metallurgical Conference 2009 (EMC2009), 1097-1110, 2009.06.
68. Effect of Thiourea on Copper Electrorefining.
69. Satoshi Oue , Hiroaki Nakano, Shigeo Kobayashi and Hisaaki Fukushima, Structure and Codeposition Behavior of Ni-W Alloys Electrodeposited from Ammoniacal Citrate Solutions , Journal of The Electrochemical Society, D17-D22, 2009.01.
70. In-Joon Son, Hiroaki Nakano, Satoshi Oue, Shigeo Kobayashi, Hisaaki Fukushima and Zenji Horita, Effect of Annealing on the Pitting Corrosion Resistance of Anodized Aluminum-Magnesium Alloy Processed by Severe Plastic Deformation, Materials Transactions, 2008.12.
71. In-Joon Son, Hiroaki Nakano, Satoshi Oue, Shigeo Kobayashi, Hisaaki Fukushima and Zenji Horita, Pitting Corrosion Resistance of Anodized Aluminum-Copper Alloy Processed by Severe Plastic Deformation, Materials Transactions, Vol.49,Vol.11, p.2648-2655, 2008.11.
72. Evaluation of Degradation of Polymer Additive during Long-Term Cu Electrorefining.
73. In-Joon Son, Hiroaki Nakano, Satoshi Oue, Shigeo Kobayashi, Hisaaki Fukushima and Zenji Horita, Pitting Corrosion Resistance of Anodized Aluminum-Copper and Aluminum-Magnesium Alloys Processed by Equal-Channel Angular Pressing, 11th International Conference on Aluminum Alloys (ICAA 11), Aachen, 2066-2072, 2008.09.
74. Hiroaki Nakano Satoshi Oue Shoji Hisano Shigeo Kobayashi and Hisaaki Fukushima, Codeposition Behaviour of Impurities in during Electrogalvanization in Sulfate Baths in the Presence of Fe Ions, ISIJ International, Vol.47 7(2007)pp.1029-1033, 2008.07.
75. Pitting Corrosion Resistance of Aluminum-Magnesium Alloy Processed with Continuous Rotation Evolutional Control.
76. Hiroaki Nakano Satoshi Oue Shoichi Taniguchi Shigeo Kobayashi Hisaaki Fukushima, Effects of Small Amounts of Molybdenum Tungsten or Tin Additive on the Morphology and Orientation of Electrodeposited Zinc, ISIJ Intertnational, Vol.48 5(2008)pp.634-639, 2008.05.
77. Pitting Corrosion Resistance of Aluminum-Copper Alloy Processed by Severe Plastic Deformation.
78. In-Joon Son, Hiroaki Nakano, Satoshi Oue, Shigeo Kobayashi, Hisaaki Fukushima and Horita Zenji, Pitting Corrosion Resistance of Anodized Aluminum-Copper Alloy Processed Bt Severe Plastic Deformation, 日本金属学会誌, Vol.72, No.5, p.354-357, 2008.05.
79. Hiroaki Nakano Satoshi Oue Daisuke Kozaki Shigeo Kobayashi Hisaaki Fukushima, Electrodeposition of Composites of Zinc with Vanadium Oxide from Sulfate Solutions, ISIJ Intertnationa, Vol.48 4(2008)pp.506-511, 2008.04.
80. Hiroaki NAKANO, Satoshi OUE, Daisuke KOZAKI, Shigeo KOBAYASHI and Hisaaki FUKUSHIMA, Electrodeposition of Composites of Zinc with Vanadium Oxide from Sulfate Solutions, ISIJ, 506-511, 2008.04.
81. Synergistic Effect of Impurities on the Dissolution Behavior of Zn Electrodeposited from Electrowinning Solutions.
82. Effect of Annealing on the Pitting Corrosion Resistance of Anodized Aluminum-Magnesium Alloy Processed by Severe Plastic Deformation.
83. Effect of a Small Amount of Mo W and Sn Additives on the Morphology and Orientation of Electrodeposited Zn.
84. Electrodeposition of Zn-V Oxide Composite from Sulfate Solutions.
85. Hiroaki Nakano, Satoshi Oue, Hisaaki Fukushima, Shigeo Kobayashi, EFFECTS OF SMALL AMOUNTS OF VARIOUS INORGANIC ADDITIVES ON THE MORPHOLOGY AND APPEARANCE OF ZINC ELECTRODEPOSITED ON STEEL SHEETS, Proceedings of The 7th International Conference on Zinc and Zinc Alloy Coated Steel Sheet (Galvatech’07), Osaka, 207-212, 2007.11.
