記述言語：英語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Zn–Ni alloys were electroplated on a Fe plate with a thickness of 40 μm at 500 A·m−2 and 293 K in unagitated zincate solutions. The reaction product of epichlorohydrin and imidazole (IME) was added to the solution as a brightener at concentrations of 0–5 mL dm–3. The corrosion resistance of the obtained Zn–Ni alloy films was investigated from the polarization curve in 3 mass% NaCl solution before and after the corrosion treatment (formation of corrosion products) for 48 hours. Before the corrosion treatment, the corrosion current density of plated films rarely changed, regardless of the addition of IME into the zincate solution, because the reduction reaction of dissolved oxygen rarely changed. However, in films plated from the solution containing IME, the anode reaction was suppressed, and the corrosion potential shifted toward the noble direction. The suppression of the anode reaction with an addition of IME into the plating solution is attributed to the increase in γ-phase in the plated films. After the corrosion treatment, Zn chloride hydroxide of the corrosion product uniformly formed on the surface when increasing the concentration of IME. The reduction reaction of dissolved oxygen was suppressed by increasing the concentration of IME, resulting in a decrease in corrosion current density.

DOI： 10.2355/isijinternational.isijint-2023-236

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CiNii Research

記述言語：英語   出版者・発行元：一般社団法人 日本鉄鋼協会  

The electrodeposition of an Zn–Zr compound composite is performed under pulsed and double-pulsed current conditions at 313 K in unagitated pH 2 sulfate solutions containing Zn2+ and ZrO2+ ions and polyethylene glycol. Under constant-current electrolysis at 5 000 A·m−2, coarse granular partial deposits containing Zr compounds are observed. Under pulse electrolysis, such coarse deposits are observed rarely; however, both deposited films containing Zr compounds and exfoliated films are observed. On the contrary, in double-pulse electrolysis at high (5 000 A·m−2) and low (500 A·m−2) current densities, coarse deposits are not observed while fine-particle deposits containing Zr compounds are observed. In double-pulse electrolysis at low current densities, the rate of hydrogen evolution decreases and Zn is deposited without the codeposition of Zr compounds; therefore, the continuous hydrogen evolution is suspended in some areas. That is, the area of hydrogen evolution appears to be random. Although Zr compounds are usually concentrated at the upper regions of the deposited films, regardless of the electrolysis method, it is found to have been codeposited even in the inner regions under double-pulse electrolysis. The corrosion current density in 3 mass% NaCl solution is the smallest for the films produced by double-pulse electrolysis, when comparing with the films obtained by pulse electrolysis and constant-current electrolysis. This can be attributed to the suppression of the reduction reaction of dissolved oxygen.

DOI： 10.2355/isijinternational.isijint-2023-270

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CiNii Research

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2023-270

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Zn–Ni alloys were electroplated on a Fe plate with a thickness of 40 μm at 500 A·m−2 and 293 K in unagitated zincate solutions. The reaction product of epichlorohydrin and imidazole (IME) was added to the solution as a brightener at concentrations of 0–5 mL dm–3. The corrosion resistance of the obtained Zn–Ni alloy films was investigated from the polarization curve in 3 mass% NaCl solution before and after the corrosion treatment (formation of corrosion products) for 48 hours. Before the corrosion treatment, the corrosion current density of plated films rarely changed, regardless of the addition of IME into the zincate solution, because the reduction reaction of dissolved oxygen rarely changed. However, in films plated from the solution containing IME, the anode reaction was suppressed, and the corrosion potential shifted toward the noble direction. The suppression of the anode reaction with an addition of IME into the plating solution is attributed to the increase in γ-phase in the plated films. After the corrosion treatment, Zn chlo- ride hydroxide of the corrosion product uniformly formed on the surface when increasing the concentra- tion of IME. The reduction reaction of dissolved oxygen was suppressed by increasing the concentration of IME, resulting in a decrease in corrosion current density.

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2023-236

記述言語：英語   出版者・発行元：一般社団法人 日本鉄鋼協会  

The effect of brighteners on the deposition behavior of Zn–Ni alloys and their microstructure was investigated. Zn–Ni alloys were electrodeposited on Cu electrode at 10–5 000 A·m−2, 105 C·m−2, and 308 K. Although the degree of suppression of hydrogen evolution differed depending on the kind of brightener, the transition current density at which the deposition behavior shifted from normal to anomalous was practically the same in all the solutions containing brighteners. The current efficiency of the alloy deposition significantly decreased with the addition of brighteners, which had a suppression effect on the Zn deposition. Considering that the brighteners suppressed the Ni deposition more than the Zn deposition, the Ni content in the deposited films decreased with the addition of brighteners. When the brightener of a straight-chain polymer comprising a quaternary ammonium cation (PQ) that can suppress the diffusion of ZnO22− and Ni ions in a solution was added, the Ni content in the deposited films increased with increasing current density in a high-current-density region. This was attributed to the fact that Zn, which was preferentially deposited over Ni earlier, reached the diffusion limitation of ZnO22−, and Ni deposition did not reach the diffusion-limited current density. When PQ and a quaternary ammonium salt with a benzene ring were added to the solution, the films obtained at the diffusion-limited current density of ZnO22− exhibited smooth surfaces comprising fine crystals. With the addition of brighteners to increase the overpotential for deposition, the γ-phase (the intermetallic compound of Ni2Zn11) of the deposited films easily formed.

DOI： 10.2355/isijinternational.isijint-2023-103

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CiNii Research

記述言語：日本語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Electrodeposition of Zn–Zr compound composite was performed under pulsed and double pulsed current conditions at 313 K on unagitated pH 2 sulfate solutions containing Zn2+, ZrO2+ ions and a polyethylene glycol (PEG). At constant current density of 5000 A∙m-2 , the coarse granular deposits containing Zr compound existed partially. Meanwhile, in pulse electrolysis, the coarse deposits were rarely seen and the both areas of deposited films containing Zr compound and its films being exfoliated were observed. On the contrary, in double pulse electrolysis of high current density (5000 A∙m-2) and low current density (500 A∙m-2), the coarse deposits were not observed and the fine particle deposits containing Zr compound were present. In double pulse electrolysis, since at low current density, the rate of hydrogen evolution decreases and Zn deposits without co-deposition of Zr compound, the continuous hydrogen evolution is suspended in some areas and the area of hydrogen evolution seems to become random. Although Zr compound concentrated at upper area of deposited films regardless of electrolytic method, it codeposited even at inner part with double pulse electrolysis. The corrosion current density in 3 mass% NaCl solution was the smallest for the films produced by double pulse electrolysis, comparing with films obtained by pulse electrolysis and constant current electrolysis. This is attributed to reduction reaction of dissolved oxygen being suppressed.

DOI： 10.2355/tetsutohagane.tetsu-2023-013

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CiNii Research

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn–Zr compound composite was performed under pulsed and double pulsed current conditions at 313 K on unagitated pH 2 sulfate solutions containing Zn2+, ZrO2+ ions and a polyethylene glycol (PEG). At constant current density of 5000 A∙m−2 , the coarse granular deposits containing Zr compound existed partially. Meanwhile, in pulse electrolysis, the coarse deposits were rarely seen and the both areas of deposited films containing Zr compound and its films being exfoliated were observed. On the contrary, in double pulse electrolysis of high current density (5000 A∙m−2) and low current density (500 A∙m−2), the coarse deposits were not observed and the fine particle deposits containing Zr compound were present. In double pulse electrolysis, since at low current density, the rate of hydrogen evolution decreases and Zn deposits without co-deposition of Zr compound, the continuous hydrogen evolution is suspended in some areas and the area of hydrogen evolution seems to become random. Although Zr com- pound concentrated at upper area of deposited films regardless of electrolytic method, it codeposited even at inner part with double pulse electrolysis. The corrosion current density in 3 mass% NaCl solution was the smallest for the films produced by double pulse electrolysis, comparing with films obtained by pulse electrolysis and constant current electrolysis. This is attributed to reduction reaction of dissolved oxygen being suppressed.

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2023-013

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2022-110

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2022-110

記述言語：日本語   出版者・発行元：公益社団法人 日本金属学会  

DOI： 10.2320/jinstmet.erj202202

CiNii Research

記述言語：英語   出版者・発行元：公益社団法人 日本金属学会  

Cu electrorefining using a low-grade copper anode is desirable from the standpoint of electric power savings. Cu electrolysis was carried out in an unagitated sulfate solution with a low-grade copper anode, and the effect of impurity ions and additives in the solution on the passivation of the anode was investigated. The time when anode passivation firstly occurs shortened significantly in a solution containing 0.596 mol·dm13 of Ni2+ ions as impurity and shortened somewhat in a solution containing As5+(0.053 mol·dm13) or Bi3+(0.0005 mol·dm13) ions. Sn2+(0.0004 mol·dm13) and As3+(0.053 mol·dm13) ions slightly decreased the time to passivation, but Sb3+(0.004 mol·dm13) ions did not. The viscosity coefficient of the solution increased when the 0.596 mol·dm13 of Ni2+ ions were added to the solution, while the diffusion coefficient of Cu2+ ions decreased. The compound of the AsSbO or AsBiO system was formed in anode slime when the As5+(0.053 mol·dm13) or Bi3+(0.0005 mol·dm13) ions were added to the solution, which seemed to increase the compactness of slime. The time to passivation was slightly longer in thiourea-free solution but shortened when the concentration of thiourea was increased from 0.525 to 2.24 mmol·dm13. The time to passivation was constant in solutions containing 0 to 1.13 mmol·dm13 of Cl1 ions, but significantly decreased as the concentration of Cl1 ions increased above 1.13 mmol·dm13. Cl1 ions formed CuCl at the upper area of anode slime, which increased the compactness of slime and promoted the passivation.

DOI： 10.2320/matertrans.mt-m2022087

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CiNii Research

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.MT-M2022087

記述言語：日本語   出版者・発行元：一般社団法人 日本鉄鋼協会  

The effect of brighteners on the deposition behavior of Zn-Ni alloys ant its microstructure was investigated. Zn-Ni alloys were electrodeposited on Cu electrode at 10-5000 A·m−2, 105 C·m−2, 308 K in unagitated zincate solutions containing various brighteners. Although the degree of suppression of hydrogen evolution was different depending on the kind of brightener, the transition current density at which the deposition behavior shifted from normal to anomalous was almost same in solutions containing brighteners. The current efficiency for alloy deposition significantly decreased with an addition of brighteners which had suppression effect on the Zn deposition. Since the brighteners more suppressed the Ni deposition than Zn deposition, the Ni content in deposited films decreased with an addition of brighteners. When the brightener of a straight-chain polymer composed of a quaternary ammonium cation (PQ) which can suppress the diffusion of ZnO22− and Ni ions in solution was added, the Ni content in deposited films increased with increasing current density at high current density region. This is attributed to that Zn which is preferentially deposited over Ni earlier reached the diffusion limitation of ZnO22− ions and Ni deposition didn't reach the diffusion-limited current density. When both PQ and a quaternary ammonium salt with a benzene ring were added in solution, the films obtained at the diffusion-limited current density of ZnO22− ions exhibited the smooth surfaces composed of fine crystals. With an addition of brighteners to increase the overpotential for deposition, the γ-phase (intermetallic compound of Ni2Zn11) of the deposited films was formed easily.

