九州大学 研究者情報
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黒河 周平(くろかわ しゆうへい) データ更新日:2024.02.12

教授 /  工学研究院 機械工学部門 加工プロセス


原著論文
1. Koji KUMAGAI, Hanlin LIU and Syuhei KUROKAWA, Non-Linear Wear Propagation Property and Prediction Method Having Influencing Pitting Failure of Helical Gears, Tribology Online, 10.2474/trol.17.44, 17, 1, 44-53, 2022.02, A simulation method taking into account sequential changes of the tooth contact state due to the tooth surface wear was developed in order to evaluate the influence of wear on pitting durability. As a result of calculating the tooth end relief shape as a parameter, the variation in the wear propagation rate was obtained depending on the contact stress distribution. The study also obtained the nonlinear wear propagation property, in which the initial wear propagation was rapid and then changed gradually. In order to verify the wear characteristics, gear durability tests were conducted using gears with tooth tip modification and end relief, and sequential changes in the tooth surface wear state were observed. The test results revealed that the non-linear wear propagation property was obtained as in the calculation results. Wear propagation in the tooth lead direction and pitting life were able to be predicted. Using this calculation method and the experimental evaluation, it was made clear that the temporal alteration of contact stress and the non-linear propagation changed the pitting initiation timing and position, and may also have an effect on the pitting durability..
2. Jiaqing ZHU, Terutake HAYASHI, and Syuhei KUROKAWA, Nanoparticle sizing for CMP slurry using nanoparticle chip, Proc. of the 10th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 1-4, 2021.11.
3. Tatsuro TAKAGI, Noritaka FUJIMURA, Keisuke YOSHIKAWA, Kazuyuki ISHIZU, Manami GOTO, and Syuhei KUROKAWA, High Speed Precision Dry Hobbing Replacing Conventional Hobbing and Shaving, Proc. of the 10th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 1-4, 2021.11, High Speed Precision Dry Hobbing, whose cutting speed is from 1000 to 2450m/min with axial feed of 0.3mm/part-rev., achieved gear accuracy equivalent to a shaving process; ISO grade 6 in profile, ISO grade 3 in helix, and surface roughness Ra 0.3 by a single-cut strategy. The stable cutting force and low workpiece temperature by the cutting speed of 2450m/min were observed in spite of producing red heated cutting chips. By replacing conventional hobbing and shaving with high speed precision dry hobbing, an environmentally friendly manufacturing process can be achieved..
4. Syuntaro HAYASHI, Syuhei KUROKAWA, Terutake HAYASHI, Naoyuki HANDA, Yutaka WADA, and Hirokuni HIYAMA, Clarification of polishing mechanism focusing on abrasive particle behavior in CMP -Quantification of abrasive particles retained in the contact area of polishing pads with different removal rates-
, Proc. of Asian Workshop on Planarization/CMP Technology 2021, 5-8, 2021.10, CMP (Chemical Mechanical Polishing/Planarization) is used in the manufacture of semiconductor products. CMP is a polishing process that combines chemical reaction and mechanical actions, and it is possible to obtain extremely smooth polished surfaces by softening the substrate surface with a processing fluid (slurry) through chemical reaction and then removing it mechanically with free abrasive particles. Most of the CMP systems used these days are rotary CMP, where the substrate held by the head is pressed against the polishing pad while the slurry is dripped onto the platen with the polishing pad attached. In this process, continuous polishing deteriorates the surface geometry of the pad and reduces the polishing rate. Therefore, the polishing rate is maintained by conditioning the surface of the pad with a diamond dresser. This suggests that the polishing rate is greatly affected by the topography of the pad surface. Since abrasive particles in the slurry at the interface between the polishing pad and the substrate contribute to polishing directly, we consider the behavior of abrasive particles to be important in clarifying the polishing mechanism and aim to quantify the contribution of abrasive particles to CMP..
5. Jiaqing ZHU, Terutake HAYASHI, and Syuhei KUROKAWA, Measurement of Molar Concentration Spectrum Based on Number-weighted Particle Size Distribution for Poly-dispersed Particles Using Nanoparticle Chip, Proc. of the 23th IMEKO World Congress, 1-4, 2021.08, Nanoparticle size distribution (PSD) analysis and particle concentration measurement are important for quality management of slurry, that used in chemical mechanical polishing (CMP) process. CMP slurry contains poly-dispersed particles in suspension. It is difficult to measure the PSD using Dynamic Light Scattering (DLS), that is a typical method for mono-dispersed particles. On the other hand, Image Analysis (IA) using Electron Microscope can analyse number-weighted PSD for poly-dispersed particles. However, number-weighted PSD is difficult to identify the particle concentration for primary particle and aggregation. In addition, solid concentration is used in concentration evaluation for CMP slurry. However, solid concentration is difficult to identify the mean particle diameter and the variance of diameter. In this study, we defined a molar concentration spectrum to evaluate the PSD and molar concentration and suggested a novel particle sizing method using nanoparticle chip (NPC) for molar concentration spectrum measurement. In this paper, it is reported the fundamental experiment to measure the molar concentration spectrum for poly-dispersed particles using NPC..
6. Jiaqing ZHU, Terutake HAYASHI, and Syuhei KUROKAWA, Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip, Precision Engineering, 10.1016/j.precisioneng.2021.08.008, 74, 460-468, 2021.08, Particle size distribution (PSD) analysis for nanoparticle is important for quality management of CMP slurry, that used in chemical mechanical polishing (CMP) process. CMP slurry contains poly-dispersed particles, which consist of size-different primary particles and secondary particles in suspension. It is difficult to measure PSD for poly-dispersed particle using Dynamic Light Scattering, which is one of a typical method to evaluate PSD for mono-dispersed particles. The image analysis is also employed for PSD analysis. For image analysis, it needs to transfer the particles from suspension to a substrate before measurement. In this procedure, some particles aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in suspension
and the PSD for observed particle using image analysis. In addition, concentration measurement is important for quality management of CMP slurry. Mass concentration is used in concentration evaluation for CMP slurry. However, it is difficult to identify the molar concentration for multi-modal particles, respectively. In this study, we suggested a method to define molar concentration spectra to express both a modal diameter and molar concentration for multi-modal nanoparticles to evaluate the CMP slurry. In order to measure the molar concentration spectra, we suggested a novel particle sizing method using nanoparticle chip (NPC) to measure number-weighted mean particle diameter, a variance of diameters, and molar concentration for every spectrum. Nanoparticles grid on a substrate to maintain the poly-dispersed condition in suspension to process NPC. NPC can assist the image analysis process to measure the PSD of particles in suspension. The number of particles, that aligned on the substrate, can be counted to measure the molar concentration. In this paper, a fundamental experiment was performed to investigate the feasibility of molar concentration spectra measurement. It is confirmed the molar concentration spectra for poly-dispersed particles can be measured by using NPC and it is considered that PSD with molar concentration spectra can give detail information of abrasive grain in suspension for quality management of CMP slurry..
7. Tao TIN, ZhiDa WANG, Toshiro DOI, Syuhei KUROKAWA, Zhe TAN, XiaoKang DING, Huan LIN, Characteristic of SiC Slurry in Ultra Precision Lapping of Sapphire Substrates, International Journal of Precision Engineering and Manufacturing, DOI: 10.1007/s12541-021-00521-1, 22, 6, 1021-1029, 2021.04, A method is proposed in this paper to prepare a SiC slurry with SiC particles selected by an ultrasonic-assisted elutriation method to reduce substrate surface damage caused by abrasive particles during lapping. Sapphire substrate lapping experiments were carried out using the prepared SiC slurry, and the lapping performance of the slurry was analyzed. The experimental results show that the SiC particle size is a factor that directly affects the material removal rate and surface roughness Ra, of sapphire substrates. When a SiC slurry with a particle size of 630 nm was used, the material removal rate was 508 nm/h, and the surface roughness Ra was 1.9 nm; increasing the slurry concentration and the platen rotating speed can improve the material removal rate. In addition, the agglomeration of SiC particles in the slurry depends on the pH of the slurry. Efficient precision lapping of sapphire substrates can be achieved by selecting appropriately sized SiC particles and by adjusting the slurry pH to control the agglomeration and dispersion of SiC particlesto further reduce the scratches on the substrate surface during the lapping process..
8. Hitoshi OHMORI, Shinjiro UMEZU, Yunji KIM, Yoshihiro UEHARA, Hiroshi KASUGA, Teruko KATO, Nobuhide ITOH, Syuhei KUROKAWA, Takayuki KUSUMI, Yugo SUGAWARA, and Shinsuke KUNIMURA, A high quality surface finish grinding process to produce total reflection mirror for x-ray fluorescence analysis, International Journal of Extreme Manufacturing, https://doi.org/10.1088/2631-7990/ab7a29, 2, 1, 1-7, 2021.03, Total reflection x-ray fluorescence analysis is applied to trace element detection in liquid for effective environmental monitoring. This analytical approach requires x-ray total reflection mirrors. In order to achieve high sensitivity element detection, the mirrors require high surface quality for high x-ray reflectivity. Surface finishing for x-ray mirrors is typically conducted through a series of abrasive processes, such as grinding and polishing, and is thus time consuming. The purpose of this study is to streamline and enhance the surface finishing process based on unique high quality grinding techniques for the production of x-ray total reflection mirrors..
9. Mitsuaki MURATA, Naoki HARADA, Amine GOUARIR and Syuhei KUROKAWA, In-process tool wear detection by measuring the slip of AC induction motor in intermittent cutting process, Journal of Advanced Mechanical Design, Systems, and Manufacturing, https://doi.org/10.1299/jamdsm.2021jamdsm0011, 15, 1, 1-9, 2021.02, The molds used in the manufacture of many industrial products are mainly manufactured by cutting with a machining center. Since the cutting time is very long in these cutting processes, it is important to judge the tool life and know the appropriate timing for tool change. The authors of this study have been investigating in-process detection of tool wear using tools and the work material itself as sensors, and good results have been obtained. In this method, since the work material and the cutting edge of the cutting tool themselves become sensors, therefore the detection system can be constructed at low cost and does not affect the actual work. In this study, the focus was on the slip of the AC induction motor for driving the spindle of a milling machine. This detection method can also construct the detection system at low cost and does not affect the actual work. By measuring it, it was possible to investigate whether tool wear can be detected in-process. It was found that there is an excellent relationship between the progress of tool flank wear and the slip of the AC induction motor..
10. Jiaqing ZHU, Terutake HAYASHI, and Syuhei KUROKAWA, Measurement of molar concentration spectrum for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip, Proc. of the 18th International Conference on Precision Engineering (ICPE2020), 1-2, 2020.11, Particle sizing distribution (PSD) analysis for slurry is important in chemical mechanical polishing (CMP) process. CMP slurry usually contains poly-dispersed particles in suspension and it is difficult to evaluate the number-weighted multi-modal PSD using DLS, which is the most typical method to evaluate PSD for mono-dispersed particles. On the other hand, Image analysis (IA) can be used for PSD analysis for poly-dispersed particles. However, IA is a time-consuming method and it is required to improve the quickness. We suggest a novel particle sizing method using nanoparticle chip (NPC). The objective is improving the measurement efficiency of IA to a level that can be applied to the quality management of CMP slurry. It is considered that NPC-IA can apply to measure the PSD for poly-dispersed particles. In addition, it is possible to evaluate the molar concentration of particles in suspension at every multi-modal peak on PSD. In this paper, it is reported the fundamental experiment to measure the molar concentration of particles for poly-dispersed particle with bimodal PSD using NPC..
11. 朱 家慶,林 照剛,黒河 周平, ナノ粒子チップを用いた多分散ナノ粒子の粒度分布計測, 日本機械学会論文集, https://doi.org/10.1299/transjsme.20-00220, 86, 892, 1-19, 2020.10, For poly-dispersed nanoparticles, which have more than two peaks on their particle size distribution (PSD), it is important to determine the mean particle diameter and their dispersion at each peak in a liquid. Dynamic Light Scattering (DLS), that is one of a typical nanoparticle sizing method, has difficulty to determine the several peaks in the PSD for the poly-dispersed particles. On the other hand, Image analysis methods (IA) can distinguish the peak for both the primary particle and secondary particle in the PSD of poly-dispersed particles accurately. However, IA is a time-consuming method and it is difficult to apply the measurement of the PSD due to the requirement of measuring the large number of particles, one by one. The particles in the liquid are transferred to a substrate in air when observing the particle to measure their size and the size distribution. In this procedure, some particles usually aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in liquid and that of the particles on the substrate. In this study, we suggest a novel particle sizing method using “Nanoparticle chip”, that is nanoparticles grid on the substrate to maintain the poly-dispersed condition in the liquid, to develop IA for measuring the poly-dispersed particles in liquid. The dispersed condition of the particle on Nanoparticle chip can be kept from the condition in liquid when the particles are transferred to the substrate in air. Therefore, measuring the PSD on Nanoparticle chip is equal to measure the PSD in the liquid. In this paper, in order to verify the feasibility of the nanoparticle sizing using Nanoparticle chip to measure the PSD for poly-dispersed particles in the liquid, we performed a fundamental experiment to fabricate the Nanoparticle chip and to determine the PSD for poly-dispersed particles. In this report, it is reported that the PSD for the poly-dispersed particles, which is the mixture of 152nm particle and 498nm particle, using Nanoparticle chip..
12. Min Li, Fangzeng Song, Hitoshi Ohmori, Naohiro Nishikawa, and Syuhei Kurokawa, Shear-thickening Polishing Process for the Tungsten-cobalt Carbide Tool , Transactions of MIRAI, 8, 26-30, 2020.10, To improve the cutting performance of tool, shear-thickening polishing is adopted to process the surface of tungsten-cobalt carbide tool (Co content of 6%). A new rheological slurry has been prepared for shear thickening of tungsten-cobalt material. Rheological performance of the polishing slurry has been investigated to maintain its stability for actual machining. Several parameters having significant effects, including flow velocity, shear rate, flow rate, abrasive size, abrasive concentration and polishing time are experimentally explored in this process. Under the optimal processing parameters, the ultra-precision surface of tungsten-cobalt carbide tool was obtained, reducing from Ra 115.4 nm to Ra 6.5 nm after polishing time of 30min. This result can contribute to improve performance and productivity of the tungsten-cobalt carbide tool and suggests that shear-thickening polishing is a potential ultraprecision machining method for cutting tool fabrication..
13. Md. Hazrat ALI, Gaziz YERBOLAT, and Syuhei KUROKAWA, Modeling and simulation of multi-materials for additive manufacturing, International Journal on Interactive Design and Manufacturing, https://doi.org/10.1007/s12008-020-00678-5, 14, 1057-1069, 2020.08, This paper discusses the modeling and simulation of multi-materials for additive manufacturing. The mechanical property analysis of multi-materials is essential for developing a very feasible product. To that aim, a few steps are necessary, firstly, a database of those multi-materials is created. Secondly, stiffening technology is introduced together with an alternative optimization method. Finally, the material minimization technique is developed through the simulation results. Two methods are proposed for material optimization. The first method saves the materials twice, and the second method improves the stiffness characteristics of the materials. The developed method generates promising results, and it is applicable to composite geometries. The finding shows that the technique helps to reduce production costs at large..
14. Assetbek Ashirbekob, Anuar Abilgaziyev, Syuhei Kurokawa, Md Hazrat Ali, Modelling of functionally graded materials using thermal loads, Journal of Engineering Science and Technology, 15, 3, 1719-1730, 2020.06, [URL], Functionally Graded Materials (FGMs) are used in specialized industries, notably, in the aerospace industry, due to their unique response to thermal loads which are very prominent during spacecraft flights. The use of FGMs in the rapidly growing 3D printing area is also increasing interest in them, and proper modelling of FGMs is becoming a prominent development topic. This paper suggests a method of modelling FGMs using the ANSYS Workbench environment for dummy thermal loads in ANSYS Mechanical, which excludes the need for extensive FORTRAN programming typical of a significant part of FGM modelling methods. The method can be applied for complex geometries, imported from CAD software, works with shell elements bodies, and any distribution of materials throughout the FGM. Two case studies: one for 2D analysis and another for 3D shell elements analysis are developed. Two solutions are developed for each case: numerical solution, obtainable through the proposed method, and analytical solution. Solutions are compared, and the results yielded by the proposed method matched the analytical solution with high accuracy. .
15. Koji KUMAGAI, Yuta NAITO, Syuhei KUROKAWA, Pitting failure of helical gears induced by trochoidal interference and multidirectional, interacting wear, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 10.1299/jamdsm.2020jamdsm0060, 14, 4, 1-13, 2020.05, [URL], Improving gear mesh efficiency contributes to reducing the environmental impact of vehicles. This study examined the effect of adjusting gear specifications on improving mesh efficiency. When the gear ratio of cylindrical gears is relatively high, it tends to increase the sliding velocity between the engaging gear teeth. Moving the contact region toward the base circle of the pinion along the line of action is considered to be one solution for reducing friction loss. However, it may cause deterioration of tooth surface strength because the radius of curvature of the tooth surface becomes smaller on account of being closer to the base circle. In order to confirm the influence of the gear meshing region on tooth surface strength, gear durability tests were carried out and tooth damage states were observed in detail under a microscope. The results revealed that pitting failure occurred near the tooth root region of the pinion. Furthermore, trochoidal interference due to the high torque condition extended over the base circle. In this case, trochoidal interference has a greater influence on pitting failure. In order to investigate the effect of reducing trochoidal interference near the base circle on pitting failure, further gear durability tests were conducted using the mating gears with large tooth tip modification. However, the effect on improving pitting durability was limited. Multidirectional, interacting wear was observed not only in the profile direction due to trochoidal interference but also in the lead direction due to edge contact. Such wear changed the location of pits. The results of these detailed investigation revealed a new viewpoint for explaining the mechanism of these phenomena in terms of conflict between pitting and multidirectional, interacting wear. Presumably, pitting failure changes if the state of progression of trochoidal interference and wear in the lead direction changes. In order to confirm the influence of such wear on pitting durability, a gear durability test was conducted using gears with tooth tip modification and endface relief. The test results confirmed that the location of pits and pitting durability changed. These results revealed that pitting durability and the state of damage were influenced sensitively and compositely by multidirectional, interacting wear, i.e., wear in the profile and lead directions..
