Updated on 2024/10/01

Information

 

写真a

 
KINO HISASHI
 
Organization
Faculty of Information Science and Electrical Engineering Department of Electronics Associate Professor
School of Engineering Department of Electrical Engineering and Computer Science(Concurrent)
Graduate School of Information Science and Electrical Engineering Department of Electrical and Electronic Engineering(Concurrent)
Joint Graduate School of Mathematics for Innovation (Concurrent)
Title
Associate Professor
Contact information
メールアドレス
Profile
1) 研究活動 新しい半導体デバイスおよび集積化技術の研究に取り組んでおり、具体的には負熱膨張材料を用いた新しいひずみ導入技術、トンネル効果を用いた新しい不揮発性半導体メモリの研究を遂行している。 2) 教育活動 学部にて「電気工学基礎I/II」と「持続可能半導体概論」、大学院にて「持続可能半導体特論」を担当している。
External link

Research Areas

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Electron device and electronic equipment

Degree

  • Ph.D.

Research Interests・Research Keywords

  • Research theme:Highly sensitive FET biosensor

    Keyword:FET biosensor

    Research period: 2023.10

  • Research theme:Three dimensional integrated circuits

    Keyword:3D IC

    Research period: 2023.10

  • Research theme:Improving IC (Integrated Circuit) Performances by Controlling Stress Using Negative Thermal Expansion

    Keyword:Negative thermal expansion, Stress control

    Research period: 2023.10

  • Research theme:Semiconductor Memory with Tunnel FET

    Keyword:Tunnel FET, Semiconductor memory

    Research period: 2023.10

Awards

  • 2017年度「貴金属に関わる研究助成金」 シルバー賞

    2018.3   一般財団法人 田中貴金属記念財団   3D-NANDフラッシュメモリの大容量・低コスト・高信頼化に向けた超高密度Ptナノ粒子を有する電荷保持層の開発

Papers

  • Enhancement of carrier mobility in metal-oxide semiconductor field-effect transistors using negative thermal expansiongate electrodes Reviewed International journal

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Applied Physics Express   15 ( 11 )   111004-1 - 111004-5   2022.4

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: 10.35848/1882-0786/ac9d24

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    Repository Public URL: https://hdl.handle.net/2324/7173495

  • Generation of STDP With Non-Volatile Tunnel-FET Memory for Large-Scale and Low-Power Spiking Neural Networks Reviewed International journal

    H. Kino, T. Fukushima, T. Tanaka

    IEEE Journal of the Electron Devices Society   8   1266 - 1271   2020.9

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: 10.1109/JEDS.2020.3025336

  • D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations

    Kentaro Mihara, Takashi Hare, Hirofumi Sakai, Shimpei Aoki, Toyoharu Terada, Mariappan Murugesan, Hiryuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima, Fumihiro Inoue, Akira Uedono

    2024 IEEE 74th Electronic Components and Technology Conference (ECTC)   60   420 - 426   2024.5

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/ectc51529.2024.00074

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  • Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly

    Atsushi Shinoda, Chang Liu, Akihiro Tominaga, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    2024 IEEE 74th Electronic Components and Technology Conference (ECTC)   849 - 854   2024.5

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/ectc51529.2024.00136

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  • Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics

    Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Japanese Journal of Applied Physics   63 ( 4 )   04SP74 - 04SP74   2024.4   ISSN:0021-4922 eISSN:1347-4065

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    Publishing type:Research paper (scientific journal)   Publisher:IOP Publishing  

    Abstract

    This study focuses on enhancing the bendability of flexible interconnects with out-of-plane corrugation for flexible hybrid electronics. We propose two typical configurations of 3D corrugated interconnects: serpentine and trapezoidal. Three methods are introduced to fabricate these corrugated interconnects. The advantages and drawbacks of each fabrication strategy are discussed, and the impact of the 3D corrugation geometry and material on bendability is elucidated. In addition, the material properties of two types of negative photosensitive materials, SU-8 and F-PD (flexible-photoimageable dielectric), are compared. Results show that the resistance increase of 3D corrugated interconnects after a 5 mm radius bending test is drastically lower (by approximately 1900%–2000%) than that of conventional 2D planar interconnects.

    DOI: 10.35848/1347-4065/ad375f

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    Other Link: https://iopscience.iop.org/article/10.35848/1347-4065/ad375f/pdf

  • FOWLP-Based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display

    Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    2023 IEEE CPMT Symposium Japan (ICSJ)   49 - 52   2023.11

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/icsj59341.2023.10339585

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  • FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach

    Tadaaki Hoshi, Nishiguchi Daichi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    2023 IEEE CPMT Symposium Japan (ICSJ)   45 - 48   2023.11

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/icsj59341.2023.10339614

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  • Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction

    Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    2023 IEEE Biomedical Circuits and Systems Conference (BioCAS)   1 - 4   2023.10

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/biocas58349.2023.10389082

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  • High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

    Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Zehua Du, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials   2023.9

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    Publishing type:Research paper (international conference proceedings)   Publisher:The Japan Society of Applied Physics  

    DOI: 10.7567/ssdm.2023.g-5-02

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  • Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last

    Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Murugesan Mariappan, Mitsumasa Koyanagi, Takafumi Fukushima

    2023 IEEE International 3D Systems Integration Conference (3DIC)   499   1 - 4   2023.5

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/3dic57175.2023.10154930

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  • Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging

    Atsushi Shinoda, Yuki Susumago, Chang Liu, Jiayi Shen, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)   25   596 - 600   2023.5

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/ectc51909.2023.00105

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  • 3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration

    Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    IEICE Electronics Express   19 ( 23 )   20220363 - 20220363   2022.12   eISSN:1349-2543

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    Publishing type:Research paper (scientific journal)   Publisher:Institute of Electronics, Information and Communications Engineers (IEICE)  

    DOI: 10.1587/elex.19.20220363

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  • Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip

    Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    2022 IEEE Biomedical Circuits and Systems Conference (BioCAS)   519 - 523   2022.10

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    Publishing type:Research paper (international conference proceedings)   Publisher:IEEE  

    DOI: 10.1109/biocas54905.2022.9948542

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  • Fabrication and Characterization of Through-X Via (TXV) for Smart Skin Display

    Tadaaki Hoshi, Yuki Susumago, Liu Chang, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials   2022.9

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    Publishing type:Research paper (international conference proceedings)   Publisher:The Japan Society of Applied Physics  

    DOI: 10.7567/ssdm.2022.e-7-02

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  • Failure Analyses and Yield Enhancement of Electroplated Cu Direct Bonding for Heterogeneous 3D and Micro-LED Integration

    Yuki Susumago, Tadaaki Hoshi, Chang Liu, Atushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials   2022.9

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    Publishing type:Research paper (international conference proceedings)   Publisher:The Japan Society of Applied Physics  

    DOI: 10.7567/ssdm.2022.k-4-02

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  • Design and Evaluation of Light and Dark Adaptation Functions for High QoL Artificial Vision Chip

    Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials   2022.9

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    Publishing type:Research paper (international conference proceedings)   Publisher:The Japan Society of Applied Physics  

    DOI: 10.7567/ssdm.2022.d-1-03

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  • Simulation and Experimental Study of Stretchable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

    CHANG LIU, Yuki Susumago, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials   2022.9

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    Publishing type:Research paper (international conference proceedings)   Publisher:The Japan Society of Applied Physics  

    DOI: 10.7567/ssdm.2022.k-1-01

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  • Fabrication of the 3D-stacked retinal prosthesis chip to realize high-performance retinal prosthesis

    Aoba Onishi, Ryotaro Bamba, Bungo Tanaka, Ryouhei Kishimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials   2022.9