DOI： 10.2355/tetsutohagane.tetsu-2022-104

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CiNii Research

記述言語：日本語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Zn–Ni alloys were electroplated on an Fe plate with thicknesses of 40 μm at 500 A·m−2 and 293 K in unagitated zincate solutions. The reaction product of epichlorohydrin and imidazole (IME) was added in the solution as a brightener at the concentration of 0-5 ml/dm−3. The corrosion resistance of the obtained Zn–Ni alloys films was investigated from the polarization curve in 3 mass% NaCl solution before and after the corrosion treatment (formation of corrosion products) in NaCl solution for 48 h. Before the corrosion treatment, the corrosion current density of plated films rarely changed regardless of addition of IME into the zincate solution because the reduction reaction of dissolved oxygen rarely changed. However, in films plated from the solution containing IME, the anode reaction was suppressed and the corrosion potential shifted to noble direction. The suppression of anode reaction with an addition of IME in plating solution is attributed to the increase in γ-phase in plated films. On the other hand, after the corrosion treatment, the morphology of Zn chloride hydroxide of corrosion product was uniformly formed on the surface with increasing the concentration of IME. The reduction reaction of dissolved oxygen was suppressed with increasing the concentration of IME, resulting in decrease in corrosion current density.

DOI： 10.2355/tetsutohagane.tetsu-2022-110

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CiNii Research

DOI： 10.2320/matertrans.MT-M2022087]

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記述言語：英語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Zn-Ni alloys were electrodeposited on a Cu electrode at 10-5000 A•m-2, 5 × 104 C•m-2, 293 K, 313 K, and 333 K in unagitated zincate solutions containing the reaction product of epichlorohydrin and imidazole (IME) as a brightener. The synergistic effect of IEM and solution temperature on the deposition behavior of Zn-Ni alloys was investigated. The transition current density at which the deposition behavior shifted from normal to anomalous one decreased with IME at 293 K, but did not change regardless of IME addition at 313 K and 333 K. The suppression effect of IME on the Zn and Ni depositions during alloy deposition was observed at 293 K while at 313 K and 333 K, the suppression effect decreased on the Zn deposition but was maintained on the Ni deposition. Therefore, Ni content in deposits significantly decreased with IME as the temperature increased. The current efficiency of Zn deposition significantly decreased with IME at 293 K, with a small degree of decrease at 313 K and 333 K. The C content in deposits was the highest at 293 K and decreased with increasing solution temperature, indicating that the adsorption ability of IME on the cathode decreases with the increasing temperature. As a result, the suppression effect of IME on the Zn deposition decreases with the increasing temperature. The gloss of deposited films was the highest at 293 K, attributed to the IME adsorption ability being large at 293 K and deposited films with fine crystals becoming smooth.

DOI： 10.2355/isijinternational.isijint-2022-160

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Scopus

CiNii Research

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Zn–Ni alloys were electrodeposited on a Cu electrode at 10–5 000 A·m−2, 5 × 104 C·m−2, 293 K, 313 K, and 333 K in unagitated zincate solutions containing the reaction product of epichlorohydrin and imid- azole (IME) as a brightener. The synergistic effect of IEM and solution temperature on the deposition behavior of Zn–Ni alloys was investigated. The transition current density at which the deposition behavior shifted from normal to anomalous one decreased with IME at 293 K, but did not change regardless of IME addition at 313 K and 333 K. The suppression effect of IME on the Zn and Ni depositions during alloy deposition was observed at 293 K while at 313 K and 333 K, the suppression effect decreased on the Zn deposition but was maintained on the Ni deposition. Therefore, Ni content in deposits significantly decreased with IME as the temperature increased. The current efficiency of Zn deposition significantly decreased with IME at 293 K, with a small degree of decrease at 313 K and 333 K. The C content in deposits was the highest at 293 K and decreased with increasing solution temperature, indicating that the adsorption ability of IME on the cathode decreases with the increasing temperature. As a result, the sup- pression effect of IME on the Zn deposition decreases with the increasing temperature. The gloss of deposited films was the highest at 293 K, attributed to the IME adsorption ability being large at 293 K and deposited films with fine crystals becoming smooth.

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2022-160

記述言語：英語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Zn–Ni alloys were electrodeposited on a Cu electrode at 10–500 A·m-2 and 5 × 104 C·m-2 in an unagitated zincate solution at 293, 313, and 333 K. The effect of solution temperature on the electrodeposition behavior of Zn–Ni alloys from alkaline zincate solutions was investigated. The transition current density at which the deposition behavior shifted from a normal to an anomalous co-deposition was almost identical at 293 and 313 K but increased at 333 K, due to enhanced H2 evolution and Ni deposition at 333 K. The current efficiency for alloy deposition increased with solution temperature in both the normal (10–50 A·m-2) and anomalous (500 A·m-2) co-deposition regions. In the normal co-deposition region, Ni deposition and H2 evolution mainly occurred, and the current efficiency increased with solution temperature due to the stronger promotional effect of increase in solution temperature on Ni deposition. In the anomalous co-deposition region at 500 A·m-2, Zn deposition and H2 evolution mainly occurred, and Zn deposition appeared to proceed based on a mixed rate-determining process comprising the charge transfer and diffusion of Zn ions. The current efficiency increased with solution temperature due to the acceleration of the Zn ions diffusion. The Ni content in the deposited films increased with the solution temperature at all the current densities, since Ni deposition was accelerated to a greater degree than Zn deposition by increasing the solution temperature in the region where the charge transfer process was rate-limiting. The γ-phase of the deposited films also increased with increasing solution temperature.

DOI： 10.2355/isijinternational.isijint-2022-076

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CiNii Research

記述言語：日本語   出版者・発行元：公益社団法人 日本金属学会  

The Cu electrorefining using low-grade copper anode is desired from the view point of reduction of electric power. Cu electrolysis was performed using a low-grade copper anode in an unagitated sulfate solution, and the effect of impurity ions and additives in solution on the passivation of anode was investigated. The time when anode passivation firstly occurs shortened significantly in solution containing 0.596 mol·dm-3 of Ni2+ ions as impurity, and shortened somewhat in solution containing As5+(0.053 mol·dm-3) or Bi3+(0.0005 mol·dm-3) ions. Sn2+(0.0004 mol·dm-3) and As3+(0.053 mol·dm-3) ions slightly decreased the time to passivation, but Sb3+ (0.004 mol·dm-3) ions rarely decreased the time. When the 0.596 mol·dm-3 of Ni2+ ions were added in solution, the viscosity coefficient of solution increased and the diffusion coefficient of Cu2+ ions decreased. When the As5+(0.053 mol·dm-3) or Bi3+(0.0005 mol·dm-3) ions were added in solution, the compound of As-Sb-O or As-Bi-O system was formed in anode slime, which seemed to increase the compactness of slime. The time to passivation was slightly longer in thiourea-free solution, but shortened with increasing the concentration of thiourea from 0.525 to 2.24 mmol·dm-3. In the solutions containing 0 to 1.13 mmol·dm-3 of Cl- ions, the time to passivation was constant, but significantly shortened with increasing the concentration of Cl- ions at the region above 1.13 mmol·dm-3. Cl- ions formed CuCl at the upper area of anode slime, as a result, increased the compactness of slime and promoted the passivation.

DOI： 10.2320/jinstmet.j2022001

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CiNii Research

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

he Cu electrorefining using low–grade copper anode is desired from the view point of reduction of electric power. Cu electrolysis was performed using a low–grade copper anode in an unagitated sulfate solution, and the effect of impurity ions and additives in solution on the passivation of anode was investigated. The time when anode passivation firstly occurs shortened significantly in solution containing 0.596 mol·dm−3 of Ni2+ ions as impurity, and shortened somewhat in solution containing As5+(0.053 mol·dm−3) or Bi3+(0.0005 mol·dm−3) ions. Sn2+(0.0004mol·dm−3) and As3+(0.053mol·dm−3) ions slightly decreased the time to passivation, but Sb3+ (0.004mol·dm−3) ions rarely decreased the time. When the 0.596mol·dm−3 of Ni2+ ions were added in solution, the viscosity coefficient of solution increased and the diffusion coefficient of Cu2+ ions decreased. When the As5+(0.053mol·dm−3) or Bi3+(0.0005mol·dm−3) ions were added in solution, the compound of As–Sb–O or As–Bi–O system was formed in anode slime, which seemed to increase the compactness of slime. The time to passivation was slightly longer in thiourea–free solution, but shortened with increasing the concentration of thiourea from 0.525 to 2.24 mmol·dm−3. In the solutions containing 0 to 1.13 mmol·dm−3 of Cl− ions, the time to passivation was constant, but significantly shortened with increasing the concentration of Cl− ions at the region above 1.13 mmol·dm−3. Cl− ions formed CuCl at the upper area of anode slime, as a result, increased the compactness of slime and promoted the passivation.

DOI： [doi:10.2320/jinstmet.J2022001]

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Zn–Ni alloys were electrodeposited on a Cu electrode at 10–5000 A·m−2, 5 × 104 C·m−2, and 293, 313 and 333 K in unagitated zincate solutions containing the reaction product of epichlorohydrin and imidazole (IME) as a brightener. The synergistic effect of IEM and solution temperature on the deposition behavior of Zn–Ni alloy was investigated. The transition current density, at which the deposition behavior shifted from the normal type to anomalous ones, decreased with IME at 293 K, but didn’t change regardless of IME addition at 313 and 333 K. The suppression effect of IME on the Zn and Ni depositions during alloy deposition was observed at 293 K, while at 313 and 333 K, the suppression effect was decreased on the Zn deposition but was maintained on the Ni deposition. Therefore, Ni content in deposits significantly decreased with IME as temperature increased. The current efficiency for Zn deposition significantly decreased with IME at 293 K, while the degree of decrease was small at 313 and 333 K. The content of C in deposits was highest at 293 K, and decreased with increasing solution temperature, indicating that the adsorption ability of IME on the cathode decreases with increasing temperature. As a result, the sup- pression effect of IME on the Zn deposition seems to decrease with increasing temperature. The gloss of deposited films was highest at 293 K.
This is attributed to adsorption ability of IME being large at 293 K and depos- ited films with fine crystals becoming smooth.

