| Utsumi Jun | Last modified date：2024.04.30 |
Post-doctoral Fellow /
Department of Electronics
Faculty of Information Science and Electrical Engineering
Faculty of Information Science and Electrical Engineering
E-Mail *Since the e-mail address is not displayed in Internet Explorer, please use another web browser:Google Chrome, safari.
Phone
092-802-3721
Academic Degree
Ph.D.
Country of degree conferring institution (Overseas)
No
Field of Specialization
Photophysics, Optical waveguide, Surface activated bonding
Total Priod of education and research career in the foreign country
00years00months
Research
Research Interests
Membership in Academic Society
- 3D integration technology by surface activated bonding at room temperature
Surface activated bonding process at room temperature
Hybrid bonding
Direct bondig of oxcide materials at room temperature
keyword : Surface activated bonding at room temperature Surfaces/interface science
2001.04.
- THE INSTITUTE OF ELECTRICAL ENGINEERS OF JAPAN
- THE JAPAN SOCIETY OF APPLIED PHYSICS
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