16. Chengwu Wang, Toshiro Doi, Keiji Miyachi, Keiichi Tsukamoto, Tadakazu Miyashita, Syuhei Kurokawa, Li Fan, Yu Zhang, Wei Hang, Hybrid effect study of PAD-conditioning/slurry-supply by high-pressure-micro-jet (HPMJ) method during CMP process, ECS Journal of Solid State Science and Technology, 10.1149/2162-8777/ab7a0d, 9, 3, 2020.03, [URL], Surface clogging of polishing pad is inevitable during CMP (Chemical Mechanical Polishing) process of semiconductor wafers. In this paper, a novel slurry-feeding system utilizing HPMJ (High Pressure Micro Jet) apparatus was presented as in situ conditioning for CMP process. Clogging of pad surface can be greatly removed; the surface damage of polishing pad can also be extremely reduced by this new method. The experimental results exhibited that the material remove rate (MRR) of HPMJ method was almost constant value 100 μm h–1. However, the MRR value of conventional slurry-dripping method was about 50 μm h–1. On the other hand, surface roughness Ra changed both in hybrid HPMJ method and conventional slurry-dripping method after long-time continuous CMP process, the average Ra of hybrid HPMJ method was about 30% smaller than that of conventional slurry-dripping method, indicating that better surface quality could be obtained by HPMJ method polishing. It was demonstrated that HPMJ method showed higher MRR and lower surface roughness Ra for polishing process. HPMJ hybrid system mentioned in this study can also be applied to the polishing process of hard-to-process wide bandgap semiconductor substrate materials, such as SiC or GaN..
17. Temirlan Otepbergenov, Zhalgas Smagulov, Anuar Abilgaziyev, Syuhei Kurokawa and Md. Hazrat Ali, Numerical and experimental analysis of the 3D printed multi-material ankle-foot orthosis, Journal of Physics: Conference Series, Volume 1510, 2019
The 10th Asia Conference on Mechanical and Aerospace Engineering 26-28 December 2019, Bangkok, Thailand
, 10.1088/1742-6596/1510/1/012012, 2020.01, [URL], The application of 3D printing in medicine is the major area to concern in the nearest future. Namely, it is convenient to additively manufacture the Ankle-Foot Orthosis (AFO) by fused-deposition modeling 3D printer. AFO is the device, used in medicine, to help the patients rehabilitate from the foot drop disease. The shape of the AFO may vary depending on the leg and foot specifications of the patient. In this paper, three models of the AFO were designed to analyze both numerically and experimentally, those are fracture propagation, stress distribution, and deformation. The regions with the highest stress concentration were altered with the Nylon 12, and this contributed to stress reduction. Three different gait instances were considered for the numerical simulations FEA software. Then, the simplest model to prototype and its modified versions were tested by the compression machine, and the results were compared with the numerical ones. This work demonstrated the significance of the optimization of the multi-material 3D printed AFO's performance and comfort for patients..
18. Tetsuo Inoue, Syuhei Kurokawa, Evaluation of Feel of Fishing Reel by Elucidating the Relationship Between Tactile Sensation and Gear Vibration, AHFE International Conference on Affective and Pleasurable Design, 2019
Advances in Affective and Pleasurable Design - Proceedings of the AHFE 2019 International Conference on Affective and Pleasurable Design
, 10.1007/978-3-030-20441-9_17, 154-164, 2020.01, [URL], Fishing spinning reels use a pair of face gear; when the handle of the reel is rotated, vibration is generated by the engagement of the gear pair. An angler feels the gear vibration as a sensation in the fishing reel. In this study, a new method is proposed to improve the fishing reel sensation. In this method, several grooves are added on the tooth flank of the face gear. The optimal groove width and number of grooves are determined by investigating the influence the grooves have on vibration. In addition, by introducing the concept of the tactile-response delay time, the authors elucidate the reason that the vibration sensation can be improved by specifying the number of grooves..
19. Tetsuo INOUE, Syuhei KUROKAWA, Validity of quantifying sensation of fishing reel using transmission error instead of sensory human evaluation for face gear design, Mechanical Engineering Journal, 10.1299/mej.19-00318, 6, 6, 1-20, 2019.12, [URL], This paper discusses the determination of tooth-flank modification on a face gear system in order to improve the handle rotational sensation of a fishing spinning reel (hereafter, fishing reel sensation) and quantification of it. The spinning reel considered in this study uses a face gear system. One of the advantages of a face gear system is that it offers good rotational tactile sensation. However, these systems have a high propensity for assembly errors. If the reel experiences an assembly error, vibration based on the gear-pair engagement occurs when the handle of the reel rotates. The vibration is transmitted to the angler’s finger via the handle. When the vibration is large, the angler feels discomfort, which ultimately has a large influence on the fishing reel sensation. Therefore, reducing gear vibration is our most important objective. It was previously reported that when the tooth flank of the face gear is shaped according to a transmission-error-controlled curve, the reel exhibits robustness against the influence of assembly errors. The report indicated that there is a relationship
between the fishing reel sensation and the amplitude of transmission error. However, it did not indicate a relationship between the fishing reel sensation and the waveform of transmission error. Moreover, the amount and width of tooth-flank modification were not optimized in the previous studies. On the other hand, because the fishing reel sensation is conventionally evaluated by human judgment, it is ambiguous and inefficient. To solve these problems, the best factor and level for tooth-flank modification were derived according to a design method based on robust engineering. The fishing reel sensation was quantified by the Mahalanobis–Taguchi system of robust engineering with high correlation. Moreover, a suitable noise factor could be applied in robust design by the accurate measurement of the transmission error. Accordingly, the optimum condition for tooth-flank modification was identified experimentally. This report elucidates the relationship between the fishing reel sensation and the waveform of transmission error and proposes a quantification of the same. Consequently, the face gear design for improving the fishing reel sensation has been established by quantifying the fishing reel sensation using the transmission error instead of sensory human evaluation..
20. Kaito Wakamatsu, Syuhei Kurokawa, Takaaki Toyama, Terutake Hayashi, CMP characteristics of quartz glass substrate by aggregated colloidal ceria slurry, Precision Engineering, 10.1016/j.precisioneng.2019.06.014, 60, 458-464, 2019.11, [URL], Colloidal ceria is expected to be a candidate of alternative slurry for glass substrate CMP because the slurry particles are small and have a regular shape comparing to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high quality surface in glass substrate CMP, but removal rate (RR) is smaller than that of calcined ceria. In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make colloidal ceria particles aggregate and improve RR close to that of calcined ceria. By evaluating the extent of aggregation with and without ultrasonic dispersion, it was found there was a strong correlation with KOH concentration to aggregation strength and RR. To obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high quality surface..
21. Md Hazrat Ali, Temirlan Otepbergenov, Sagidolla Batay, Syuhei Kurokawa, Shape optimization technique in 3D printing, 3rd International Conference on Automation, Control and Robots, ICACR 2019
Proceedings of 2019 3rd International Conference on Automation, Control and Robots, ICACR 2019
, 10.1145/3365265.3365271, 2019.10, [URL], The emergence of additive manufacturing technology allowed prototyping the complex 3D shape models. Fused Deposition Modeling (FDM) method in 3D printing is the most widespread material extrusion technology that has great potential to further advance in better quality, low-cost, material, and time optimization. This paper discusses and compares the methods of shape optimization for various models of 3D printed pressure vessels, such as Cylindrical, peanut, pumpkin, and honeycomb, in terms of weight and stress distribution, through FEA simulation in ANSYS software by applying pressure up to 100 MPa inside the vessel. Some optimized shapes of pressure vessels were obtained with uniformly-distributed stress all over the vessel body due to the removal of the less useful parts of the vessel. The most lightweight was the peanut-shaped modified cylindrical pressure vessel, which resulted in a 9.81% weight reduction after applying shape optimization method, and the least average stress undergoing vessel was a simple cylindrical pressure vessel. The simulation results show that the developed technique has a great prospect of possible application in additive manufacturing technology..
22. Masanori KAJIKI, Syuhei KUROKAWA, Terutake HAYASHI, Three-dimensional Shape Measurement using Non-contact Line Laser Probe, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.124, 2019.10, Recently, three-dimensional coordinate measuring machines (CMMs) have drawn attention as a technique for measuring industrial products that are becoming complicated and diversified due to improvement of processing techniques. There are two types of coordinates acquisition methods in CMMs, contact type and non-contact type. While the contact type has a disadvantage in its measurement speed, the non-contact type has problems with its measurement accuracy. The final goal is to propose a high-accuracy and high-speed measurement method by combining the tactile and non-contact methods. In the previous research, an abnormal phenomenon related to the accuracy of the light section method was found. It is that the flat surface having irregularities of only 1 to 3 µm is detected incorrectly as a surface having large irregularities of 340 µm. Therefore, we focused on the accuracy of the non-contact measurement using light section method and conducted some experiments to find the cause of the abnormal phenomenon called “excessive detection error”. As a result of the experiments, it was found that the width of the line laser and uneven reflection of the measured surface greatly contributed to excessive detection error. Since the laser is irradiated with a Gaussian intensity distribution, it is desirable that the reflected light also has a Gaussian intensity distribution. However, the reflected light distribution is changed by the difference on the reflection state of the measured surface within the laser width, and the probe mis-detects the position of the measured surface. Then, we modeled the principle of generating excessive detection error and made simulator of measurement results. This simulator is expected to be used to correct the measurement results including excessive detection error. Some information, the tool path during machining and the reflection state of the measured surface, is required to simulate the measurement result. It is easy to know the tool path because most industrial products are designed with CAD, but the reflection state of the measured surface can not be calculated before processing. Therefore, we propose to use a point laser displacement meter whose laser width is much smaller than that of the line laser probe. Specifically, the reflection state is calculated from the ratio of reflected light intensity at each point. We conducted the experiment to verify this idea, and its usefulness was confirmed. .
23. Kaito WAKAMATSU, Syuhei KUROKAWA, Terutake HAYASHI, Polishing of Quartz Glass by Using Colloidal Ceria with Controlled Aggregation State, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.123, 2019.10, Ceria slurry is generally used for glass substrate CMP because of its chemical characteristics and higher removal rate (RR) than other types of slurry. There are various kinds of ceria slurry, and calcined ceria slurry is commonly used for glass substrate CMP. High RR can be obtained by using calcined ceria slurry, but a defect issue such as scratches is still remaining. Colloidal ceria slurry is expected to be a candidate for alternative slurry for glass substrate CMP because of its small slurry particle and regular shape compared to conventional calcined ceria particles. Thanks to the characteristics, the colloidal ceria can generate a high-quality surface in glass substrate CMP, but RR is smaller than that of calcined ceria.
In order to improve the RR, KOH was added to the colloidal ceria. KOH additives make the colloidal ceria particles aggregate and improve the RR close to that of calcined ceria while maintaining a high quality surface. The correlation between KOH concentration and agglomeration strength was investigated by evaluating the degree of agglomeration with and without ultrasonic dispersion. As a result, it was found that the KOH concentration to be added has a great influence on the degree of aggregation and the RR. Detailed surface observation by AFM revealed that the colloidal ceria slurry added KOH (aggregated colloidal ceria slurry) generates only slightly scratches. In terms of quality, to meet higher level requirements, two-stage sequential CMP was applied: the first stage used the aggregated colloidal ceria slurry and second one used the original colloidal ceria slurry only. This two-stage CMP can be easily achieved by only stopping KOH supply without stopping the polishing process on the same polishing pad. By observing the surface quality, tiny scratches disappeared within 20s after stopping KOH. In addition, from the viewpoint of efficiency, utilizing this aggregated colloidal ceria slurry to obtain further RR and to reduce the consumption of slurry, influence of polishing pressure and slurry concentration on polishing characteristics was investigated. As the polishing pressure increased, the RR improved, while slurry residue occurred partly on the edge of the substrate surface. The slurry residue was restrained by decreasing slurry concentration. Furthermore, although scratches in the nanometer order increase slightly under high polishing pressure, they are smaller than those by calcined ceria slurry. By controlling the degree of aggregation of colloidal ceria, we have achieved both high RR and high-quality surface..
24. Terutake HAYASHI, Jiaqing ZHU, Syuhei KUROKAWA, Nano particle sizing using nanoparticle chip, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.122, 2019.10, Nanoparticle is widely used in industrial production, such as biological sensor, pigment and slurry in CMP (Chemical Mechanical Polishing). Particle size distribution is used in the quality evaluation of nanoparticle. It is important to measure the particle size distribution of primary particle for the mixture solution of both primary and secondary particle. Image analysis method is able to accurately measure the geometric diameter of primary particle, even though secondary particle is present in solution. It is able to solve the problem that the result of DLS (Dynamic Light Scattering) is unreliable when secondary particle is present in solution. It is necessary that it takes a lot of time to observe thousands of particles.
In this research, in order to accurately measure average diameter of primary particle and classify types of particle as primary particle or secondary particle, we suggest a new sample preparation method that called “nanoparticle micro array”.
Nanoparticles are uniformly dispersed in solution. These nanoparticles are sampled one by one from the solution and arranged on silicon wafer in a high density and uniformly-spaced position. After the solution was evaporated, the sample is observed by SEM (Scanning Electron Microscope)/AFM (Atomic Force Microscope). The geometric diameter of primary particle is measured from the SEM/AFM image.
In order to verify the feasibility of particle characterization using “nanoparticle micro array”, we performed a fundamental experiment to classify particles and measure primary particle size distribution on a nanoparticle chip.
The fundamental experiments were performed to verify the feasibility of particle characterization using nanoparticle micro array. For the particle that the diameter range is 100nm~500nm, it is possible to transport the droplet which includes an isolated primary particle. When the molar density of a particle solution is determined, the size control of a sampling droplet is equal to control the number of particles which contains in the droplet. The particle size distribution of the mixture solvent which includes size different particles can be measured. It is expected that by using the nanoparticle micro array, the particle size distribution for the primary particle and the secondary particle can be distinguished in the mixture solution.
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25. Terutake HAYASHI, Syuhei KUROKAWA, Nano particle sizing method based on the analysis of the nano particle diffusional motion, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.121, 2019.10, CMP (Chemical Mechanical Polishing and Planarization) slurries consist of a nano-sized abrasive dispersed in acidic or basic solution. There is strong demand to characterizing slurry in CMP process. The size range of CMP abrasive particles are usually 50-200 nm, which directly affects critical metrics including rate of removal and wafer defects. Thus the precise particle sizing methods are important to characterize abrasive colloid in CMP.
The dynamic light scattering (DLS), differential centrifugal photo-sedimentometry, and nanoparticle tracking analysis are the typical particle analyzing techniques based on Stokes-Einstein equation for spherical nano particle. Before characterizing the particle size distribution (PSD), we need to determine the viscosity and temperature of the slurry solvent in above techniques. Thus we suggest a method to characterize PSD without estimation of viscosity and temperature of solvent based on the translational diffusion coefficient analysis.
We have developed the method to evaluate the viscosity of the slurry by using the fluorescence polarization anisotropy (FPA) analysis. The rotational diffusion coefficient can be measured by using the fluorescent probe, that is dispersed in slurry.
In this research, we apply the precise viscosity evaluation based on FPA to characterize PSD from the translational Brownian motion analysis of abrasive particles in slurry. By using the conventional method, it is difficult to determine PSD in slurry due to the validation of the viscosity and temperature in wide area. By using the proposed method, we expect that PSD can be determined accurately at measurement area without estimation of the viscosity and temperature of slurry.
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26. Yuto KAJITANI, Syuhei KUROKAWA, Terutake HAYASHI, Tetsuya TAGUCHI, Ryota MATSUOKA, Accuracy improvement of gear measuring machine with coordinate measuring function
-Significant factors that cause scanning errors-, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.120, 2019.10, There are many demands for gears such as more accurate transmission, longer lifetime, lower vibration and noise. To satisfy these demands, high precision processing and high precision inspection are required. However, it is not possible to measure the tooth root and bottom region that differ in shape depending on the gear manufacturing method, because of the specifications of the probe in conventional gear measuring machines. Therefore, in this research, we replaced the conventional single-axis probe with a three-dimensional tactile scanning probe. We aim to develop a gear measuring machine that can measure not only the working flank but also the shape of the tooth root and the tooth bottom by three-dimensional measuring the machine. It has been confirmed in the previous research that the measurement by the development machine has some dispersion. There may be several factors that can cause errors in measurement. For example, the 3D probe output stability, damage of the stylus tip, straightness error of the mechanical drive shaft, and error due to scanning operation algorithm, and so on. In this paper we surveyed using a calibration ball whose shape and size are guaranteed beforehand to evaluate the repeatability of the measurement. Measurement deviations along the equator of the calibration ball were confirmed in the radial direction. First, we adopted a new probe with high output stability, but the range of measurement variation did not decrease. From this, it is considered that factors other than the stability of the probe output cause the dispersion of the scanning measurement. Next, since it was predicted that the stylus tip surface of the probe would be damaged, the stylus surface was observed with a confocal laser scanning microscope (CLSM) in detail. The observed result revealed that the stylus surface had some salients. These salients were removed by ultrasonic cleaning, so it is expected that oil stains were sticking. It turned out that it is necessary to pay attention also to adhering oil stains, which should be cleaned out each time just after measurement as well as before measurement when conducting gear measurement with high accuracy..