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2021-105

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Zn電析は古くから鋼板の腐食防止のために使用されてきたが，電析膜の耐食性を更に向上させるためにZn合金電析が行われている1–8)。合金電析の中でもZn-Ni合金は，熱安定性と耐食性に優れており，自動車部品，建築資材など様々な産業分野で適用されている。Zn-Ni合金電析は，通常，硫酸塩浴，塩化物浴から行われるが，小物部品等に対する均一電着性の観点からは，ジンケート浴からの方が望ましい。硫酸塩浴，塩化物浴からのZn-Ni合金電析については，従来より多数の研究が行われており，実用的な電流密度の領域では，電気化学的に卑なZnが貴なNiより優先析出する変則型共析挙動を示すことが知られている9–15)。ジンケート浴からのZn-Ni合金の電析については，電析膜中のNi含有率に及ぼす電流密度16–19)，全金属塩濃度20)，撹拌19)，Ni錯化剤濃度19)，浴組成の影響17,19–21)，合金電析の電流効率に及ぼす電流密度18,20)の影響が報告されているが硫酸塩浴，塩化物浴からの場合に比べて電析機構22)に関する研究例が少ない。
一方，浴温は，電析過電圧，均一電着性，金属塩の溶解度，浴導電率等に影響を及ぼす23)。浴温を高くすると，浴の導電率が増加する。また，イオンの拡散係数および金属塩の溶解度が増大するため金属析出の拡散限界電流密度を高くすることが出来る。浴温を低下させると，電析過電圧が増加することにより電析物の結晶粒が微細化し，また均一電着性が改善される。このように，浴温は電析において極めて重要な因子であるが，ジンケート浴からのZn-Ni合金の電析挙動に及ぼす浴温の影響についてはほとんど報告されていない19)。そこで，本研究では，ジンケート浴からのZn-Ni合金電析挙動に及ぼす浴温の影響をZn，Ni析出および水素発生の部分分極曲線に基づき考察した。

DOI： https://www.jstage.jst.go.jp/article/tetsutohagane/108/2/108_TETSU-2021-092/_article/-char/ja/

記述言語：日本語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Zn–Ni alloys were electrodeposited on a Cu electrode at 10–5000 A·m−2, 5 × 104 C·m−2, and 293, 313 and 333 K in unagitated zincate solutions containing the reaction product of epichlorohydrin and imidazole (IME) as a brightener. The synergistic effect of IEM and solution temperature on the deposition behavior of Zn–Ni alloy was investigated. The transition current density, at which the deposition behavior shifted from the normal type to anomalous ones, decreased with IME at 293 K, but didn’t change regardless of IME addition at 313 and 333 K. The suppression effect of IME on the Zn and Ni depositions during alloy deposition was observed at 293 K, while at 313 and 333 K, the suppression effect was decreased on the Zn deposition but was maintained on the Ni deposition. Therefore, Ni content in deposits significantly decreased with IME as temperature increased. The current efficiency for Zn deposition significantly decreased with IME at 293 K, while the degree of decrease was small at 313 and 333 K. The content of C in deposits was highest at 293 K, and decreased with increasing solution temperature, indicating that the adsorption ability of IME on the cathode decreases with increasing temperature. As a result, the suppression effect of IME on the Zn deposition seems to decrease with increasing temperature. The gloss of deposited films was highest at 293 K. This is attributed to adsorption ability of IME being large at 293 K and deposited films with fine crystals becoming smooth.

DOI： 10.2355/tetsutohagane.tetsu-2021-105

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CiNii Research

記述言語：日本語   出版者・発行元：一般社団法人 日本鉄鋼協会  

Zn-Ni alloys were electrodeposited on a Cu electrode at 10-5000 A·m−2 and 5 × 104 C·m−2 in an unagitated zincate solution at 293, 313, and 333 K. The effect of solution temperature on the electrodeposition behavior of Zn-Ni alloys from alkaline zincate solutions was investigated. The transition current density at which the deposition behavior shifted from a normal to anomalous codeposition was almost similar at 293 and 313 K but increased at 333 K. The transition current density increased at 333 K due to the enhanced hydrogen evolution and Ni deposition. The current efficiency for alloy deposition increased with solution temperature in both normal (10-50 A·m−2) and anomalous (500 A·m−2) codepositions region. In a normal codeposition region, Ni deposition and hydrogen evolution mainly occurred, and the current efficiency increased with solution temperature due to a larger promotion effect of increase in solution temperature on the Ni deposition. In an anomalous codeposition region at 500 A·m−2, Zn deposition and hydrogen evolution mainly occurred, and Zn seems to proceed under a mixed rate-determining process of the charge transfer and diffusion of Zn ions. The current efficiency increased with solution temperature since the diffusion of Zn ions was accelerated. The Ni content in the deposited films increased with solution temperature at all the current densities, since Ni deposition was more accelerated than Zn deposition with increasing solution temperature in the region where the charge transfer process was rate-limiting. The γ phase of the deposited films increased with increasing solution temperature.

DOI： 10.2355/tetsutohagane.tetsu-2021-092

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CiNii Research

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2320/matertrans.MT-M2021126

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

It was investigated whether the spherical electrolytic copper powder could be electrolyzed by adding polyethyleneimine (PEI) in the electrolytic solution. In order to identify the optimum electrolysis conditions for the electrodeposition of spherical copper powder, we investigated the effect of molecular weight of PEI, the amount of PEI added, the current density, and the cathode material on the morphology of electrolytic copper powder. The electrodeposited copper powder was analyzed with a scanning electron microscope, a laser diffraction scattering particle size distribution measuring device, and an X-ray diffractometer. It was found that the spherical copper powder can be obtained by electrolysis at 3000 A·m−2 scraping copper powder every 10 to 60 s in solution containing 0.126 mol·dm−3 Cu2+, 0.5 mol·dm−3 free H2SO4 and 1.0 g·dm−3 PEI with average molecular weight 10000.

DOI： https://doi.org/10.2320/jinstmet.J2021032

記述言語：英語   掲載種別：研究論文（学術雑誌）  

A Zn–Ni alloy was electrodeposited on a Cu electrode at a current density of 10–5 000 A·m − 2, a charge of 5 × 104 C·m−2, and temperature of 293 K in an unagitated zincate solution containing the reaction product of epichlorohydrin and imidazole (EI polymer) as a brightener. The effect of the EI polymer on the deposition behavior of the Zn–Ni alloy was investigated. The transition current densities at which the deposition behavior shifted from the normal type to anomalous were 50–100 A·m−2 and 10–20 A·m−2 in the EI polymer-free solution and polymer containing solutions, respectively, indicating that the EI polymer decreased the transition current density. The transition current density corresponded to the current density at which the potential of the total polarization curve significantly shifted from the more noble region than the equilibrium potential of Zn to the less noble region. The decrease in transition current density with EI polymer was attributed to the suppression of hydrogen evolution. In addition, the current efficiency for alloy deposition in the high-current-density region decreased due to the suppression of both Zn and Ni depositions. The Ni content of deposited films decreased with EI polymer, indicating that Ni deposition was more suppressed with the EI polymer addition than Zn deposition. With increasing current density, the crystals of the films deposited from the EI polymer-containing solution smoothened and showed sig- nificant brightness. The oxidation reaction of the films deposited from the EI polymer-containing solution was suppressed, thus causing the corrosion potential to shift to a noble direction.

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2021-080

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

To investigate the effect of polymer additives and chloride ions on the electrodeposition behavior and morphology of copper powder, the polarization curves were measured and constant current electrolysis of 300 A·m−2 and 500 A·m−2 was conducted in an electrolytic solution containing 0.079 mol·dm−3 of Cu2+ and 0.5 mol·dm−3 of free H2SO4 at 293K and 393 K without stirring. Polyethylene glycol (PEG) and polyethyleneimine (PEI) were used as polymer additives. PEG and PEI had a suppressing effect on the electrodeposition of copper powder. The current efficiency for Cu deposition decreased with the addition of PEG and PEI. The addition of PEG decreased the average particle size of the copper powder, while PEI didn’t change the average particle size. When Cl− coexisted with PEG, the suppressing effect on the electrodeposition of copper powder became even greater and the particle size of the copper powder became finer than when Cl− or PEG was added alone

DOI： https://doi.org/10.2320/jinstmet.J2021018

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

To investigate the effect of halide ions on the electrodeposition behavior and morphology of copper powder, the polarization curves were measured and constant current electrolysis of 300 A·m−2 and 500 A·m−2 was conducted in an electrolytic solution of 0.079 mol·dm−3 of Cu2+ and 0.5 mol·dm−3 of free H2SO4 at 293 K and 303 K without stirring. In the deposition of copper powder, Cl− had a promoting effect on the deposition of copper powder, while Br− and I− had a suppressing effect. The current efficiency for Cu deposition increased with the addition of Cl− and decreased with Br−. The addition of Cl− reduced the average particle size of the copper powder and grown dendrite-shaped branches and trunks, resulting in a lower tap density. On the other hand, when Br− was added, the average particle size and crystallite size of the copper powder became smaller, and the tap density also became smaller. With increasing Cl− concentration in solution, the current efficiency for Cu deposition increased, that is, copper deposition was promoted even in the diffusion rate-determining region of Cu2+ ions, showing that the deposition of copper powder was affected by the charge transfer process for Cu deposition. The change in morphology of Cu powder with halide ions is attributed to change of the charge transfer process. The deposition of Cu powder seems to proceed under a mixed rate-determining process of the diffusion of Cu2+ ions and charge transfer.

DOI： https://doi.org/10.2320/jinstmet.J2021008

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.MT-M2021027

記述言語：英語   掲載種別：研究論文（学術雑誌）  

The electrodeposition of Invar Fe–Ni alloy with low thermal expansion was performed at 100–5 000 A·m􏰖􏰗 and 105 C·m􏰖􏰗 in agitated Watt’s solutions containing NiSO4, NiCl2, FeSO4, malonic acid (C3H4O4), saccharin sodium (C7H4NNaO3S), and H3BO3 at 50°C. With increasing concentration of malonic acid, the Ni content in deposits formed at current densities greater than 2 000 A·m 􏰖 􏰗 decreased, whereas the Ni content increased in deposits formed at current densities less than 1 000 A·m 􏰖 􏰗. The current efficiency for alloy deposition decreased with increasing concentration of malonic acid. The deposits were com- posed of granular crystals whose size decreased with increasing concentration of malonic acid. With the addition of saccharin, the Ni content in the deposits decreased substantially, and the current efficiency for alloy deposition increased. With the addition of boric acid, the Ni content in the deposits somewhat decreased, and the current efficiency for alloy deposition increased. The surface morphology of deposits changed as the current density was varied and with the addition of saccharin, whereas it rarely changed with the addition of boric acid. The morphology was found to depend on the Ni content in the deposits. The deposits with a Ni content of 29–38 mass% were composed of granular crystals approximately 300 nm in size, whereas the deposits with a Ni content of 41–52 mass% exhibited a smooth surface that consisted of fine crystals. The effects of additives on the Ni content in deposits and current efficiency can be explained by the changes in the partial polarization curves for Fe and Ni depositions and H2 evolution during Fe–Ni alloy deposition.

