Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

An Analysis of Particle in Spray Cleaning and a Study on their Cleaning Efficiency -A comparison of Cleaning Efficiency between Two Fluid Spray and High Pressure Micro Jet Spray-

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Research on Cleaning Efficiency of High Pressure Micro Het -A Study through Analysis of Particles' Novement and Experiment on Cleaning-

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Transient Phenomenon of Chip Generation and Its Movement in Hobbing
(4th Report, The Relationship between the Jamming of Chips on the Finished Surface and the Chip Form in Generating in Flytool Simulation Tests)

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Transmission Error Analysis of Involute Cylindrical Gears with Consideration of Gear Eccentricity
(Derivation of Strict Analytical Solutions of Transmission Error with Radial Eccentricity)

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1088/1742-6596/13/1/003

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

A simulation method taking into account sequential changes of the tooth contact state due to the tooth surface wear was developed in order to evaluate the influence of wear on pitting durability. As a result of calculating the tooth end relief shape as a parameter, the variation in the wear propagation rate was obtained depending on the contact stress distribution. The study also obtained the nonlinear wear propagation property, in which the initial wear propagation was rapid and then changed gradually. In order to verify the wear characteristics, gear durability tests were conducted using gears with tooth tip modification and end relief, and sequential changes in the tooth surface wear state were observed. The test results revealed that the non-linear wear propagation property was obtained as in the calculation results. Wear propagation in the tooth lead direction and pitting life were able to be predicted. Using this calculation method and the experimental evaluation, it was made clear that the temporal alteration of contact stress and the non-linear propagation changed the pitting initiation timing and position, and may also have an effect on the pitting durability.

DOI： 10.2474/trol.17.44

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

High Speed Precision Dry Hobbing, whose cutting speed is from 1000 to 2450m/min with axial feed of 0.3mm/part-rev., achieved gear accuracy equivalent to a shaving process; ISO grade 6 in profile, ISO grade 3 in helix, and surface roughness Ra 0.3 by a single-cut strategy. The stable cutting force and low workpiece temperature by the cutting speed of 2450m/min were observed in spite of producing red heated cutting chips. By replacing conventional hobbing and shaving with high speed precision dry hobbing, an environmentally friendly manufacturing process can be achieved.

Language：English   Publishing type：Research paper (international conference proceedings)  

CMP (Chemical Mechanical Polishing/Planarization) is used in the manufacture of semiconductor products. CMP is a polishing process that combines chemical reaction and mechanical actions, and it is possible to obtain extremely smooth polished surfaces by softening the substrate surface with a processing fluid (slurry) through chemical reaction and then removing it mechanically with free abrasive particles. Most of the CMP systems used these days are rotary CMP, where the substrate held by the head is pressed against the polishing pad while the slurry is dripped onto the platen with the polishing pad attached. In this process, continuous polishing deteriorates the surface geometry of the pad and reduces the polishing rate. Therefore, the polishing rate is maintained by conditioning the surface of the pad with a diamond dresser. This suggests that the polishing rate is greatly affected by the topography of the pad surface. Since abrasive particles in the slurry at the interface between the polishing pad and the substrate contribute to polishing directly, we consider the behavior of abrasive particles to be important in clarifying the polishing mechanism and aim to quantify the contribution of abrasive particles to CMP.

Language：English   Publishing type：Research paper (international conference proceedings)  

Nanoparticle size distribution (PSD) analysis and particle concentration measurement are important for quality management of slurry, that used in chemical mechanical polishing (CMP) process. CMP slurry contains poly-dispersed particles in suspension. It is difficult to measure the PSD using Dynamic Light Scattering (DLS), that is a typical method for mono-dispersed particles. On the other hand, Image Analysis (IA) using Electron Microscope can analyse number-weighted PSD for poly-dispersed particles. However, number-weighted PSD is difficult to identify the particle concentration for primary particle and aggregation. In addition, solid concentration is used in concentration evaluation for CMP slurry. However, solid concentration is difficult to identify the mean particle diameter and the variance of diameter. In this study, we defined a molar concentration spectrum to evaluate the PSD and molar concentration and suggested a novel particle sizing method using nanoparticle chip (NPC) for molar concentration spectrum measurement. In this paper, it is reported the fundamental experiment to measure the molar concentration spectrum for poly-dispersed particles using NPC.

Language：English   Publishing type：Research paper (scientific journal)  

Particle size distribution (PSD) analysis for nanoparticle is important for quality management of CMP slurry, that used in chemical mechanical polishing (CMP) process. CMP slurry contains poly-dispersed particles, which consist of size-different primary particles and secondary particles in suspension. It is difficult to measure PSD for poly-dispersed particle using Dynamic Light Scattering, which is one of a typical method to evaluate PSD for mono-dispersed particles. The image analysis is also employed for PSD analysis. For image analysis, it needs to transfer the particles from suspension to a substrate before measurement. In this procedure, some particles aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in suspension
and the PSD for observed particle using image analysis. In addition, concentration measurement is important for quality management of CMP slurry. Mass concentration is used in concentration evaluation for CMP slurry. However, it is difficult to identify the molar concentration for multi-modal particles, respectively. In this study, we suggested a method to define molar concentration spectra to express both a modal diameter and molar concentration for multi-modal nanoparticles to evaluate the CMP slurry. In order to measure the molar concentration spectra, we suggested a novel particle sizing method using nanoparticle chip (NPC) to measure number-weighted mean particle diameter, a variance of diameters, and molar concentration for every spectrum. Nanoparticles grid on a substrate to maintain the poly-dispersed condition in suspension to process NPC. NPC can assist the image analysis process to measure the PSD of particles in suspension. The number of particles, that aligned on the substrate, can be counted to measure the molar concentration. In this paper, a fundamental experiment was performed to investigate the feasibility of molar concentration spectra measurement. It is confirmed the molar concentration spectra for poly-dispersed particles can be measured by using NPC and it is considered that PSD with molar concentration spectra can give detail information of abrasive grain in suspension for quality management of CMP slurry.