27. Ryosuke MIZUMACHI, Terutake HAYASHI, Syuhei KUROKAWA, Yuki HIROTSU, Noboru HASEGAWA, Masamoto NISHIKINO, Thanh-hung DINH, Surface Processing for Fused Silica using Multi Shot Femtosecond Laser Beam
, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.70, 2019.10, Fused silica is excellent in heat resistance, corrosion resistance and light transmission, and is used in a wide range of applications such as optical components and semiconductor substrates. However, since it is a hard and brittle material, it is difficult to use cutting, and a high efficiency machining method is required as an alternative. We use a femtosecond laser to remove fused silica. Since femtosecond lasers have a short pulse width, energy can be concentrated in a very short time, and it is possible to process with less heat affection. It also makes processing some materials possible such as semiconductors by utilizing the multiphoton absorption process. Fused silica has a very wide band gap (7.75 to 10 eV), so it is necessary to use very high fluences or very short wavelengths to excite the electrons from the valence band to the conduction band and process it. Both of them cost a lot of money. So, in this study, we propose the double-pulse processing method using a femtosecond laser at low fluences and with visible light wavelength. The double-pulse beam has two peak pulses within several picoseconds of each other. The purpose of the first pulse is to photo-excite the surface before the second pulse is irradiated. And that of the second pulse is to process the photo-excited surface at a low peak fluence. This has been demonstrated to enable processing with low fluences and low heat affection in SiC, and almost same effects can be expected with fused silica. In this report, we irradiate fused silica with a femtosecond laser at 800nm using this proposed method and confirm the effectiveness..
28. Shuhei OKOGE, Syuhei KUROKAWA, Terutake HAYASHI, Kaito WAKAMATSU, Planarization of CVD polycrystalline SiC by plasma fusion CMP, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.69, 2019.10, Plasma fusion CMP is a combination technique of CMP (chemical mechanical polishing) capable of high-precision polishing and P-CVM (Plasma Chemical Vaporization Machining) capable of high-efficiency processing. CMP utilizes a chemical action in which the slurry softens the substrate surface and a mechanical action in which the abrasives in slurry remove the softened layer. P-CVM processes by irradiating the substrate surface with highly reactive plasma to generate volatile substances as by-products.
In this study, a newly developed CMP / P-CVM fusion processing machine was used. CMP and P-CVM can be performed at the same time by supplying a plasma from holes on the polishing pad. CVD polycrystalline SiC was used as a test substrate. CVD polycrystalline SiC is used for laser mirrors and glass molds. Therefore, a very accurate surface finishing is required. There are hard crystal parts and relatively soft amorphous parts in the structure, and there is a difference in processing speed. So, when CMP is applied, steps occur on the surface, and high-precision polishing is difficult by normal CMP.
This paper describes research aimed at high-precision and high-efficiency polishing of polycrystalline CVD SiC using plasma fusion CMP.
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29. Syuhei KUROKAWA, Chengwu WANG, Terutake HAYASHI, Surface Morphology of Femtosecond Laser Induced SiC Substrate and Effective CMP Application, Proceedings of the 19th International Symposium on Aerospace Technology & Manufacturing Process, P.67, 2019.10, Silicon carbide (SiC) is considered as one of the next generation power device materials because of its outstanding properties and vast potential market. However, it is still extremely difficult to polish SiC substrates due to their high chemical stability and high hardness. A new technique is necessary regarding how to realize high polishing efficiency and high surface accuracy for SiC substrates in CMP processes.
Femtosecond (fs) laser has a capability to induce ablation effect on hard materials without heat conduction. By giving lower power than conventional usage, trial formation of easy-to-process sites on as-lapped C-face of SiC substrates was carried out by fs laser irradiation. The sites are expected to be polished easily at the final surface finishing process. Two kinds of fs laser induced methods were applied to SiC substrates and the substrates were polished by CMP process with normal colloidal silica slurry in short time.
By the observation of the fs irradiated surface, a typical ripple structure was observed. The formation of such periodic rippled morphology will help CMP slurry stay on the substrate efficiently and polishing pressure affects evenly on the structure. The results of CMP application on the fs laser irradiated substrate show that the surface roughness improvement was obvious in comparison to the non-irradiated surface even in short processing time.
By consideration of the mechanisms, three main advantages became clear. The first advantage is the formation of the periodic rippled surface morphology on which CMP slurry can be kept efficiently. The second advantage is the further oxidation effect processed in the air atmosphere, and the third one is that the formation of an amorphous layer in subsurface can be expected. All three aspects act as the enhancement effect on the following CMP process..
30. Tetsuo INOUE and Syuhei KUROKAWA, Improving the Estimation Accuracy of Fishing Reel Sensation Caused by Gear Vibration Using Tactile Response Delay Time, Proc. of the VDI International Conference on Gears 2019, 1-11, 2019.09, Fishing spinning reels use a face gear system. When the handle of the reel rotates, vibration occurs in the face gear system, which is transmitted to an angler's finger via the handle. Although the vibration is small, at the micrometer level, the angler feels discomfort when the vibration is relatively large. In addition, this discomfort significantly affects the success rate of fishing. The most important function of the fishing reel is its sensation, because it determines the worth of the reel. In the author's previous paper, a method using the addition of grooves to the tooth flank of the face gear was proposed to improve the gear vibration behavior. The paper suggested a phenomenon wherein the sensation of a fishing reel is improved with a specific number of grooves. Moreover, the authors elucidated the phenomenon by introducing the concept of “tactile response delay time.” The principle is, after a receptor at the fingertip receives a vibration signal, time delay occurs until the receptor detects the vibration magnitude.
There are four types of receptors beneath the skin of a fingertip, namely Meissner’s corpuscle, Pacinian corpuscle, Merkel’s disk, and Ruffini ending. In this study, it is considered that an angler feels the gear vibration through these receptors. Because these receptors are regarded as biosensors, there must be a transient response in relation to signal input/output, and it is reported that this response time is of the order of milliseconds. When considering gear vibration as a collection of sinusoidal waves at various frequencies, it is inferred that a human feels the amplitude of vibration of each frequency as the magnitude of vibration in general. However, in the case of “tactile response delay time,” the human feels the wave height (i.e., displacement) after the time delay, due to the transient response of the receptors, instead of the vibration amplitude. Using this technique, the estimation of the sensation of fishing reel was easily achieved using the vibration waveform, through the concept of “estimated value of vibration sensation.” However, the accuracy of the estimated value was not high, and a slight divergence was observed between the estimated value and the result of the human judgment.
In this study, the estimation equation that was proposed in the previous report is modified to improve the estimation accuracy of the feel of fishing reel. In our previous study, the tactile response delay time included in the estimation equation was fixed at 1.3 ms. However, when receptors are regarded as biosensors, it is easily inferred that the “tactile response delay time” depends on human variable variations (e.g., individual differences, finger, age, gender, and race), environment (e.g., temperature, humidity, and atmospheric pressure), and the nature of vibrations (e.g., amplitude and frequency). In this report, we focus on amplitude among all the other estimation factors, as it changes the “tactile response delay time,” and refers to the dependence on the amplitude of “tactile response delay time.” In addition, we confirm the improvement in the estimation accuracy of the fishing reel sensation by using the modified estimation equation. In the case of the dependence on the amplitude of “tactile response delay time,” first, the estimated feel of fishing reel by the tactile response ratio (the ratio of tactile detection limit and amplitude at frequency) and the estimated feel of fishing reel by “tactile response delay time” are compared. Next, the relationship between the magnitude of amplitude and “tactile response delay time” is confirmed. In the case of improvement in the estimation accuracy, the estimated value of vibration sensation is calculated by inputting the transmission error waveform that occurs in the meshing of the gear pair into the estimation equation. Finally, the improvement in the estimation accuracy is confirmed by comparing with the calculated result using the modified equation and actual feel of fishing reel.
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31. Syuhei KUROKAWA, Atsushi WATANABE, Terutake HAYASHI, Naoyuki HANDA, Yutaka WADA, Chikako TAKATOH, Shoichi SHIMA, and Hirokuni HIYAMA, Direct observation of slurry particle behavior at the interface of CMP pad and glass substrate, Proc. of the 2019 International Conference on Planarization/CMP Technology (ICPT2019), 1-2, 2019.09, In situ observation of the abrasive grain behavior of the contact interface in CMP was achieved by preparing an observation experimental device
simulating the environment of CMP. When comparing the hard pad and the soft pad, both were in the same situation from the point of view that particles were caught in the contact area between the pad and the glass substrate and that there was a circulating flow in pad pores. The new finding from the observation must lead us to the correct mechanism of CMP..
32. Yuto KAJITANI, Syuhei KUROKAWA, Terutake HAYASHI, Tetsuya TAGUCHI, Ryota MATSUOKA, Accuracy improvement of gear measuring machine with coordinate measuring function
-Significant factors of deviation in measurement-, Proc. of the 14th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII2019), 1-6, 2019.09, The research aims to develop a gear measuring machine that can measure not only the working flank but also the shape of the tooth root and the tooth bottom by a three-dimensional measuring machine. Therefore, the conventional single-axis probe with a three-dimensional tactile scanning probe is replaced. It has been confirmed in the previous research that the measurement accomplished by the developed machine has some dispersion. In this paper, the repeatability of the measurement is evaluated by a calibration ball whose shape and size are fixed. . Measurement deviations along the equator of the calibration ball were found in the radial direction. The stylus surface wasobserved with a confocal laser scanning microscope in detail. The obtained results revealed that the stylus tip had some salient, which were removed by ultrasonic cleaning. It was noticed that oil stains were sticking on the stylus tip. When the calibration ball was measured again after cleaning the stylus tip, the measurement deviations apparently decreased in the radial direction. It turns out that it is necessary to pay attention also to adhering oil stains, which should be cleaned out each time just before and after the measurement for measuring gear with high accuracy..
33. Masanori KAJIKI, Syuhei KUROKAWA, Terutake HAYASHI, Three-dimensional Shape Measurement using Non-contact Line Laser Probe
‒ An abnormal phenomenon of excessive detection error ‒, Proc. of the 14th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII2019), 1-6, 2019.09, Three-dimensional coordinate measuring machines (CMMs) have drawn attention as a technique for measuring complex and diverse industrial products. There are two types of coordinate acquisition methods in CMMs, tactile and non-contact methods. We focused on the accuracy in non-contact surface measurement. In the non-contact measurement using the light section method, it is reported that the flat surface having irregularities of only 1 to 3 μm was detected as a surface having irregularities of about 340 μm. Therefore, experiments were conducted to clarify why such an abnormal phenomenon occurs. From examining the findings, it was assumed that the relation between the width of the line laser and the uneven reflection greatly contributed to the abnormal phenomenon. Specifically, to get a correct coordinate of a measured surface in the light section method, it is necessary to make the intensity of reflected light from the laser center as the strongest. However, the reflected light from a position not at the laser center may be the strongest due to the uneven reflection, which may lead to excessive detection error. In this paper, this assumption was shown to be correct by further experiments..
34. Jiaqing ZHU, Terutake HAYASHI and Syuhei KUROKAWA, Measurement of number based particle sizing distribution using nanoparticle micro array, Proc. of the 14th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII2019), 1-6, 2019.09, DLS (Dynamic Light Scattering) is commonly used for measuring the diffusional diameter of the nanoparticle in solution. However, DLS has difficulty to distinguish the particle size distribution between the primary particle and the secondary particle. For poly-dispersed nanoparticles, the image analysis method is a prior method to confirm the secondary particle and measure the particle size distribution. The image analysis method can measure the geometric diameter of the primary particle accurately. In this case, it takes a lot of time to observe thousands of particles to obtain an accurate size distribution. The aggregation of particles is also a problem during sample preparation from the solution. In order to measure the mean diameter of the primary particle and their size distribution, we suggest a novel particle sizing method using “nanoparticle micro array”. The sampled particle is aligned on the substrate and the geometric diameter of each primary particle can be measured by using SEM (Scanning Electron Microscope), TEM (Transmission Electron Microscope), or AFM (Atomic Force Microscope) with a time-saving protocol..
35. Ryota MATSUOKA, Tetsuya TAGUCHI and Syuhei KUROKAWA, Development of tactile and non-tactile hybrid gear measuring machine
- Pre-feasibility study of non-tactile gear measurement -, Proc. of the 14th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII2019), 1-6, 2019.09, Gears need high accuracy, as important mechanical elements. Measuring gears generally needs using the gear measuring machine (GMM) with high precision which have a tactile scanning probe. Measuring the whole shape of gears also uses the coordinate measuring machine (CMM) with
a tactile or non-tactile probe, gear measuring has become increasingly diversified. The tactile and non-tactile probes have advantages to each other, and sharing them has the potential to advance measurement. Developing the new measuring system having both advantages (= Hybrid) is the
author's purpose. Measuring a gear-like shape requires complicated paths for movement and takes a very long time including setup. The authors investigated non-tactile probes suitable for GMM, and focused on Line laser probe (LLP) with high general versatility that obtain point clouds quickly and
abundantly. And we verified the effectiveness for gear measuring, and considered scanning conditions suitable for gears. As a result, some thorn-like abnormal points appeared on the tooth. We focused on the characteristics of the probe and on the interference of laser, and clarified the
mechanism of the abnormal point. We succeeded to find an effective measuring method for gear using LLPs..
36. Syuhei KUROKAWA, Shuhei YAMAMOTO, Terutake HAYASHI, and Yu HOSHINO, Acceleration of CO2 absorption rate of temperature-responsive hydrogels by precision machining and spray coating process, The 40th MATADOR International Conference on Advanced Manufacturing and Design, P.144, 2019.07, The CO2 capture process used in the thermal power plants now has a problem of its running cost because it must heat the adsorbent at high temperature to desorb the carbon dioxide. Since a new hydrogels-based absorbent developed at Kyushu University absorbs and desorbs CO2 in response to small temperature change, it may be the best way to reduce CO2 emissions from the thermal power stations. Furthermore, since this absorbent can be fabricated as coating films, it can be applied not only to a flat surface but also to a complicated shape. However, the way to use it with high efficiency has not been developed yet. We fabricated an aluminum reactor which has many fine grooves by precision machining and formed tens of an absorbent gel film on it by spray coating. This method accelerates the absorption and/or desorption rate of the carbon dioxide, reducing size of the CO2 capture reactor. In this paper, the influence of the film thickness and the carrier surface area on the absorption rate was investigated. CO2 gas was guided into the reactor and the concentration of the carbon dioxide contained in the gas after contact with the absorbent was measured. Comparison was made between reactors with fine grooves and without grooves. Desorption process and absorption process were performed once. As a result, it has been found that the absorption-desorption cycle improves as the film thickness decreases and the carrier surface area increases..
37. Syuhei KUROKAWA, Yuuki UTSUNOMIYA, Terutake HAYASHI, Tetsuya TAGUCHI, and Ryota MATSUOKA, Whole Outline Scanning Measurement of Internal Gear by using CNC Gear Measuring Machine, The 6th International BAPT Conference on Power Transmissions 2019, P.1-P.5, 2019.06, A three-dimensional probe is mounted on a specialized gear measuring machine whose measurement target is limited on the working flanks. The newly developed measuring machine has a coordinate measuring mechanism, aiming to be a highly versatile and relatively inexpensive measuring machine. According to our previous research, in addition to the working tooth surface, shape data of the root, bottom and tip profiles can be acquired with a single measurement operation. However, the target object for which this developed method has been applied was only the external cylindrical gear. In this paper, we applied and expanded the development method to the internal cylindrical gear and the evaluation of the axial displacement in the same cross-sectional scanning of the internal helical gear are performed..
38. Mitsuaki Murata, Makoto Hino, Ryoichi Kuwano, Syuhei Kurokawa, Machinability of SMART Forging Process Materials in Intermittent Cutting
2nd Report: Machinability in Normal Cutting Region and Selection of Optimum Cutting Condition, 3rd International Conference on Power, Energy and Mechanical Engineering, ICPEME 2019
E3S Web of Conferences
, 10.1051/e3sconf/20199501001, 95, 2019.05, [URL], Transmission used in automobiles is indispensable from the viewpoint of improvement of maximum speed, quietness and fuel consumption even if the power source of automobile is changed from internal combustion engine to electric motor in the future. We are studying a heat treatment process for imparting machinability to the forged material after hot forging used for a transmission of automobiles. In the past, the heat stored in the material after hot forging was merely released into the atmosphere. We succeeded in imparting machinability to the material by cooling while well controlling the heat stored in the forged material after hot forging. In the previous paper [1], we reported the progress of tool wear of this forged material in the high-speed cutting region with the cutting speed of 200 m/min or more in intermittent cutting. In this report, we conducted cutting experiments on the machinability of this developed forged material in the normal cutting speed region with the cutting speed less than 200 m/min. As a result, at the cutting speed V of V=157 m/min or less, it reached the conclusion that the built-up edges frequently occurred and the tool was chipped due to it. From the previous report and the results of this experiment, it was found that the cutting speed V of about V=213 m/min is optimum for cutting these forged materials with cemented carbide..