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2020-105

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn-Ni alloy was performed on a Cu electrode at a current density of 10–5000 A·m−2 and a charge of 5 × 104 C·m−2 in an unagitated zincate solution at 293 K containing the reaction product of epichlorohydrin and imidazole as brightener. The effect of brightener on the deposition behavior of Zn-Ni alloy was investigated. The transfer current density at which the deposition behavior shifts from the normal type to anomalous was 50 to 100 A·m−2 in brightener-free solution, while it became 10 to 20 A·m−2 with an addition of brightener, indicating that the brightener greatly decreased the transfer current density. The transfer current density corresponded to the current density at which the potential of total polarization curve significantly shifted from the more noble region than the equilibrium potential of Zn to less noble region. With an addition of brightener, the decrease in transfer current density is attribut- ed to suppression of hydrogen evolution, and the current efficiency for alloy deposition at high current density region decreased due to suppression of both Zn and Ni deposition. The Ni content of deposited films decreased with brightener, indicating that Ni deposition was more suppressed with brightener. With increasing current density, the crystals of
films deposited from the solution contain- ing brightener became smooth and showed the significant brightness. The oxidation re- action of films deposited from the solution containing brightener is suppressed, as a re- sult, the corrosion potential shifted to noble direction.

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2020-108

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn was performed on an Fe electrode at a current density of 50–5000 A·m!2 and a charge of 4 × 104 C·m!2 in an unagitated zincate solution at 313 K containing 0.62 mol·dm!3 of ZnO, 4.0 mol·dm!3 of KOH or NaOH, and organic additives. The e!ects of KOH and NaOH on the deposition behavior of Zn in solution containing organic additives and the microstructure of the deposits were investigated. In solution containing a quaternary ammonium cation (PQ) and a quaternary ammonium salt with a benzene ring (QA), the current e"ciency for Zn deposition at high current density region of 1000 to 5000 A·m!2 to produce the glossy #lms was higher with KOH than that with NaOH. At high current densities above 1000 A·m!2, Zn deposition approaches the di!usion limitation of ZnO22! ions. With additions of PQ and QA, the di!usion of ZnO22! ions was signi#cantly suppressed, and the degree of suppression was smaller with KOH than that with NaOH. The polarization resistance at 200 A·m!2 investigated by AC impedance revealed that the adsorption ability of PQ and QA onto the cathode was smaller with KOH than that with NaOH. Since the suppression e!ect of additives on the Zn deposition is smaller with KOH than that with NaOH, the current e"ciency for Zn deposition at high current density region is larger with KOH. The upper limit of current density to produce the glossy #lms was smaller with KOH than that with NaOH, and the spongy thin #lms were partially observed on the platelets crystals obtained at high current density in KOH solution. The content of C resulting from the additives in deposited Zn was smaller with KOH. These phenomena are attributed to the adsorption ability of PQ and QA onto the cathode being smaller with KOH. "

DOI： doi:10.2320/jinstmet.J2020043

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn!Zr and Zn!V oxide composites was performed under galvanostatic conditions at 313 K on unagitated pH 2 sulfate solutions containing Zn2+ and Zr4+ or VO2+ ions and an additive such as polyethylene glycol (PEG). The e!ects of PEG addition on the co- deposition of Zr and V oxides and their polarization behavior, and on the microstructure of the deposits, were investigated. Although the Zr content in the deposits obtained from the Zn!Zr solution in the absence of PEG was approximately zero, it increased signi"cantly at a current density of above 1000A·m"2 following the addition of PEG. In the Zn!V solution, the V content in the deposits obtained from 100 to 2000 A·m"2 was higher with PEG than without it. In the presence of PEG, the cathode potential polarized, the rate of hydrogen evolution increased, and the hydrolysis reaction of Zr4+ and VO2+ ions proceeded smoothly, resulting in an increase in the Zr and V content in the deposits. Additionally, the crystal platelets of Zn in the Zn!Zr and the Zn!V oxide "lms became "ne, and the surface coverage of the spongiform Zr and "lm-like V oxides increased. Furthermore, the corrosion current densities of the Zn!Zr and Zn!V oxide "lms obtained from the solution with PEG were lower than those from the solution without it. The reduction rate of dissolved oxygen decreased in the "lms in the presence of PEG, thereby leading to a decrease in the corrosion current density.

DOI： doi:10.2320/matertrans.MT-M2020164

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2320/matertrans.MT-M2020182

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.M-M2020808

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.MT-M2019316

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

To elucidate the effects of polyethylene glycol(PEG)and glue on the deposition behavior of Zn from electrowinning solutions and its crystal structure, Zn electrodeposition was performed at a current density of 600 A·m−2 and a charge of 8.64 × 106 C·m−2 in an agitated sulfate solution containing 1.07 mol·dm−3 and 1.8 mol·dm−3 of ZnSO4 and H2SO4, respectively, at a temperature of 45°C. With the additions of PEG and glue, the evolution of hydrogen was suppressed at current density region less than the critical current density for Zn deposition, resulting in decrease in critical current density of Zn. The degree of decrease in critical current density of Zn was larger with glue than that with PEG. The current efficiency for Zn deposition was higher with PEG and glue than that without at low current density region because the critical current density of Zn decreased with additives. Since the additives suppressed Zn deposition more than the hydrogen evolution at high current density region, the current efficiency of Zn decreased with increasing concentration of additives in solution. At high current density region, there was little difference in current efficiency of Zn between PEG and glue. The effect of molecular weight of PEG on the current efficiency of Zn was rarely observed at molecular weight above 2000. With an addition of PEG, the deposits became fine platelets crystals with preferred orientation of {1011} and layered pyramidally, while the deposits orientated to {1120} preferentially and the platelets crystals grew perpendicu- larly to the substrate with an addition of glue. The surface roughness of deposited Zn decreased with additives and it was smaller with PEG than that with glue

DOI： doi:10.2320/jinstmet.J2019045

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn-Zr oxide and Zn-V oxide composites was performed under galvanostatic conditions from an unagitated sulfate solution containing Zn2+, Zr4+, or VO2+ ions and an additive such as polyethylene glycol(PEG). The sulfate solution had a pH of 2 and the electrodeposition was performed at 313 K. The effects of PEG on the co-deposition of the Zr oxides and V oxides and their polarization be- havior were investigated. Additionally, the effects of PEG on the microstructure of the deposits were investigated. Although the Zr content in the deposits obtained from the Zn-Zr solution without PEG was approximately zero, it increased significantly at a current density above 1000 A m−2 following the addition of PEG. In the Zn-V solution, the V content in the deposits obtained from 100 A m−2 to 2000 A m−2 was higher with PEG than that without PEG. In the presence of PEG, the cathode potential polarized, the rate of hydrogen evolution increased, and the hydrolysis reaction of Zr4+ and VO2+ ions occurred easily. This resulted in the Zr content and V content increasing in the deposits. Additional- ly, the crystal platelets of Zn in the Zn-Zr oxide film and the Zn-V oxide film became fine, and the surface coverage of the spongiform Zr ox- ide and the film-like V oxide increased. Furthermore, the corrosion current densities of the Zn-Zr oxide film and the Zn-V oxide film ob- tained from the solution with PEG were lower than those from the solution without PEG. The reduction reaction of dissolved oxygen decreased in the films with PEG, thereby decreasing the corrosion current density. [doi:10.2320/jinstmet.J2019031]

DOI： doi:10.2320/jinstmet.J2019031

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn was performed on a Fe electrode at a current density of 20-5000 A·m−2 and a charge of 4 × 104 C·m−2 in an un- agitated zincate solution containing 0.62 mol·dm−3 of ZnO, 4.0 mol·dm−3 of NaOH and organic additives at 313 K. The effects of organic ad- ditives on the deposition behavior of Zn and the microstructure of the deposits were investigated. The films deposited at current densities higher than 1000 A・m−2 from the solution containing additives of a straight-chain polymer composed of quaternary ammonium cation(PQ) and a quaternary ammonium salt with benzene ring(QA)exhibited the gloss. The polarization curve was separated into a partial polarization curve of Zn deposition and that of hydrogen evolution by using the galvanostatic data of Zn deposition. The overpotentials of charge transfer of Zn deposition and that of ZnO22− ions diffusion increased with additions of PQ and QA. The increase in overpotential was remarkable at potential less noble than −1.5 V. Zn deposition reached the diffusion limit of ZnO22− ions at potential less noble than −1.5 V, indicating that the diffusion of ZnO22− ions was greatly suppressed by PQ and QA. With additions of PQ and QA, the C, N and H were co-deposited with Zn, showing that the additives of PQ and QA were incorporated in deposited films. The size of the Zn crystallite decreased with increasing current density. At a high current density of 5000 A・m−2, the crystallite size decreased furthermore with additions of PQ and QA and the filmshowedthesmoothsurface.Theorientationindexofthe{101 ̄0}planeofZndepositedfromthesolutioncontainingPQandQAincreased with current density. The change of the crystallite size and crystal orientation of deposited Zn were explained related to the deposition overpo- tential.

DOI： doi:10.2320/jinstmet.J2019027

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

To investigate the effect of the surface texture of steel on the crystal orientation relation between Fe and Zn, we deposited Zn at 1500 A・ m−2 and 1.48 × 104 C・m−2 onto both Al-killed and IF steel sheets in an agitated sulfate solution at 313 K. Chemically polishing the steel simplifies the deposition of Zn epitaxially because of the decreased strain in the steel surface. For Zn deposited on Al-killed steel, the Burgers’ orientation relation of {110}Fe//{0001}Zn was completed after the chemical polishing of the steel. In this case, because the orientation of {111}Fe increased and Zn was deposited according to the orientation relation of {110}Fe//{0001}Zn, the orientation of {0001}Zn decreased. In contrast, for Zn deposited on IF steel, the preferred relation was {111}Fe//{0001}Zn. The crystal-grain size of IF steel is larger than that of Al-killed steel, which makes the epitaxial growth of Zn easier on IF steel than on Al-killed steel. The orientation of {111}Fe was more promi- nent in IF steel than in Al-killed steel. Because the proportion of {0001}Zn increases under conditions where the epitaxial growth of Zn occurs easily and the orientation {111}Fe was more prominent in IF steel, this appears to be the cause of the relation of {111}Fe//{0001}Zn. The ori- entation relation between the deposited Zn and steel changes based on the strain, crystal orientation, and grain size of the steel. Therefore, the crystal orientation of the deposited Zn changes as well.