DOI： 10.1016/j.precisioneng.2021.08.008

Language：English   Publishing type：Research paper (scientific journal)  

A method is proposed in this paper to prepare a SiC slurry with SiC particles selected by an ultrasonic-assisted elutriation method to reduce substrate surface damage caused by abrasive particles during lapping. Sapphire substrate lapping experiments were carried out using the prepared SiC slurry, and the lapping performance of the slurry was analyzed. The experimental results show that the SiC particle size is a factor that directly affects the material removal rate and surface roughness Ra, of sapphire substrates. When a SiC slurry with a particle size of 630 nm was used, the material removal rate was 508 nm/h, and the surface roughness Ra was 1.9 nm; increasing the slurry concentration and the platen rotating speed can improve the material removal rate. In addition, the agglomeration of SiC particles in the slurry depends on the pH of the slurry. Efficient precision lapping of sapphire substrates can be achieved by selecting appropriately sized SiC particles and by adjusting the slurry pH to control the agglomeration and dispersion of SiC particlesto further reduce the scratches on the substrate surface during the lapping process.

DOI： DOI: 10.1007/s12541-021-00521-1

Other Link： https://link.springer.com/article/10.1007/s12541-021-00521-1

Language：English   Publishing type：Research paper (scientific journal)  

Total reflection x-ray fluorescence analysis is applied to trace element detection in liquid for effective environmental monitoring. This analytical approach requires x-ray total reflection mirrors. In order to achieve high sensitivity element detection, the mirrors require high surface quality for high x-ray reflectivity. Surface finishing for x-ray mirrors is typically conducted through a series of abrasive processes, such as grinding and polishing, and is thus time consuming. The purpose of this study is to streamline and enhance the surface finishing process based on unique high quality grinding techniques for the production of x-ray total reflection mirrors.

DOI： https://doi.org/10.1088/2631-7990/ab7a29

Language：English   Publishing type：Research paper (scientific journal)  

The molds used in the manufacture of many industrial products are mainly manufactured by cutting with a machining center. Since the cutting time is very long in these cutting processes, it is important to judge the tool life and know the appropriate timing for tool change. The authors of this study have been investigating in-process detection of tool wear using tools and the work material itself as sensors, and good results have been obtained. In this method, since the work material and the cutting edge of the cutting tool themselves become sensors, therefore the detection system can be constructed at low cost and does not affect the actual work. In this study, the focus was on the slip of the AC induction motor for driving the spindle of a milling machine. This detection method can also construct the detection system at low cost and does not affect the actual work. By measuring it, it was possible to investigate whether tool wear can be detected in-process. It was found that there is an excellent relationship between the progress of tool flank wear and the slip of the AC induction motor.

DOI： https://doi.org/10.1299/jamdsm.2021jamdsm0011

Language：English   Publishing type：Research paper (other academic)  

Particle sizing distribution (PSD) analysis for slurry is important in chemical mechanical polishing (CMP) process. CMP slurry usually contains poly-dispersed particles in suspension and it is difficult to evaluate the number-weighted multi-modal PSD using DLS, which is the most typical method to evaluate PSD for mono-dispersed particles. On the other hand, Image analysis (IA) can be used for PSD analysis for poly-dispersed particles. However, IA is a time-consuming method and it is required to improve the quickness. We suggest a novel particle sizing method using nanoparticle chip (NPC). The objective is improving the measurement efficiency of IA to a level that can be applied to the quality management of CMP slurry. It is considered that NPC-IA can apply to measure the PSD for poly-dispersed particles. In addition, it is possible to evaluate the molar concentration of particles in suspension at every multi-modal peak on PSD. In this paper, it is reported the fundamental experiment to measure the molar concentration of particles for poly-dispersed particle with bimodal PSD using NPC.

Language：Japanese   Publishing type：Research paper (scientific journal)  

For poly-dispersed nanoparticles, which have more than two peaks on their particle size distribution (PSD), it is important to determine the mean particle diameter and their dispersion at each peak in a liquid. Dynamic Light Scattering (DLS), that is one of a typical nanoparticle sizing method, has difficulty to determine the several peaks in the PSD for the poly-dispersed particles. On the other hand, Image analysis methods (IA) can distinguish the peak for both the primary particle and secondary particle in the PSD of poly-dispersed particles accurately. However, IA is a time-consuming method and it is difficult to apply the measurement of the PSD due to the requirement of measuring the large number of particles, one by one. The particles in the liquid are transferred to a substrate in air when observing the particle to measure their size and the size distribution. In this procedure, some particles usually aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in liquid and that of the particles on the substrate. In this study, we suggest a novel particle sizing method using “Nanoparticle chip”, that is nanoparticles grid on the substrate to maintain the poly-dispersed condition in the liquid, to develop IA for measuring the poly-dispersed particles in liquid. The dispersed condition of the particle on Nanoparticle chip can be kept from the condition in liquid when the particles are transferred to the substrate in air. Therefore, measuring the PSD on Nanoparticle chip is equal to measure the PSD in the liquid. In this paper, in order to verify the feasibility of the nanoparticle sizing using Nanoparticle chip to measure the PSD for poly-dispersed particles in the liquid, we performed a fundamental experiment to fabricate the Nanoparticle chip and to determine the PSD for poly-dispersed particles. In this report, it is reported that the PSD for the poly-dispersed particles, which is the mixture of 152nm particle and 498nm particle, using Nanoparticle chip.