39. Tao Yin, Kei Kitamura, Toshiro Doi, Syuhei Kurokawa, Zhaozhong Zhou, Kaiping Feng, Effects of changes in gas type and partial pressure on chemical mechanical polishing property of Si substrate, ECS Journal of Solid State Science and Technology, 10.1149/2.0201904jss, 8, 4, P293-P297, 2019.05, [URL], As a critical link of efficient and high-quality semiconductor substrate chemical mechanical polishing process, this paper focuses on the effects of the changes of the atmosphere to be processed on the CMP property of Si substrate. The experiment results showed that O2 existing in the processing atmosphere played an active role in facilitating material removal, and when the partial pressure of O2 in the processing atmosphere increased to 500kPa, the Si MRR of CMP reached 905nm/min. The Si material surface dissolutions in different atmospheres were analyzed respectively using SEM, EDS and light interference microscope. It was found that when O2 was sufficient, an extremely thin and tight oxide film was formed on the Si substrate surface, which prevented the furtherance of oxidation reaction, and compared with the Si-Si bonds, the Si-O bonds generated during this process were more inclined to undergo hydrolysis reaction; on the other hand, the O2 atmosphere caused the polishing pad, polishing particles and Si substrate to contact closely, increasing the mechanical friction and thus significantly improving the MRR. Based on the results of experiment and analysis, the Mechanisms of Si substrate polishing in high-pressure O2 atmosphere were summarized and a material removal model was built..
40. Koji KUMAGAI, Kunihiko MORIKAWA, Atsushi HAYATA, Yuta NAITO and Syuhei KUROKAWA, Influence of Trochoidal Interference near Base Circle of Helical Gears on Pitting Failure, The 8th International Conference on Manufacturing, Machine Design and Tribology, TH-B-2-1, P1-P2, 2019.04, This study examined the effect of adjusting gear specifications on improving mesh efficiency. When the gear ratio of a cylindrical gear is relatively high, it tends to increase the sliding velocity between the engaging gear teeth. Moving the contact region toward the base circle of the pinion along the line of action is considered to be one solution for reducing friction loss . However, it may cause deterioration of tooth surface strength because the radius of the curvature of the tooth surface becomes smaller due to being close to the base circle. Two types of gear durability tests were carried out to confirm the influence on tooth surface strength. The results showed that pitting failure occurred in the tooth root area of the pinion. Furthermore, trochoidal interference and wear extended over the base circle of the pinion due to a high torque driving condition. In addition, the results of the tests differed with respect to pitting durability and the positions of pitting. These differences coincided with the state of wear. One reason could be that slight variations in the edge shape of the tooth width and the tooth flank deviations resulted in different sensitivity to pitting failure. These results revealed that pitting durability and the state of failure are influenced sensitively and compositely by trochoidal interference and wear..
41. Amine Gouarir, Syuhei Kurokawa, Takao Sajima, Mitsuaki Murata, Influence of coating in square end mill using in-process tool wear detection based on electrical contact resistance, International Journal of Automation Technology, 10.20965/IJAT.2019.P0125, 13, 1, 125-132, 2019.01, [URL], In this paper, a method using electrical contact resistance to monitor in-process tool wear is proposed. The high-speed tool wear detection system uses the contact resistance between the tool and workpiece as an indicator to monitor the progression of tool wear during cutting operations. The electrical resistance decreases with an increase in contact area on the tool flank. In our previous study, the objective was an end milling process using uncoated square end mills. In this experiment, our targets are solid and throw away coated square end mills. The experiment shows the present method to also be effective as an in-process tool wear detection system for coated square end mills..
42. Tao Yin, Tosiro Doi, Syuhei Kurokawa, Zhao zhong Zhou, Kai ping Feng, Polishing Characteristics of MnO2 Polishing Slurry on the Si-face of SiC Wafer, International Journal of Precision Engineering and Manufacturing, 10.1007/s12541-018-0206-9, 19, 12, 1773-1780, 2018.12, [URL], To realize an efficient and high-quality chemical-mechanical polishing process for the surface of a SiC wafer, a new type of MnO2 slurry is developed employing the multi-valence and oxidation-reduction characteristics of MnO2 particles.
This slurry is utilized to polish the Si-face of SiC wafers. In this paper, the influences of the polishing particle concentration and the pH of slurry on MRR are analyzed, the polishing performance of the MnO2 slurry is studied, and the polishing mechanism of the MnO2 slurry on the SiC wafer is determined. The polishing mechanism of the MnO2 slurry is verified by selecting commonly used additives, such as KMnO4, and the influence of the additive amount on the MRR is analyzed.
Finally, the surface morphology of the material after polishing is observed with analytical instruments.
The experimental results show that the MRR of the MnO2 slurry is highly dependent on the pH value of the slurry. The MnO2 particles tend to convert into MnO4- ions in an alkaline environment, and the strong oxidizing property of MnO4- ions greatly improves the polishing efficiency.
As the MnO4- ion concentration increases, the MRR can reach over 600 nm/h, and an ultra-smooth surface with a surface..
43. Terutake Hayashi, Syuhei KUROKAWA, and Zhu Jiaqing, A novel nano particle characterizing method using nano particle micro array, Proc. of the 17th International Conference on Precision Engineering (ICPE2018), 1-2, 2018.11.
44. Kaito WAKAMATSU, Syuhei KUROKAWA, and Terutake HAYASHI, CMP Characteristics of Quartz Glass Substrate by Aggregated Colloidal Ceria Slurry Slurry, Proc. of the 17th International Conference on Precision Engineering (ICPE2018), 1-4, 2018.11.
45. Syuhei Kurokawa, Takaaki Toyama, Terutake Hayashi, Eisaku Suda, and Jun Tokuda, High Performance CMP of Oxide Film by Controlling Aggregation State of Colloidal Ceria Slurry, Proc. of the 2018 International Conference on Planarization/CMP Technology (ICPT2018), 1-4, 2018.10.
46. Tetsuo Inoue and Syuhei KUROKAWA, Estimation of feel of fishing reel by using the tactile response delay time, Proc. of the International Gear Conference 2018, 1361-1371, Vol II, 2018.08.
47. Mitsuaki MURATA, Makoto HINO, Ryoichi KUWANO, Syuhei KUROKAWA, Machinability of SMART Forged Materials in Intermittent Cutting, Int. J. of Materials Science and Engineering, DOI: 10.17706/ijmse.2018.6.1.1-9, Vol.6, No.1, 1-9, 2018.03.
48. Chengwu WANG, Syuhei KUROKAWA, Julong YUAN, Li FAN, Huizong LU, Zhe WU, Weifeng YAO, Yu ZHANG, and Toshiro DOI, Study of Femtosecond Laser Ablation Effect on Micro-Processing for 4H-SiC Substrate, Int. J. of Automation Technology, DOI: 10.20965/ijat.2018.p0187, Vol.12, No.2, 187-198, 2018.03.
49. Chengwu WANG, Syuhei KUROKAWA, Toshiro DOI, Julong YUAN, Masatoshi MITSUHARA, Weifeng YAO, and Kehua ZHANG, SEM, AFM and TEM Studies for Repeated Irradiation Effect of Femtosecond Laser on 4H-SiC Surface Morphology at Near Threshold Fluence, ECS Journal of Solid State Science and Technology, DOI: 10.1149/2.0421712jss, Vol.7, Issue 2, P29-P34, 2018.01.
50. Chengwu WANG, Syuhei KUROKAWA, Toshiro DOI, Julong YUAN, Binghai LV, and Kehua ZHANG, Surface Morphology Evolution Induced by Repeated Femtosecond Laser Ablation on 4H-SiC Substrate and Its Application to CMP, ECS Journal of Solid State Science and Technology, DOI: 10.1149/2.0261712jss, Vol.6, Issue 12, P835-P861, 2017.12.
51. Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masaharu NISHIKINO, and Yoji MATSUKAWA, Dynamics of Photo-excitation for the Ablation of 4H-SiC Substrate using Femtosecond Laser, Proc. of the 9th International Conference on Leading Edge Manufacturing in 21st Century, LEM21, 1-4, 2017.11.
52. Syuhei KUROKAWA, Takaaki TOYAMA, Terutake HAYASHI, Eisaku SUDA, and Jun TOKUDA, Controllable CMP of Oxide Film by Using Colloidal Ceria Slurry, Proc. of the International Conference on Planarization/CMP Technology, ICPT2017, 177-182, 2017.10.
53. Syuhei KUROKAWA, Yuki UTSUNOMIYA, Tetusya TAGUCHI, Terutake HAYASHI, and Yoji MATSUKAWA, Whole Gear Outline Scanning Measurement of Internal Gear by Using CNC Gear Measuring Machine, Proc. of the 13th International Symposium on Measurement Technology & Intelligent Instruments 2017, ISMTII2017, 1-6, 2017.09.
54. Tetsuo INOUE and Syuhei KUROKAWA, Evaluation of Handle Rotational Feeling in Fishing Reel by Coordinate Measurement and Gear Transmission Error Measurement, Applied Mechanics and Materials, DOI: 10.4028/www.scientific.net/AMM.870.185, Vol.870, 185-190, 2017.09.
55. Terutake HAYASHI, Toshiki SERI, and Syuhei KUROKAWA, A Novel Particle Sizing Method for Nano Abrasives in CMP Slurry by Using Fluorescent Nano Probe, Int. J. of Automation Technology, DOI: 10.20965/ijat.2017.p0754, Vol.11, No.5, 754-760, 2017.09.
56. Tetsuo INOUE and Syuhei KUROKAWA, Influence of Waveform Components Derived from the Transmission Error of a Face Gear Pair on a Fishing Reel based on Tactile Sensibility, Precision Engineering, DOI: 10.1016/j.precisioneng.2017.08.015, Vol.51, 232-243, 2017.08.
57. 黒河周平, SiC研磨技術の現状と新加工法-強酸化剤を添加したスラリーによる加工-, 砥粒加工学会誌, Vol.61, No.8, 422-425, 第61巻第8号,422~425頁, 2017.08, [URL].
58. Hideo AIDA, Toshiro DOI, Yasuhisa SANO, and Syuhei KUROKAWA, Plasma Fusion Chemical Mechanical Polishing as a Next Generation Processing Technology and its Applications to SiC, GaN, and Diamond Substrates, Proc. of the 10th MIRAI Conference on Microfabricatoin and Green Technology, MIRAI2017 (Transaction of MIRAI), Vol.5, 70-75, 2017.06.
59. Syuhei KUROKAWA, Takashi TERAOKA, Yuki UTSUNOMIYA, Tetusya TAGUCHI, Terutake HAYASHI, and Yoji MATSUKAWA, Whole Outline Scanning Measurement for Helical Gears Including Root and Bottom Profiles, Proc. of the JSME International Conference on Motion and Power Transmissions MPT2017-Kyoto, 1-4, USB-Storage, pp 1-4, 2017.03.
60. Tetsuo INOUE and Syuhei KUROKAWA, Effects of Pinion Gear Pressure Angle and Helix Angle Errors on Transmission Error of a Face Gear Modified with a Transmission Error Controlled Curve, Proc. of the JSME International Conference on Motion and Power Transmissions MPT2017-Kyoto, 1-5, USB-Storage, pp 1-5, 2017.03.
61. Chengwu WANG, Syuhei KUROKAWA, Toshiro DOI, Julong YUAN, Yasuhisa SANO, Hideo AIDA, Kehua ZHANG, and Qianfa DENG, The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP), ECS Journal of Solid State Science and Technology, DOI: 10.1149/2.0041704jss, Vol. 6, Issue 4, P105-P112, pp P105-P112, 2017.01.
62. Tetsuo INOUE and Syuhei KUROKAWA, Proposal of a face gear which generates virtual high mesh frequencyby addition of grooves on the tooth flank, and the investigation viavibration simulator and actual samples, Precision Engineering, DOI: 10.1016/j.precisioneng.2016.09.006, Vol. 47, 321-332, pp 321-332, 2017.01.
63. 有川 剛史, 今村 亮祐, 黒河 周平, 大型鍛鋼品の偏析帯と焼割れ発生の関係, 日本機械学会論文集, DOI: 10.1299/transjsme.16-00442, Vol. 83, No.845, 1-17, pp 1-17, 2016.12.
64. Terutake HAYASHI, Keigo MATSUNAGA, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masaharu NISHIKINO, Takayuki KUMADA, Tomohiro OTOBE, Yoji MATSUKAWA, and Yasuhiro TAKAYA, Study on low power laser processing technique with instant surface excitation using femtosecond double pulse, Proc. of 16th International Conference on Precison Engineeering ICPE2016, C305-8183, 1-4, pp 1-4, 2016.11.
65. Syuhei KUROKAWA, Leo HIRASHIMA, Terutake HAYASHI, Keiichiro WATANABE, Hiroyuki TSUJI, and Tomoki NAGAE, Planarization for Translucent Polycrystalline Alumina by Surface Polishing Technique, Proc. of 16th International Conference on Precison Engineeering ICPE2016, C111-8207, 1-2, pp 1-2, 2016.11.
66. 有川 剛史, 堀江 祥平, 野崎 孝彦, 香川 恭徳, 柿本 英樹, 黒河 周平, 段付厚板の熱間曲げ加工における表面疵の発生挙動および曲げ加工の適正化 ― 大型鍛鋼クランクスローの成形工程に関する研究 ―, 塑性と加工, DOI: 10.9773/sosei.57.1077, Vol. 57, No.670, 1077-1082, pp 1077-1082, 2016.11.
67. Syuhei KUROKAWA, Yuki UTSUNOMIYA, Takashi TERAOKA, and Terutake HAYASHI, Scanning Strategy of Edge Corners in Gear Outline Measurement, Proc. of the International Conference on Power Transmissions 2016, 917-921, pp 917-921, 2016.10.
68. Syuhei KUROKAWA, Chengwu WANG, Toshiro DOI, Yasuhisa SANO, Hideo AIDA, Koki OYAMA, Terutake HAYASHI, and Noboru FUKIHARU, CMP Characteristics for SiC Substrates Irradiated by Femtosecond Laser, Proc. of the International Conference on Planarization/CMP Technology, ICPT2016, 86-89, pp 86-89, 2016.10.
69. Terutake HAYASHI, Toshiki SERI, and Syuhei KUROKAWA, Particle Size Ddistribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe, Proc. of the International Conference on Planarization/CMP Technology, ICPT2016, 75-78, pp 75-78, 2016.10.
70. Syuhei KUROKAWA, Hyomin CHA, Terutake HAYASHI, and Morihisa HOGA, Gear Metrology for Gear Meshing Accuracy and Nano-Manufacturing Application to Micro Gear Engagement, Proc. of 5th International Conference on Power Transmission BAPT2016, 194-198, pp 194-198, 2016.10.
71. Amine GOUARIR, Syuhei KUROKAWA, Takao SAJIMA, and Mitsuaki MURATA, In-Process Tool Wear Detection of Uncoated Square End Mill Based on Electrical Contact Resistance, International Journal of Automation Technology, DOI: 10.20965/ijat.2016.p0767, Vol. 10, No.5, 767-772, pp 767-772, 2016.09.
72. 有川 剛史, 今村 亮祐, 松宮 知朗, 沖田 圭介, 松田 真理子, 黒河 周平, 大型鍛鋼品ポリマー焼入れにおける段付き丸棒のフランジ厚みが焼割れ発生に及ぼす影響―大型鍛鋼品のポリマー焼入れに関する研究―, 塑性と加工, DOI: 10.9773/sosei.57.648, Vol. 57, No.666, 648-654, pp 48-654, 2016.07.
73. Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masaru NISHIKINO, Takayuki KUMADA, Tomohito OTOBE, Yoji MATSUKAWA, and Yasuhiro TAKAYA, Study on Surface Excitation of SiC by Double Pulse Femtosecond Laser Process –Investigation of Surface Irradiation-, Proc. of the 15th International Conference on X-Ray Lasers, 2016.05.
74. Amine GOUARIR, Syuhei KUROKAWA, Takao SAJIMA, and Mitsuaki MURATA, Real-time evaluation of tool wear detection system under wet machining based on electrical contact resistance, Proc. of euspen’s 16th International Conference & Exhibition, P4.12, 311-312, pp 311-312, 2016.05.
75. Syuhei KUROKAWA, Removal Rate Improvement in SiC-CMP and its Mechanisms, Proc. of Cross-Strait and Asia-Pacific Conference on Wafer Planarization/CMP Technology 2016, APWCMP2016, 151-156, pp 151-156, 2016.05.
76. Yasuhisa SANO, Kousuke SHIOZAWA, Toshiro DOI, Syuhei Kurokawa, Hideo AIDA, Tadakazu MIYASHITA, Kazuto YAMAUCHI, High-efficiency Planarization Method Combining Mechanical Polishing and Atmospheric-pressure Plasma Etching for Hard-to-machine Semiconductor Substrates, Mechanical Engineering Journal, DOI: 10.1299/mej.15-00527, Vol. 3, No.1, 1-9, pp 1-9, 2016.01.
77. 有川 剛史, 朴 海洋, 松宮 知朗, 今村 亮祐, 沖田 圭介, 松田 真理子, 黒河 周平, 大型鍛鋼品ポリマー焼入れにおけるポリマー水溶液の劣化が焼割れ発生に及ぼす影響, 日本機械学会論文集, DOI: 10.1299/transjsme.15-00456, Vol.82, No.833, 1-11, pp 1-11, 2016.01.
78. Tetsuo INOUE, Syuhei Kurokawa, Takashi MAENO, Yasutoshi MAKINO, Evaluation of Handle Rotational Feeling in Fishing Reels Using a Bone Conduction Speaker Based on Transmission Error of Gear Pairs and Predication by MT System, Mechanical Engineering Journal, DOI: 10.1299/mej.15-00339, Vol. 2, No.6, 1-9, pp 1-9, 2015.12.
79. Chengwu WANG, Syuhei Kurokawa, Toshiro DOI, Yasuhisa SANO, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Koki OYAMA, Terutake Hayashi, Ji ZHANG, Eiji ASAKAWA, Consideration of Femtosecond Laser-induced Effect on Semiconductor Material SiC Substrate for CMP Processing, Applied Mechanics and Materials, doi:10.4028/www.scientific.net/AMM.799-800, Vols. 799-800, 458-462, pp.458-462, 2015.10.
80. Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, A Study on Fluorescence Polarization Method for Analyzing Diffusional Movement of Abrasive Grain in CMP Slurry, Proc. of the 8th International Conference on Leading Edge Manufacturing in 21st Century, LEM21, 2015, D07-1504, pp.1-4 , 2015.10.