DOI： 10.2320/jinstmet.J2019023

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

The electrodeposition of invar Fe-Ni alloy with low thermal expansion was performed at 100-5000 A·m–2 and 105 C·m–2 in agitated Watt’s solution containing NiSO4, NiCl2, FeSO4, C3H4O4, C7H4NNaO3S and H3BO3 at 50oC. With increasing the concentration of malonic acid, the Ni content in deposits decreased at higher current density region than 2000 A·m–2, while it increased at lower current density region than 1000 A·m–2. The current efficiency for alloy deposition decreased with increasing the concentration of malonic acid. The deposits were composed of granular crystals whose size decreased with increasing the concentration of malonic acid. With an addition of saccharin, the Ni content in deposits significantly decreased, and the current efficiency for alloy deposition increased. With an addition of boric acid, the Ni content in deposits somewhat decreased, and the current efficiency for alloy deposition increased. The surface morphology of deposits changed with the current density and an addition of saccharin, and rarely changed with an addition of boric acid. It was found that the morphology depended on the Ni content in deposits. The deposits with Ni content of 29-38 mass% were composed of granular crystals approximately 300 nm in size, while the deposits with Ni content of 41-52 mass% showed the smooth surface consisted of fine crystals. The effects of additives on the Ni content in deposits and current efficiency can be explained by the change of partial polarization curve for Fe and Ni deposition and hydrogen evolution in Fe-Ni alloy deposition.

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2019-045

記述言語：英語   掲載種別：研究論文（学術雑誌）  

To elucidate the effects of the electrolysis conditions on the formation of electrodeposited invar Fe–Ni alloys with low thermal expansion, Fe–Ni electrodeposition was performed at 10–5 000 A·m − 2 and 5 × 105 C·m−2 in an agitated solution containing NiSO4, NiCl2, FeSO4, H3BO3, C7H4NNaO3S, and C3H4O4 at 40°C–60°C. In the low-current-density region, the Ni content in the deposits significantly decreased with increasing current density, reached a minimum, and then increased after reaching the diffusion-limiting current density for Fe deposition. With the increasing concentration of FeSO4 in the solution, the Ni con- tent in the deposits decreased in the lower-current-density region, reached a constant at a moderate cur- rent density, and then began to increase at higher current density. As a result, the current density range in which the Ni content in the deposits reached a minimum and remained constant became wider with increasing FeSO4 concentration. With the decreasing pH of the solution, since the partial polarization curve for H2 evolution and the total polarization curve shifted to a higher-current-density region, the curve of the Ni content in the deposits as a function of the current density shifted toward a higher current density. The change in the composition of the Fe–Ni alloy deposits because of the electrolysis conditions can be explained by the changes in the total polarization curve and the partial polarization curves for Fe and Ni deposition and H2 evolution.

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2019-023

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn was performed on a Fe electrode at a current density of 20-5000 A·m−2 and a charge of 4 × 104 C·m−2 in an un- agitated zincate solution containing 0.62 mol·dm−3 of ZnO, 4.0 mol·dm−3 of NaOH and organic additives at 313 K. The effects of organic ad- ditives on the deposition behavior of Zn and the microstructure of the deposits were investigated. The films deposited at current densities higher than 1000 A・m−2 from the solution containing additives of a straight-chain polymer composed of quaternary ammonium cation(PQ) and a quaternary ammonium salt with benzene ring(QA)exhibited the gloss. The polarization curve was separated into a partial polarization curve of Zn deposition and that of hydrogen evolution by using the galvanostatic data of Zn deposition. The overpotentials of charge transfer of Zn deposition and that of ZnO22− ions diffusion increased with additions of PQ and QA. The increase in overpotential was remarkable at potential less noble than −1.5 V. Zn deposition reached the diffusion limit of ZnO22− ions at potential less noble than −1.5 V, indicating that the diffusion of ZnO22− ions was greatly suppressed by PQ and QA. With additions of PQ and QA, the C, N and H were co-deposited with Zn, showing that the additives of PQ and QA were incorporated in deposited films. The size of the Zn crystallite decreased with increasing current density. At a high current density of 5000 A・m−2, the crystallite size decreased furthermore with additions of PQ and QA and the film showed the smooth surface. The orientation index of the {101 ̄0} plane of Zn deposited from the solution containing PQ and QA increased with current density. The change of the crystallite size and crystal orientation of deposited Zn were explained related to the deposition overpo- tential. [doi:10.2320/jinstmet.J2019027]

DOI： https://doi.org/10.2320/jinstmet.J2019027

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.1080/00325899.2019.1585032

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.M2018353

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

To elucidate the effects of electrolysis conditions on the formation of electrodeposited invar Fe-Ni alloys with low thermal expansion, Fe-Ni electrodeposition was performed at 10-5000 A·m–2 and 5×105 C·m–2 in agitated solution containing NiSO4, NiCl2, H3BO3, FeSO4, C7H4NNaO3S and C3H4O4 at 40-60°C. Ni content in deposits significantly decreased in the low current density region with increasing current density, reached a minimum, and then increased due to reaching at diffusion limiting current density for Fe deposition as the current density increased further. With increasing the concentration of FeSO4 in solution, Ni content in deposits decreased at lower current density region, reached a constant at lower current density, and then began to increase at higher current density. As a result, the current density range where Ni content in deposits was minimum and constant became wider with higher concentration of FeSO4. With decreasing pH in solution, since the partial polarization curve for H2 evolution and total polarization curve sifted to higher current density region, Ni content in deposits-cur- rent density curve shifted to higher current density region. With stirring the solution, Ni content in deposits reached a minimum as the current density increased, and then began to increase at higher current density than without stirring due to increase in diffusion limiting current densi- ty for Fe deposition. The change of the composition in deposits by electrolysis condition can be explained by the changes of the total polariza- tion curve for Fe-Ni alloy deposition and the partial polarization curves for Fe and Ni depositions and H2 evolution.

DOI： https://doi.org/10.2355/tetsutohagane.TETSU-2018-101

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2355/isijinternational.ISIJINT-2018-429

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.M2018243

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/jinstmet.J2018020

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.1016/j.matchar.2018.05.004

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： DOI : http://dx.doi.org/10.2355/tetsutohagane.TETSU-2017-079

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/matertrans.M-M2017827

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/jinstmet.J2017015

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.1016/j.msea.2017.06.084

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/matertrans.M2016463

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： https://doi.org/10.2473/journalofmmij.133.165

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/matertrans.M2016442

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320 matertrans.M2016442

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/jinstmet.J2017015

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/matertrans.M2017215

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

The phosphate coating for Mg alloy was performed in the unagitated solutions containing 1 g dm 3 of Mg, Ca, Sr and Ba as alkali earth metal and 50 g dm 3 of H3PO4 of pH 3 and 40 C for 3 min, and the structure and formation behavior of the phosphate films were investigated. The X ray diffraction patterns of phosphate films broadened regardless of the kinds of alkali earth metal, which was a characteristic of an amorphous structure. XPS analysis revealed that the valence of P in the phosphate films was pentavalent. The pH in the vicinity of the Mg alloy during the phosphate coating, as measured using an Sb microelectrode, was approximately 10.4, 11.4, 10.7, 12.0 in the solutions containing Mg, Ca, Sr and Ba, respectively, which shows that the phos- phoric acid dissociates to the third stage during the phosphate coating and the phosphate films composed of M3 PO4 2 containing alkali earth metal M are formed. The phosphate coating were successively performed in the two kinds of solutions containing different alkali earth metals and the cross section was analyzed, as a result, it was suggested that the new phosphate films were formed at the interface between Mg alloy substrate and phosphate films and the previously formed phosphate films were boosted up in films.

DOI： doi:10.2320 jinstmet.J2016039

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： dos:10.2320/matertrans.H-M2016825

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： http://dx.doi.org/10.2355/isijinternational.ISIJINT-2016-111

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn–Zr oxide composite from an unagitated sulfate solution containing Zn2+ and Zr ions was investigated at pH 1–2 and at 313 K under galvanostatic conditions. The Zr content was higher in deposits formed from the solution at pH 2 than

DOI： doi:10.2320 matertrans.M2016084

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： http://dx.doi.org/10.2355/isijinternational.ISIJINT-2016-110

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Ni-W alloys was conducted from an unagitated sulfate solution containing citric acid at pH 5 and 60 °C under coulo- static (9.0×105) and galvanostatic (100-5000 A·m–2) conditions onto steel sheets with an initial Ni plating, and the effect of initial Ni plating on the structure and hardness of deposited Ni-W alloys was investigated before and after annealing. The precipitates of Ni4W and NiW were observed in deposits obtained at all the current densities after annealing, irrespective of having undergone initial Ni plating or not. Without initial Ni plating, a lot of large precipitates occurred in the vicinity of steel substrate, while the fine precipitates occurred with initial Ni plat- ing. Without initial Ni plating, the W content in deposits increased in the vicinity of steel substrate due to diffusion of Ni in deposits into steel substrate during annealing. With initial Ni plating, the W content in deposits in the vicinity of Ni plating decreased due to diffusion of Ni in Ni plating into deposits during annealing. Before annealing, W content in deposits was lower with initial Ni plating than that without Ni plating. With initial Ni plating, W content in deposits was lower and Ni diffused from Ni plating to deposits during annealing, as a result, the forma- tion of large precipitates of Ni4W and NiW seems to be suppressed. The hardness of deposited Ni-W alloys after annealing increased when the precipitates of Ni4W and NiW became uniform and fine.

DOI： http://dx.doi.org/10.2355/tetsutohagane.TETSU-2015-050

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Ni-W alloys was conducted from an unagitated sulfate solution containing citric acid at pH 5 and 60 °C under coulostatic (9.0×105) and galvanostatic (100-3000 A·m–2) conditions onto steel sheets with an initial Ni plating to investigate the effect of annealing dura- tion on the structure and hardness of deposited Ni-W alloys. The crystallite size of Ni in deposits with several seconds annealing increased significantly compared to without annealing, and gradually increased with annealing duration. With increasing the holding time at 700 °C to 100 and 1000 s, the precipitates of Ni4W and NiW were increased and became coarse at upper layers of deposits. The hardness of all the de- posits increased with annealing, and the degree of increase became significantly large with increasing W content in deposit by increasing cur- rent density. The hardness of deposit with W content 45 mass% was maximum at holding time of 10 s at 700 °C, and gradually decreased with increasing annealing duration. The hardness of deposits increased when the precipitates of Ni4W and NiW were uniformly distributed in a fine size, which showing the optimum precipitation state at holding time of 10 s at 700 °C.