DOI： https://doi.org/10.1299/transjsme.20-00220

Language：English   Publishing type：Research paper (other academic)  

To improve the cutting performance of tool, shear-thickening polishing is adopted to process the surface of tungsten-cobalt carbide tool (Co content of 6%). A new rheological slurry has been prepared for shear thickening of tungsten-cobalt material. Rheological performance of the polishing slurry has been investigated to maintain its stability for actual machining. Several parameters having significant effects, including flow velocity, shear rate, flow rate, abrasive size, abrasive concentration and polishing time are experimentally explored in this process. Under the optimal processing parameters, the ultra-precision surface of tungsten-cobalt carbide tool was obtained, reducing from Ra 115.4 nm to Ra 6.5 nm after polishing time of 30min. This result can contribute to improve performance and productivity of the tungsten-cobalt carbide tool and suggests that shear-thickening polishing is a potential ultraprecision machining method for cutting tool fabrication.

Language：English   Publishing type：Research paper (scientific journal)  

This paper discusses the modeling and simulation of multi-materials for additive manufacturing. The mechanical property analysis of multi-materials is essential for developing a very feasible product. To that aim, a few steps are necessary, firstly, a database of those multi-materials is created. Secondly, stiffening technology is introduced together with an alternative optimization method. Finally, the material minimization technique is developed through the simulation results. Two methods are proposed for material optimization. The first method saves the materials twice, and the second method improves the stiffness characteristics of the materials. The developed method generates promising results, and it is applicable to composite geometries. The finding shows that the technique helps to reduce production costs at large.

DOI： https://doi.org/10.1007/s12008-020-00678-5

Language：English   Publishing type：Research paper (scientific journal)  

Functionally Graded Materials (FGMs) are used in specialized industries, notably, in the aerospace industry, due to their unique response to thermal loads which are very prominent during spacecraft flights. The use of FGMs in the rapidly growing 3D printing area is also increasing interest in them, and proper modelling of FGMs is becoming a prominent development topic. This paper suggests a method of modelling FGMs using the ANSYS Workbench environment for dummy thermal loads in ANSYS Mechanical, which excludes the need for extensive FORTRAN programming typical of a significant part of FGM modelling methods. The method can be applied for complex geometries, imported from CAD software, works with shell elements bodies, and any distribution of materials throughout the FGM. Two case studies: one for 2D analysis and another for 3D shell elements analysis are developed. Two solutions are developed for each case: numerical solution, obtainable through the proposed method, and analytical solution. Solutions are compared, and the results yielded by the proposed method matched the analytical solution with high accuracy.

Language：English   Publishing type：Research paper (scientific journal)  

Improving gear mesh efficiency contributes to reducing the environmental impact of vehicles. This study examined the effect of adjusting gear specifications on improving mesh efficiency. When the gear ratio of cylindrical gears is relatively high, it tends to increase the sliding velocity between the engaging gear teeth. Moving the contact region toward the base circle of the pinion along the line of action is considered to be one solution for reducing friction loss. However, it may cause deterioration of tooth surface strength because the radius of curvature of the tooth surface becomes smaller on account of being closer to the base circle. In order to confirm the influence of the gear meshing region on tooth surface strength, gear durability tests were carried out and tooth damage states were observed in detail under a microscope. The results revealed that pitting failure occurred near the tooth root region of the pinion. Furthermore, trochoidal interference due to the high torque condition extended over the base circle. In this case, trochoidal interference has a greater influence on pitting failure. In order to investigate the effect of reducing trochoidal interference near the base circle on pitting failure, further gear durability tests were conducted using the mating gears with large tooth tip modification. However, the effect on improving pitting durability was limited. Multidirectional, interacting wear was observed not only in the profile direction due to trochoidal interference but also in the lead direction due to edge contact. Such wear changed the location of pits. The results of these detailed investigation revealed a new viewpoint for explaining the mechanism of these phenomena in terms of conflict between pitting and multidirectional, interacting wear. Presumably, pitting failure changes if the state of progression of trochoidal interference and wear in the lead direction changes. In order to confirm the influence of such wear on pitting durability, a gear durability test was conducted using gears with tooth tip modification and endface relief. The test results confirmed that the location of pits and pitting durability changed. These results revealed that pitting durability and the state of damage were influenced sensitively and compositely by multidirectional, interacting wear, i.e., wear in the profile and lead directions.

DOI： 10.1299/jamdsm.2020jamdsm0060

Language：English   Publishing type：Research paper (scientific journal)  

Surface clogging of polishing pad is inevitable during CMP (Chemical Mechanical Polishing) process of semiconductor wafers. In this paper, a novel slurry-feeding system utilizing HPMJ (High Pressure Micro Jet) apparatus was presented as in situ conditioning for CMP process. Clogging of pad surface can be greatly removed; the surface damage of polishing pad can also be extremely reduced by this new method. The experimental results exhibited that the material remove rate (MRR) of HPMJ method was almost constant value 100 μm h^–1. However, the MRR value of conventional slurry-dripping method was about 50 μm h^–1. On the other hand, surface roughness Ra changed both in hybrid HPMJ method and conventional slurry-dripping method after long-time continuous CMP process, the average Ra of hybrid HPMJ method was about 30% smaller than that of conventional slurry-dripping method, indicating that better surface quality could be obtained by HPMJ method polishing. It was demonstrated that HPMJ method showed higher MRR and lower surface roughness Ra for polishing process. HPMJ hybrid system mentioned in this study can also be applied to the polishing process of hard-to-process wide bandgap semiconductor substrate materials, such as SiC or GaN.

