| Utsumi Jun | Last modified date：2024.05.01 |
Post-doctoral Fellow /
Department of Electronics
Faculty of Information Science and Electrical Engineering
Faculty of Information Science and Electrical Engineering
E-Mail *Since the e-mail address is not displayed in Internet Explorer, please use another web browser:Google Chrome, safari.
Phone
092-802-3721
Academic Degree
Ph.D.
Country of degree conferring institution (Overseas)
No
Field of Specialization
Photophysics, Optical waveguide, Surface activated bonding
ORCID(Open Researcher and Contributor ID)
0000-0003-2338-3588
Total Priod of education and research career in the foreign country
00years00months
Research
Research Interests
Membership in Academic Society
- 3D integration technology by surface activated bonding at room temperature
Surface activated bonding process at room temperature
Hybrid bonding
Direct bondig of oxcide materials at room temperature
keyword : Surface activated bonding at room temperature Surfaces/interface science
2001.04.
- THE INSTITUTE OF ELECTRICAL ENGINEERS OF JAPAN
- THE JAPAN SOCIETY OF APPLIED PHYSICS
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