Kyushu University Academic Staff Educational and Research Activities Database
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Takigawa Ryo Last modified date:2018.12.13



Graduate School
Undergraduate School


E-Mail
Phone
092-802-3740
Fax
092-802-3740
Academic Degree
Ph.D
Field of Specialization
Optoelectronic integration, Optical packaging, Hetero integration
Research
Research Interests
  • ・Hybrid integration of optical chips by low temperature bonding

    ・Low-temperature hermetic packaging using low temperature bonding
    keyword : Optical microsystem, Hybrid integration, low temperature bonding, hermetic packaging
    2013.04.
Academic Activities
Papers
1. Hirofumi Nogami, Wataru Iwasaki, Nobutomo Morita and Ryo Takigawa, Relationship between AC/DC Ratio and Light-blocking Structure for Reflective Photoplethysmographic Sensor , Sensors and Materials, Accepted.
2. Ryo Takigawa, Eiji Higurashi, Tanemasa Asano, Surface Activated Bonding of LiNbO3 and GaN at Room Temperature, ECS transactions, 86, 5, 207-213, 2018.07.
3. Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano, Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim, Sensors and Materials, Accepted.
4. Ryo Takigawa, Eiji Higurashi, Tanemasa Asano, Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method, Japanese Journal of Applied Physics, 57, 2018.05.
5. Toru Tomimatsu, Ryo Takigawa, Correlation between the local stress and the grain misorientation in the polycrystalline Al2O3 measured by near-field luminescence spectroscopy, Japanese Journal of Applied Physics, 57, 2018.05.
6. Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano, Investigation of the interface between LiNbO3 and Si wafers bonded by laser irradiation, JAPANESE JOURNAL OF APPLIED PHYSICS, 56, 088002-1-088002-3, 2017.07.
7. Ryo Takigawa, Eiji Higurashi, Tetsuya Kawanishi, Tanemasa Asano, Demonstration of ultraprecision ductile-mode cutting for lithium niobate microring waveguides, JAPANESE JOURNAL OF APPLIED PHYSICS, 10.7567/JJAP.55.110304, 55, 11, 2016.11.
8. Hiroki Kawano, Ryo Takigawa, Hiroshi Ikenoue, Tanemasa Asano, Bonding of lithium niobate to silicon in ambient air using laser irradiation, JAPANESE JOURNAL OF APPLIED PHYSICS, 10.7567/JJAP.55.08RB09, 55, 8, 2016.08.
9. Hiroki Kawano, Ryo Takigawa, Hiroshi Ikenoue, Tanemasa Asano, Bonding of LiNbO3 thin film on Si substrate using laser irradiation, THE TWENTIETH MICROOPTICS CONFERENCE Post Deadline Papers, 24-25, 2015.10.
10. Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano, High-speed via hole filling using electrophoresis of Ag nanoparticles, IEEE 3D-IC, TS5.4.1-TS5.4.4, 2015.09.
11. Ryo Takigawa, Eiji HIgurashi, Tetsuya Kawanishi, Tanemasa Asano, Lithium niobate ridged waveguides with smooth vertical sidewalls fabricated by an ultra-precision cutting method, Optics Express, 10.1364/OE.22.027733, 22, 22, 27733-27738, 2014.11.
12. Linghan, Li, Takigawa Ryo, Akio Higo, Eiji Higurashi, Masakazu Sugiyama, Bingyao Liu, Yoshiaki Nakano, Electrical pumping Fabry-Perot lasing of a III-V layer on a highly doped silicon micro rib, LASER PHYSICS LETTERS, 11, 11, 115807, 2014.11.
13. Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano, Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim
, JAPANESE JOURNAL OF APPLIED PHYSICS, 53, 06JM05, 2014.05.
14. Toshihiro Kamei, Keiko Sumitomo, Sachiko Ito, Ryo Takigawa, Tsujimura Noriyuki, Hisayuki Kato, Takeshi Kobayashi, Ryutaro Maeda, Heterogeneously integrated laser-induced fluorescence detection devices: Integration of an excitation source, JAPANESE JOURNAL OF APPLIED PHYSICS, 10.7567/JJAP.53.06JL02, 53, 6, 2014.06.
15. Yuichi Kurashima, Atsuhiko Maeda, Takigawa Ryo, Hideki Takagi, Room temperature bonding of metal films using flattening by thermal imprint process, Microelectronic Engineering, 112, 52-56, 2013.12.
Presentations
1. Ryo Takigawa, [Invited]Demonstration of strongly confined optical waveguides using ultra-precision ductile-mode cutting, The 5th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging, 2017.03.
2. Kohei Nitta, Ryo Takigawa, A. Ikeda, M. Kumazawa, T. Hirai, M. Komatsu, Tanemasa Asano, Electroless Ni Plating of Seed Film of Electrophoresis of Ag Nanoparticles, 29th International Microprocesses and Nanotechnology Conference (MNC2016), 2016.11.
3. Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano, LiNbO3/Si Hybrid Wafer Bonded in Ambient Air Using Laser Irradiation, 29th International Microprocesses and Nanotechnology Conference (MNC2016), 2016.11.
4. Ryo Takigawa, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano, High-speed via filling using electrophoresis of Ag nanoparticles, INC11, 2015.05.
5. Keiichiro Iwanabe, Takanori Shuto, Ryo Takigawa, Tanemasa Asano, Softening of Metal Under Ultrasonic Application Observed in Bonding of Au Compliant Microbump, 27th International Microprocesses and Nanotechnology Conference, 2014.11.
6. Tatsuya Baba, Y. Lee, Ai Ueno, Ryo Takigawa, J.-J. Delaunay, Reo Kometani, Etsuo Maeda, Triple-Walled Gold Structures with Nano-Gaps for Non-Resonance Surface Enhanced Raman Scattering of Rhodamine 6G Molecules, 27th International Microprocesses and Nanotechnology Conference, 2014.11.
7. Ryo Takigawa, Hiroki Kawano, Yohei Aoki, Takanori Shuto, Keiichiro Iwanabe, Tanemasa Asano, Expanded Cavity Size of Room-Temperature Hermetic Sealing Using Au Compliant Rim for Microsystem Packaging, 27th International Microprocesses and Nanotechnology Conference, 2014.11.
8. Ryo Takigawa, Hiroki Kawano, takanori Shuto, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano, Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim, IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2014.07.
9. Ryo Takigawa, Keiichiro Iwanabe, Takanori shuto, Takayuki Takao, Tanemasa Asano, Room-Temperature Bonding using Au Compliant Rim with Ultrasonic Assist and its Application to Hermetic Sealing, International Conference on Electronics Packaging, 2014.04.
10. Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano, Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim
, 26th International Microprocesses and Nanotechnology Conference, 2013.11.