DOI： 10.1149/2162-8777/ab7a0d

Language：English   Publishing type：Research paper (scientific journal)  

The application of 3D printing in medicine is the major area to concern in the nearest future. Namely, it is convenient to additively manufacture the Ankle-Foot Orthosis (AFO) by fused-deposition modeling 3D printer. AFO is the device, used in medicine, to help the patients rehabilitate from the foot drop disease. The shape of the AFO may vary depending on the leg and foot specifications of the patient. In this paper, three models of the AFO were designed to analyze both numerically and experimentally, those are fracture propagation, stress distribution, and deformation. The regions with the highest stress concentration were altered with the Nylon 12, and this contributed to stress reduction. Three different gait instances were considered for the numerical simulations FEA software. Then, the simplest model to prototype and its modified versions were tested by the compression machine, and the results were compared with the numerical ones. This work demonstrated the significance of the optimization of the multi-material 3D printed AFO's performance and comfort for patients.

DOI： 10.1088/1742-6596/1510/1/012012

Language：English   Publishing type：Research paper (other academic)  

Fishing spinning reels use a pair of face gear; when the handle of the reel is rotated, vibration is generated by the engagement of the gear pair. An angler feels the gear vibration as a sensation in the fishing reel. In this study, a new method is proposed to improve the fishing reel sensation. In this method, several grooves are added on the tooth flank of the face gear. The optimal groove width and number of grooves are determined by investigating the influence the grooves have on vibration. In addition, by introducing the concept of the tactile-response delay time, the authors elucidate the reason that the vibration sensation can be improved by specifying the number of grooves.

DOI： 10.1007/978-3-030-20441-9_17

Language：English   Publishing type：Research paper (scientific journal)  

This paper discusses the determination of tooth-flank modification on a face gear system in order to improve the handle rotational sensation of a fishing spinning reel (hereafter, fishing reel sensation) and quantification of it. The spinning reel considered in this study uses a face gear system. One of the advantages of a face gear system is that it offers good rotational tactile sensation. However, these systems have a high propensity for assembly errors. If the reel experiences an assembly error, vibration based on the gear-pair engagement occurs when the handle of the reel rotates. The vibration is transmitted to the angler’s finger via the handle. When the vibration is large, the angler feels discomfort, which ultimately has a large influence on the fishing reel sensation. Therefore, reducing gear vibration is our most important objective. It was previously reported that when the tooth flank of the face gear is shaped according to a transmission-error-controlled curve, the reel exhibits robustness against the influence of assembly errors. The report indicated that there is a relationship
between the fishing reel sensation and the amplitude of transmission error. However, it did not indicate a relationship between the fishing reel sensation and the waveform of transmission error. Moreover, the amount and width of tooth-flank modification were not optimized in the previous studies. On the other hand, because the fishing reel sensation is conventionally evaluated by human judgment, it is ambiguous and inefficient. To solve these problems, the best factor and level for tooth-flank modification were derived according to a design method based on robust engineering. The fishing reel sensation was quantified by the Mahalanobis–Taguchi system of robust engineering with high correlation. Moreover, a suitable noise factor could be applied in robust design by the accurate measurement of the transmission error. Accordingly, the optimum condition for tooth-flank modification was identified experimentally. This report elucidates the relationship between the fishing reel sensation and the waveform of transmission error and proposes a quantification of the same. Consequently, the face gear design for improving the fishing reel sensation has been established by quantifying the fishing reel sensation using the transmission error instead of sensory human evaluation.

DOI： 10.1299/mej.19-00318

Language：English   Publishing type：Research paper (other academic)  

The emergence of additive manufacturing technology allowed prototyping the complex 3D shape models. Fused Deposition Modeling (FDM) method in 3D printing is the most widespread material extrusion technology that has great potential to further advance in better quality, low-cost, material, and time optimization. This paper discusses and compares the methods of shape optimization for various models of 3D printed pressure vessels, such as Cylindrical, peanut, pumpkin, and honeycomb, in terms of weight and stress distribution, through FEA simulation in ANSYS software by applying pressure up to 100 MPa inside the vessel. Some optimized shapes of pressure vessels were obtained with uniformly-distributed stress all over the vessel body due to the removal of the less useful parts of the vessel. The most lightweight was the peanut-shaped modified cylindrical pressure vessel, which resulted in a 9.81% weight reduction after applying shape optimization method, and the least average stress undergoing vessel was a simple cylindrical pressure vessel. The simulation results show that the developed technique has a great prospect of possible application in additive manufacturing technology.

DOI： 10.1145/3365265.3365271

Language：English   Publishing type：Research paper (other academic)  

Silicon carbide (SiC) is considered as one of the next generation power device materials because of its outstanding properties and vast potential market. However, it is still extremely difficult to polish SiC substrates due to their high chemical stability and high hardness. A new technique is necessary regarding how to realize high polishing efficiency and high surface accuracy for SiC substrates in CMP processes.
Femtosecond (fs) laser has a capability to induce ablation effect on hard materials without heat conduction. By giving lower power than conventional usage, trial formation of easy-to-process sites on as-lapped C-face of SiC substrates was carried out by fs laser irradiation. The sites are expected to be polished easily at the final surface finishing process. Two kinds of fs laser induced methods were applied to SiC substrates and the substrates were polished by CMP process with normal colloidal silica slurry in short time.
By the observation of the fs irradiated surface, a typical ripple structure was observed. The formation of such periodic rippled morphology will help CMP slurry stay on the substrate efficiently and polishing pressure affects evenly on the structure. The results of CMP application on the fs laser irradiated substrate show that the surface roughness improvement was obvious in comparison to the non-irradiated surface even in short processing time.
By consideration of the mechanisms, three main advantages became clear. The first advantage is the formation of the periodic rippled surface morphology on which CMP slurry can be kept efficiently. The second advantage is the further oxidation effect processed in the air atmosphere, and the third one is that the formation of an amorphous layer in subsurface can be expected. All three aspects act as the enhancement effect on the following CMP process.