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    Publishing type:Research paper (international conference proceedings)   Publisher:The Japan Society of Applied Physics  

    DOI: 10.7567/ssdm.2022.k-1-03

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  • Electrochemical characterization of ZnO-based transparent materials as recording electrodes for neural probes in optogenetics

    Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Journal of Vacuum Science & Technology B   40 ( 5 )   052202 - 052202   2022.9   ISSN:2166-2746 eISSN:2166-2754

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    Language:Others   Publishing type:Research paper (scientific journal)   Publisher:American Vacuum Society  

    In the elucidation of brain functions, neuroscience has garnered attention in the realization of brain-machine interfaces, deep brain stimulation, and artificial intelligence. Optogenetics is a biological technique used to control neural activities via optical stimulation. It is one of the most effective approaches used to investigate brain functions. This study proposed to employ the transparent recording electrode to enhance the performance of neural probes for optogenetics. Compared with conventional metal recording electrodes, the proposed transparent recording electrodes have the potential to obtain higher signal-to-noise ratios when placed over optical stimulation points. To develop transparent recording electrodes, we used ZnO-based materials with good biocompatibility and transparency for utilization as biomedical electrodes. Considering saline as one of the main components of living organisms, we investigated the fundamental electrochemical characteristics of ZnO-based electrodes in saline through electrochemical impedance spectroscopy and cyclic voltammetry. The results showed that nondoped ZnO and Al-doped ZnO, deposited by radio frequency magnetron sputtering, exhibited a broad potential window. An electrical double layer was found to strongly act on the interface between the electrodes and solution rather than a redox reaction. In addition, this study reports the effects of crystallization and dopant on the electrochemical characteristics of the ZnO-based electrodes. The transparent ZnO-based electrode developed herein is a promising candidate to enhance the performance of neural probes for optogenetics and can be effectively applied in biological devices.

    DOI: 10.1116/6.0001836

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  • Developing a Low-Temperature Flip-Chip Bonding Technology with In/Au Microbumps to Suppress the Thermal Load on Spintronics Devices

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    2022 IEEE International Interconnect Technology Conference (IITC)   2022.6

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    DOI: 10.1109/iitc52079.2022.9881288

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  • Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs

    Yuki Susumago, Shunsuke Arayama, Tadaaki Hoshi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)   2022.5

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    Language:Others   Publishing type:Research paper (other academic)   Publisher:IEEE  

    DOI: 10.1109/ectc51906.2022.00225

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  • Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System

    Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    2021 IEEE Biomedical Circuits and Systems Conference (BioCAS)   2021.10

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    Language:Others   Publishing type:Research paper (other academic)  

    DOI: 10.1109/biocas49922.2021.9645034

  • Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

    Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan

    2021 IEEE International 3D Systems Integration Conference (3DIC)   2021.10

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    DOI: 10.1109/3dic52383.2021.9687601

  • High-thermal-stability resistor formed from manganese nitride compound that exhibits the saturation state of the mean free path

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Applied Physics Express   14 ( 9 )   2021.9

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    DOI: 10.35848/1882-0786/ac18b0

  • Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    2021 IEEE International Interconnect Technology Conference, IITC 2021   2021.7

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    DOI: 10.1109/IITC51362.2021.9537336

  • Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics

    Zhe Wang, Ikumi Ozawa, Yuki Susumago, Tomo Odashima, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    2021 IEEE International Interconnect Technology Conference, IITC 2021   2021.7

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    DOI: 10.1109/IITC51362.2021.9537540

  • On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO<inf>2</inf>

    Takafumi Fukushima, Mariappan Murugesan, Ji Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

    Journal of Polymer Science   58 ( 16 )   2248 - 2258   2020.8

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    DOI: 10.1002/pol.20200094

  • Significant Die-Shift Reduction and μlED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics

    10 ( 8 )   1419 - 1422   2020.8

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    © 2011-2012 IEEE. Typical die shift is beyond several tens micrometers or more, which is a serious problem on advanced fan-out wafer-level packaging (FOWLP), to give inevitable misalignment errors in the subsequent photolithography processes for fine-pitch redistributed wiring layer (RDL) formation. In particular, this problem is expected to grow all the more serious in chiplets and tiny dies less than 1 mm in a side. In this work, the use of an anchoring layer is proposed to fix these dies/chiplets on a double-side laminate thermo-release tape and drastically reduce the die shift. In addition, an on-nail photoplethysmogram (PPG) sensor module as a part of flexible hybrid electronics (FHE) is integrated with mu LED ( 270,,mu ext{m},, imes 270,,mu ext{m} ) based on a die-first FOWLP methodology using a biocompatible polydimethylsiloxane (PDMS) mold resin for real-time monitoring pulse wave and percutaneous oxygen saturation (SpO2). The repeated bendability of fan-out Au wirings formed on the PDMS and the current-voltage ( I - V ) behavior of the mu LED before and after die embedment in the PDMS is characterized.

    DOI: 10.1109/TCPMT.2020.3009640

  • RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

    Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Proceedings - Electronic Components and Technology Conference   2020-June   811 - 816   2020.6

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    DOI: 10.1109/ECTC32862.2020.00132

  • Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion

    Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Proceedings - Electronic Components and Technology Conference   2020-June   1199 - 1204   2020.6

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    DOI: 10.1109/ECTC32862.2020.00192

  • 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

    2020-June   1453 - 1458   2020.6

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    © 2020 IEEE. High-density interconnections are highly required for 3D IC such as FPGA and image sensor applications. Fine-pitch interconnects using conventional solder microbumps are still required. To meet this requirements, low-height Cu/Sn microbumps are evaluated in this study. The thermal compression bonding with the low-height solder microbumps makes it challenging to fulfill high-viscous capillary underfill (CUF) into extremely small gaps between the chips stacked in layers. Here, we demonstrate to apply a 7-μm-thick non-conductive film (NCF) to flip-chip bonding with the low-height solder microbumps. Compared with a CUF, the electrical characterization such as electromigration (EM) and leakage current of microbump daisy chains with the ultra-thin NCF was investigated with temperature cycle test (TCT) and unbiased HAST.

    DOI: 10.1109/ECTC32862.2020.00230

  • Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings   2020.4

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    Language:English   Publishing type:Research paper (other academic)  

    DOI: 10.1109/EDTM47692.2020.9118027

  • Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory Reviewed

    Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

    Japanese Journal of Applied Physics   59 ( SG )   2020.4

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    DOI: 10.35848/1347-4065/ab6867

  • Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration Reviewed

    Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Japanese Journal of Applied Physics   59 ( SB )   17   2020.2

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: 10.7567/1347-4065/ab4f3c

  • Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs Reviewed

    Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019   2019.10

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    DOI: 10.1109/3DIC48104.2019.9058841

  • PPG and SpO<inf>2</inf> Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System Reviewed

    Ryosuke Yabuki, Tetsu Tanaka, Zhengyang Qian, Kar Mun Lee, Bang Du, Filipe Alves Satake, Tasuku Fukushima, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama

    BioCAS 2019 - Biomedical Circuits and Systems Conference, Proceedings   2019.10

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    Language:Others   Publishing type:Research paper (other academic)  

    DOI: 10.1109/BIOCAS.2019.8919027

  • Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019   2019.10

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    Language:Others   Publishing type:Research paper (other academic)  

    DOI: 10.1109/3DIC48104.2019.9058838

  • Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO<inf>2</inf> for Low-Temperature TSV Liner Formation Reviewed

    Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Murugesan Mariappan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019   2019.10

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    DOI: 10.1109/3DIC48104.2019.9058843

  • Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing Reviewed

    Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019   2019.10

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    Language:Others   Publishing type:Research paper (other academic)  