81. Amine Gouarir, Syuhei Kurokawa, Mitsuaki Murata, Takao Sajima, Tetsuya Torii, In-process Tool Wear Detection of Square End mill Based on DC Two Terminal Method, Proc. of the 8th International Conference on Leading Edge Manufacturing in 21st Century, LEM21, 2015, B29-0513, pp.1-6, 2015.10.
82. Tetsuo Inoue, Syuhei Kurokawa, Proposal of a Face Gear which Generates Virtual High Mesh Frequency by Addition of Grooves on the Tooth Flank, Proc. of International Conference on Gears, VDI-Berichte Nr.2255, 2015, pp.581-590, 2015.10.
83. Yasuhisa Sano, Kousuke SHIOZAWA, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo Aida, Koki Oyama, Tadakazu Miyashita, Haruo Sumizawa, Kazuto Yamaguchi, Optimization of Machining Conditions of Basic-Type CMP/PCVM Fusion Processing Using SiC Substrate, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.302-305, 2015.09.
84. Hideaki Nishizawa, Koki Oyama, Toshiro Karaki Doi, Hideo Aida, Seongwoo Kim, Yasuhisa Sano, Syuhei Kurokawa, Chengwu Wang, Study on Innovative Plasma Fusion CMP and its Application to Processing of Diamond Substrate, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.298-301, 2015.09.
85. Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, Brownian Diffusion Analysis for Nano-Abrasives in CMP Slurry by Using Fluorescence Polarization Method, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.89-92, 2015.09.
86. Masashi Kitamura, Syuhei Kurokawa, Yuta Tokumoto, Terutake Hayashi, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh, Proposal of Cleanliness Evaluation Method of CMP Pad and Investigation of Cleaning Effect by the High-Pressure Jet, Proc. of the International Conference on Planarization/CMP Technology, ICPT2015, pp.24-27, 2015.09.
87. Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, A Novel Measurement Method for Brownian Diffusion of Nano-abrasives in CMP Slurry, Proc. of International Symposium on Measurement Technology & Intelligent Instruments 2015, ISMTII2015, USB-Storage, pp.1-6, 2015.09.
88. Syuhei Kurokawa, Kensuke Uesugi, Takashi Teraoka, Tetsuya Taguchi, Terutake Hayashi, Yoji Matsukawa, Comprehensive Evaluation for Individual Gear Accuracy by Whole Circumference Scanning Measurement, Proc. of International Symposium on Measurement Technology & Intelligent Instruments 2015, ISMTII2015, USB-Storage, pp.1-6, 2015.09.
89. Tetsuo Inoue, Syuhei Kurokawa, Evaluation of Handle Rotational Feeling in Fishing Reel by Coordinate Measurement and Gear Transmission Error Measurement, Proc. of International Symposium on Measurement Technology & Intelligent Instruments 2015, ISMTII2015, USB-Storage, pp.1-6, 2015.09.
90. N. Mir-Nasiri, Md. Hazrat Ali, Syuhei Kurokawa, Development of 3D Printer with Integrated Temperature Control System, Proc. of the 4th International Conference on Informatics, Electronics & Vision, ICIEV2015, CD-ROM, pp.1-6, 2015.06.
91. Tetsuo INOUE, Syuhei Kurokawa, Takashi MAENO, Yasutoshi MAKINO, Evaluation of Handle Rotational Feeling in Fishing Reels Using a Bone Conduction Speaker Based on Transmission Error of Gear Pairs, Proc. of the 6th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2015, pp.190-191, 2015.04.
92. Syuhei Kurokawa, Tomoaki HOTOKEBUCHI, Yusuke UCHIYAMA, Keiji MIYACHI, Yoshinori KOBAYASHI, Terutake Hayashi, Kazuhisa MATSUO, Conformal Resist Coating Technique for TSV Manufacturing Process by Electrostatic Spray, Proc. of the 38th Internatinal Manufacturing Automation and Systems Technology Applications Design Organisation and Management Research (MATADOR) Conference, pp.37-42, 2015.03.
93. Ji ZHANG, Syuhei Kurokawa, Terutake Hayashi, Eiji ASAKAWA, Chengwu WANG, Processing Characteristics of SiC Wafer by Consideration of Oxidation Effect in Different Atmospheric Environment, Proc. of the International Conference on Planarization/CMP Technology, ICPT2014, pp.279-282 , 2014.11.
94. Kousuke SHIOZAWA, Yasuhisa SANO, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo AIDA, Koki OYAMA, Tadakazu MIYASHITA, Haruo SUMIZAWA, Kazuto YAMAUCHI, Development of Basic-Type CMP/P-CVM Fusion Processing System (Type A) and Its Fundamental Characteristics, Proc. of the International Conference on Planarization/CMP Technology, ICPT2014, pp.275-278, 2014.11.
95. Koki OYAMA, Toshiro Karaki Doi, Yasuhisa SANO, Syuhei Kurokawa, Hideo AIDA, Tadakazu MIYASHITA, Seongwoo KIM, Tsutomu YAMAZAKI, Hideaki NISHIZAWA, Study on a Novel CMP/P-CVM Fusion Processing System (Type B) and Its Basic Characteristics, Proc. of the International Conference on Planarization/CMP Technology, ICPT2014, pp.142-146, 2014.11.
96. Terutake Hayashi, Toshiki SERI, Syuhei Kurokawa, Study on Diffusion Coefficient Evaluation for Free Abrasives and Chemicals by Using Fluorescent Anisotropy Analysis, Proc. of the 18th International Conference on Mechatronics Technology, USB-Storage, pp.1-8, 2014.10.
97. Takashi TERAOKA, Kensuke UESUGI, Syuhei Kurokawa, Tetsuya TAGUCHI, Terutake Hayashi, Yoji MATSUKAWA, Development of Gear Measuring Machine for Whole Scanning Method of Cylindrical Gear Outline and Evaluation of Tooth Root and Tooth Profile Deviations, Proc. of the 18th International Conference on Mechatronics Technology, USB-Storage, pp.1-8, 2014.10.
98. Tetsuo INOUE, Syuhei Kurokawa, Rotational Feeling Evaluation in Fishing Reel Using Vibration Simulator (Influence of Transmission Error Component of Gear Pair onTtactile Sensibility), Proc. of the International Gear Conference, pp.1120-1130 , 2014.08.
99. Syuhei Kurokawa, Kensuke UESUGI, Takashi TERAOKA, M.D. Hazrat ALI, Tetsuya TAGUCHI, Yoji MATSUKAWA, Identification of Radii of Tooth Root and Pitch Deviations from Whole Circumference Scanning Measurement of Cylindrical Gears, Proc. of the International Gear Conference, pp.924-932, 2014.08.
100. Yasuhisa SANO, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Yu OKADA, Hiroaki NISHIKAWA, Kazuto YAMAUCHI, Basic Study on Etching Selectivity of Plasma Chemical Vaporization Machining by Introducing Crystallographic Damage into Work Surface, Key Engineering Materials, Vol. 625, pp 550-553, 2014.08.
101. MD. Hazrat ALI, Syuhei Kurokawa, Kensuke UESUGI, Application of machine vision in improving safety and reliability for gear profile measurement, Machine Vision and Application, 10.1007/s00138-014-0619-0, 25, 6, 1549-1559, Vol.25, Issue 6, pp.1549-1559, 2014.08.
102. Yoshiyuki SEIKE, Yasushi Koishikawa, Mikihiro KATO, Keiji MIYACHI, Syuhei Kurokawa, Akinari DOI, Hiroshi MIYAZAKI, CHIHAYA ADACHI, The Study of Film Formation Process by Electrospray Method to Manufacture High Productivity Organic Light-Emitting Diode Devices, SID 2014 Digest, pp.1593-1596, 2014.06.
103. Yasuhisa SANO, Toshiro Karaki Doi, Syuhei Kurokawa, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Kousuke SHIOZAWA, Yu OKADA, Kazuto YAMAUCHI, Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage, Sensors and Materials, Vol. 26, No. 6, pp 429-434, 2014.06.
104. Toshiro Karaki Doi, Yasuhisa SANO, Syuhei Kurokawa, Hideo AIDA, Osamu OHNISHI, Michio UNEDA, Koki OHYAMA, Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining(CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts, Sensors and Materials, Vol. 26, No. 6, pp 403-415, 2014.06.
105. Amine GOUARIR, Syuhei Kurokawa, Mitsuaki MURATA, Fujiwara HIROAKI, Performance Analysis of High Speed Tool Wear Detection System based on DC Two Terminal Methods, Proc. of the 5th International Symposium on Advanced Control of Industrial Processes, USB-Storage, pp.438-443, 2014.05.
106. Syuhei Kurokawa, Toshiro Karaki Doi, Chengwu W. WANG, Yasuhisa SANO, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI, Approach to High Efficient CMP for Power Device Substrates, ECS Transactions, Vol.60, Issue1, pp.641-646, 2014.03.
107. Akira ISOBE, Kenjiro OGATA, Syuhei Kurokawa, Macromodel for Changes in Polishing Pad Surface Condition Caused by Dressing and Polishing, Japanese Journal of Applied Physics, 53, 1, 016501-1-016501-7, Vol.53, No.1, Issue 1, pp.016501-1-016501-7, 2013.12.
108. MD. Hazrat ALI, Syuhei Kurokawa, Kensuke UESUGI, Camera Based Precision Measurement in Improving Measurement Accuracy, Measurement, 49, 138-147, Vol.49, pp.138-147, 2013.12.
109. MD. Hazrat ALI, Syuhei Kurokawa, Kensuke UESUGI, Takashi TERAOKA, Camera Based 3D Probe Control in Measuring Gear Profile, Proc. of the Second International Conference on Robot, Vision and Signal Processing, 1-5, CD-ROM, pp.1-5, 2013.12.
110. Akira ISOBE, Masatoshi AKAJI, Syuhei Kurokawa, Proposal of New Polishing Mechanicam Based on Feret’s Diameter of Contact Area between Polishing Pad and Wafer, Japanese Journal of Applied Physics, 52, 12, 126503-1-126503-6, Vol.52, No.12, pp.126503-1-126503-6, 2013.11.
111. Akira ISOBE, Takashi KOMIYAMA, Syuhei Kurokawa, New Model of Defect Formation Caused by Retainer Ring in Chemical Mechanical Polishing, Japanese Journal of Applied Physics, 52, 12, 126502-1-126502-5, Vol.52, No.12, pp.126502-1-126502-5, 2013.11.
112. Akira ISOBE, Toshiyuki YOKOYAMA, Takashi KOMIYAMA, Syuhei Kurokawa, Mechanisms of Local Planarization Improvement Using Solo Pad in Chemical Mechamical Polishing, Japanese Journal of Applied Physics, 52, 12, 126501-1-126501-6, Vol.52, No.12, pp.126501-1-126501-6, 2013.11.
113. MD. Hazrat ALI, Akio KATSUKI, Takao Sajima, Hiroshi MURAKAMI, Syuhei Kurokawa, Control Strategy of Developed Mechanical Actuator in Measuring Hole-Surface Parameter, International Journal of Advanced Manufacturing Technology, 69, 5-8, 1-10, Vol.69, Nos. 5-8, pp.1-10, 2013.11.
114. Koki OYAMA, Toshiro Karaki Doi, Hideo AIDA, Syuhei Kurokawa, Yasuhisa SANO, Hidetoshi TAKEDA, Koji KOYAMA, Tsutomu YAMAZAKI, Kunimitsu TAKAHASHI, Diamond Substrate Planarization Polishing Technique, Proc. of the International Conference on Planarization/CMP Technology, ICPT2013, 307-309, pp.307-309, 2013.11.
115. Syuhei Kurokawa, Takateru EGASHIRA, Zhe TAN, Tao YIN, Toshiro Karaki Doi, Removal Rate Improvement in SiC-CMP Using MnO2 Slurry with Strong Oxidant, Proc. of the International Conference on Planarization/CMP Technology, ICPT2013, 271-276, pp.271-276, 2013.11.
116. Akio KATSUKI, M.D. Hazrat ALI, Takao Sajima, Hiroshi MURAKAMI, Osamu OHNISHI, Syuhei Kurokawa, Development of a Laser-Guided Deep-Hole Measurement System --- Adjustment to a Small Size ---, Proc. of the the Twenty-Eighth Annual Meeting of the American Society for Precision Engineering, ASPE2013, 431-436, pp.431-436, 2013.10.
117. Chengwu WANG, Syuhei Kurokawa, Shin-ichi KOMAI, Hideo AIDA, Koki OYAMA, Kunimitsu TAKAHASHI, Yasuhisa SANO, Keiichi TSUKAMOTO, Toshiro Karaki Doi, Formation and Evaluation of Quasi-radical Site Induced by Femtosecond Laser on the Surface of Diamond, Proc. of the 13th International Symposium on Aerospace Technoloy, 49-51, pp.49-51, 2013.10.
118. Tetsuo INOUE, Syuhei Kurokawa, Influence of Manufacturing Error on Transmission Error of a Face Gear with Controlled Curve and Proposal of Improved Manufacturing Process, Proc. of the International Conference on Gears VDI-Berichte 2199.2, 1043-1054, pp.1043-1054, 2013.10.
119. Syuhei Kurokawa, Yoji Umezaki, Yoshiyuki FUNAKI, Experimental Estimation for Wear Resistance of Coating Films on High-speed Steel Hob and the Effect of Oxidization of Coating Films on Crater Wear, Proc. of the International Conference on Gears VDI-Berichte 2199.2, 917-929, pp.917-929, 2013.10.
120. Syuhei Kurokawa, Yoji Umezaki, Morihisa HOGA, Ryohei ISHIMARU, Osamu OHNISHI, Toshiro Karaki Doi, Application of MEMS Technique for Micro Gear Metrology, Proc. of the 4th International Conference on Power Transmissions, 457-466, pp.457-466, 2013.09.
121. Syuhei Kurokawa, M.D. Hazrat ALI, Kensuke UESUGI, Tetsuya TAGUCHI, Yoji Umezaki, Yoji MATSUKAWA, Whole Circumference Scanning Measurement of Cylindrical Gears Including Working Flanks, Tooth Tip and Bottom Profiles, Proc. of the 11th International Symposium on Measurement Technology and Intelligent Instruments, ISMTII2013, 1-5, USB-Storage, pp.1-5, 2013.07.
122. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, 工具・被削材間接触電気抵抗変化による正面フライス工具摩耗のインプロセス検出, 日本機械学会論文集(C編), 79巻, 803号, 2546-2557, 2013.07.
123. M.D. Hazrat ALI, Syuhei Kurokawa, A.A. SHAFIE, Autonomous Road Surveillance System: A Proposed Model for Vehicle Detection and Traffic Signal Control, Proc. of the 3rd International Symposium on Frontiers in Ambient and Mobile Systems, 19, 963-970, Vol.19, pp.963-970, 2013.06.
124. MD. Hazrat Ali, Syuhei Kurokawa, Kensuke UESUGI, Vision Based Measurement System for Gear Profile, Proc. of the International Conference on Informatics, Electronics & Vision 2013, ICIEV13, 1-6, CD-ROM, pp.1-6 , 2013.05.
125. Ryohei Ishimaru, Isao Sakuragi, Yasuo Yoshitake, Naoshi Izumi, Syuhei Kurokawa, A Study for Damage of Carbide Hobs, Proc. of the 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 187, 2013.05.
126. Hyomin Cha, Syuhei Kurokawa, yoji umezaki, Yoji Matsukawa, Morihisa Hoga, Prototype of a Grating Disk of 500 μm in Diameter using Nanoimprint Technique to Evaluate the Micro Gear Engagement, Proc. of the 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 74, 2013.05.
127. Tetsuo Inoue, Syuhei Kurokawa, Tooth Flank Modification on Face Gear with Transmission Error Controlled Curve and Investigation on Rotational Feeling in Spinning Reel, Proc. of the 5th International Conference on Manufacturing, Machine Design and Triboligy, ICMDT2013, 19, 2013.05.
128. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, Development of High Speed Tool Wear Detection System by using DC Two-Terminal Methods, Proc. of the 9th Cooperative and Joint international conference on Ultra-precision Machining Process, CJUMP2013, 72-76, 2013.03.
129. Syuhei Kurokawa, Toshiro Karaki Doi, Takanori Iwahashi, Koichi Sato, Yoshinori Kobayashi, Formation of Organic EL Films by Combination of Precision Spray Deposition Method and Imprinting Technique under Atmospheric Pressure, Proc. of the 12th International Symposium on Advanced Organic Photonics ISAOP-12, 31, 2012.12.
130. Md. Hazrat Ali, Akio Katsuki, Takao Sajima, Hiroshi Murakami, Syuhei Kurokawa, Development of Mechanical Actuator for Deep-Hole Measurement System, Proc. of the First International Conference for Trends in Intelligent Robotics, Automation, and Manufacturing IRAM2012, 280-287, 2012.11.
131. 清家 善之, 大坪 正徳, 鳥井 太, 丸山 健治, 山本 浩之, 小林 義典, 宮地 計二, 土肥 俊郎, 黒河 周平, 大西 修, 三次元スタック構造の半導体デバイスにおけるコンフォーマル成膜技術に関する研究(第1報 回転霧化エアロゾルスプレーによるTSVの成膜方法の提案とその装置化), 精密工学会, 78, 11, 965-969, 第78巻第11号 965~969頁, 2012.11.
132. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Toshiro Karaki Doi, Tool Flank Wear Estimation in Face Milling by Holm's Contact Theory, Proc. of the International Conference on Manufacturing Process Technology 2012, 2-3, 2012.10.