Language：English   Publishing type：Research paper (other academic)  

Plasma fusion CMP is a combination technique of CMP (chemical mechanical polishing) capable of high-precision polishing and P-CVM (Plasma Chemical Vaporization Machining) capable of high-efficiency processing. CMP utilizes a chemical action in which the slurry softens the substrate surface and a mechanical action in which the abrasives in slurry remove the softened layer. P-CVM processes by irradiating the substrate surface with highly reactive plasma to generate volatile substances as by-products.
In this study, a newly developed CMP / P-CVM fusion processing machine was used. CMP and P-CVM can be performed at the same time by supplying a plasma from holes on the polishing pad. CVD polycrystalline SiC was used as a test substrate. CVD polycrystalline SiC is used for laser mirrors and glass molds. Therefore, a very accurate surface finishing is required. There are hard crystal parts and relatively soft amorphous parts in the structure, and there is a difference in processing speed. So, when CMP is applied, steps occur on the surface, and high-precision polishing is difficult by normal CMP.
This paper describes research aimed at high-precision and high-efficiency polishing of polycrystalline CVD SiC using plasma fusion CMP.

Language：English   Publishing type：Research paper (other academic)  

Fused silica is excellent in heat resistance, corrosion resistance and light transmission, and is used in a wide range of applications such as optical components and semiconductor substrates. However, since it is a hard and brittle material, it is difficult to use cutting, and a high efficiency machining method is required as an alternative. We use a femtosecond laser to remove fused silica. Since femtosecond lasers have a short pulse width, energy can be concentrated in a very short time, and it is possible to process with less heat affection. It also makes processing some materials possible such as semiconductors by utilizing the multiphoton absorption process. Fused silica has a very wide band gap (7.75 to 10 eV), so it is necessary to use very high fluences or very short wavelengths to excite the electrons from the valence band to the conduction band and process it. Both of them cost a lot of money. So, in this study, we propose the double-pulse processing method using a femtosecond laser at low fluences and with visible light wavelength. The double-pulse beam has two peak pulses within several picoseconds of each other. The purpose of the first pulse is to photo-excite the surface before the second pulse is irradiated. And that of the second pulse is to process the photo-excited surface at a low peak fluence. This has been demonstrated to enable processing with low fluences and low heat affection in SiC, and almost same effects can be expected with fused silica. In this report, we irradiate fused silica with a femtosecond laser at 800nm using this proposed method and confirm the effectiveness.

Language：English   Publishing type：Research paper (other academic)  

There are many demands for gears such as more accurate transmission, longer lifetime, lower vibration and noise. To satisfy these demands, high precision processing and high precision inspection are required. However, it is not possible to measure the tooth root and bottom region that differ in shape depending on the gear manufacturing method, because of the specifications of the probe in conventional gear measuring machines. Therefore, in this research, we replaced the conventional single-axis probe with a three-dimensional tactile scanning probe. We aim to develop a gear measuring machine that can measure not only the working flank but also the shape of the tooth root and the tooth bottom by three-dimensional measuring the machine. It has been confirmed in the previous research that the measurement by the development machine has some dispersion. There may be several factors that can cause errors in measurement. For example, the 3D probe output stability, damage of the stylus tip, straightness error of the mechanical drive shaft, and error due to scanning operation algorithm, and so on. In this paper we surveyed using a calibration ball whose shape and size are guaranteed beforehand to evaluate the repeatability of the measurement. Measurement deviations along the equator of the calibration ball were confirmed in the radial direction. First, we adopted a new probe with high output stability, but the range of measurement variation did not decrease. From this, it is considered that factors other than the stability of the probe output cause the dispersion of the scanning measurement. Next, since it was predicted that the stylus tip surface of the probe would be damaged, the stylus surface was observed with a confocal laser scanning microscope (CLSM) in detail. The observed result revealed that the stylus surface had some salients. These salients were removed by ultrasonic cleaning, so it is expected that oil stains were sticking. It turned out that it is necessary to pay attention also to adhering oil stains, which should be cleaned out each time just after measurement as well as before measurement when conducting gear measurement with high accuracy.

Language：English   Publishing type：Research paper (other academic)  

CMP (Chemical Mechanical Polishing and Planarization) slurries consist of a nano-sized abrasive dispersed in acidic or basic solution. There is strong demand to characterizing slurry in CMP process. The size range of CMP abrasive particles are usually 50-200 nm, which directly affects critical metrics including rate of removal and wafer defects. Thus the precise particle sizing methods are important to characterize abrasive colloid in CMP.
The dynamic light scattering (DLS), differential centrifugal photo-sedimentometry, and nanoparticle tracking analysis are the typical particle analyzing techniques based on Stokes-Einstein equation for spherical nano particle. Before characterizing the particle size distribution (PSD), we need to determine the viscosity and temperature of the slurry solvent in above techniques. Thus we suggest a method to characterize PSD without estimation of viscosity and temperature of solvent based on the translational diffusion coefficient analysis.
We have developed the method to evaluate the viscosity of the slurry by using the fluorescence polarization anisotropy (FPA) analysis. The rotational diffusion coefficient can be measured by using the fluorescent probe, that is dispersed in slurry.
In this research, we apply the precise viscosity evaluation based on FPA to characterize PSD from the translational Brownian motion analysis of abrasive particles in slurry. By using the conventional method, it is difficult to determine PSD in slurry due to the validation of the viscosity and temperature in wide area. By using the proposed method, we expect that PSD can be determined accurately at measurement area without estimation of the viscosity and temperature of slurry.