    DOI: 10.1109/3DIC48104.2019.9058856

  • Development of 3D-IC Embedded Flexible Hybrid System Reviewed

    Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019   2019.10

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    DOI: 10.1109/3DIC48104.2019.9058880

  • Development of Wireless Opto-Neural Probe with Upconversion Nanoparticles (UCNP) for Optogenetics Reviewed

    S. Urayama, H. Kino, T. Fukushima, T. Tanaka

    Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials   68th   41 - 42   2019.9

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    Development of Wireless Opto-Neural Probe with Upconversion Nanoparticles (UCNP) for Optogenetics

  • Ultrasmall Area and Ultralow Frequency Ring-oscillatorUsing GIDL Currentfor IoT Edge Applications Reviewed

    Bang Du, Zhengyang Qian, KarMun Lee, Ryosuke Yabuki, Tasuku Fukushima, Filipe Alves Satake, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials   1039 - 1040   2019.9

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    Ultrasmall Area and Ultralow Frequency Ring-oscillatorUsing GIDL Currentfor IoT Edge Applications

  • Spike Timing Dependent Plasticity Characteristics of Tunnel FET based MONOS Memory for Low Power Neural Network Circuits Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials   673 - 674   2019.9

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    Spike Timing Dependent Plasticity Characteristics of Tunnel FET based MONOS Memory for Low Power Neural Network Circuits

  • Hydrogel-based Flexible Hybrid Electronics Technology for Biomedical Application Reviewed

    N.Takahashi, Y.Susumago, H. Kino, T.Tanaka, T.Fukushima

    Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials   859 - 860   2019.9

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    Hydrogel-based Flexible Hybrid Electronics Technology for Biomedical Application

  • Mechanical and electrical characterization of FOWLP-based flexible hybrid electronics (FHE) for biomedical sensor application Reviewed

    Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Proceedings - Electronic Components and Technology Conference   2019-May   264 - 269   2019.5

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    DOI: 10.1109/ECTC.2019.00046

  • Investigation of the Impact of External Stress on Memory Characteristics by Modifying the Backside of Substrate Reviewed

    Young-Taek Oh, Jae-Min Sim, Nguyen Van Toan, Hisashi Kino, Takahito Ono, Tetsu Tanaka, Yun-Heub Song

    IEEE Transactions on Electron Devices   66 ( 4 )   1 - 6   2019.4

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: 10.1109/TED.2019.2900155

  • Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019   222 - 224   2019.3

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    Language:Others   Publishing type:Research paper (other academic)  

    DOI: 10.1109/EDTM.2019.8731161

  • Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter Reviewed

    Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    IEEE Electron Device Letters   40 ( 1 )   1 - 1   2019.1

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    DOI: 10.1109/LED.2018.2884452

  • High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs Reviewed

    Hideto Hashiguchi, Takafumi Fukushima, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE Transactions on Components, Packaging and Manufacturing Technology   9 ( 1 )   181 - 188   2019.1

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    DOI: 10.1109/TCPMT.2018.2871764

  • Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips Reviewed

    Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino, Takafumi Fukushima, Koji Kiyovama, Tetsu Tanaka

    2018 IEEE Biomedical Circuits and Systems Conference, BioCAS 2018 - Proceedings   1 - 4   2018.12

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    DOI: 10.1109/BIOCAS.2018.8584776

  • Process Integration for FlexTrate TM Reviewed

    Tak Fukushima, Yuki Susumago, Hisashi Kino, Tetsu Tanaka, Arsalan Alam, Amir Hanna, Subramanian S. Iyer

    2018 International Flexible Electronics Technology Conference, IFETC 2018   1 - 2   2018.12

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    DOI: 10.1109/IFETC.2018.8584029

  • The Effect of Mechanical Stress on Cell Characteristics in MONOS Structures Reviewed

    Young-Taek Oh, Il-Pyo Roh, Hisashi Kino, Tetsu Tanaka, Yun-Heub Song

    IEEE Transactions on Electron Devices   65 ( 10 )   4313 - 4319   2018.10

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    DOI: 10.1109/TED.2018.2865007

  • Pulse Arrival Time Measurement with Finger-Based ECG and Trans-Nail PPG Circuits for Cuffless Blood Pressure Monitoring Reviewed

    K.M. Lee, Z. Qian, R. Yabuki, H. Kino, T. Fukushima, K. Kiyoyama, T. Tanaka

    Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials   557 - 558   2018.9

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    Pulse Arrival Time Measurement with Finger-Based ECG and Trans-Nail PPG Circuits for Cuffless Blood Pressure Monitoring

  • Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs Reviewed

    Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka

    2018 IEEE International Interconnect Technology Conference, IITC 2018   135 - 137   2018.8

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    DOI: 10.1109/IITC.2018.8430390

  • TSV liner dielectric technology with spin-on low-k polymer Reviewed

    S. Lee, Y. Sugawara, M. Ito, H. Kino, T. Fukushima, T. Tanaka

    2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018   346 - 349   2018.6

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    DOI: 10.23919/ICEP.2018.8374320

  • The Effect of High Electric Field in Tunnel-FET MONOS Memory on Endurance Characteristics Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Proceedings of 2018 IEEE Silicon Nanoelectronics Workshop   81 - 82   2018.6

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    The Effect of High Electric Field in Tunnel-FET MONOS Memory on Endurance Characteristics

  • Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system Reviewed

    Z. Qian, Y. Takezawa, K. Shimokawa, H. Kino, T. Fukushima, K. Kiyoyama, T. Tanaka

    Japanese Journal of Applied Physics   57 ( 4S )   04FM11-01 - 04FM11-04   2018.3

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    Development of integrated photoplethysmographic recording circuit for trans-nail pulse-wave monitoring system

  • Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration Reviewed

    Hideto Hashiguchi, Takafumi Fukushima, Hiroyuki Hashimoto, Ji-Cheol Bea, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE TRANSACTIONS ON ELECTRON DEVICES   64 ( 12 )   5065 - 5072   2017.12

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    DOI: 10.1109/TED.2017.2767598

  • An Integrated Photo-Plethysmography Recording Circuit for Trans-Nail Pulse-Wave Monitoring System Reviewed

    Zhengyang Qian, Yoshiki Takezawa, Kenji Shimokawa, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    Extended abstracts of the 2017 International Conference on Solid State Devices and Materials   257 - 258   2017.9

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    An Integrated Photo-Plethysmography Recording Circuit for Trans-Nail Pulse-Wave Monitoring System

  • Wide-range bioelectrical impedance analysis circuit with GIDL-controlled ultrasmall current and ultralow frequency square wave generator Reviewed

    Yoshiki Takezawa, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino, Takafumi Fukushima, Koji Kiyoyama, Tetsu Tanaka

    Extended abstracts of the 2017 International Conference on Solid State Devices and Materials   517 - 518   2017.9

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    Wide-range bioelectrical impedance analysis circuit with GIDL-controlled ultrasmall current and ultralow frequency square wave generator

  • New Tunnel FET Charge-Trapping Memory with Large Memory Window for Ultra Low Power Operation Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Extended abstracts of the 2017 International Conference on Solid State Devices and Materials   791 - 792   2017.9

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    New Tunnel FET Charge-Trapping Memory with Large Memory Window for Ultra Low Power Operation

  • Development of Vertically-Stacked Multi-Shank Si Neural Probe Array with Sharpened Tip for Cubic Spatial Recording Reviewed

    Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Norihiro Katayama, Tetsu Tanaka

    Extended abstracts of the 2017 International Conference on Solid State Devices and Materials   269 - 270   2017.9

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    Development of Vertically-Stacked Multi-Shank Si Neural Probe Array with Sharpened Tip for Cubic Spatial Recording

