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Terutake Hayashi Last modified date:2018.07.30

Associate Professor / Manufacturing Processes
Department of Mechanical Engineering
Faculty of Engineering

Graduate School

Academic Degree
Ph.D (Engineering)
Field of Specialization
laser processing, optical measurement, nano production and measurement
Research Interests
  • Study on nano particle sizing based on brownian diffusion evaluation by using fluorescence nano probe.
    keyword : fluorescence polarization, rotational diffusion coefficient, nano particle, particle sizing
  • Low power femto second laser processing with surface excitation using double pulse beam
    keyword : laser ablation, femto second laser processing
Academic Activities
1. Terutake Hayashi, Nanoparticle sizing method based on fluorescence anisotropy analysis, Measurement, vol. 59, 382-388, 2015.01, Demand for applications of nanoparticles in electric architecture has been increasing. Nanoparticles provide new opportunities for improving circuit response. We discuss a novel method for evaluating nanoparticle sizes based on fluorescence anisotropy analysis. Particle size evaluation is possible through measurements of the rotational diffusion coef- ficient, which is sensitive to particle size. We develop a system for measuring rotational diffusion coefficients by using a fluorescent probe to label a particle. We report fundamen- tal experiments that verify the feasibility of the proposed method. The rotational diffusion coefficients of gold nanoparticles with diameters ranging 6–20 nm were measured using the proposed method. The measured rotational diffusion coefficients decrease with increasing particle size. This finding indicates that nanoparticles smaller than 15 nm can be measured with fine resolution..
2. Masaki Michihata, Terutake Hayashi, Atushi Adachi, Yasuhiro Takaya, Measurement of probe-stylus sphere diameter for micro-CMM based on spectral fingerprint of whispering gallery modes, CIRP, 63, 1, 469-472, 2014.08, Probe calibration contributes to the measurement uncertainty of micro-coordinate measuring machines (micro-CMMs). This study proposes a new method of measuring stylus sphere diameters for micro-CMMs based on the analysis of whispering gallery modes (WGMs). Depending on the incident wavelength, different WGMs will be excited in the probe stylus, resulting in a wavelength spectral fingerprint that is related to the sphere diameter. In this paper, the diameter of the microprobe stylus sphere was determined with a least-squares method using theoretical and measured spectra of WGMs.
The measurement results showed that the precision of the proposed method was nm..
3. Terutake Hayashi, Masaki Michihata, Yasuhiro Takaya, and Kok Fonog Lee, Development of nanoparticle sizing system using fluorescence polarization, ACTA IMEKO, 2, 2, 67-72, 2013.12.
4. Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA, Development of an Optical Heterogeneity Evaluation System Using Phase-Shift Digital Holography, Key Engineering Materials, 523-524, 865-870, 2012.11.
5. Masafumi YASUDA, Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA, A Novel Batch Fabrication of Micro Parts Using DNA Pattern Recognition, Key Engineering Materials, 523-524, 598-603, 2012.11.
6. Yusuke FUKUTA, Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA, Development of a Novel Surface Processing System Using Femtosecond Pulse Train, Key Engineering Materials, 523-524, 220-225, 2012.11.
7. Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA, Evaluation of Optical Heterogeneity Using Phase-Shift Digital Holography, International Journal of Nanomanufacturing, 8, 5-6, 508-521, 2012.08.
8. Terutake HAYASHI, Yasuhiro TAKAYA, and Masaki MICHIHATA, Development of Nanoparticle Sizing System Integrated with Optical Microscopy Using Fluorescence Polarization, International Journal of Nanomanufacturing, 8, 1-2, 54-66, 2012.01.
9. Yasuhiro TAKAYA, Hirotaka KISHIDA, Terutake HAYASHI, Masaki MICHIHATA, and Ken KOKUBO, Chemical Mechanical Polishing of Patterned Copper Wafer Surface Using Water-Soluble Fullerenol Slurry, CIRP, 60, 1, 567-570, 2011.08.
10. Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA, Total Angle-Resolved Scattering: Characterization of Microlens Mold Surface, Procedia Engineering, 19, 132-137, 2011.01.
1. Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masuhara NISHIKINO, Yoji MATSUKAWA, Dynamics of photo-excitation for the ablation of 4H-SiC substrate using femtosecond laser, the 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 2017.11.
2. Terutake Hayashi, Syuhei Kurokawa, Study on diffusion coefficient evaluation for free abrasives and chemicals by using fluorescent anisotropy analysis, The 18th International Conference On Mechatronics Technology, 2014.10, CMP (Chemical Mechanical Polishing/ Planarization) for semiconductor production has become increasingly important to integrate the multi-layer circuits. CMP is a process of smoothing wafers surface with the both chemical reaction in slurry and mechanical polishing by using polishing pad and abrasives. In this research, we aim at the high-efficiency and high quality CMP of semiconductor wafer. We investigate fundamental property of CMP process in the aspect of polishing and alternation based on observing the diffusion of abrasive and chemicals. We consider the translational diffusion is related to the frequency of the contact for the free abrasives and chemicals on the surface of the material. Thus, the translational diffusion coefficient is considered to be related the change of the surface integrity and the material processing properties, such as removal rate, surface roughness, and flatness. In this paper, we suggest a novel measurement method for the translational diffusion coefficient based on the measurement of the fluidity of the slurry. The fluidity of slurry is measured by using fluorescence anisotropy analysis. We develop a system for measuring fluidity of slurry by using a fluorescent probe. The fundamental experiments are performed to verify the feasibility of the proposed method..
Membership in Academic Society
  • The Japan Society for Abrasive Technology
  • The Japan Society for Precision Engineering
  • Japan Society of Mechanical Engineers