Language：English   Publishing type：Research paper (other academic)  

Nanoparticle is widely used in industrial production, such as biological sensor, pigment and slurry in CMP (Chemical Mechanical Polishing). Particle size distribution is used in the quality evaluation of nanoparticle. It is important to measure the particle size distribution of primary particle for the mixture solution of both primary and secondary particle. Image analysis method is able to accurately measure the geometric diameter of primary particle, even though secondary particle is present in solution. It is able to solve the problem that the result of DLS (Dynamic Light Scattering) is unreliable when secondary particle is present in solution. It is necessary that it takes a lot of time to observe thousands of particles.
In this research, in order to accurately measure average diameter of primary particle and classify types of particle as primary particle or secondary particle, we suggest a new sample preparation method that called “nanoparticle micro array”.
Nanoparticles are uniformly dispersed in solution. These nanoparticles are sampled one by one from the solution and arranged on silicon wafer in a high density and uniformly-spaced position. After the solution was evaporated, the sample is observed by SEM (Scanning Electron Microscope)/AFM (Atomic Force Microscope). The geometric diameter of primary particle is measured from the SEM/AFM image.
In order to verify the feasibility of particle characterization using “nanoparticle micro array”, we performed a fundamental experiment to classify particles and measure primary particle size distribution on a nanoparticle chip.
The fundamental experiments were performed to verify the feasibility of particle characterization using nanoparticle micro array. For the particle that the diameter range is 100nm~500nm, it is possible to transport the droplet which includes an isolated primary particle. When the molar density of a particle solution is determined, the size control of a sampling droplet is equal to control the number of particles which contains in the droplet. The particle size distribution of the mixture solvent which includes size different particles can be measured. It is expected that by using the nanoparticle micro array, the particle size distribution for the primary particle and the secondary particle can be distinguished in the mixture solution.

Language：English   Publishing type：Research paper (other academic)  

Ceria slurry is generally used for glass substrate CMP because of its chemical characteristics and higher removal rate (RR) than other types of slurry. There are various kinds of ceria slurry, and calcined ceria slurry is commonly used for glass substrate CMP. High RR can be obtained by using calcined ceria slurry, but a defect issue such as scratches is still remaining. Colloidal ceria slurry is expected to be a candidate for alternative slurry for glass substrate CMP because of its small slurry particle and regular shape compared to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high-quality surface in glass substrate CMP, but RR is smaller than that of calcined ceria.
In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make the colloidal ceria particles aggregate and improve the RR close to that of calcined ceria while maintaining a high quality surface. The correlation between KOH concentration and agglomeration strength was investigated by evaluating the degree of agglomeration with and without ultrasonic dispersion. As a result, it was found that the KOH concentration to be added has a great influence on the degree of aggregation and the RR. Detailed surface observation by AFM revealed that the colloidal ceria slurry added KOH (aggregated colloidal ceria slurry) generates only slightly scratches. In terms of quality, to meet higher level requirements, two-stage sequential CMP was applied: the first stage used the aggregated colloidal ceria slurry and second one used the original colloidal ceria slurry only. This two-stage CMP can be easily achieved by only stopping KOH supply without stopping the polishing process on the same polishing pad. By observing the surface quality, tiny scratches disappeared within 20s after stopping KOH. In addition, from the viewpoint of efficiency, utilizing this aggregated colloidal ceria slurry to obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high-quality surface.

Language：English   Publishing type：Research paper (other academic)  

Recently, three-dimensional coordinate measuring machines (CMMs) have drawn attention as a technique for measuring industrial products that are becoming complicated and diversified due to improvement of processing techniques. There are two types of coordinates acquisition methods in CMMs, contact type and non-contact type. While the contact type has a disadvantage in its measurement speed, the non-contact type has problems with its measurement accuracy. The final goal is to propose a high-accuracy and high-speed measurement method by combining the tactile and non-contact methods. In the previous research, an abnormal phenomenon related to the accuracy of the light section method was found. It is that the flat surface having irregularities of only 1 to 3 µm is detected incorrectly as a surface having large irregularities of 340 µm. Therefore, we focused on the accuracy of the non-contact measurement using light section method and conducted some experiments to find the cause of the abnormal phenomenon called “excessive detection error”. As a result of the experiments, it was found that the width of the line laser and uneven reflection of the measured surface greatly contributed to excessive detection error. Since the laser is irradiated with a Gaussian intensity distribution, it is desirable that the reflected light also has a Gaussian intensity distribution. However, the reflected light distribution is changed by the difference on the reflection state of the measured surface within the laser width, and the probe mis-detects the position of the measured surface. Then, we modeled the principle of generating excessive detection error and made simulator of measurement results. This simulator is expected to be used to correct the measurement results including excessive detection error. Some information, the tool path during machining and the reflection state of the measured surface, is required to simulate the measurement result. It is easy to know the tool path because most industrial products are designed with CAD, but the reflection state of the measured surface can not be calculated before processing. Therefore, we propose to use a point laser displacement meter whose laser width is much smaller than that of the line laser probe. Specifically, the reflection state is calculated from the ratio of reflected light intensity at each point. We conducted the experiment to verify this idea, and its usefulness was confirmed.