DOI： http://dx.doi.org/10.2355/tetsutohagane.TETSU-2015-051

記述言語：英語   掲載種別：研究論文（学術雑誌）  

The electrodeposition behavior of Zn­Fe alloys has been investigated at 308K at current densities of 10­500A·m12 and a charge of 5 © 104 C·m12 in an unagitated zincate solution containing triethanolamine, which forms a stable complex with Fe2+ ions. The content of Fe in the deposit changed significantly depending on the current density. At current densities lower than 20A·m12, the content of Fe was approximately 90mass%, that is, the Zn­Fe alloy exhibited normal co-deposition, whereby the electrochemically more noble Fe deposited preferentially. At current densities higher than 100A·m12, however, anomalous co-deposition was observed, whereby the less noble Zn deposited preferentially. The current density at which the Fe content in the deposit changed significantly corresponded to that at which the cathode potential in the total polarization curve abruptly shifted to a less noble region than the equilibrium potential for Zn deposition. Iron deposition and H2 evolution were significantly suppressed by the co-existence of Zn2+ ions in the region of anomalous co-deposition at higher current densities, showing the formation of an inhibitor to deposition arising from Zn2+ ions in the cathode layer. The current efficiency for alloy deposition was not close to zero even in the region of normal co-deposition, and the Fe content in the region of anomalous co-deposition was close to the composition reference line, which shows deposition behavior different from that in sulfate solutions. In the region of normal co- deposition at lower current densities, underpotential deposition of Zn occurred with Fe. TEM analysis revealed that Zn­Fe alloys deposited at lower current densities comprised the stable intermetallic compound Fe5Zn21. The activity coefficient of Zn in the deposit appears to remarkably decrease because of this formation of stable Fe5Zn21.

DOI： doi:10.2320/matertrans.M2015230

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/matertrans.M2014432

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： doi:10.2320/jinstmet.J2014033

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

DOI： DOI : http://dx.doi.org/10.2355/tetsutohagane.100.1391

記述言語：英語   掲載種別：研究論文（学術雑誌）  

The electrodeposition of a Zn–V oxide composite under galvanostatic conditions from an agitated sul- fate solution without dispersed particles and containing Zn2+ and VO2+ at pH 2 and 313 K was investi- gated. Although the V content in the deposits initially decreased with increasing current density, irrespective of the flow rate of electrolyte, a further increase in the current density resulted in an increase in the V content of the deposits. The curves, which show the relationship between the V content in the deposits and the current density, shifted to the higher-current-density region with increasing flow rate of the electrolyte. Agitation of the electrolyte decreased the V content of the deposits but reduced the seg- regation of V oxide. EDX point analysis of the cross-section of the deposits revealed that the V oxide con- centrated at the surface of the deposits. The polarization curves in 3% NaCl solution revealed that the corrosion potential of the deposited Zn–V oxide films depended on the V content in the deposits, irrespec- tive of the flow rate of electrolyte, and that the corrosion potential shifted toward the more noble direction with the codeposition of V oxide when the V content in the deposits was less than 2 mass%. At V con- tents of <4 mass%, the corrosion current density of the deposits decreased with increasing V content. The corrosion current densities of the deposits obtained from agitated solutions were smaller than those of the deposits obtained from unagitated solutions.

DOI： http://dx.doi.org/10.2355/isijinternational.54.1906

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Zn–Ni composite films were electrodeposited under coulostatic (515–5145 C⋅m−2) and galvanostatic (5 A⋅m−2) conditions onto brass plates with a Ni precoating in an unagitated chloride solution at 23°C to investigate the color and structure of the deposited films. The chromaticity of the deposited Zn–Ni com- posite films changed in a clockwise direction in each quadrant of the a*b* diagram of the L*a*b* color space with increasing amount of charge. The deposited films contained S, Zn, and Ni, and their content decreased in the order of S > Zn > Ni. X-ray photoelectron spectroscopy revealed that the deposited films were primarily composed of ZnS, ZnO, and Ni and contained small amounts of Zn(OH)2 and Zn. The color of the deposited films is attributed to interference of light, and the index of refraction of the depos- ited films composed of ZnS, ZnO, and Ni is assumed to be large. When Ni was excluded from the elec- trolytic solution, ZnS did not codeposit and the amount of Zn deposited in the metallic state increased. This result suggests that the Ni deposition induces the codeposition of ZnS.

DOI： DOI: http://dx.doi.org/10.2355/isijinternational.54.1661

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Zn-V oxide composite was examined from an agitated sulfate solution without dispersed particles containing Zn2+ and VO2+ at pH 2 and 40 oC under galvanostatic conditions. Although V content in deposits decreased for the moment with increasing current density regardless of flow rate of electrolyte, the further increase in current density brought about the increase in V content in deposits. The curves, which shows the relationship between the V content in deposits and current density, shifted to the higher current density region with increasing flow rate of electrolyte. Agitation of the electrolyte decreased the V content of the deposits but reduced the segregation of V ox- ide. EDX point analysis of cross section of deposits revealed that the V oxide concentrated at the surface of deposits. It was found from the polarization curves in 3% NaCl solution that the corrosion potential of deposited Zn-V oxide films depended on the V content in deposits regardless of the flow rate of electrolyte and it shifted to more noble direction with codeposition of V oxide at V contents in deposits below 2 mass%. At V contents of < 4 mass%, the corrosion current density of deposits decreased with increasing V contents in deposits. The corrosion current densities of deposits obtained from agitated solutions were smaller than that from un-agitated solutions.

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Zn electrodeposition was performed galvanostatically on a steel sheet at 1500 A/m2 in an agitated sulfate solution at 40oC to investigate the effect of preadsorption of organic additives on the lightness and morphology of Zn. The organic additives preadsorbed were classified into two types: 1) polyethylene glycol (PEG), gelatin and stearyl dimethyl benzyl ammonium chloride (SDBAC) (type I), which exhibit the po- larization effect on Zn deposition ; 2) saccharin and sodium lauryl sulfate (type II) , which exhibit no polarization effect on Zn deposition. The platelet crystals of deposited Zn became small by preadsorption of all kinds of organic additives. The decrease in size of platelet crystals of Zn with the preadsorption is attributed to both the increase in overpotential for Zn deposition and the decrease in epitaxial growth of Zn. The orientation of {0001} Zn basal plane decreased significantly because of an increase in overpotential for Zn deposition by the preadsorp- tion of PEG and gelatin, and the orientation decreased slightly by saccharin and sodium lauryl sulfate in spite of no polarization effect on Zn deposition. The surface roughness of deposited Zn decreased by the preadsorption of organic additives with the exception of SDBAC. This is due to decrease in size of platelet crystals of Zn. The lightness of deposited Zn was increased by the preadsorption of organic additives with the exception of SDBAC. Because Zn deposited ununiformly by the preadsorption of SDBAC, the surface roughness of Zn increased and the lightness decreased.

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Zn-Ni composite electrodeposition was performed under coulostatic (515-5145C·m–2) and galvanostatic (5A·m–2) conditions on a brass with Ni precoating in an unagitated chloride solution at 23oC to investigate the color and structure of the deposited films. The chromaticity of deposited Zn-Ni composite films changed in a clockwise direction in each quadrant of a*b* diagram of La*b* color space with increasing the amount of charge. The deposited films contained S, Zn and Ni, and the content was in the order of S > Zn > Ni. XPS revealed that the deposited films were composed of ZnS, ZnO and Ni mainly and contained Zn(OH)2 and Zn slightly. The color of deposited films is attributed to interference of light, and the index of refraction of deposited films composed of ZnS, ZnO and Ni is assumed to be large. When the Ni was excluded from the electrolytic solution, ZnS did not codeposit and the deposition of Zn in metallic state increased. This suggests that the Ni deposition induces the codeposition of ZnS.

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/jinstmet.J20130401

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/jinstmet.J20130401

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

Tensile tests of 16mass%Cr bearing ferritic steels were performed in order to investigate the effect of the mean interparticle spacing (λ) on the local deformation energy. λ of Cr precipitates was changed from 3. 3 to 5. 1 μm. The amounts of Cr precipitates in the specimens tested were controlled to be the same level. The local deformation energy was increased with increasing λ in the specimens without a notch, while the local deformation energy does not depend on λ for the notched specimens. AsB (Angle selective Backscattered Electron Detector) images of voids beneath the fracture surface showed that the difference of the local deformation energy dependence on λ between notchless and notched specimens was due to the void coalescence processes. This finding reveals that the local deformation energy is influenced by the stress triaxiality through the void coalescence behavior.

DOI： http://dx.doi.org/10.2355/tetsutohagane.99.60

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Electrodeposition behavior of Zn­Ni alloys was investigated at current densities of 10­500 A·m12 and a charge of 5 © 104 C·m12 in an unagitated zincate solution containing triethanolamine, which forms a stable complex with Ni2+ ions at 308 K. At low current densities, the Zn­ Ni alloy exhibited normal codeposition, wherein electrochemically more noble Ni deposited preferentially, while at high current densities, it exhibited anomalous codeposition, wherein less noble Zn deposited preferentially. Ni deposition and H2 evolution were significantly suppressed in the region of anomalous codeposition at higher current densities, showing the formation of an inhibitor for deposition, which results from Zn2+ ions in the cathode layer. In contrast, in the region of normal codeposition at lower current densities, the underpotential deposition of Zn apparently occurred with Ni. Because Zn­Ni alloys are composed of a stable intermetallic compound of Ni5Zn21, the activity coefficient of Zn in the deposit appears to decrease remarkably.

DOI： 10.2320/matertrans.M2012241

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

DOI： 10.2320/matertrans.M2011379

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Sn-Ag Alloys and Evaluation of Connection Reliability for Automotive Connectors

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（その他学術会議資料等）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Codeposition Behaviour of Impurities in during Electrogalvanization in Sulfate Baths in the Presence of Fe Ions

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Effects of Small Amounts of Molybdenum Tungsten or Tin Additive on the Morphology and Orientation of Electrodeposited Zinc

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Electrodeposition of Composites of Zinc with Vanadium Oxide from Sulfate Solutions

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（国際会議プロシーディングス）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Structure and Polarization Poperties of Zn-Nb Films Formed on Steel Sheet by Sputtering. Hiroshi Kuboyama Hiroaki Nakano Satoshi Oue Hisaaki Fukushima Masataka Masuda Shunichi Hashimoto ISIJ International Vol.46 8(2006)pp.1205-1209.

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：英語   掲載種別：研究論文（学術雑誌）  

TEM-EDX Observations of the Microstructure of Electrodeposited Ni-Sn Alloys Satoshi Oue Hiroaki Nakano Ryo Kuroda Shigeo Kobayashi Hisaaki Fukushima Materials Transactions Vol.47 6(2006)pp.1550-1554.

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Pitting Corrosion Resistance of Ultrafine-Grained Aluminum Processed by Servere Plastic Deformation In-Joon Son Hiroaki Nakano Satoshi Oue Shigeo Kobayashi Hisaaki Fukushima Zenji Horita Materials Transactions Vol.47 4(2006)pp.1163-1169.

記述言語：英語   掲載種別：研究論文（学術雑誌）  

Effect of Polyethylene Glycol on the Morphology of Zn Electrodeposition on Steel Sheet Hiroaki Nakano Satoshi Oue Toshiyuki Miki Shigeo Kobayashi Hisaaki Fukushima ISIJ International Vol.46 1(2006)pp.106-110.

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

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掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

Effect of electrolysis factors on crystal orientation and morphology of electrodeposited cobalt
H. Nakano K. Nakahara S. Kawano S. Oue T. Akiyama and H. Fukushima
Journal of Applied Electrochemistry
Vol.32 1(2002)pp.43-48.