133. Takateru Egashira, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, MIchio Uneda, Isamu Koshiyama, Daizo Ichikawa, Characteristics of Sapphire CMP Under Various Gas Conditions Using Bell-Jar Type CMP Machine, Proc. of Advanced Metallization Conference 2012, 90-91, 90-90, 2012.10.
134. Shinichi Iwamoto, Syuhei Kurokawa, Toshiro Karaki Doi, MIchio Uneda, Osamu Ohnishi, Toshiyuki Suzuki, Yasuhiro Kawase, Ken Harada, Evaluation of Surface Damaged Layer Depth of Si Wafer for TSV, Proc. of Advanced Metallization Conference 2012, 88-89, 88-89, 2012.10.
135. Yoshiyuki Seike, Masanori Ohtsubo, Kenji Maruyama, Futoshi Shimai, Hiroyuki Akenaga, Hiroshi Morishita, Keiji Miyachi, Masahiko Amari, Toshiro Karaki Doi, Syuhei Kurokawa, Conformal Resist Coating Technique in the Trough-Silicon Via (TSV) with a Rotary Atomizer Aerosol Spray, Proc. of Advanced Metallization Conference 2012, 72-73, 72-73, 2012.10.
136. Zhe Tan, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Tao Yin, SiC-CMP Processing Characteristics under Different Atmospheres Using MnO2 Slurry with Strong Oxidant, Proc. of Advanced Metallization Conference 2012, 22-23, 22-23, 2012.10.
137. Tao Yin, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Zhida Wang, Zhe Tan, Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP, Proc. of International Conference on Planarization/CMP Technology 2012, 333-338, 333-338, 2012.10.
138. Tao Yin, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, 山崎 努, Zhida Wang, Zhe Tan, The Effects of Strong Oxidizing Slurry and Processing Atmosphere on Double-sided CMP of SiC Wafer, Advanced Materials Research, 591-593, 1131-1134, Vols.591-593, pp.1131-1134, 2012.10.
139. Mitsuaki Murata, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Toshiro Karaki Doi, Real-Time Evaluation of Tool Flank Wear by In-Process Contact Resistance Measurement in Face Milling, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 6, 958-970, Vol.6, No.6, pp.958-970, 2012.08.
140. Takao Sajima, Hiroshi Murakami, Akio Katsuki, Daisuke Tabuchi, Osamu Ohnishi, Syuhei Kurokawa, Hiromichi Onikura, Toshiro Karaki Doi, Precision Profile Measurement System for Microholes Using Vibrating Optical Fiber, Sensors and Materials, 24, 7, 387-396, Vol.24, No.7, pp.387-396 , 2012.07.
141. 山崎努,土肥俊郎,畝田道雄,黒河周平,大西修,瀬下清,會田英雄, 研磨パッドにおける各種溝パターンがスラリーフローに及ぼす影響, 砥粒加工学会誌, 56, 6, 388-394, 第56巻第6号, pp.388-394, 2012.06.
142. Songchon Park, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, Optical Performance of a Laser Point Source Strongly Emitted by an Aspheric Expander, Advanced Materials Research, 497, 304-310, Vol.497, pp.304-310, 2012.04.
143. 山崎 努, Toshiro Karaki Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Kiyoshi Seshimo, Hideo Aida, Development of Novel Groove Pattern for CMP Pad, Advanced Materials Research, 497, 264-267, Vol.497, pp.264-267, 2012.04.
144. 池田 洋, 赤上 陽一, 畝田 道雄, 大西 修, 黒河 周平, 土肥 俊郎, 電界トライボケミカル反応を利用した高効率研磨技術の開発(電界下における研磨界面のスラリー挙動がガラス基板の研磨特性に及ぼす影響), 精密工学会, 78, 4, 316-320, 第78巻第4号 316~320頁, 2012.04.
145. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro K. DOI, Mn2O3 Slurry Reuse by Circulation Achieving High Constant Removal Rate, Japanese Journal of Applied Physics, 51, 4, 04DB07-1-04DB07-5, Vol.51, No.4, pp.04DB07-1-04DB07-5, 2012.04.
146. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro K. DOI, Mn2O3 Slurry Achieving Reduction of Slurry Waste, Japanese Journal of Applied Physics, 51, 1, 046506-1-046506-6, Vol.51, No.1, pp.046506-1-046506-6, 2012.04.
147. Mitsuaki MURATA, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, and Toshiro DOI, Development of In-process Tool Flank Wear Detection System for Intermittent Cutting Process by Face Milling, Proc. of the 4th International Conference on Advanced Manufacturing, 1-6, CD-ROM pp.1-6, 2012.03.
148. Sung-Min MOON, Jae-Hwa KANG, Hiromitsu KIDO, Syuhei KUROKAWA, and Sung-Ki LYU, The Evaluation of Cylindrical Gear Measurement on Teeth Roots and Bottom Profiles in Different Sections, Journal of the Korean Society of Manufacturing Process Engineers, 11, 1, 46-49, Vol.11, No.1, pp.46-49, 2012.02.
149. Yoji UMEZAKI, Yoshiyuki FUNAKI, Syuhei KUROKAWA, Osamu OHNISHI, and Toshiro DOI, Wear Resistance of Coating Films on Hob Teeth --- Intermittent Cutting Tests with a Flytool ---, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 2, 206-221, Vol.6, No.2, pp.206-221, 2012.02.
150. 山崎努,土肥俊郎,黒河周平,大西修,畝田道雄,梅崎洋二,尹涛,會田英雄, 加工環境コントロール型CMP装置によるガラス基板の研磨特性(CeO2スラリー使用量の低減を指向した加工雰囲気の効果), 精密工学会誌, 78, 2, 149-154, 第78巻第2号, pp.149-154, 2012.02.
151. Atsushi OHTAKE, Kinya KOBAYASHI, Syuhei KUROKAWA, Osamu OHNISHI, and Toshiro DOI, Fast Diffusion of Water Molecules into Chemically Modified SiO2 Films Formed by Chemical Vapor Deposition, Chemistry Letters, 41, 1, 60-61, Vol.41, No.1, pp.60-61, 2012.01.
152. Tetsuo INOUE and Syuhei KUROKAWA, Derivation of Path of Contact and Tooth Flank Modification by Minimizing Transmission Error on Face Gear, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 6, 1, 15-22, Vol.6, No.1, pp.15-22, 2012.01.
153. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro K. DOI, Dielectric SiO2 Planarization Using MnO2 Slurry, Japanese Journal of Applied Physics, 51, 1, 016501-1-016501-5, Vol.51, No.1, pp.016501-1-016501-5, 2012.01.
154. Syuhei KUROKAWA, Morihisa Hoga, and Toshiro DOI, Nanomanufacturing of Radial Grating Patterns by Nanoimprint with a Silicon Mold for Rotational Angle Measurement of Microgears, International Journal of Nanomanufacturing, 8, 1-2, 123-139, Vol.8, Nos.1-2,pp.123-139, 2012.01.
155. 畝田道雄,近藤容章,石川憲一,大西修,黒河周平,土肥俊郎, 空間移動平均法とMUSIC 法の併用による強相関複数騒音源の位置同定に関する研究(小型マイクロホンアレーシステムを指向した高精度位置同定法), 精密工学会誌, 77, 12, 1158-1164, 第77巻第12号, pp.1158-1164, 2011.12.
156. 池田洋,赤上陽一,畝田道雄,大西修,黒河周平,土肥俊郎, 電界砥粒制御技術を適用したガラス基板の高効率研磨技術の開発(電界がスラリー挙動とガラスの研磨特性に及ぼす影響), 精密工学会誌, 77, 12, 1146-1150, 第77巻第12号, pp.1146-1150, 2011.12.
157. Toshiro DOI, Kenji YOJIMA, Osamu OHNISHI, Michio UNEDA, Syuhei KUROKAWA, Takao SAJIMA, Tsutomu YAMAZAKI and Takahiro MIURA, Research on the electrochemical process (E-CMP) for aluminum alloy-Polishing on inside an aluminum tank for fuel system, Proc. of Fray International Symposium 2011, 122-125, pp.122-125, 2011.11.
158. Song Chon PARK, Sang Ho SEO, Toshiro DOI, Michio UNEDA, Syuhei KUROKAWA, Osamu OHNISHI, and Tsutomu YAMAZAKI, Optical Performance of a Laser Point Spurxe Strongly Emitted by an Aspheric Expander, Proc. of the 8th China-Japan International Conference on Ultra-Precision Machining, 70-73, pp.70-73, 2011.11.
159. Tsutomu YAMAZAKI, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Kiyoshi SESHIMO, and Hideo AIDA, Development of Novel Groove Pattern for CMP Pad, Proc. of the 8th China-Japan International Conference on Ultra-Precision Machining, 50-53, pp.50-53, 2011.11.
160. Masahiko MURATA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Takanori IWAHASHI, Kunihito MIYAKE, Keiji MIYACHI, and Yoshinori KOBAYASHI, Study on Formation of Films by a Spray Deposition Method for the Organic Thin Film Solar Cells, Proc. of the 6th International Conference on Leading Edge Manufacturing in 21st Century 2011,, 1-4, CD-ROM, pp.1-4, 2011.11.
161. Mitsuaki MURATA, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, and Toshiro DOI, In-process Tool Flank Wear Detection in Intermittent Cutting Process by Face Milling, Proc. of the 6th International Conference on Leading Edge Manufacturing in 21st Century 2011,, 1-6, CD-ROM, pp.1-6, 2011.11.
162. Takanori IWAHASHI, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Koichi SATO, Yoshinori KOBAYASHI, and Masahiko MURATA, Precision Deposition of Organic EL Films under the Atmosphere Pressure by Combined Processing of Spray and Nanoimprinting, Proc. of International Conference on Planarization/CMP Technology 2011, 511-514, pp.511-514, 2011.11.
163. Yu MORIWAKI, Tsutomu YAMAZAKI, Toshiro K. DOI, Syuhei KUROKAWA, Osamu OHNISHI, and Michio UNEDA, Development of Novel Pad Groove Design to Achieve High Efficiency CMP --- Friction Characteristic for Glass Polishing ---, Proc. of International Conference on Planarization/CMP Technology 2011, 494-497, pp.494-497, 2011.11.
164. Tsutomu YAMAZAKI, Toshiro K. DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Yoji UMEZAKI, Kiyoshi SESHIMO, and Hideo AIDA, Development of Novel Pad Groove Design to Achieve High Efficiency CMP --- Designing of Novel Groove Patterns Based on Image Analysis of Slurry Flow Behavior ---, Proc. of International Conference on Planarization/CMP Technology 2011, 490-493, pp.490-493, 2011.11.
165. Hiroshi IKEDA, Yoichi AKAGAMI, Michio UNEDA, Osamu OHNISHI, Syuhei KUROKAWA, and Toshiro DOI, The High-Efficiency Polishing Technology for Glass Substraight Using Electrical Controlled Slurry Polishing, Proc. of International Conference on Planarization/CMP Technology 2011, 428-431, pp.428-431, 2011.11.
166. Shinji KOGA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, Yoji MATSUKAWA, Keiji MATSUHIRO, and Tsutomu YAMAZAKI, Removal Mechanism of Oxide Single Crystal in Chemical Mechanical Polishing, Proc. of International Conference on Planarization/CMP Technology 2011, 395-398, pp.395-398, 2011.11.
167. Akira ISOBE, Shinichi HABA, Hideaki NISHIZAWA, and Syuhei KUROKAWA, Numerical Discussion of Polishing Mechanism Considering Contact Area of Polishing Pad and that of Polishing Abrasives, Proc. of International Conference on Planarization/CMP Technology 2011, 252-257, pp.252-257, 2011.11.
168. Tao YIN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Michio UNEDA, Zhida WANG, Zhe TAN, and Takateru EGASHIRA, Processing Characteristics of SiC Wafer by Atmosphere-Controlled CMP Machine, Proc. of International Conference on Planarization/CMP Technology 2011, 165-168, pp.165-168, 2011.11.
169. Atsushi OHTAKE, Akihiro SANO, Kinya KOBAYASHI, Osamu OHNISHI, Syuhei KUROKAWA, and Toshiro DOI, Investigation into Mechanism of Pre-CMP Electroplated Copper Overgrowth and Various Defects of Cu on Trench and Via Holes, Proc. of International Conference on Planarization/CMP Technology 2011, 96-100, pp.96-100, 2011.11.
170. Satoshi YAMAGUCHI, Toshiro DOI, Hiroyuki KOHNO, Syuhei KUROKAWA, Osamu OHNISHI, Michio UNEDA, and Yoji MATSUKAWA, Simplified Method of Evaluation Scratches on the Wafer Polished by Fumed Silica Slurry, Proc. of International Conference on Planarization/CMP Technology 2011, 62-65, pp.62-65, 2011.11.
171. Syuhei KUROKAWA, Hiromitsu KIDO, Tetsuya TAGUCHI, Tatsuki OKADA, Osamu OHNISHI, and Toshiro DOI, Scanning Measurement and Evaluation of Gear Tooth Root and Bottom Profiles, Proc. of Advances in Power Transmission Science and Technology, 838-841, pp.838-841, 2011.10.
172. 畝田道雄,村田慎太郎,成瀬尚,山崎努,大西修,黒河周平,石川憲一,土肥俊郎, 画像処理によるスラリーフローの定量評価研究, 日本機械学会論文集(C編), 77, 782, 3891-3903, 第77巻第782号, pp.3891-3903, 2011.10.
173. 山崎努,土肥俊郎,黒河周平,大西修,畝田道雄,梅崎洋二,山口靖英,岸井貞浩, 酸化セリウムとその代替を目指す酸化マンガン系スラリーによるガラス基板の研磨特性とその加工メカニズム, 精密工学会誌, 77, 10, 960-965, 第77巻第10号, pp.960-965, 2011.10.
174. Sadahiro KISHII, Ko NAKAMURA, Kenzo HANAWA, Satoru WATANABE, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro DOI, Mn2O3 Slurry Reuse for SiO2 Film CMP, Proc. of the 2011 International Conference on Solid State Devices and Materials, 52-53, pp.52-53, 2011.09.
175. Syuhei KUROKAWA, Morihisa HOGA, Yoji MATSUKAWA, Osamu OHNISHI, and Toshiro DOI, Micro Radial Grating Disk Manufactured by Nanoimprinting Technique for Transmission Error Measurement of Micro Gears, Proc. of the 56th International Scientific Colloquium, 1-7, USB-Storage, pp.1-7, 2011.09.
176. Michio UNEDA, Tatsunori OMOTE, Ken-ichi ISHIKAWA, Toshiro DOI, Syuhei KUROKAWA, and Osamu OHNISHI, Performance Evaluation Method of CMP Pad Conditioner Using Digital Image Correlation (DIC) Processing, Proc. of Advanced Metallization Conference 2011, 114-115, pp.114-115, 2011.09.
177. Tsutomu YAMAZAKI, Toshiro K. DOI, Syuhei KUROKAWA, Michio UNEDA, Osamu OHNISHI, Kiyoshi SESHIMO, and Yasunori ASO, Development of New Groove Patterns on CMP Pad --- Slurry Flow Analysis using Digital Image Processing ---, Proc. of Advanced Metallization Conference 2011, 112-113, pp.112-113, 2011.09.
178. Osamu OHNISHI, Toshiro DOI, Syuhei KUROKAWA, Tsutomu YAMAZAKI, Michio UNEDA, Kei KITAMURA, Tao YIN, Isamu KOSHIYAMA, and Koichiro ICHIKAWA, CMP Characteristics of SiC Wafers Using a Simultaneous Double-side CMP Machine ---Effects of Atmosphere and Ultraviolet Light Irradiation ---, Proc. of Advanced Metallization Conference 2011, 110-111, pp.110-111, 2011.09.
179. Syuhei KUROKAWA, Hiromitsu KIDO, Tetsuya TAGUCHI, Tatsuki OKADA, Osamu OHNISHI, and Toshiro DOI, Scanning Measurement and Evaluation of Gear Tooth Root and Bottom Profiles, Applied Mechanics and Materials, 86, 838-841, Vol.86, pp.838-841, 2011.09.
180. Mitsuaki MURATA, Syuhei KUROKAWA, Osamu OHNISHI, Toshiro DOI, and Michio UNEDA, Characteristics of Thermo-Electromotive Force, Electric Current and Electric Resistance in Intermittent Cutting Process by Face Milling, Advanced Materials Research, 314-316, 1075-1078, Vols.314-316, pp.1075-1078, 2011.09.
181. 三浦崇寛,田淵大介,佐島隆生,大西修,鬼鞍宏猷,土肥俊郎,黒河周平, 同時加熱成形法を用いたCFRPパイプ破裂強度改善に関する研究, 精密工学会誌, 77, 9, 856-860, 第77巻第9号, pp.856-860, 2011.09.
182. Morihisa HOGA, Kimio ITOH, Mikio ISHIKAWA, Naoko KUWAHARA, Masaharu FUKUDA, Nobuhito TOYAMA, Syuhei KUROKAWA, and Toshiro DOI, Comparison of Quartz and Silicon as a Master Mold Substrate for Patterned Media UV-NIL Replica Process, Microelectronic Engineering, 88, 8, 1975-1977, Vol.88, Issue 8, pp.1975-1977, 2011.08.
183. 梅崎洋二,舟木義行,黒河周平,大西 修,土肥俊郎, ホブコーティング膜の耐摩耗性に関する基礎研究(一本刃舞いツールによる断続切削試験), 日本機械学会論文集(C編), 77, 779, 2863-2874, 第77巻第779号, pp.2863-2874, 2011.07.
184. Sadahiro KISHII, Akiyoshi HATADA, Yoshihiro ARIMOTO, Syuhei KUROKAWA, and Toshiro DOI, Tungsten Film Chemical Mechanical Polishing using MnO2 Slurry, Japanese Journal of Applied Physics, 50, 7, 076502-1-076701-4, Vol.50, No.7, pp.076502-1-076701-4, 2011.07.