  • Characterization of Cu-TSVs Fabricated by a New All-Wet Process Reviewed

    Miao Xiong, Yangyang Yan, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Extended abstracts of the 2017 International Conference on Solid State Devices and Materials   403 - 404   2017.9

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    Characterization of Cu-TSVs Fabricated by a New All-Wet Process

  • Remarkable Suppression of Local Stress in 3D IC by Manganese Nitride-Based Filler with Large Negative CTE Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Proceedings - Electronic Components and Technology Conference   1523 - 1528   2017.8

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    DOI: 10.1109/ECTC.2017.209

  • 3-D Sidewall Interconnect Formation Climbing Over Self-Assembled KGDs for Large-Area Heterogeneous Integration Reviewed

    Takafumi Fukushima, Akihiro Noriki, Jichoel Bea, Mariappan Murugesan, Hisashi Kino, Koji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE TRANSACTIONS ON ELECTRON DEVICES   64 ( 7 )   2912 - 2918   2017.7

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    DOI: 10.1109/TED.2017.2705562

  • Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission Reviewed

    Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka

    IITC 2017 - 2017 IEEE International Interconnect Technology Conference   2017.7

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    DOI: 10.1109/IITC-AMC.2017.7968936

  • Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler Reviewed

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    2016 IEEE International 3D Systems Integration Conference, 3DIC 2016   2017.7

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    DOI: 10.1109/3DIC.2016.7970031

  • Design and evaluation of wide-range and low-power analog front-end enabling body-implanted devices to monitor charge injection properties Reviewed

    Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

    Japanese Journal of Applied Physics   56 ( 4 )   04CM05-1 - 04CM05-5   2017.4

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    DOI: 10.7567/JJAP.56.04CM05

  • Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces Reviewed

    Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Japanese Journal of Applied Physics   56 ( 4S )   04CM04-1 - 04CM04-4   2017.3

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    Development of Si neural probe with piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces
    A Si neural probe is one of the most important tools for neurophysiology and brain science because of its various functions such as optical stimulation and drug delivery. However, the Si neural probe is not robust compared with a metal tetrode, and could be broken by mechanical stress caused by insertion to the brain. Therefore, the Si neural probe becomes more useful if it has a stress sensor that can measure mechanical forces applied to the probe so as not to be broken. In this paper, we proposed and fabricated the Si neural probe with a piezoresistive force sensor for minimally invasive and precise monitoring of insertion forces. The fabricated piezoresistive force sensor accurately measured forces and successfully detected insertion events without buckling or bending in the shank of the Si neural probe. This Si neural probe with a piezoresistive force sensor has become one of the most versatile tools for neurophysiology and brain science.

    DOI: 10.7567/JJAP.56.04CM04

  • Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber Reviewed

    Takumi Morikawa, Takuya Harashima, Hisashi Kino, Takafumi Fukusihma, Tetsu Tanaka

    Japanese Journal of Applied Physics   56 ( 4S )   04CM08-1 - 04CM08-4   2017.3

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    Evaluation of insertion characteristics of less invasive Si optoneural probe with embedded optical fiber
    A less invasive Si optoneural probe with an embedded optical fiber was proposed and successfully fabricated. The diameter of the optical fiber was completely controlled by hydrogen fluoride etching, and the thinned optical fiber can propagate light without any leakage. This optical fiber was embedded in a trench formed inside a probe shank, which causes less damage to tissues. In addition, it was confirmed that the optical fiber embedded in the probe shank successfully irradiated light to optically stimulate gene transfected neurons. The electrochemical impedance of the probe did not change despite the light irradiation. Furthermore, probe insertion characteristics were evaluated in detail and less invasive insertion was clearly indicated for the Si optoneural probe with the embedded optical fiber compared with conventional optical neural probes. This neural probe with the embedded optical fiber can be used as a simple and easy tool for optogenetics and brain science.

    DOI: 10.7567/JJAP.56.04CM08

  • 光ファイバ埋め込みシリコンオプト神経プローブの開発

    森川 拓実, 原島 卓也, 木野 久志, 福島 誉史, 坂本 一寛, 片山 統裕, 虫明 元, 田中 徹

    平成28年度文部科学省新学術領域研究 学術研究支援基盤形成 先端モデル動物支援プラットフォーム 成果発表会 プログラム・抄録集   68 - 68   2017.2

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  • 半導体微細加工技術を用いた高機能シリコン神経プローブの開発

    原島 卓也, 森川 拓実, 木野 久志, 福島 誉史, 坂本 一寛, 片山 統裕, 虫明 元, 田中 徹

    平成28年度文部科学省新学術領域研究 学術研究支援基盤形成 先端モデル動物支援プラットフォーム 成果発表会 プログラム・抄録   66 - 66   2017.2

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  • Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration Reviewed

    Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

    Micromachines   7 ( 10 )   184-1 - 184-18   2016.10

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    DOI: 10.3390/mi7100184

  • Analysis of Charge Injection Characteristics of Stimulus Electrode with Wide-Range Analog Front-end for Body-Implanted Devices Reviewed

    Keita Ito, Shoma Uno, Tatsuya Goto, Yoshiki Takezawa, Takuya Harashima, Takumi Morikawa, Satoru Nishino, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

    Extended abstracts of the 2016 International Conference on Solid State Devices and Materials   393 - 394   2016.9

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    Analysis of Charge Injection Characteristics of Stimulus Electrode with Wide-Range Analog Front-end for Body-Implanted Devices

  • 集積化脳神経プローブシステムの過熱保護用温度検出回路の一考察

    西野悟, 伊藤圭汰, 竹澤好樹, 下川賢士, 後藤竜也, 宇野正真, 木野久志, 田中徹, 清山浩司

    平成28年度(第69回)電気・情報関係学会九州支部連合大会講演論文集   256 - 256   2016.9

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  • 網膜下刺激人工網膜におけるAZO透明刺激電極の基礎評価

    下川 賢士, 後藤 大輝, 木野 久志, 福島 誉史, 田中 徹

    2016年第77回応用物理学会秋季学術講演会講演予稿集   77th   11-408 - 11-408   2016.9

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  • 光ファイバ埋め込みシリコンオプト神経プローブの刺入特性

    森川拓実, 原島卓也, 木野 久志, 福島 誉史, 田中 徹

    2016年第77回応用物理学会秋季学術講演会講演予稿集   77th   11-416 - 11-416   2016.9

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  • マルチウェル構造TSVを用いたTSV側壁Si-SiO2界面準位の評価

    菅原陽平, 木野久志, 福島誉史, 李康旭, 小柳光正, 田中徹

    2016年第77回応用物理学会秋季学術講演会講演予稿集   77th   12-340 - 12-340   2016.9

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  • Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber Reviewed

    Takumi Morikawa, Takuya Harashima, Takafumi Fukushima, Hisashi Kino, Tetsu Tanaka

    Extended abstracts of the 2016 International Conference on Solid State Devices and Materials   389 - 390   2016.9

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    Insertion Characteristics Evaluation of Si Opto-Neural Probe with Embedded Optical fiber

  • Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique Reviewed

    Yohei Sugawara, Hisashi Kino, Takahumi Fukushima, Kang-Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka

    Extended abstracts of the 2016 International Conference on Solid State Devices and Materials   467 - 468   2016.9

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    Evaluation of Depth-dependent TSV-liner Interface States Using Multi-well Structure TSV and Charge Pumping Technique

  • Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring Reviewed

    Takuya Harashima, Takumi Morikawa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Extended abstracts of the 2016 International Conference on Solid State Devices and Materials   409 - 410   2016.9

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    Development of Si Neural Probe with Piezoresistive Force Sensor for Insertion Force Monitoring