86. H. Kuboyama, H. Nakano, S. Oue and H. Fukushima and S. Kobayashi, SYNERGISTIC EFFECT OF POLYMER ADDITIVES AND CHLORIDE IONS ON COPPER ELECTROREFINING , Copper 2007 conference, 495-506, 2007.08.
87. H. Nakano, S. Oue and H. Fukushima, S. Kobayashi and Y. Abe, CODEPOSITION BEHAVIOR OF IMPURITIES IN COPPER ELECTROWINNING FROM CUPROUS CHLORIDE SOLUTION, Copper 2007 conference, 507-518, 2007.08.
88. Effect of Polyethylene Glycol on the Dissolution Behavior of Zn Electrodeposited from Impurity-containing Electriwinning Solutions.
89. Hiroaki NAKANO, Satoshi OUE, Shoji HISANO, Shigeo KOBAYASHI and Hisaaki FUKUSHIMA, Codeposition Behavior of Impurities During Electrogalvanization in Sulfate Baths in the Presence of Fe Ions, ISIJ, 47, 7, 1029-1033, 2007.07.
90. In-Joon Son, Hiroaki Nakano, Satoshi Oue, Shigeo Kobayashi, Hisaaki Fukushima and Zenji Horita, Effect of Annealing on the Pitting Corrosion Resistance of Anodized Aluminum-Magnesium Alloy Processed by Equal Channel Angular Pressing, CORROSION SCIENCE AND TECHNOLOGY, 6, 6, 275-281, 2007.06.
91. Hiroaki Nakano, Satoshi Oue, Hisaaki Fukushima and Shigeo Kobayashi, Effect of polymer additives on zinc electrowinning, European metallurgical Conference 2007, 1535-1547, 2007.06.
92. Codeposition Behaviour of Impurities in Copper Electrowinning from Cuprous Chloride Solution
Hiroaki Nakano Satoshi Oue Yosuke Yamaguchi Kaori Maeda Shinpei Kimura Hisaaki Fukushima and Yoshifumi Abe
Journal of MMIJ
Vol.123 1(2007)pp.33-38..
93. TEM-EDX Observations of the Microstructure of Electrodeposited Ni-Sn Alloys
Satoshi Oue Hiroaki Nakano Ryo Kuroda Shigeo Kobayashi Hisaaki Fukushima
ISIJ
Vol.70 10(2006)pp.804-808..
94. Hiroshi Kuboyama Hiroaki Nakano Satoshi Oue Hisaaki Fukushima Masataka Masuda Shunichi Hashimoto, Structure and Polarization Poperties of Zn-Nb Films Formed on Steel Sheet by Sputtering., ISIJ International, Vol.46 No.8 pp.1205-1209, 2006.08.
95. Effect of Polyethylene Glycol on the Morphology of Zn Electrodeposition on Steel Sheet
Hiroaki Nakano Satoshi Oue Toshiyuki Miki Shigeo Kobayashi Hisaaki Fukushima
Tetsu-to-Hagane
Vol.92 8(2006)pp.33-38..
96. Pitting Corrosion Resistance of Aluminum Alloys Processed by Servere Plastic Deformation after Anodizing
In-Joon Son Hiroaki Nakano Satoshi Oue Shigeo Kobayashi Hisaaki Fukushima Zenji Horita
The Japan Institute of Metals
Vol.70 7(2006)pp.534-540..
97. Satoshi Oue Hiroaki Nakano Ryo Kuroda Shigeo Kobayashi Hisaaki Fukushima, TEM-EDX Observations of the Microstructure of Electrodeposited Ni-Sn Alloys, Materials Transactions, Vol.47 No.6 pp.1550-1554, 2006.06.
98. In-Joon Son Hiroaki Nakano Satoshi Oue Shigeo Kobayashi Hisaaki Fukushima Zenji Horita, Pitting Corrosion Resistance of Ultrafine-Grained Aluminum Processed by Servere Plastic Deformation, Materials Transactions, Vol.47 No.4 pp.1163-1169, 2006.04.