185. Daisuke TABUCHI, Takao SAJIMA, Toshiro DOI, Hiromichi ONIKURA, Osamu OHNISHI, Syuhei KUROKAWA, and Takahiro MIURA, Development of a Filament-Winding Machine Based on Internal Heating by a High-Temperature Fluid for Composite Vessels, Sensors and Materials, 23, 6, 347-358, Vol.23, No.6, pp.347-358, 2011.06.
186. Morihisa HOGA, Kimio ITOH, Mikio ISHIKAWA, Nobuhiro TOYAMA, Hiroaki KITAHARA, Tadashi FUJINAWA, Tetsuya IIDA, Syuhei KUROKAWA, and Toshiro DOI, Negative-tone E-beam Resist Patterning for more than 1 Tbit/in.2 Bit-patterned Media NIL Mold, Proc. of the 55th International Conference of Electron, Ion, and Photon Beam Technology and Nanofabrication, 25.1-25.2, pp.25.1-25.2, 2011.06.
187. Hironori NISHI, Osamu OHNISHI, Hiromichi ONIKURA, Toshiro DOI, Syuhei KUROKAWA, Michio UNEDA, Weichen KUO, and Toshihiko EGUCHI, Processing Characteristics to Grooving of Brittle Materials with Micro Ni-W Electroplated Diamond Tools ---Influence of Coolant and Tool Runout on Tool Life ---, Proc. of the 1st International Conference on Manufacturing Process Technology, 25-27, pp.25-27, 2011.05.
188. Tao YIN, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Michio UNEDA, Zhida WANG, and Takateru EGASHIRA, High Efficient Processing of Si and SiC Wafer by Atmosphere-Controlled CMP Machine, Proc. of the 1st International Conference on Manufacturing Process Technology, 18-20, pp.18-20, 2011.05.
189. Syuhei KUROKAWA, Yoji UMEZAKI, Morihisa HOGA, Toshiro DOI, Osamu OHNISHI, Michio UNEDA, and Yoji MATSUKAWA, Gear Metrology and Nanomanufacturing Application for Micro Gear Measurement, Proc. of the 1st International Conference on Manufacturing Process Technology, 1-6, pp.1-6, 2011.05.
190. 玉井一誠,安井晃仁, 芹川雅之, 森永 均, 土肥俊郎, 黒河周平, 大西 修, 畝田道雄, CMPにおける材料除去能率向上に向けた研磨抵抗の要因解析, 先端加工学会誌, 29, 1, 53-58, Vol.29, No.1, pp.53-58, 2011.04.
191. Tetsuo INOUE and Syuhei KUROKAWA, Derivation of Path of Contact and Tooth Flank Modification by Minimizing Transmission Error on Face Gear, Proc. of the 4th International Conference on Manufacturing, Machine Design and Tribology, 77-78, pp.77-78, 2011.04.
192. 船越考雄,小島泉里,石井慶一郎,土肥俊郎,黒河周平,大西 修, タングステンCMPスラリーのリサイクルに関する基礎的研究, 精密工学会誌, 77, 4, 388-393, Vol.77, No.4, pp.388-393, 2011.04.
193. Syuhei KUROKAWA, Yasutsune ARIURA, and Toshiro DOI, Evaluation of Pitch Deviations with Comprehensive Representation Suitable for Engagement Evaluation in Different Types of Gears, International Journal of Automation Technology, 5, 2, 132-137, Vol.5, No.2, pp.132-137, 2011.03.
194. Atsushi OHTAKE, Toshiyuki ARAI, Syuhei KUROKAWA, and Toshiro DOI, Development of a Nonperiodic Boundary Practical Simulator for Oxide and Shallow Trench Isolation Chemical Mechanical Polishing Processes, Journal of the Electrochemical Society, 158, 2, H142-H145, Vol.158, No.2, pp.H142-H145, 2011.02.
195. Kazusei TAMAI, Hitoshi MORINAGA, Toshiro DOI, Syuhei KUROKAWA, and Osamu OHNISHI, Analysis of Chemical and Mechanical Factors in CMP Processes for Improving Material Removal Rate, Journal of the Electrochemical Society, 158, 3, H333-H337, Vol.158, No.3, pp.H333-H337, 2011.01.
196. Daisuke TABUCHI, Takao SAJIMA, Hiromichi ONIKURA, Osamu OHNISHI, Syuhei KUROKAWA, Toshiro DOI, and Toshiaki OHTA, Development of U-anchor CFRP Rod Manufacturing Machine, Advanced Materials Research, 168-170, 2125-2128, Vols.168-170, pp.2125-2128, 2010.12.
197. Yuki KUGIMOTO, Atsumi WAKABAYASHI, Toshiaki DOBASHI, Syuhei KUROKAWA, Osamu OHNISHI, Toshiro DOI, Preparation of Optically Transparent Anti-static Films, Proc. of 2nd International Conference on Advanced Micro-Device Engineering, 2010.12.
198. Takao FUNAKOSHI, Senri OJIMA, Yohei YAMADA, Syuhei KUROKAWA, Toshiro DOI, Osamu OHNISHI, Yoji UMEZAKI, and Yoji MATSUKAWA, Detection of Large-Sized Foreign Particles in CMP Slurry and Reduction of Micro-Scratches (II), Proc. of International Conference on Planarization/CMP Technology 2010, 356-359, pp.356-359, 2010.11.
199. Tadashi HASEGAWA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Tsutomu YAMAZAKI, Yasuhiro KAWASE, Yasuhide YAMAGUCHI, and Sadahiro KISHII, Chemical Mechanical Polishing (CMP) of Silicon Carbide (SiC) with Manganese Oxide Slurry ---Polishing Characteristics under High Pressure Gas Atmosphere Inside the Bell-Jar (Chamber) Shaped CMP Machine---, Proc. of International Conference on Planarization/CMP Technology 2010, 328-331, pp.328-331, 2010.11.
200. Kazusei TAMAI, Akihito YASUI, Masayuki SERIKAWA, Hitoshi MORINAGA, Toshiro DOI, and Syuhei KUROKAWA, Factorial Analysis of Friction Energy for Material Removal Rate Improvement in CMP Processing, Proc. of International Conference on Planarization/CMP Technology 2010, 257-260, pp.257-260, 2010.11.
201. Syuhei KUROKAWA, Toshiro DOI, Tsutomu YAMAZAKI, Yoji UMEZAKI, Osamu OHNISHI, Yoji MATSUKAWA, Kiyoshi SESHIMO, Yasuhide YAMAGUCHI, and Yasunori KAWASE, Impact of Reduction in CeO2 Slurry Consumption for Oxide CMP ---Approach from Alternative Slurries and Pad Groove Patterns---, Proc. of International Conference on Planarization/CMP Technology 2010, 244-247, pp.244-247, 2010.11.
202. Kazunori KADOMURA, Syuhei KUROKAWA, Toshiro DOI, Taro AKAMA, Yohei YAMADA, Yoji MATSUKAWA, Yoji UMEZAKI, and Osamu OHNISHI, Quantification of Asperity’s Conditions on Pad Surface with Diamond Conditioner, Proc. of Advanced Metallization Conference 2010, 168-169, pp.168-169, 2010.10.
203. Yoshiyuki SEIKE, Keiji MIYACHI, Syuhei KUROKAWA, Osamu OHNISHI, and Toshiro DOI, Semiconductor Device Cleaning with Liquid Aerosol Nozzle using Rotary Atomizer Method, Proc. of Advanced Metallization Conference 2010, 156-157, pp.156-157, 2010.10.
204. Shinichi YOSHIURA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, and Naofumi SHINYA, CMP Characteristic on Crystal Orientations of Single-Crystal Si and High-Precision Planarization CMP of Poly-Si, Proc. of Advanced Metallization Conference 2010, 144-145, pp.144-145, 2010.10.
205. Kei KITAMURA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Yoji UMEZAKI, Tsutomu YAMAZAKI, Yoji MATSUKAWA, Tadashi HASEGAWA, Isamu KOSHIYAMA, and Koichi ICHIKAWA, Characteristics of Silicon CMP Performed in Various High Pressure Atmospheres ---Development of a New Double-side Simultaneous CMP Machine Housed in a High Pressure Chamber---, Proc. of Advanced Metallization Conference 2010, 138-139, pp.138-139, 2010.10.
206. Tadashi HASEGAWA, Toshiro DOI, Syuhei KUROKAWA, Osamu OHNISHI, Yasuhiro KAWASE, Yasuhide YAMAGUCHI, and Sadahiro KISHII, SiC-CMP Characteristics under High Pressure Gas Atmospheres using Manganese Slurry, Proc. of Advanced Metallization Conference 2010, 22-23, pp.22-23, 2010.10.
207. Toshiro K. DOI, Tsutomu YAMAZAKI, Syuhei KUROKAWA, Yoji UMEZAKI, Osamu OHNISHI, Yoichi AKAGAMI, Yasuhide YAMAGUCHI, and Sadahiro KISHII, Study on the Development of Resource-Saving High Performance Slurry ---Polishing/CMP for Glass Substrates in a Radical Polishing Environment, Using Manganese Oxide Slurry as an Alternative for Ceria Slurry---, Advances in Science and Technology, 64, 65-70, Vol.64, pp.65-70, 2010.10.
208. Syuhei KUROKAWA, Atsushi BEKKI, Yoji MATSUKAWA, and Toshiro DOI, Characteristics of Sidebands of Mesh Frequency Caused by Gear Eccentricity ---Identification of Indices of Amplitude Modulation under Load by Transmission Error Measurement---, Proc. of the International Conference on Gears, VDI-Berichte 2108.1, 293-304, VDI-Berichte 2108.1, pp.293-304, 2010.10.
209. Syuhei KUROKAWA, Yasutsune ARIURA, and Toshiro DOI, Comprehensive Representation of Pitch Deviations Suitable for Engagement Evaluation in Different Types of Gears, Proc. of the 10th International Symposium on Measurement and Quality Control, B2-051-1-B2-051-4, pp.B2-051-1-B2-051-4, 2010.09.
210. 宮地計二,黒河周平,土肥俊郎,清家善之,泉川晋一,赤間太郎,大西 修, CMPにおける高圧マイクロジェットによる不織布系パッドの非破壊コンディショニング, 精密工学会誌, 76, 9, 1076-1081, 第76巻第9号, pp.1076-1081, 2010.09.
211. 宮地計二,黒河周平,川島早由里,明永裕樹,清家善之,小林義典,大西 修,土肥俊郎, 高圧マイクロジェットの洗浄力に関する研究(ノズル形状の違いが洗浄力に与える影響), 精密工学会誌, 76, 8, 907-911, 第76巻第8号, pp.907-911, 2010.08.
212. Tsutomu YAMAZAKI, Toshiro DOI, Syuhei KUROKAWA, Sho ISAYAMA, Yoji UMEZAKI, Yoji MATSUKAWA, Hiroyuki KONO, Youichi AKAGAMI, Yasuhide YAMAGUCHI, and Yasuhiro KAWASE, Polishing Mechanism of Glass Substrates with Its Processing Characteristics by Cerium Oxide and Manganese Oxide Slurries, Key Engineering Materials, 447-448, 141-145, Vol.447-448, pp.141-145, 2010.07.
213. Osamu OHNISHI, Hiromichi ONIKURA, Toshihiko EGUCHI, Muhammad AZIZ, Toshiro DOI, and Syuhei KUROKAWA, Improvement in Drilling Performance of Micro Compound Tool, Key Engineering Materials, 447-448, 96-100, Vol.447-448, pp.96-100, 2010.07.
214. Kei KITAMURA, Toshiro DOI, Syuhei KUROKAWA, Yoji UMEZAKI, Yoji MATSUKAWA, Yota OOKI, Tadashi HASEGAWA, Isamu KOSHIYAMA, Koichiro ICHIKAWA, and Yoshio NAKAMURA, Basic Characteristics of a Simultaneous Double-side CMP Machine, Housed in a Sealed, Pressure-Resistance Container, Key Engineering Materials, 447-448, 61-65, Vol.447-448, pp.61-65, 2010.07.
215. Akira FUKUDA, Akira KODERA, Yasushi TOMA, Tsukuru SUZUKI, Hirokuni HIAMA, Toshiro DOI, Syuhei KUROKAWA, and Osamu OHNISHI, Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing, Japanese Journal of Applied Physics, 49, 7, Vol.49,No.7, pp.076701-1-076701-8, 2010.07.
216. 福田 明,福田哲生,檜山浩國,辻村 学,土肥俊郎,黒河周平,大西 修, STI-CMP性能に及ぼすウェーハエッジ形状の影響(FEM解析を用いたウェーハ面圧分布計算による考察), 日本機械学会論文集 C編, 76, 766, 1610-1616, 第76巻第766号, pp.1610-1616, 2010.06.
217. Yoshiyuki SEIKE, Keiji MIYACHI, Tatsuo SHIBATA, Yoshinori KOBAYASHI, Syuhei KUROKAWA, and Toshiro DOI, Silicon Wafer Cleaning Using New Liquid Aerosol with Controlled Droplet Velocity and Size by Rotary Atomizer Method, Japanese Journal of Applied Physics, 49, 6, Vol.49, No.6, pp.-, 2010.06.
218. Yoji Umezaki, Syuhei KUROKAWA, and Yasutsune ARIURA, Impact of High-Speed Image Recognition of Transition Phenomenon of Chip Formation and Chip Flow in Gear Hobbing Process, Key Engineering Materials, 437, 189-193, Vol.437, pp.189-193, 2010.03.
219. Tadashi HASEGAWA, Yoji UMEZAKI, Syuhei KUROKAWA, Ryohei ISHIMARU, Yoji MATSUKAWA, and Toshiro DOI, Characteristics of Micro Fiber Pads in Electro-Chemical Mechanical Polishing (E-CMP) of Copper Substrates, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 74-76, pp.74-76, 2010.03.
220. Kei KITAMURA, Yoji UMEZAKI, Syuhei KUROKAWA, Toshiro DOI, Yoji MATSUKAWA, and Yoshiyuki FUNAKI, Influence of Oxidization Resistance of TiAlN Coating Film on the Wear Resistance of High-Speed Steel Hobs, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 65-67, pp.65-67, 2010.03.
221. Syuhei KUROKAWA, Shinya IMAMURA and Yasutsune ARIURA, Nano Manufacturing of a Micro Rotary Grating Disk for Measurement of Rotational Accuracy of Micro-Machine Elements, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 56-64, pp.56-64, 2010.03.
222. Ryohei ISHIMARU, Yasutsune ARIURA, Syuhei KUROKAWA, and Yoji MATSUKAWA, Surface Durability of Austempered Ductile Iron (ADI) Rollers under Minimal Quantity Lubrication (MQL) Conditions, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, 43-48, pp.43-48, 2010.03.
223. Hiromitsu KIDO, Syuhei KUROKAWA, Tetsuya TAGUCHI, Nagisa KOYAMA, and Toshiro DOI, Systematic Error by Temperature Transition of Gear Measuring Machine and Measurement of Tooth Root and Bottom Profiles of Cylindrical Gears, Proc. of International Symposium on Technology of Mechanical Design and Production 2010, pp.1-4, 2010.03.
224. Hiromitsu KIDO, Syuhei KUROKAWA, Tetsuya TAGUCHI, Nagisa KOYAMA, and Toshiro DOI, Development of Gear Measuring Machine and Measurement of Tooth Root and Bottom Profiles of Cylindrical Gears, Proc. of the 3rd International Conference on Advanced Manufacture, 533-537, pp.533-537, 2010.02.
225. Kei KITAMURA, Yoji UMEZAKI, Syuhei KUROKAWA, Toshiro DOI, Yoji Matsukawa, and Yoshiyuki FUNAKI, Influence of Oxidization Resistance and Aluminum Concentrations of TiAlN Coating Film on the Wear Resistance of High-Speed Steel Hobs, Proc. of the 3rd International Conference on Advanced Manufacture, 13-16, pp.13-16, 2010.02.
226. Syuhei KUROKAWA and Yasutsune ARIURA, Development of a grating disk of a microrotary encoder for measurement of meshing accuracy of microgears, The International Journal of Advanced Manufacturing Technology, 46, 9, 931-944, Vol.46, Issue 9, pp.931-944, 2010.01.
227. Akira FUKUDA, Akira KODERA, Yasushi TOMA, Tsukuru SUZUKI, Hirokuni HIYAMA, Toshiro K. DOI, and Syuhei KUROKAWA, Simulation of Electrochemical Mechanical Polishing, Proc. of International Conference on Planarization/CMP Technology 2009, 473-478, pp.473-478, 2009.11.
228. Yota OKI, Toshiro K. DOI, Syuhei KUROKAWA, Yoji UMEZAKI, Yoji MATSUKAWA, Kei KITAMURA, and Isamu KOSHIYAMA, Cu-CMP Characteristics by Controlled Atmosphere Polishing Machine and Effect of High Pressure CO2 Gas, Proc. of International Conference on Planarization/CMP Technology 2009, 416-421, pp.416-421, 2009.11.
229. Tadashi HASEGAWA, Yoji UMEZAKI, Syuhei KUROKAWA, Ryohei ISHIMARU, Yoji MATSUKAWA, and Toshiro K. DOI, Electro-Chemical Mechanical Polishing (E-CMP) of Copper Substrates with Micro Fiber Pad, Proc. of International Conference on Planarization/CMP Technology 2009, 411-415, pp.411-415, 2009.11.