  • 画素間ばらつき補正機能を有する3次元積層人工網膜チップの提案 Reviewed

    伊藤 圭汰, 宇野 正真, 後藤 竜也, 竹澤 好樹, 西野 悟, 木野 久志, 清山 浩司, 田中 徹

    LSIとシステムのワークショップ2016   2016.5

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  • Design and evaluation of area-efficient and wide-range impedance analysis circuit for multichannel high-quality brain signal recording system Reviewed

    Takuma Iwagami, Takaharu Tani, Keita Ito, Satoru Nishino, Takuya Harashima, Hisashi Kino, Koji Kiyoyama, Tetsu Tanaka

    JAPANESE JOURNAL OF APPLIED PHYSICS   55 ( 4 )   04EM12-1 - 04EM12-5   2016.4

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    DOI: 10.7567/JJAP.55.04EM12

  • Evaluation of in-plane local stress distribution in stacked IC chip using dynamic random access memory cell array for highly reliable three-dimensional IC Reviewed

    Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    JAPANESE JOURNAL OF APPLIED PHYSICS   55 ( 4 )   2016.4

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    DOI: 10.7567/JJAP.55.04EC07

  • Effect of local stress induced by thermal expansion of underfill in three-dimensional stacked IC Reviewed

    Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    JAPANESE JOURNAL OF APPLIED PHYSICS   55 ( 4 )   04EC03-1 - 04EC03-4   2016.4

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    DOI: 10.7567/JJAP.55.04EC03

  • DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価

    谷川 星野, 木野久志, 福島 誉史, 田中 徹

    第63回応用物理学会春季学術講演会 講演予稿集   63rd   11-130   2016.3

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  • Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC Reviewed

    Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    Japanese Journal of Applied Physics   55 ( 4S )   04EC07-1 - 04EC07-4   2016.3

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    Evaluation of In-plane Local Bending Stress Distribution with DRAM Cell Array for Highly Reliable 3D IC

    DOI: 10.7567/JJAP.55.04EC07

  • Impact of Chip-Edge Structures on Alignment Accuracies of Self-Assembled Dies for Microelectronic System Integration Reviewed

    Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS   25 ( 1 )   91 - 100   2016.2

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    DOI: 10.1109/JMEMS.2015.2480787

  • 三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価

    谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹

    2015年度 応用物理学会東北支部 第70回学術講演会   70th   2015.12

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  • 電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発

    原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

    平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム   60 - 60   2015.12

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  • 柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-

    鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹

    平成27年度 包括型脳科学研究推進支援ネットワーク 冬のシンポジウム   60 - 60   2015.12

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  • 低消費電力生体信号処理LSIの設計及びポータブルプロトタイプシステムの開発 (多機能集積化脳神経プローブシステム2)

    伊藤圭汰, 谷卓治, 岩上卓磨, 宇野正真, 後藤竜也, 竹澤好樹, 西野悟, 木野久志, 清山浩司, 田中徹

    平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム   60 - 60   2015.12

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  • 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価

    菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹

    第76回応用物理学会秋季学術講演会講演予稿集   76th   12-123 - 12-123   2015.9

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  • 大脳皮質層別光刺激のための反射ミラー集積シリコン神経プローブの開発

    原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

    第76回応用物理学会秋季学術講演会予稿集   76th   p11-381 - p11-381   2015.9

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  • 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究

    木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹

    第25回マイクロエレクトロニクスシンポジウム論文集   25th   355 - 358   2015.9

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  • チップ集積・フレキシブルケーブル一体化シリコン神経プローブの開発(集積化脳神経プローブシステムの開発1)

    鈴木雄策, 谷卓治, 原島卓也, 木野久志, 福島誉史, 田中徹

    2015年第76回応用物理学会秋季学術講演会講演予稿集   76th   11 - 379   2015.9

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  • Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC Reviewed

    Hisashi Kino, Hideto hashiguchi, Seiya Tanikawa, Youhei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials   56 - 57   2015.9

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    Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC

  • Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array Reviewed

    Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials   790 - 791   2015.9

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    Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array

  • DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価

    谷川 星野, 木野 久志, 福島 誉史, 小柳 光正, 田中 徹

    2015年第76回応用物理学会秋季学術講演会講演予稿集   76th   12 - 124   2015.9

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  • Vertical-cavity surface-emitting laser chip bonding by surface-tension-driven self-assembly for optoelectronic heterogeneous integration Reviewed

    Yuka Ito, Takafumi Fukushima, Hisashi Kino, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

    JAPANESE JOURNAL OF APPLIED PHYSICS   54 ( 3 )   030206-1 - 030206-6   2015.3

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    DOI: 10.7567/JJAP.54.030206

  • 表層刺激電極を有する網膜下埋植人工網膜チップモジュールの作製

    後藤 大輝, 長沼 秀樹, 木野 久志, 田中 徹

    第62回応用物理学会春季学術講演会   11-027   2015.3

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  • 三次元集積化における異種材料間の熱膨張係数差がおよぼす影響

    木野 久志, 池ヶ谷 俊介, 小柳 光正, 田中 徹

    第62回応用物理学会春季学術講演会   17-065   2015.3

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  • マルチグルーブシャンクを有する昆虫用In vivoシリコン神経プローブの作製(集積化脳神経プローブシステムの開発3)

    鈴木 雄策, 原島 卓也, 木野 久志, 田中 徹

    第62回応用物理学会春季学術講演会   11-026   2015.3

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  • Development of Si neural probe module with adjustable gain amplifier for neuronal signal recording Reviewed

    Transactions of Japanese Society for Medical and Biological Engineering   52   377 - O-378   2014.8

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    DOI: 10.11239/jsmbe.52.O-377

  • Development of chip-surface stimulus electrode array for fully-implantable subretinal prosthesis chip Reviewed

    Yuichiro Sasaki, Takuji Suzuki, Takuma Iwagami, Takaharu Tani, Hideki Naganuma, Hisashi Kino, Jari Hyttinen, Minna Kellomaki, Tetsu Tanaka

    Transactions of Japanese Society for Medical and Biological Engineering   52   253 - O-254   2014.8

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    DOI: 10.11239/jsmbe.52.O-253

  • Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice Reviewed

    Murugesan Mariappan, Yasuhiko Imai, Shigeru Kimura, Takafumi Fukushima, Ji-Choel Bea, Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE TRANSACTIONS ON ELECTRON DEVICES   61 ( 2 )   540 - 547   2014.2

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    DOI: 10.1109/TED.2013.2295463

  • Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu-SnAg Microbumps and a Nonconductive Film Reviewed

    Takafumi Fukushima, Jichoel Bea, Hisashi Kino, Chisato Nagai, Mariappan Murugesan, Hideto Hashiguchi, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE TRANSACTIONS ON ELECTRON DEVICES   61 ( 2 )   533 - 539   2014.2

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    DOI: 10.1109/TED.2013.2294831

  • Fabrication and In vivo Evaluation of Poly(3,4-ethylenedioxythiophene) Stimulus Electrodes for Fully Implantable Retinal Prosthesis Reviewed

    Chikashi Kigure, Hideki Naganuma, Yuichiro Sasaki, Hisashi Kino, Hiroshi Tomita, Tetsu Tanaka

    JAPANESE JOURNAL OF APPLIED PHYSICS   52 ( 4 )   2013.4

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    DOI: 10.7567/JJAP.52.04CL03

  • Study of Insertion Characteristics of Si Neural Probe with Sharpened Tip for Minimally Invasive Insertion to Brain Reviewed

    Sanghoon Lee, Soichiro Kanno, Hisashi Kino, Tetsu Tanaka

    JAPANESE JOURNAL OF APPLIED PHYSICS   52 ( 4 )   2013.4

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    DOI: 10.7567/JJAP.52.04CL04

  • Investigation of Local Bending Stress Effect on Complementary Metal–Oxide–Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration Reviewed