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-11

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-6

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-6

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-6

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-6

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-2

Language：English   Publishing type：Research paper (other academic)  

The CO2 capture process used in the thermal power plants now has a problem of its running cost because it must heat the adsorbent at high temperature to desorb the carbon dioxide. Since a new hydrogels-based absorbent developed at Kyushu University absorbs and desorbs CO2 in response to small temperature change, it may be the best way to reduce CO2 emissions from the thermal power stations. Furthermore, since this absorbent can be fabricated as coating films, it can be applied not only to a flat surface but also to a complicated shape. However, the way to use it with high efficiency has not been developed yet. We fabricated an aluminum reactor which has many fine grooves by precision machining and formed tens of an absorbent gel film on it by spray coating. This method accelerates the absorption and/or desorption rate of the carbon dioxide, reducing size of the CO2 capture reactor. In this paper, the influence of the film thickness and the carrier surface area on the absorption rate was investigated. CO2 gas was guided into the reactor and the concentration of the carbon dioxide contained in the gas after contact with the absorbent was measured. Comparison was made between reactors with fine grooves and without grooves. Desorption process and absorption process were performed once. As a result, it has been found that the absorption-desorption cycle improves as the film thickness decreases and the carrier surface area increases.

Language：English   Publishing type：Research paper (other academic)  

A three-dimensional probe is mounted on a specialized gear measuring machine whose measurement target is limited on the working flanks. The newly developed measuring machine has a coordinate measuring mechanism, aiming to be a highly versatile and relatively inexpensive measuring machine. According to our previous research, in addition to the working tooth surface, shape data of the root, bottom and tip profiles can be acquired with a single measurement operation. However, the target object for which this developed method has been applied was only the external cylindrical gear. In this paper, we applied and expanded the development method to the internal cylindrical gear and the evaluation of the axial displacement in the same cross-sectional scanning of the internal helical gear are performed.

Language：English   Publishing type：Research paper (scientific journal)  

Transmission used in automobiles is indispensable from the viewpoint of improvement of maximum speed, quietness and fuel consumption even if the power source of automobile is changed from internal combustion engine to electric motor in the future. We are studying a heat treatment process for imparting machinability to the forged material after hot forging used for a transmission of automobiles. In the past, the heat stored in the material after hot forging was merely released into the atmosphere. We succeeded in imparting machinability to the material by cooling while well controlling the heat stored in the forged material after hot forging. In the previous paper [1], we reported the progress of tool wear of this forged material in the high-speed cutting region with the cutting speed of 200 m/min or more in intermittent cutting. In this report, we conducted cutting experiments on the machinability of this developed forged material in the normal cutting speed region with the cutting speed less than 200 m/min. As a result, at the cutting speed V of V=157 m/min or less, it reached the conclusion that the built-up edges frequently occurred and the tool was chipped due to it. From the previous report and the results of this experiment, it was found that the cutting speed V of about V=213 m/min is optimum for cutting these forged materials with cemented carbide.

DOI： 10.1051/e3sconf/20199501001

Language：English   Publishing type：Research paper (scientific journal)  

As a critical link of efficient and high-quality semiconductor substrate chemical mechanical polishing process, this paper focuses on the effects of the changes of the atmosphere to be processed on the CMP property of Si substrate. The experiment results showed that O₂ existing in the processing atmosphere played an active role in facilitating material removal, and when the partial pressure of O₂ in the processing atmosphere increased to 500kPa, the Si MRR of CMP reached 905nm/min. The Si material surface dissolutions in different atmospheres were analyzed respectively using SEM, EDS and light interference microscope. It was found that when O₂ was sufficient, an extremely thin and tight oxide film was formed on the Si substrate surface, which prevented the furtherance of oxidation reaction, and compared with the Si-Si bonds, the Si-O bonds generated during this process were more inclined to undergo hydrolysis reaction; on the other hand, the O₂ atmosphere caused the polishing pad, polishing particles and Si substrate to contact closely, increasing the mechanical friction and thus significantly improving the MRR. Based on the results of experiment and analysis, the Mechanisms of Si substrate polishing in high-pressure O₂ atmosphere were summarized and a material removal model was built.

DOI： 10.1149/2.0201904jss

Language：English   Publishing type：Research paper (other academic)  

This study examined the effect of adjusting gear specifications on improving mesh efficiency. When the gear ratio of a cylindrical gear is relatively high, it tends to increase the sliding velocity between the engaging gear teeth. Moving the contact region toward the base circle of the pinion along the line of action is considered to be one solution for reducing friction loss . However, it may cause deterioration of tooth surface strength because the radius of the curvature of the tooth surface becomes smaller due to being close to the base circle. Two types of gear durability tests were carried out to confirm the influence on tooth surface strength. The results showed that pitting failure occurred in the tooth root area of the pinion. Furthermore, trochoidal interference and wear extended over the base circle of the pinion due to a high torque driving condition. In addition, the results of the tests differed with respect to pitting durability and the positions of pitting. These differences coincided with the state of wear. One reason could be that slight variations in the edge shape of the tooth width and the tooth flank deviations resulted in different sensitivity to pitting failure. These results revealed that pitting durability and the state of failure are influenced sensitively and compositely by trochoidal interference and wear.

Language：English   Publishing type：Research paper (scientific journal)  

In this paper, a method using electrical contact resistance to monitor in-process tool wear is proposed. The high-speed tool wear detection system uses the contact resistance between the tool and workpiece as an indicator to monitor the progression of tool wear during cutting operations. The electrical resistance decreases with an increase in contact area on the tool flank. In our previous study, the objective was an end milling process using uncoated square end mills. In this experiment, our targets are solid and throw away coated square end mills. The experiment shows the present method to also be effective as an in-process tool wear detection system for coated square end mills.