DOI： 10.1023/A:1014219106152

掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

掲載種別：研究論文（学術雑誌）  

記述言語：日本語   掲載種別：研究論文（学術雑誌）  

The electrodeposition of Al-Mn alloys from the molten chlorides salts was carried out to discuss the funda- mental codeposition behavior.
The effect of a current density on the alloy composition and on the cathode current efficiency was investi-
gated. The result shows characteristic feature that the Mn content in the deposits is kept almost constant at relatively lower current densities. At higher current densities, the Mn content in the deposits shifts to reach another constant values which are depended on the bath composition and determined by the limiting current densities of Al and Mn.
Then, the polarization curves were measured for Al and Al-Mn deposition. Both depositions of Al and Mn from the alloy plating baths occur at the same potential and no potential region where Mn or Al deposited individually is observed. The partial polarization curves for Al deposition show that the potential of Al deposition
shifts to less noble direction by 70 mV due to the codeposition with Mn.
Raising temperature promotes the mass transfer of the reactants to increase the limiting current densities
of Al and Mn. On the other hand, the Mn content of the deposits increases at higher temperatures.

開催年月日： 2022年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州産業大学   国名：日本国  

開催年月日： 2022年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：オンライン   国名：日本国  

開催年月日： 2022年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州産業大学   国名：日本国  

開催年月日： 2021年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：オンライン   国名：日本国  

開催年月日： 2021年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：Zoomによるオンライン開催   国名：日本国  

開催年月日： 2021年5月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学   国名：日本国  

開催年月日： 2021年5月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学   国名：日本国  

開催年月日： 2019年9月

記述言語：日本語  

開催地：京都大学　桂キャンパス   国名：日本国  

Zn2+1.07 mol/L, H2SO41.53 mol/Lとなるように実験室にて作製した浴および同組成の操業浴に添加剤として分子量6000のニカワまたはポリエチレングリコール（PEG）を10 mg/L添加し，浴温45 ℃，攪拌100 rpmにてZnの電解採取を行い，ニカワの代替としてPEGを使用できるかどうかを検討した。実験浴，操業浴からのZn電析の電流効率は共にニカワ，PEGを添加すると5%程度低下した。電流効率はPEGを添加した方がニカワを添加するより1〜2%程高くなった。また，操業浴からの方が，実験浴より1〜2%程電流効率が高くなった。操業浴からの電析Znは，添加剤が無いと水素発生痕による孔が生じたが，ニカワ，PEGを添加すると水素発生痕は消失した。PEGを添加するとZnは{1011}面に優先配向する電場配向繊維型の組織となり，ニカワ添加の場合より結晶粒が微細となり表面粗度がより小さくなった。電析Znの結晶構造に及ぼすニカワの影響は，実験浴と操業浴では若干異なったが，PEG添加の影響は浴の種類に関わらずほぼ同一であった。

開催年月日： 2019年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：福岡工業大学   国名：日本国  

開催年月日： 2019年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：神奈川大学横浜キャンパス   国名：日本国  

開催年月日： 2019年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：神奈川大学横浜キャンパス   国名：日本国  

開催年月日： 2019年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：千葉工業大学   国名：日本国  

銅の電解精製におけるアノードの不動態化は、アノード表面への硫酸銅結晶の析出が主原因であるため、不動態 化を抑制するにはアノード表面からの銅イオンの拡散を促進する必要がある。これまで、電解液組成とアノード 組成の最適化を検討してきたが、今回は電解液の流れに着目し、流れの現状解析と最適化を検討した。現状解析 から、電解に伴って発生する自然対流により、電解槽内の電解液濃度分布が不均一になっていることが分 かった。例えば、銅濃度であれば、電極間の上下で約8g/lの濃度差が生じている。これを電解槽への電解液の給液 および排液方法を変更するという強制対流で緩和可能と推定し、ミニチュアの槽を用いて効果を確認できたた め、その内容を報告する。

開催年月日： 2018年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：福岡工業大学   国名：日本国  

Zn2+ 1.07 mol/L, H2SO41.53 mol/Lの溶液に添加剤としてニカワ(分子量6000)またはポリエチレングリコール (PEG，分子量200~35000)を10 mg/L添加し，浴温45°C，攪拌100 rpmにてZnの電解採取を行い，ニカワの 代替としてPEGを使用できるかどうかを検討した。Zn電析の電流効率は，添加剤無添加の場合が最も高く, PEGを 添加した方がニカワを添加するより若干高くなった。Zn析出の部分分極曲線は，PEG，ニカワを添加すると分極 し，その分極の程度は，分子量が同程度であれば，PEGとニカワでほぼ同一であった。PEGについては分子量が低 い方から4000までは分子量の増加に伴い，吸着座が増えることでZn析出に対する分極効果が大きくなるが, 分子 量が4000を超えると，PEG同士の絡まりおよび水溶液への溶解性の低下により，分極効果が低下した。添加剤を 含まない浴では，電析Znの表面には水素発生痕が目立ち, 表面が粗くなった。ニカワまたはPEGを添加すると水素 発生痕はほとんど見られなくなり，表面が平滑になった。ニカワとPEG添加を比較すると，表面粗度はPEG添加の 方が小さくなり，より平滑となった。電析Znの表面粗度，結晶形態に及ぼすPEGの分子量の影響は，特に見られ なかった。

開催年月日： 2018年9月

記述言語：日本語  

開催地：福岡工業大学   国名：日本国  

インバー型Fe-Ni合金は，室温付近の熱膨張係数がFe-Ni合金中で最も小さいため，光学機器，電子通信機 器，シャドーマスク等の精密機器材料として，多くの用途に利用されている。電析法によるFe-Ni合金の作製に は，基板の選定が必要不可欠であるが，溶解鋳造等と違い複雑な面や極小部位での形成が可能であり，膜形成速 度が速く，低温作業であるため消費エネルギーが低いといった大量生産に適した特徴を持っている。しかし，水 溶液からのFe-Ni合金電析は，卑なFeの優先析出が変則型共析の挙動を示すため，一定の組成を持つ合金を安定し て得ることが困難である。本研究では，硫酸浴，ワット型ベース浴およびスルファミン酸浴を基本浴として，浴 組成，添加剤，電流密度等の電解条件，電析合金組成，カソード分極，表面形態および電析合金の内部応力に及 ぼす影響について検討した結果を報告する。

開催年月日： 2018年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：北九州国際会議場   国名：日本国  

開催年月日： 2018年6月

記述言語：日本語  

開催地：北九州国際会議場   国名：日本国  

開催年月日： 2018年6月

記述言語：日本語  

開催地：北九州国際会議場   国名：日本国  

開催年月日： 2018年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：北九州国際会議場   国名：日本国  

開催年月日： 2018年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

水溶液中からのZn電析において, Zn皮膜中に Mg, Al, Ti などの標準単極電位が Zn よりも低い活 性金属を Zn 膜中に含有させると耐食性が向上す ることが分かっている。Zr も標準単極電位 E0 が -1.53[V vs.NHE]と, Zn (E0= -0.73[V vs.NHE])より も卑な活性金属であり，Zn 膜中に取り込むことで 耐食性の向上が期待できる。しかし，水溶液中か ら Zr を金属状態で析出させることは困難である ため，本研究では電析時の陰極界面の pH 上昇を 利用して ZrO2+イオンを加水分解させ，そのまま 酸化物として Zn 膜中に取り込むことを検討した。 ポリエチレングリコール(PEG)は，陰極電位を卑 に移行させ，陰極界面の pH を上昇させ ZrO2+イオ ンの加水分解反応を促進させることが期待され る。そこで，本研究では，PEG を添加した溶液に おいて，Zn-ZrO2 の複合電析挙動とその微細構造 を調査した。

開催年月日： 2018年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

電気Znめっきは，安価で，犠牲防食により耐食性に優れるため鋼板製品全般にて広く活用されている。通常電気Znめっき鋼板は化成処理を施し，未塗装で用いられることが多い。化成処理後の外観は電析Znの表面形状に左右されるため，その結晶形態を制御することが重要である。電気Znめっきは電気化学プロセスで成膜するため, 電解条件（浴組成, 電流密度等）を変化させることで電析物を容易に制御できる。これは溶融Znめっきと大きく異なる点であり, 特に純Zn電気めっきの場合は電解条件により結晶形態, 配向性が変化し, それに応じて外観, 加工性, 化成処理性が大きく変化する。 電析Znの結晶形態に及ぼす電解条件，電解液への有機系添加剤の影響に関してはこれまでに多数の研究が行われている。しかし，電析Znの結晶形態に及ぼす鋼板の表面性状の影響については，報告　が少なく不明な点が多い。そこで，本研究では表面性状の異なる種々の実用鋼板上にZnを電析させ，電析Znの析出挙動，結晶配向性に及ぼす鋼板の表面性状の影響を調査した。

開催年月日： 2018年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：芝浦工業大学   国名：日本国  

開催年月日： 2017年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州工業大学付属図書館   国名：日本国  

開催年月日： 2017年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州工業大学付属図書館   国名：日本国  

開催年月日： 2017年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：金沢工業大学   国名：日本国  

複合電析は，素材に耐摩耗性，潤滑性，耐食性などの機能を付与することができる。複合電析では，通常，分散材として微粒子を電解液中に懸濁させ，電析の際にその微粒子を皮膜中に取り込む。微粒子は，電解液中で凝集し易いため，電析膜に微細な状態では共析し難く，電解液中で凝集した微粒子が沈降するため製造プロセス上の問題点も多い。そこで本研究では，分散材として，カチオン性の高い水溶性のポリエチレンイミン(以下PEI)を用いて，非懸濁溶液からのZn-PEI複合電析の検討を行った。Zn電析の部分分極曲線，電流効率，電析物の微細構造，耐食性に及ぼすPEI添加の影響について調査した。

開催年月日： 2017年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本大学黒髪南キャンパス   国名：日本国  

開催年月日： 2017年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本大学黒髪南キャンパス   国名：日本国  

開催年月日： 2017年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本大学工学部2号館   国名：日本国  

開催年月日： 2017年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本大学工学部2号館   国名：日本国  

開催年月日： 2017年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本大学工学部2号館   国名：日本国  

開催年月日： 2017年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：千葉工業大学津田沼キャンパス   国名：日本国  