    52 ( 4 )   04CB11-1 - 04CB11-5   2013.4

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    DOI: 10.7567/JJAP.52.04CB11

  • MOSFET Nonvolatile Memory with High-Density Cobalt-Nanodots Floating Gate and HfO2 High-k Blocking Dielectric Reviewed

    Yanli Pei, Chengkuan Yin, Toshiya Kojima, Ji-Cheol Bea, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

    IEEE TRANSACTIONS ON NANOTECHNOLOGY   10 ( 3 )   528 - 531   2011.5

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    DOI: 10.1109/TNANO.2010.2050331

  • MOSFET nonvolatile memory with a high-density tungsten nanodot floating gate formed by self-assembled nanodot deposition Reviewed

    Y. Pei, C. Yin, J. C. Bea, H. Kino, T. Fukushima, T. Tanaka, M. Koyanagi

    SEMICONDUCTOR SCIENCE AND TECHNOLOGY   24 ( 4 )   2009.4

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    DOI: 10.1088/0268-1242/24/4/045022

▼display all

Books

  • 熱膨張制御材料の開発と応用

    竹中康司, 東正樹, 扇澤敏明, 石川隆司, 小橋眞, 山村泰久, 表篤志, 藤田麻哉, 岡研吾, 竹澤晃弘, 荒井豊, 大野康晴, 藤田俊輔, 南川弘行, 河原正美, 木野久志, 田中徹, 佐々木拓, 八島正知, 鈴木義和( Role: Joint author)

    シーエムシー出版  2018.1 

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Presentations

  • Development of Ultrathin-Metal-Capped Transparent Conductive Film Electrode for Optical Biomedical Devices

    Hisashi Kino, Yuki Miwa, Takafumi Fukushima, Tetsu Tanaka

    2021 International Conference on Solid State Devices and Materials  2021.9 

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  • Development of Manganese Nitride Resistor with Near-Zero Temperature-Coefficient of Resistance to Achieve High-Thermal-Stability ICs

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    2021 IEEE International Interconnect Technology Conference  2021.7 

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  • Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD

    M. Murugesan, Y. Susumago, T. Odashima, H. Kino, T. Tanaka, K. Sumitani, Y. Imai, S. Kimura, and T. Fukushima

    Solid State Devices and Materials  2020.9 

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  • Development of Manganese Nitride Wiring with High Thermal Stability Caused by Saturation of the Mean Free Path

    Hisashi Kino, Aoba Onishi, Takafumi Fukushima, TetsuTanaka

    Solid State Devices and Materials  2020.9 

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  • Micro-LED and PPG Sensor Integration Using Flexible Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave/SpO2 Monitoring

    Tomo Odashima, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    Solid State Devices and Materials  2020.9 

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  • Fabrication and Evaluation of Neural Recording Microelectrode on Opto-Neural Probe with Upconversion Nanoparticles Light Emitter

    Fen Yang, Shota Urayama, Haruki Nagasaki, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Solid State Devices and Materials  2020.9 

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  • Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices

    Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Solid State Devices and Materials  2020.9 

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  • Die-Level Cu-CMP Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration

    Shuai Liu, Kousei Kumahara, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Solid State Devices and Materials  2020.9 

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  • Development of Optical Waveguiding Neural Probe with Upconversion-Nanoparticle Light Emitter for Optogenetics

    Shota Urayama, Fen Yang, Haruki Nagasaki, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    Solid State Devices and Materials  2020.9 

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  • RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel

    Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

    70th IEEE Electronic Components and Technology Conference  2020.6 

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  • Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion

    Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    70th IEEE Electronic Components and Technology Conference  2020.6 

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  • 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration

    2020.6 

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  • Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks

    Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

    4th Electron Devices Technology and Manufacturing Conference  2020.3 

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  • Development of underfill with negative-CTE material for high-reliable three-dimensional integrated circuit (3D IC) Invited

    Hisashi Kino

    3rd International Symposium on Negative Thermal Expansion and Related Materials (ISNTE-3)  2019.12 

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    Development of underfill with negative-CTE material for high-reliable three-dimensional integrated circuit (3D IC)

  • Investigation of the Underfill with Negative-Thermal-Expansion Material toSuppress Mechanical Stress in 3D Integration System

    Hisashi Kino

    IEEE International 3D Systems Integration Conference 2019 (3DIC 2019)  2019.10 

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    Investigation of the Underfill with Negative-Thermal-Expansion Material toSuppress Mechanical Stress in 3D Integration System

  • Local Bending Stress Suppression with Negative-CTE Material for High Performance 3D IC Invited

    Hisashi Kino

    NANO KOREA 2019 Symposium  2019.7 

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    Local Bending Stress Suppression with Negative-CTE Material for High Performance 3D IC

  • C-12-53 帯域切換及び利得切換機能を有するマルチ生体信号記録モジュールの設計と評価(C-12.集積回路)

    谷 卓治, 長沼 秀樹, 木野 久志, 清山 浩司, 田中 徹

    電子情報通信学会総合大会講演論文集  2013.3 

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  • C-12-3 エッジ強調機能を有する3次元積層人工網膜チップの低電力特性(C-12.集積回路)

    長沼 秀樹, 木暮 爾, 谷 卓治, 笹木 悠一郎, 木野 久志, 清山 浩司, 田中 徹

    電子情報通信学会総合大会講演論文集  2013.3 

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  • 6PM3-PMN-006 低侵襲シリコン神経プローブの作製と刺入特性評価(OS3 マイクロ・ナノ生体医工学,ポスターセッション)

    原島 卓也, 遠藤 栄典, 木野 久志, 田中 徹

    マイクロ・ナノ工学シンポジウム  2013.11 

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    Recently, many neural probes with various materials and shapes have been developed for treatments of cerebropathy and analyses of the brain function. Among these probes, silicon neural probe attracts much attentions because various kinds of functional structures such as microfluidic channel and optical waveguides can be fabricated by semiconductor micro- and nano-fabrication technologies. On the other hand, it was reported that the recording quality of the neuronal signals deteriorated when nervous tissues were damaged due to insertion and placement of the silicon neural probes. In this research, lower invasive Si neural probes with small shank cross-sections and sharpened tips were successfully fabricated using silicon anisotropic etching techniques. Also, insertion characteristics of the probes were carefully evaluated, indicating that the probe will cause less damages to nervous tissues in the brain.

  • ゲイン・帯域切替可能生体信号処理LSI及び神経プローブモジュールの開発と評価 (MEとバイオサイバネティックス)

    谷 卓治, 原島 卓也, 長沼 秀樹, 川原 岬, 岩上 卓磨, 伊藤 圭汰, 鈴木 雄策, 後藤 大輝, 木野 久志, 清山 浩司, 田中 徹

    電子情報通信学会技術研究報告 = IEICE technical report : 信学技報  2014.11 

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    ゲイン及び帯域を切り替えることが可能な増幅器とアナログ・デジタル変換器を含むLSIを設計・試作し、このLSIチップを搭載した脳内の生体信号記録や解析のためのシリコン神経プローブモジュールを作製した。試作した生体信号処理回路は、ゲインを20dB~60dB、低域遮断周波数を56mHz~35Hz、高域遮断周波数を492Hz~11kHzの間で調節することが可能である。このモジュールを用いることにより、脳皮質や脳深部の生体信号を取得し、それに対して適した信号処理を行うことが可能である。

  • Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration International conference

    H. Hashiguchi, H. Yonekura, T. Fukushima, M. Murugesan, H. Kino, K.-W. Lee, T. Tanaka, M. Koyanagi

    2015 IEEE 65th Electronic Components and Technology Conference (ECTC)  2015.5 

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    Plasma Assisted Multichip-to-Wafer Direct Bonding Technology for Self-Assembly Based 3D Integration

  • Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV International conference

    Yohei Sugawara, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    2015 IEEE 65th Electronic Components and Technology Conference (ECTC)  2015.5 

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    Impact of Deep-Via Plasma Etching Process on Transistor Performance in 3D-IC with Via-Last Backside TSV

  • Development of Highly-Reliable Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges International conference

    Yuka Ito, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

    2015 IEEE 65th Electronic Components and Technology Conference (ECTC)  2015.5 

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    Development of Highly-Reliable Microbump Bonding Technology Using Self-Assembly of NCF-Covered KGDs and Multi-Layer 3D Stacking Challenges

  • Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors International conference

    Seiya Tanikawa, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    IEEE 2015 International 3D Systems Integration Conference (3DIC)  2015.8 

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    Novel Local Stress Evaluation Method in 3D IC Using DRAM Cell Array with Planar MOS Capacitors

  • 大脳皮質層別光刺激のための反射ミラー集積シリコン神経プローブの開発

    原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

    第76回応用物理学会秋季学術講演会  2015.9 

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    Venue:日本国 名古屋 (名古屋国際会議場)   Country:Other  

  • 回路動作の発熱によって三次元集積回路内に生成される局所応力の影響に関する研究

    木野 久志, 橋口 日出登, 谷川 星野, 菅原 陽平, 池ヶ谷 俊介, 福島 誉史, 小柳 光正, 田中 徹

    第25回マイクロエレクトロニクスシンポジウム MES2015  2015.9 

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    Venue:日本国 大阪 (大阪大学吹田キャンパス)   Country:Other  

  • チップ集積・フレキシブルケーブル一体化シリコン神経プローブの開発(集積化脳神経プローブシステムの開発1)

    鈴木雄策, 谷卓治, 原島卓也, 木野久志, 福島誉史, 田中徹

    2015年第76回応用物理学会秋季学術講演会  2015.9 

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    Venue:日本国 名古屋 (名古屋国際会議場)   Country:Other  

  • Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC International conference

    H. Kino, H. Hashiguchi, S. Tanikawa, Y. Sugawara, S. Ikegaya, T. Fukushima, M. Koyanagi, T. Tanaka

    2015 International Conference on Solid State Devices and Materials  2015.9 

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    Local Stress Effect due to Operation-Heating-Induced Adhesive Expansion on Transistor Performances in 3D IC

  • Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array International conference

    Seiya Tanikawa, Hideto Hashiguchi, Yohei Sugawara, Hisashi Kino, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

    2015 International Conference on Solid State Devices and Materials  2015.9 

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    Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-induced Retention Time Modulation od DRAM Cell Array

  • DRAMセルアレイの電荷保持特性を用いた3DICにおける局所曲げ応力の影響評価

    谷川 星野, 木野 久志, 福島 誉史, 小柳 光正, 田中 徹

    2015年第76回応用物理学会秋季学術講演会  2015.9 

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    Venue:日本国 名古屋 (名古屋国際会議場)   Country:Other  

  • 3D IC用ビアラスト/バックサイドビアプロセスにおける高アスペクト比ビア形成がトランジスタに与える影響評価

    菅原 陽平, 木野 久志, 福島 誉史, 李康旭, 小柳光正, 田中 徹

    第76回応用物理学会秋季学術講演会  2015.9 

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    Venue:日本国 名古屋 (名古屋国際会議場)   Country:Other  

  • 電気/薬液/光による高度脳操作を可能にするシリコン神経プローブの開発

    原島 卓也, 谷 卓治, 鈴木 雄策, 森川 拓実, 木野 久志, 福島 誉史, 田中 徹

    平成27年度 包括型脳科学研究推進支援ネットワーク冬のシンポジウム  2015.12 

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    Venue:日本国 東京   Country:Other  

  • 柔軟性を有するフレキシブルケーブル一体化シリコン神経プローブの開発-多機能集積化脳神経プローブシステムの開発1-

    鈴木 雄策, 谷 卓治, 原島 卓也, 森川拓実, 木野 久志, 福島 誉史, 田中 徹

    2015年度包括型脳科学研究推進支援ネットワーク 冬のシンポジウム  2015.12 

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    Venue:日本国 東京   Country:Other  

  • 低消費電力生体信号処理LSIの設計及びポータブルプロトタイプシステムの開発 (多機能集積化脳神経プローブシステム2)

    伊藤圭汰, 谷卓治, 岩上卓磨, 宇野正真, 後藤竜也, 竹澤好樹, 西野悟, 木野久志, 清山浩司, 田中徹

    平成27年度 包括脳ネットワーク冬のシンポジウム  2015.12 

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    Venue:日本国 東京   Country:Other  

  • 三次元集積化技術におけるチップ薄化に伴う局所曲げ応力のDRAMセルアレイを用いた評価

    谷川星野, 木野久志, 福島誉史, 小柳光正, 田中徹

    第70回応用物理学会東北支部学術講演会  2015.12 

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    Venue:日本国 青森   Country:Other  

  • DRAMリテンション測定を用いた3DIC局所曲げ応力の影響評価

    谷川 星野, 木野久志, 福島 誉史, 田中 徹

    第63回応用物理学会春季学術講演会  2016.3 

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    Venue:日本国 東京   Country:Other  

  • 集積化脳神経プローブのための過熱保護を有する電源回路の設計 (電子通信エネルギー技術)

    西野 悟, 伊藤 圭汰, 竹澤 好樹, 下川 賢士, 後藤 竜也, 宇野 正真, 木野 久志, 田中 徹, 清山 浩司

    電子情報通信学会技術研究報告 = IEICE technical report : 信学技報  2017.1 

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    Language:Japanese  

    Country:Japan  

  • Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV International conference

    Hisashi Kino

    Electron Devices Technology and Manufacturing Conference (EDTM) 2019  2019.3 

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    Country:Other  

    Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV

  • Low-Viscosity Underfill Technology with Negative CTE Filler for High-Density 3D Interconnections International conference

    Hisashi Kino

    International Interconnect Technology Conference (IITC) 2019  2019.6 

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    Country:Other  

    Low-Viscosity Underfill Technology with Negative CTE Filler for High-Density 3D Interconnections

  • Spike Timing Dependent Plasticity Characteristics of Tunnel FET based MONOS Memory for Low Power Neural Network Circuits International conference

    Hisashi Kino

    2019 International Conference on Solid State Devices and Materials  2019.9 

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    Language:English  

    Country:Other  

    Spike Timing Dependent Plasticity Characteristics of Tunnel FET based MONOS Memory for Low Power Neural Network Circuits

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MISC

  • 負熱膨張材料を用いた半導体素子へのひずみ導入技術

    木野 久志

    2024.4

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    Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (scientific journal)  

  • 【バイオセンシングデバイスの技術動向】経爪型集積化光電容積脈波計測システムの開発と応用

    銭 正陽, 杜 邦, 梁 耀淦, 中村 皓平, 叶 津銘, 木野 久志, 福島 誉史, 清山 浩司, 田中 徹

    電子情報通信学会誌   105 ( 3 )   208 - 215   2022.3   ISSN:0913-5693

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    Language:Japanese   Publisher:(一社)電子情報通信学会  

    世界の先進国では高齢者のADL/QoL(Activities of Daily Living/Quality of Life)低下を抑制することが喫緊の課題となっている。課題解決のためには健康状態を継続的に把握することが有効であり、日常で簡単に使えるヘルスケアデバイスが求められている。光電容積脈波(PPG)は血流と血管情報を含むため、健康維持や疾病の早期発見に有効な生体信号である。本稿は、爪の上に装着してPPGを継続的に計測できる経爪型集積化光電容積脈波計測システムとその応用について述べている。フォトダイオード(PD)、LED駆動回路、PPG計測回路を含むICを設計・試作して経爪のPPG計測に成功した。更に、このシステムを、PPGの非脈動成分を利用した多目的コントローラ、及びPPGと心電図(Electrocardiogram、ECG)を組み合わせたカフレス血圧計測に応用できることを明らかにした。(著者抄録)

Professional Memberships

  • The Electrochemical Society of Japan

  • The Japan Society of Applied Physics

  • IEEE

  • 応用物理学会

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  • IEEE

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Committee Memberships

  • IEEE EDS Japan Joint Chapter   Secretary   Domestic

    2024.2 - 2026.2   

Academic Activities

  • Conference Publication Chair, Technical Program Committee International contribution

    IEEE International 3D Systems Integration Conference (3DIC)  ( Japan ) 2024.9

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    Type:Competition, symposium, etc. 