230. Kazunori KADOMURA, Syuhei KUROKAWA, Toshiro K. DOI, Taro AKAMA, Yohei YAMADA, Yukio OKANISHI, Yoji MATSUKAWA, Yoji UMEZAKI, and Osamu OHNISHI, Quantification of Pad Surface Conditions with Diamond Conditioners and Polishing Characteristics in CMP Process, Proc. of International Conference on Planarization/CMP Technology 2009, 319-324, pp.319-324, 2009.11.
231. Kazusei TAMAI, Tomohiko AKATSUKA, Hitoshi MORINAGA, Toshiro K. DOI, and Syuhei KUROKAWA, Impact of SiO2 Agglomeration on surface Defectivity during CMP Process, Proc. of International Conference on Planarization/CMP Technology 2009, 296-300, pp.296-300, 2009.11.
232. Takao FUNAKOSHI, Senri OJIMA, Yohei YAMADA, Syuhei KUROKAWA, Toshiro K. DOI, Osamu OHNISHI, Yoji UMEZAKI, and Yoji MATSUKAWA, Detection of Large-Sized Foreign Particles in CMP Slurry and Reduction of Micro-scratches, Proc. of International Conference on Planarization/CMP Technology 2009, 290-295, pp.290-295, 2009.11.
233. Yoshihiko ITO, Toshiro K. DOI, Hroyuki KOHNO, Syuhei KUROKAWA, and Yoji UMEZAKI, Study on Micro-Scratches Generated in Oxide Film CMP with Fumed Silica Slurry (Effect of Slurry Dispersion Condition on Micro-Scratch Defect Generation), Proc. of International Conference on Planarization/CMP Technology 2009, 285-289, pp.285-289, 2009.11.
234. Yoshiyuki SEIKE, Tatsuo SHIBATA, Yoshinori KOBAYASHI, Keiji MIYACHI, Syuhei KUROKAWA, and Toshiro K. DOI, Development of a Revolution Atomizing Two Fluid Cleaning Nozzle (RAC nozzle) for Post-CMP Cleaning, Proc. of International Conference on Planarization/CMP Technology 2009, 273-278, pp.273-278, 2009.11.
235. Kazuasa KURIZUKA, Toshiro K. DOI, Syuhei KUROKAWA, Koichi SATO, Yoshinori KOBAYASHI, Yoshihiko TSUCHIDA, and Keiji MIYACHI, Precision Deposition of Organic EL films applying a CMP Technology Combined with Spraying under the Atmosphere Pressure, Proc. of International Conference on Planarization/CMP Technology 2009, 208-212, pp.208-212, 2009.11.
236. Takashi HYAKUSHIMA, Toshiro K. DOI, Motonobu SATO, Syuhei KUROKAWA, Mizuhisa NIHEI, and Yuji AWANO, CMP Technique for CNT/SOD Composite Using Ceria Slurry, Proc. of International Conference on Planarization/CMP Technology 2009, 197-201, pp.197-201, 2009.11.
237. Kazusei TAMAI, Akihito YASUI, Hitoshi MORINAGA, Toshiro K. DOI, and Syuhei KUROKAWA, Effect of Particle-Substrate Interaction on the Polishing Rate, Proc. of International Conference on Planarization/CMP Technology 2009, 55-59, pp.55-59, 2009.11.
238. Taro AKAMA, Keiji MIYACHI, Syuhei KUROKAWA, Toshiro DOI, Yoji UMEZAKI, Yoji MATSUKAWA, Sho ITONAGA, Yoshiyuki SEIKE, and Osamu OHNISHI, Silicon CMP Characteristics and Pad Conditioning Using a High Pressure Micro Jet (HPMJ), Proc. of the 3rd International Conference of Asian Society for Precision Engineering and Nanotechnology, USB pp.1-4, 2009.11.
239. 山田洋平,小西信博,大嶽 敦,黒河周平,土肥俊郎, Cu/Low-k配線対応CMPプロセスの開発(低選択バリアメタル研磨による表面段差是正の検討), 精密工学会誌, 75, 9, 1073-1077, 第75巻第9号 1073〜1077頁, 2009.09.
240. Akira FUKUDA, Yoshihiro MOCHIZUKI, Hirokuni HIYAMA, Manabu TSUJIMURA, Toshiro DOI, and Syuhei KUROKAWA, Stress Analysis of Dielectrics Using FEM for Analyzing the Cause of Cracking Observed After W-CMP, Journal of the Electrochemical Society, 156, 9, H694-H698, Vol.156, No.9, pp.H694-H698, 2009.07.
241. Toshiro DOI and Syuhei KUROKAWA, CMP of SiC Wafers as a Post-Si Power-Device (Bell-Jar shaped CMP machine assisted by photocatalitic reactions under high pressure oxygen gas and CMP characteristics of functional materials), Proc. of the 1st International Conference on Surface and Interface Fabrication Techonologies (ICSIF), 168-174, pp.168-174, 2009.07.
242. Yoji Umezaki, Syuhei KUROKAWA, Yasutsune ARIURA, Impact of high-speed image recognition of transition phenomenon of chip formation and chip flow in gear hobbing process, Proceedings of the 9th International Symposium on Measurement Technology and Intelligent Instruments ISMTII2009, Vol.2, pp.63-67, 2009.06.
243. 山田洋平,小西信博,黒河周平,土肥俊郎, CuCMPプロセスに起因した銅残渣発生の研究(配線間の銅残渣の低減), 精密工学会誌, 75, 5, 617-621, 第75巻第5号 617〜621頁, 2009.05.
244. Syuhei KUROKAWA, Yasutsune ARIURA, Yoji MATSUKAWA, and Toshiro DOI, Evaluation of gear engagement accuracy by Transmission Error with sub-microradian resolution, International Journal of Surface Science and Engineering, Vol.3, No.3, pp.160-177, 2009.05.
245. Ryohei ISHIMARU, Yasutsune ARIURA, Syuhei KUROKAWA, Yoji MATSUKAWA, and Masahito GOKA, A Fundamental Study on the Surface Durability of Austempered Ductile Iron (ADI) Gears in Long Life Region, Proc. of the JSME International Conference on Motion and Power Transmissions, pp.418-421, 2009.05.
246. Syuhei KUROKAWA, Atsushi BEKKI, Yoji MATSUKAWA, Yoji UMEZAKI, and Toshiro DOI, Influence of Gear Eccentricity on Sidebands of Mesh Frequency ---Derivation and Detection of Amplitude Modulation by Transmission Error Measurement---, Proc. of the JSME International Conference on Motion and Power Transmissions, pp.221-226, 2009.05.
247. Yoji UMEZAKI, Yasutsune ARIURA, Syuhei KUROKAWA, and Yuho IJIMA, Transient Phenomenon of Chip Generation and Its Movement in Hobbing ---Jamming of Chip Formed in Generating of Finished Surface in Flytool Simulation Tests---, Proc. of the JSME International Conference on Motion and Power Transmissions, pp.128-133, 2009.05.
248. 宮地計二,黒河周平,清家善之,小林義典,山本浩之,土肥俊郎, スプレー式洗浄の粒子解析と洗浄力に関する考察(二流体スプレーと高圧マイクロジェットの洗浄力比較), 精密工学会誌, 第75巻第4号 536~541頁, 2009.04.
249. 山田洋平,小西信博,黒河周平,土肥俊郎, 研磨砥粒を含まないスラリを用いたCuCMP技術の開発(不均一発砲ポリウレタンパッドを用いたCu残渣の低減), 精密工学会誌, 第75巻第4号 496~500頁, 2009.04.
250. 福田 明,福田哲生,檜山浩國,辻村 学,土肥俊郎,黒河周平, シリコンウェーハ製造研磨におけるウェーハエッジ形状の影響評価, 砥粒加工学会誌, 第53巻第2号 105~110頁, 2009.02.
251. 山田洋平,菅谷貴浩,小西信博,黒河周平,土肥俊郎, 酸化膜CMPにおけるマイクロスクラッチ低減の検討(CMPプロセスにおけるスクラッチの発生要因調査), 精密工学会誌, 第74巻第12号 1303~1307頁, 2008.12.
252. Keiji Miyachi, Taro Akama, Syuhei Kurokawa, Toshiro Doi, Kimio Nakayama, Yoshiyuki Seike, Yoji Matsukawa, Yoji Umezaki, CMP characteristics of silicon wafer with a micro-fiber pad, and pad conditioning with high pressure micro jet (HPMJ), Proc. of the 5th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium), pp.93-97, 2008.11.
253. Takeharu Kihara, Toshiro Doi, Syuhei KUROKAWA, Yota Oki, Yoji Umezaki, Yoji Matsukawa, Koichiro Ichikawa, Isamu Koshiyama, and Hiroyuki Kono, Si CMP with a sealed 'Bell-Jar' type CMP machine -Processing characteristics of Si-CMP, influenced by the processing atmosphere and additives dispersed in the slurry -, Proc. of the 5th International Symposium on Advanced Science and Technology of Silicon Materials (JSPS Si Symposium), pp.98-102, 2008.11.
254. 山田洋平,菅谷貴浩,小西信博,黒河周平,土肥俊郎, 硬質パッドを用いた高平坦化CMP技術の開発(CMPプロセスにおけるウエーハ面内研磨均一性の改善), 精密工学会誌, 第74巻第11号 1199~1203頁, 2008.11.
255. Toshiro K. DOI, and Syuhei KUROKAWA, CMP of SiC Wafers as a Post-Si Power-Device -Photocatalitic reaction assisted Bell-Jar shaped CMP Machine under high pressure oxygen gas-, Proc. of International Conference on Planarization/CMP Technology 2008, pp.2-7, 2008.11.
256. Kazumasa Kurizuka, Kazunori Kazomura, Toshio Fukunishi, Yoji Umezaki, Yoji Matsukawa, Syuhei KUROKAWA, Yuhei Nishimori, and Toshiro DOI, Pad Conditioning with Electrodeposited Diamond Conditioners and Polishing Characteristics in Cu-CMP, Proc. of International Conference on Planarization/CMP Technology 2008, pp.392-397, 2008.11.
257. Yusuke Shimoda, Yoji Umezaki, Syuhei KUROKAWA, Ryohei Ishimaru, Yoji Matsukawa, Tadashi Hasegawa, and Toshiro DOI, E-CMP of Cu Substrates with Unwoven Fabric Pads, Proc. of International Conference on Planarization/CMP Technology 2008, pp.477-481, 2008.11.
258. Syuhei Kurokawa, Keiji Miyachi, Yoshiyuki Seike, Shinichi Izumikawa, Shinichi Haba, and Toshiro Doi, Pad Conditioning Using a High Pressure Micro Jet (HPMJ) to Improve Life Span of Unwoven Fabric Pads in CMP for Silicon Wafers, Proc. of International Conference on Planarization/CMP Technology 2008, pp.243-249, 2008.11.
259. Syuhei KUROKAWA, and Yasutsune ARIURA, Development of a Grating Disk of a Micro Rotary Encoder for Measurement of Meshing Accuracy of Micro Gears, Proc. of the 8th International Symposium on Measurement Technology and Intelligent Instruments (ISMTII 2007), pp.265-268, 2007.09.
260. Keiji MIYACHI, Yoshiyuki SEIKE, Shinichi HABA, Syuhei KUROKAWA, and Toshiro K. DOI, Impact of a High Pressure Micro Jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing, Proc. of the International Conference on Planarization/CMP Technology, pp.1-6, 2007.10.
261. Kazunori KADOMURA, Toshio FUKUNISHI, Yoji UMEZAKI, Yoji MATSUKAWA, Syuhei KUROKAWA, and Toshiro K. DOI, Conditioning of CMP Pad to Reinstate Pad Surface Functions, Proc. of the International Conference on Planarization/CMP Technology, pp.1-5, 2007.10.
262. 土肥俊郎,黒河周平, 加工環境を制御するベルジャー型密閉研磨装置による高能率CMP技術, 砥粒加工学会誌, Vol.52, No.3, pp.130-133, 2008.03.
263. Yohei YAMADA, Nobuhiro KONISHI, Junji NOGUCHI, Tomoko JIMBO, Syuhei KUROKAWA, and Toshiro DOI, Study on Factors in Time-Dependent Dielectric Breakdown Degradation of Cu/Low-k Integration Related to Cu Chemical-Mechanical Polishing, Japanese Journal of Applied Physics, Vol.47, No.6, pp.4469-4474, 2008.06.
264. Yohei YAMADA, Masanori Kawakubo, Osamu Hirai, Nobuhiro KONISHI, Syuhei KUROKAWA, and Toshiro DOI, Tribological Behavior of Metal CMP and Detection of Process Abnormality, Journal of The Electrochemical Society, Vol.155, No.8, pp.H569-H574, 2008.06.
265. Yohei YAMADA, Masanori KAWAKUBO, Osamu HIRAI, Nobuhiro KONISHI, Syuhei KUROKAWA, and Toshiro DOI, Frictional Characterization of Chemical-Mechanical Polishing Pad Surface and Diamond Conditioner Wear, Japanese Hournal of Applied Physics, Vol.47, No.8, pp.6282-6287, 2008.08.
266. Syuhei Kurokawa, Yasutsune Ariura, Tatsuyuki Yamamoto , Automatic leveling procedure by use of the spring method in measurement of three-dimensional surface roughness, Proc. of the 4th International Symposium on Precision Mechanical Measurements, ISPMM2008, Proceedings of SPIE, Vol.7130, pp.71301I-1-71301I-7, 2008.08.
267. Syuhei Kurokawa, Yasutsune Ariura, Bekki Atsushi, Yoji Matsukawa, Toshiro Doi, Application of Angle Measurement with Sub-micro Radian Resolution to Detect Nanometer Engagement of a Gear Pair, Proc. of the International Conference on Precision Measurement, ICPM2008, DVD-ROM, pp.1-11, 2008.09.
268. 宮地計二,黒河周平,清家善之,山本浩之,小林義典,土肥俊郎, 高圧マイクロジェットの洗浄力に関する研究(粒子挙動解析と洗浄実験による考察), 精密工学会誌, Vol.74, No.10, pp.1074-1079, 2008.10.
269. Kazusei Tamai, Hitoshi Morinaga, Syuhei KUROKAWA, and Toshiro DOI, Analysis of Chemical and Mechanical Factors in CMP Process, Proc. of International Conference on Planarization/CMP Technology 2008, pp.22-28, 2008.11.
270. Syuhei KUROKAWA, and Yasutsune ARIURA, Measurement of Tooth Pair Deflections With Ultra High Resolution Encoders and Prediction of Transmission Error Under Load in High Precision, Proc. of the ASME 2007 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference, IDETC/CIE 2007, DVD-ROM, pp.1-10, 2007.09.
271. 梅崎洋二,有浦泰常,黒河周平,井島有朋, ホブ切り過渡現象の観察と切りくず生成機構の解明
(第4報,舞いツール基礎試験における切りくず生成時の形態とかみ込みの関係), 日本機械学会論文集C編, 73巻 733号, pp.2597-2603, 2007.09.
272. 黒河周平,有浦泰常,中西拓也, インボリュート円筒歯車の偏心を考慮したかみ合い伝達誤差解析
(偏心を伴う歯車かみ合い伝達誤差厳密解の導出), 日本機械学会論文集C編, 73巻 732号, pp.2367-2374, 2007.08.
273. Syuhei KUROKAWA and Shinya IMAMURA, Nano Manufacturing of a Small-tipped Stylus for Measurement of Micro-Machine Elements with Concave Surfaces, Proc. of the 35th International MATADOR Conference, pp.7-10, 2007.07.
274. Syuhei KUROKAWA, Yasutsune ARIURA and Akio KAWAMOTO, Identification of the Parameters of Gear Eccentericity by Using Measured Transmission Error Curves, Proc. of the International Conference on Manufacturing, Machine Design and Tribology, ICMDT2007, CD-ROM, pp.1-6, 2007.07.
275. Ryohei ISHIMARU, Syuhei KUROKAWA, Yoji MATSUKAWA and Masashito GOKA, A Fundamental Study on Surface Durability of High Strength Spheroidal Graphite Cast Iron Gears, Proc. of the International Conference on Manufacturing, Machine Design and Tribology, ICMDT2007, CD-ROM, pp.1-6, 2007.07.
276. Syuhei KUROKAWA, and Yasutsune ARIURA, Evaluation of Peak-to-Vally Values of Transmission Error with Gear Eccentricity by Measurement and Analysis, Proc. of the International Symposium of Technology of Mechanical Engineering Design, ISTMED'2007, pp.24-29, 2007.01.
277. Syuhei KUROKAWA, and Yasutsune ARIURA, Prediction of Sidebands of Mesh Frequency with Frequency Modulation Caused by Gear Eccentricity, Proc. of the International Symposium of Technology of Mechanical Engineering Design, ISTMED'2007, pp.24-29, 2007.01.
278. Syuhei KUROKAWA, Topography measurement of gear tooth flanks with CMM and evaluation of pitch deviations with the new definition, The Journal of Chinese Society of of Mechanical Engineers, Vol.27, No.5, pp.513-518, 2006.10.
279. Syuhei KUROKAWA, and Yasutsune ARIURA, Influence of gear eccentricity on the characteristics of noise spectrum
(Frequency modulation and sidebands of mesh frequency), Proc. of the International Conference on Mechanical Transmissions, ICMT'2006, Vol.II, pp.896-901, 2006.09.
280. Syuhei KUROKAWA, and Yasutsune ARIURA, Evaluation of shot peened surfaces using characterization technique of three-dimensional surface topography, Journal of Physics, 10.1088/1742-6596/13/1/003, 13, 9-12, Vol. 13, pp.9-12, 2005.09.
281. Syuhei KUROKAWA, and Yasutsune ARIURA, Evaluation of Transmission Error with Gear Eccentricity by Measurement and Approximate Formula, Proc. of the 1st International Conference on Manufacturing, Machine Design and Tribology, pp.1-4 CD-ROM, 2005.06.

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