純度78.7%の粗銅をアノードに用いて，浴温60 ℃，無撹拌にてアノード電流密度200 A/m2でCuの電解精製を行い，陽極の不動態化に及ぼす浴中不純物イオンの影響を調査した。また，回転ディスク電極法により，各種不純物存在下における浴中でのCu2+の拡散係数を測定した。不純物イオンとして，Ni2+, As5+, Bi3+が存在すると不動態化が促進されることが分かった。電解後の陽極上のスライム断面をEPMAにて解析したところ，As5+添加浴では，Sb, As, Oの重なり，Bi3+添加浴では，Bi, As, OまたはBi, S, Oの重なりが見られ，それぞれ，SbAsO4, BiAsO4, Bi2(SO4)3の形成が予想された。スライム中に形成されたSbAsO4, BiAsO4, Bi2(SO4)3が，Cu2+イオンの拡散を阻害し，不動態化を促進すると考えられる。一方，Ni2+添加浴では，浴の粘度が上昇し，浴中でのCu2+の拡散係数が低下することが分かった。また，Ni2+が共存するとCuSO4の溶解度が減少した。Ni2+イオンは，スライムの性状に影響を及ぼすこと無く，不動態化を促進した。

開催年月日： 2016年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：岩手大学   国名：日本国  

電析Cuの表面粗度,均一電着性に及ぼすゼラチン,チオ尿素,塩化物イオン添加剤の相乗作用については不明な 点が多い。そこで本研究では,添加剤の濃度を種々変化させて電析Cuの表面粗度,均一電着性に及ぼす添加剤の 相乗効果について調査した。カソードの表面粗度は,添加剤の単独, 複数添加にかかわらずチオ尿素の添加量を増 やすと低下し, 塩化物イオンの添加量を減らすと低下した。ゼラチンは,その濃度を標準条件よりも高くすると粗 度が低下した。標準条件で3種類の添加剤を添加した場合は相乗効果により粗度は低下した。塩化物イオンとゼラ チンが共存すると均一電着性は大きく改善された。また, 3種類の添加剤を添加した場合, チオ尿素の増加は均一電 着性を悪化させるのに対して,ゼラチンの増加は均一電着性を向上させた。標準条件に対して塩化物イオンの濃 度を下げ, かつゼラチンの濃度を上げることでカソードの表面粗度および均一電着性はさらに良くなると考えられ る。

開催年月日： 2016年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：岩手大学   国名：日本国  

開催年月日： 2016年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：東北大学   国名：日本国  

開催年月日： 2016年6月

記述言語：英語   会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2016年6月

記述言語：日本語  

開催地：九州大学筑紫キャンパス   国名：日本国  

開催年月日： 2016年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学筑紫キャンパス   国名：日本国  

開催年月日： 2016年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：東京大学本郷キャンパス   国名：日本国  

純度78.7%の粗銅をアノードに用いて,浴温60 °C,無撹拌にてアノード電流密度200 A/m2でCuの電解精製を行 い,陽極の不動態化に及ぼす塩化物イオンの影響を調査した。Cl-濃度が0~40 mg/Lの範囲では,約17時間で不 動態化が生じており,Cl-濃度の影響が見られないのに対して,Cl-濃度が100 mg/L以上になると不動態化までの 時間は短くなっており,不動態化に対するCl-イオンの悪影響が認められた。Cl-濃度を400mg/Lと高くすると電解 後のアノード表面に繊維状の組織が見られた。こ

開催年月日： 2016年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：早稲田大学西早稲田キャンパス   国名：日本国  

開催年月日： 2015年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：愛媛大学   国名：日本国  

開催年月日： 2015年6月

記述言語：英語   会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

開催年月日： 2015年6月

記述言語：日本語  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2015年6月

記述言語：日本語  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2015年6月

記述言語：日本語  

国名：日本国  

開催年月日： 2015年3月

記述言語：日本語  

開催地：千葉工業大学   国名：日本国  

Znの電析挙動と結晶組織に及ぼすゼラチンとSbの相乗効果およびCl-の影響を明らかにするために,Zn電析の部分 分極曲線および電析Znの結晶組織,結晶配向性を調査した。ゼラチンはZn電析,H2発生を抑制するのに対し て,SbはZn電析,H2発生を促進させた。Sbが50 μg/L存在すると,200 A/m2以下の低電流密度域で電流効率は大 きく低下したがゼラチンを添加するとSbによる電流効率の低下が大幅に緩和された。ゼラチンとSbが共存した溶 液からの電析Znは,ゼラチン1 mg/Lでは主に<110>配向の繊維状の結晶組織となるのに対して,ゼラチン濃度を 10 mg/Lと高くした場合,無配向分散状の非常に微細な結晶組織となった。一方,Cl-を添加するとZn電析の部分 分極曲線は復極し,また分極抵抗が減少した。復極および分極抵抗減少の程度は,Cl-濃度が600 mg/Lから6000 mg/Lへと増加するとより顕著になった。水素発生の部分分極曲線は,Cl-を共存させてもほとんど変化しな かった。その結果,初期のZn電析では,Cl-の共存により3~10 %電流効率が上昇した。

開催年月日： 2015年3月

記述言語：日本語  

開催地：関東学院大学工学部   国名：日本国  

開催年月日： 2015年3月

記述言語：日本語  

開催地：関東学院大学工学部   国名：日本国  

開催年月日： 2015年3月

記述言語：日本語  

開催地：関東学院大学工学部   国名：日本国  

開催年月日： 2014年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州工業大学附属図書館AVホール   国名：日本国  

開催年月日： 2014年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州工業大学附属図書館AVホール   国名：日本国  

開催年月日： 2014年12月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州工業大学附属図書館AVホール   国名：日本国  

開催年月日： 2014年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本大学   国名：日本国  

開催年月日： 2014年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2014年6月

記述言語：日本語  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2014年5月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2014年5月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2014年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：東京大学生産技術研究所   国名：日本国  

開催年月日： 2014年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：東京理科大学野田キャンパス   国名：日本国  

開催年月日： 2014年3月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：東京理科大学野田キャンパス   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：福岡工業大学   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語   会議種別：口頭発表（招待・特別）  

開催地：福岡工業大学   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：福岡工業大学   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：福岡工業大学   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：福岡工業大学   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：北海道大学高等教育推進機構   国名：日本国  

開催年月日： 2013年9月

記述言語：日本語  

開催地：北海道大学高等教育推進機構   国名：日本国  

開催年月日： 2013年6月

記述言語：英語   会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

開催年月日： 2013年6月

記述言語：日本語  

開催地：熊本県　パレア   国名：日本国  

開催年月日： 2013年6月

記述言語：日本語   会議種別：口頭発表（一般）  

開催地：熊本県 パレア   国名：日本国  

開催年月日： 2012年12月

会議種別：口頭発表（一般）  

開催地：九州工業大学附属図書館AVホール   国名：日本国  

開催年月日： 2012年9月

会議種別：口頭発表（一般）  

開催地：北海道 室蘭工業大学   国名：日本国  

開催年月日： 2012年9月

会議種別：口頭発表（一般）  

開催地：秋田大学   国名：日本国  

開催年月日： 2012年5月

会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2012年5月

会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス   国名：日本国  

開催年月日： 2012年3月

会議種別：口頭発表（一般）  

開催地：東京都市大学世田谷キャンパス   国名：日本国  

開催年月日： 2011年10月

会議種別：口頭発表（一般）  

国名：グレートブリテン・北アイルランド連合王国(英国)  

開催年月日： 2011年9月

会議種別：口頭発表（一般）  

開催地：大阪府立大学   国名：日本国  

開催年月日： 2011年9月

開催地：大阪府立大学   国名：日本国  

開催年月日： 2011年9月

会議種別：口頭発表（一般）  

開催地：名古屋大学   国名：日本国  

開催年月日： 2011年6月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2011年6月

開催地：九州大学　筑紫地区　総合研究棟C-Cube   国名：日本国  

開催年月日： 2011年6月

開催地：九州大学　筑紫地区　総合研究棟C-Cube   国名：日本国  

開催年月日： 2011年5月

開催地：福岡国際会議場   国名：日本国  

開催年月日： 2011年4月

会議種別：口頭発表（一般）  

開催地：九州異大学伊都キャンパス 工学研究院附属 循環型社会システム工学研究センター (CE40) 多目的セミナー室   国名：日本国  

開催年月日： 2011年3月 - 2011年4月

会議種別：口頭発表（一般）  

開催地：東京大学本郷キャンパス   国名：日本国  

開催年月日： 2011年3月

会議種別：口頭発表（一般）  

開催地：関東学院大学金沢八景キャンパス   国名：日本国  

開催年月日： 2011年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2011年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2011年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2011年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年12月

会議種別：口頭発表（一般）  

開催地：九州大学馬出キャンパスコラボステーション2F   国名：日本国  

開催年月日： 2010年12月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年12月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年11月

会議種別：口頭発表（一般）  

開催地：九州大学伊都キャンパス稲森記念館C会議室   国名：日本国  

開催年月日： 2010年9月

会議種別：口頭発表（一般）  

開催地：福岡市西区元岡744 九州大学伊都キャンパス   国名：日本国  

開催年月日： 2010年9月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年9月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年9月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年6月

会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

開催年月日： 2010年6月

会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

開催年月日： 2010年6月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年3月 - 2010年4月

会議種別：口頭発表（一般）  

開催地：東京大学生産技術研究所   国名：日本国  

開催年月日： 2010年3月

会議種別：口頭発表（一般）  

開催地：成蹊大学 (東京都武蔵野市吉祥寺北町3-3-1)   国名：日本国  

開催年月日： 2010年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2010年2月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2009年11月 - 2009年4月

会議種別：口頭発表（一般）  

国名：大韓民国  

開催年月日： 2009年9月

会議種別：口頭発表（一般）  

開催地：幕張メッセ 国際会議場   国名：日本国  

開催年月日： 2009年9月

会議種別：口頭発表（招待・特別）  

開催地：北海道大学   国名：日本国  

開催年月日： 2009年9月

国名：日本国  

開催年月日： 2009年9月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2009年8月 - 2010年8月

会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

Effect of Equal Channel Angular Pressing on the Pitting Corrosion Resistance of Aluminum Alloys with/without Anodization

開催年月日： 2009年8月

会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

開催年月日： 2009年7月

国名：日本国  

開催年月日： 2009年3月

会議種別：口頭発表（一般）  

開催地：千葉工業大学   国名：日本国  

開催年月日： 2009年3月

会議種別：口頭発表（一般）  

開催地：山梨大学   国名：日本国  

開催年月日： 2009年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2009年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2008年12月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2008年9月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2008年3月

会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

開催年月日： 2008年3月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2007年11月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2007年8月 - 2008年8月

会議種別：口頭発表（一般）  

国名：カナダ  

開催年月日： 2007年8月

会議種別：口頭発表（一般）  

国名：カナダ  

開催年月日： 2007年5月

会議種別：口頭発表（一般）  

国名：日本国  

開催年月日： 2007年5月

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：チリ共和国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：大韓民国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

開催地：九州工業大学   国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：大韓民国  

会議種別：口頭発表（一般）  

国名：ドイツ連邦共和国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：大韓民国  

会議種別：口頭発表（一般）  

国名：日本国  

会議種別：口頭発表（一般）  

国名：日本国  

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

参加者数：30

種別：大会・シンポジウム等 

参加者数：480

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

種別：大会・シンポジウム等 

参加者数：300