99. Hiroaki Nakano Satoshi Oue Toshiyuki Miki Shigeo Kobayashi Hisaaki Fukushima, Effect of Polyethylene Glycol on the Morphology of Zn Electrodeposition on Steel Sheet, ISIJ International, Vol.46 No.1 pp.106-110, 2006.01.
100. Structure and Polarization Property of Zn-Nb Films Formed on Steel Sheet by Sputtering
Hiroshi Kuboyama Hiroaki Nakano Satoshi Oue Hisaaki Fukushima Masataka Masuda Shunichi Hashimoto
TETSU-TO-HAGANE
Vol.92 1(2006)pp.16-20..
101. Pitting Corrosion Resistance of Ultrafine-Grained Aluminum Processed by Servere Plastic Deformation
In-Joon Son Hiroaki Nakano Satoshi Oue Shigeo Kobayashi Hisaaki Fukushima Zenji Horita
ISIJ
Vol.69 10(2005)pp.892-898..
102. Formation of Poly((2-vinylpyridine) Films on Zn by Galvanostatic Electropolymerization.
Hiroaki Nakano Yuki Kuwahara Satoshi Oue Shigeo Kobayashi Hisaaki Fukushima Jeong-Mo Yoon
J.Japan Inst.Metals
Vol.69 8(2005)pp.780-786..
103. Mechanism of Anomalous Type Electrodeposition of Fe-Ni Alloys from Sulfate Solutions
Hiroaki Nakano Masayuki Matsuno Satoshi Oue Masaaki Yano Shigeo Kobayashi Hisaaki Fukushima
J.Japan Inst.Metals.
Vol.69 7(2005)pp.548-554..
104. Quantification og Adhesion Property of Electrodeposited Film - Adhesion of Ni Electrodeposited from Sulfamate Solution -
Hiroaki Nakano Satoshi Oue Daiki Mishio Yoshinori Nishihata Hisaaki Fukushima Yutaka Tsuru
The Surface Finishing Society of Japan
Vol.56 7(2005)pp.421-426..
105. Quantification og Adhesion Property of Electrodeposited Film - Adhesion of Ni Electrodeposited from Sulfamate Solution .
106. Mg-contained Zn Electroplating from Aqueous Solution Containing Quarternary Ammonium Salt
Hiroaki Nakano Satoshi Oue Shigeo Kobayashi Hisaaki Fukushima Kuniyasu Araga Kazuo Okumura Hiroo Shige
TETSU-TO-HAGANE
Vol.90 10(2004)pp.51-56..
107. Mechanism of Anomalous Electrodeposition of Fe-Ni.
108. Synergistic Effect of Impurities on the Critical Current Density for Zn Deposition
Hiroaki Nakano Satoshi Oue Tomoko Noguchi Tetsuya Akiyama Hisaaki Fukushima
Shigen-to-Sozai
Vol.120 1(2004)pp.39-42..
109. Microstructure of Electrodeposited Ni-Sn Alloy.
Satoshi Oue Hiroaki Nakano Hisaaki Fukushima Shigeo Kobayashi Tetsuya Akiyama
Materia Japan
Vol.42 12(2003)pp.909-909..
110. Effects of Polymer Additives on Copper Electrorefining
Hiroaki Nakano Satoshi Oue Takeshi Ogai Kohei Izumi Tetsuya Akiyama Hisaaki Fukushima
Shigen-To-Sozai
Vol.119 10 11(2003)pp.663-667..
111. Vol.54 8(2003)pp.-..
112. Vol.54 8(2003)pp.-..
113. Vol.53 12(2002)pp.920-925..
114. Vol.88 9(2002)pp.513-519..
115. Effect of electrolysis factors on crystal orientation and morphology of electrodeposited cobalt
H. Nakano K. Nakahara S. Kawano S. Oue T. Akiyama and H. Fukushima
Journal of Applied Electrochemistry
Vol.32 1(2002)pp.43-48..
116. Vol.86 9(2000)pp.584-590..
117. Vol.86 2(2000)pp.116-122..
118. Vol.86 1(2000)pp.38-44..
119. Vol.85 10(1999)pp.728-734..
120. Vol.19 (1998)pp.34-39..
121. Vol.112 10(1996)pp.729-734..