DOI： 10.20965/IJAT.2019.P0125

Language：English   Publishing type：Research paper (scientific journal)  

To realize an efficient and high-quality chemical-mechanical polishing process for the surface of a SiC wafer, a new type of MnO₂ slurry is developed employing the multi-valence and oxidation-reduction characteristics of MnO₂ particles.
This slurry is utilized to polish the Si-face of SiC wafers. In this paper, the influences of the polishing particle concentration and the pH of slurry on MRR are analyzed, the polishing performance of the MnO₂ slurry is studied, and the polishing mechanism of the MnO₂ slurry on the SiC wafer is determined. The polishing mechanism of the MnO₂ slurry is verified by selecting commonly used additives, such as KMnO₄, and the influence of the additive amount on the MRR is analyzed.
Finally, the surface morphology of the material after polishing is observed with analytical instruments.
The experimental results show that the MRR of the MnO₂ slurry is highly dependent on the pH value of the slurry. The MnO₂ particles tend to convert into MnO₄^- ions in an alkaline environment, and the strong oxidizing property of MnO₄^- ions greatly improves the polishing efficiency.
As the MnO₄^- ion concentration increases, the MRR can reach over 600 nm/h, and an ultra-smooth surface with a surface.

DOI： 10.1007/s12541-018-0206-9

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-4

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-4

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-4

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Vol.6, No.1, 1-9

DOI： DOI: 10.17706/ijmse.2018.6.1.1-9

Language：English   Publishing type：Research paper (scientific journal)  

Vol.12, No.2, 187-198

DOI： DOI: 10.20965/ijat.2018.p0187

Language：English   Publishing type：Research paper (scientific journal)  

Vol.7, Issue 2, P29-P34

DOI： DOI: 10.1149/2.0421712jss

Language：English   Publishing type：Research paper (scientific journal)  

Vol.6, Issue 12, P853-P861

DOI： DOI: 10.1149/2.0261712jss

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-4

Language：English   Publishing type：Research paper (international conference proceedings)  

pp.177-182

Language：English   Publishing type：Research paper (international conference proceedings)  

USB-Storage, pp.1-6

Language：English   Publishing type：Research paper (scientific journal)  

Vol.11, No.5, 754-760

DOI： DOI: 10.20965/ijat.2017.p0754

Language：English   Publishing type：Research paper (scientific journal)  

Vol.870 pp.185-190

DOI： DOI: 10.4028/www.scientific.net/AMM.870.185

Language：English   Publishing type：Research paper (scientific journal)  

Vol.51 pp.232-243

DOI： DOI: 10.1016/j.precisioneng.2017.08.015

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Vol.5 pp.70-75

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.1149/2.0041704jss

Language：English   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.1016/j.precisioneng.2016.09.006

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.1299/transjsme.16-00442

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.9773/sosei.57.1077

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.20965/ijat.2016.p0767

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.9773/sosei.57.648

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.1299/mej.15-00527

Language：Japanese   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.1299/transjsme.15-00456

Language：English   Publishing type：Research paper (scientific journal)  

DOI： DOI: 10.1299/mej.15-00339

Language：English   Publishing type：Research paper (scientific journal)  

DOI： doi:10.4028/www.scientific.net/AMM.799-800

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

DOI： 10.1007/s00138-014-0619-0

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Development of Abrasive-Free Copper CMP Process -Reduction of Copper Residue Using Randomly Formed Polyurethanne Pad-

Language：Japanese   Publishing type：Research paper (scientific journal)  

The impact of wafer edge profile on polishing performance in silicion wafer manufacturing

Language：Japanese   Publishing type：Research paper (scientific journal)  

Study on Reduction of Micro-Scratch in Oxide CMP for Multi-Level Interconnection -Investigation of Mechanism for Micro-Scratch Formation in CMP Process-

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

Study on Hard-Pad-Based CMP of Dielectric Global Planarization -Improvement of With-In-Wafer Non-Uniformity (WIWNU) in CMP Process-

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：English   Publishing type：Research paper (scientific journal)  

Language：Japanese   Publishing type：Research paper (scientific journal)  

High efficiency CMP technology with a closed atmosphere control bell-jar type polishing machine

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Language：English   Publishing type：Research paper (international conference proceedings)  

Responsible for pages：978ページ   Language：Japanese   Book type：Scholarly book

Responsible for pages：1235ページ   Language：Japanese   Book type：Scholarly book

Event date： 2009.9

Presentation type：Oral presentation (general)  

Venue：岩手大学（盛岡市）   Country：Japan  

Evaluation of tooth bearing patterns and gear engagement

Event date： 2009.5

Presentation type：Oral presentation (general)  

Venue：Matsushima Taikanso（Miyagi）   Country：Japan  

Presentation type：Oral presentation (general)  

Venue：ホテル松島大観荘（宮城県松島町）   Country：Japan  

New evaluation of three-dimensional modification of gear tooth flanks using parameters for global form deviation

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2024.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：琉球大学千原キャンパス（沖縄県中頭郡西原町千原）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：広島大学西条キャンパス（西条市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：福岡工業大学（福岡市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：鹿児島大学（鹿児島市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：宮崎大学（宮崎市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：宮崎大学（宮崎市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：宮崎大学（宮崎市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：宮崎大学（宮崎市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：宮崎大学（宮崎市）   Country：Japan  

Event date： 2023.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：宮崎大学（宮崎市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：久留米工業大学（久留米市）   Country：Japan  

Event date： 2022.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2022.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.11

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンデマンド   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Webex)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2021.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (Zoom)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.12

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンライン (MS Teams)   Country：Japan  

Event date： 2020.9

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：web オンデマンド   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：九州産業大学（福岡市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：熊本大学 工学部（熊本市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：熊本大学 工学部（熊本市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：熊本大学 工学部（熊本市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：熊本大学 工学部（熊本市）   Country：Japan  

Event date： 2020.3

Language：Japanese   Presentation type：Oral presentation (general)  

Venue：熊本大学 工学部（熊本市）   Country：Japan