  • Program Committee International contribution

    International Conference on Solid State Devices and Material (SSDM)  ( Japan ) 2024.9

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  • ASIA IITC COMMITTEE International contribution

    IEEE International Interconnect Technology Conference (IITC)  ( UnitedStatesofAmerica ) 2024.6

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Research Projects

  • トンネルFET構造による3D-NANDフラッシュメモリの超多値化

    2024.4 - 2027.3

  • 人と同じ広視野・高機能視覚を有する三次元積層チップレット型完全埋植人工網膜の開発

    Grant number:24H00304  2024.4 - 2027.3

    科学研究費助成事業  基盤研究(A)

    田中 徹, 富田 浩史, 福島 誉史, 清山 浩司, 木野 久志

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    Grant type:Scientific research funding

    網膜疾患による視覚障がい者の視覚を工学的手法で再建する新しい人工網膜を開発する。従来の人工網膜は「見えているものを見えているように」再建するが、本研究の人工網膜は「見えているものを役立つように」再建することを目指す。三次元積層人工網膜チップレットは光電変換素子とアイコン型刺激電流生成回路等を積層した微小チップであり、多数のチップレットをフレキシブル基板に高密度一括実装して網膜の中心窩及び周辺部に配置して視野角160度を実現する。光電変換素子で得られた画像データを使って強膜に配置したコントローラチップで機械学習による対象検出・分類を行い、視野内の人や物体をアイコン形状にして網膜を刺激する。

    CiNii Research

  • トンネルFET構造による3D-NANDフラッシュメモリの超多値化

    Grant number:24K00935  2024 - 2026

    日本学術振興会  科学研究費助成事業  基盤研究(B)

    木野 久志, 田中 徹, 福島 誉史

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    Authorship:Principal investigator  Grant type:Scientific research funding

    高度情報化社会において、データを保存するストレージデバイスの大容量化は社会的に強く望まれている。SSD (Solid State Drive)やSDカードには3D-NANDフラッシュメモリが用いられており、世界中で大容量化の研究開発がなされている。3D-NANDフラッシュメモリには情報の多値化技術が用いられており、大容量化に大きく貢献している。しかしながら多値化は4bitで飽和しつつあり、5bit以上の超多値化を可能とする技術が強く望まれている。
    本研究ではヘテロ接合を用いたトンネルFET構造をフラッシュメモリ適用した独自構造により、3D-NANDフラッシュメモリの超多値化を目指す。

    CiNii Research

  • 不揮発性トンネルFETメモリを用いたスパイキングニューラルネットワークの構築 International coauthorship

    2023.4 - 2026.3

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    Authorship:Principal investigator 

  • 不揮発性トンネルFETメモリを用いたスパイキングニューラルネットワークの構築

    Grant number:22KK0245  2023 - 2025

    日本学術振興会  科学研究費助成事業  国際共同研究強化(A)

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    Authorship:Principal investigator  Grant type:Scientific research funding

  • Fundamental Study of In-Mold Electronics with Dielets and Development of Smart Skin Display

    Grant number:21H04545  2021.4 - 2025.3

    Grants-in-Aid for Scientific Research  Grant-in-Aid for Scientific Research (A)

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    Grant type:Scientific research funding

    CiNii Research

  • 不揮発性トンネルFETメモリによる超低消費電力ニューラルネットワークチップの開発

    Grant number:20H02193  2020 - 2022

    日本学術振興会  科学研究費助成事業  基盤研究(B)

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    Authorship:Principal investigator  Grant type:Scientific research funding

  • マルチスケール応力エンジニアリングが拓く高集積フレキシブルエレクトロニクス

    Grant number:19KK0101  2019 - 2022

    日本学術振興会  科学研究費助成事業  国際共同研究強化(B)

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    Authorship:Coinvestigator(s)  Grant type:Scientific research funding

  • 負の熱膨張ゲート電極によるトランジスタへの新規ひずみ導入技術の創成

    Grant number:19K21953  2019 - 2020

    日本学術振興会  科学研究費助成事業  挑戦的研究(萌芽)

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    Authorship:Principal investigator  Grant type:Scientific research funding

  • 次世代ナノインプリント用モールドの開発

    2019

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    Authorship:Principal investigator  Grant type:Contract research

  • しきい値電圧自己調整機能を有するトンネルFETの開発

    2019

    2018年度東芝メモリ奨励研究

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    Authorship:Principal investigator  Grant type:Contract research

  • 広視野の視覚を再建する眼球内完全埋植・低侵襲フレキシブル人工網膜の開発

    Grant number:18H04159  2018 - 2020

    日本学術振興会  科学研究費助成事業  基盤研究(A)

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    Authorship:Coinvestigator(s)  Grant type:Scientific research funding

  • 透明記録電極の開発による光遺伝学用シリコン神経プローブの高機能化

    2016 - 2017

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    Authorship:Principal investigator  Grant type:Contract research

  • 人の視覚と同じ高次情報処理を実現する眼球内完全埋め込み型人工網膜システムの開発

    Grant number:15H01812  2015 - 2017

    日本学術振興会  科学研究費助成事業  基盤研究(A)

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    Authorship:Coinvestigator(s)  Grant type:Scientific research funding

  • 三次元ヘテロ集積化技術を用いた積層型立体画像センサーLSIの開発

    Grant number:15H02246  2015 - 2017

    日本学術振興会  科学研究費助成事業  基盤研究(A)

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    Authorship:Coinvestigator(s)  Grant type:Scientific research funding

  • 生体構造の模倣によるFETバイオセンサの極微量検体対応化

    2015

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    Authorship:Principal investigator  Grant type:Contract research

  • 三次元集積回路の動作発熱に起因する薄化チップの動的局所変形と電気特性変動の研究

    Grant number:25820133  2013 - 2014

    科学研究費助成事業  若手研究(B)

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    Authorship:Principal investigator  Grant type:Scientific research funding

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Class subject

  • 持続可能半導体特論

    2024.10 - 2025.3   Second semester

  • 持続可能半導体概論

    2024.4 - 2024.6   Spring quarter

FD Participation

  • 2023.11   Role:Participation   Title:【シス情FD】企業等との共同研究の実施増加に向けて

    Organizer:[Undergraduate school/graduate school/graduate faculty]

  • 2023.10   Role:Participation   Title:【シス情FD】価値創造型半導体人材育成センターについて

    Organizer:[Undergraduate school/graduate school/graduate faculty]

Visiting, concurrent, or part-time lecturers at other universities, institutions, etc.

  • 2024  東北大学・大学院医工学研究科  Classification:Affiliate faculty  Domestic/International Classification:Japan 

  • 2023  東北大学・大学院医工学研究科  Classification:Affiliate faculty  Domestic/International Classification:Japan 

  • 2017  Stanford University, Department of Electrical Engineering  Classification:Affiliate faculty  Domestic/International Classification:Overseas