Updated on 2024/07/28

Information

 

写真a

 
HAYASHI TERUTAKE
 
Organization
Faculty of Engineering Department of Mechanical Engineering Associate Professor
School of Engineering (Concurrent)
Graduate School of Engineering Department of Mechanical Engineering(Concurrent)
Title
Associate Professor
Contact information
メールアドレス
External link

Degree

  • Ph.D (Engineering)

Research History

  • 大阪大学大学院工学研究科 茨城大学工学部附属超塑性工学研究センター

Research Interests・Research Keywords

  • Research theme:Number based particle sizing for nanoparitcle using Nano particle chip

    Keyword:nano particle chip, particle sizing, nano particle

    Research period: 2020.4

  • Research theme:Low power femto second laser processing with surface excitation using double pulse beam

    Keyword:laser ablation, femto second laser processing

    Research period: 2009.9

  • Research theme:Study on nano particle sizing based on brownian diffusion evaluation by using fluorescence nano probe.

    Keyword:fluorescence polarization, rotational diffusion coefficient, nano particle, particle sizing

    Research period: 2004.4

Awards

  • 砥粒加工学会賞論文賞

    2015.3   公益社団法人 砥粒加工学会   ポリグリセロール修飾ナノダイヤモンドを用いた同膜の平坦化加工に関する研究が砥粒加工学会賞論文賞を受賞した. 砥粒加工学会賞論文賞は,砥粒加工学会誌の過去1年間に掲載された論文を対象とし,内容が優 秀と認められるものに対して,砥粒加工およびその関連分野に関する学術を奨励し,砥 粒加工学の発展を促進することを目的として贈賞する.贈賞は原則として2件以内とし,該当する論文がない場合には,その年度は贈賞しない. 本年度は44編の論文から2編が受賞.

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    近年の半導体デバイスは多層構造と配線の微細化による高集積化に伴い高性能化しており,配線のさらなる多層化を行うためには各層間の十分な平坦化が必要となる.そこで平坦化加工技術として, 筆者らはポリグリセロールで修飾したナノダイヤモンド(Polyglycerol-functionalized Diamond Nanoparticles; ND-PG)を研磨砥粒とした新たな化学機械研磨(CMP)技術を提案している. ND-PGは,粒径が小さい,水分散性が良い, 金属元素を含まないなど,CMP研磨砥粒として望ましい性質を持っている. 本研究ではND-PGを用いたスラリーを試作し,配線金属の銅に対して研磨実験を行い,ND-PG砥粒を用いた研磨によってナノメートルオーダの平坦度・平滑面を実現した.

  • 精密工学会沼田記念論文賞

    2015.3   公益社団法人精密工学会   蛍光偏光法を用いたナノ粒子粒径計測に関する研究(第一報)ー蛍光DNAプローブを用いた回転拡散係数測定システムの開発ー が精密工学会沼田記念論文賞を受賞した 本会に精密工学会沼田記念論文賞は,計測関連分野および加工・制御関連分野で,独創性のある論文を公表した著者を対象 とし,その努力と精進に報いるとともに,旺盛な研究意欲を高揚させることを目的として贈賞する.本賞の審査対象論文は,前年の1月1日以降12月31日までに発行された「精密工学会誌」お よび「Precision Engineering 誌」に掲載された計測関連分野および加工・制御関連分野の論文等(以下「論文」という)とする. 贈賞は,原則として毎年2分野につきそれぞれ1件以内とする.

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    本研究では,蛍光偏光法を用いたナノ粒子の粒径計測法を提案している.提案手法では,ナノ粒子に蛍光プローブを標識し,その蛍光信号の偏光状態から粒子の回転拡散係数本報を測定し,その値から粒径を評価する.本報では,提案手法の実現可能性を開発した回転拡散係数測定システムを用いて検証している.基礎実験として金ナノ粒子サンプルの回転拡散係数の測定を行った結果,提案手法よりナノ粒子の粒径を測定できる可能性が示された.

Papers

  • Measurement of number-weighted particle size distribution for CMP slurry using nanoparticle chip Reviewed International journal

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    Precision Engineering   86   203 - 212   2024.3

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: https://doi.org/10.1016/j.precisioneng.2023.12.012

    Repository Public URL: https://hdl.handle.net/2324/7174463

  • ナノ粒子チップを用いた多分散ナノ粒子の粒度分布計測 Invited Reviewed International journal

    朱 家慶, 林 照剛, 黒河 周平

    日本機械学会論文集   86 ( 892 )   p. 20-00220 - p. 20-00220   2020.12

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    Language:Japanese   Publishing type:Research paper (scientific journal)  

    For poly-dispersed nanoparticles, which have more than two peaks on their particle size distribution (PSD), it is important to determine the mean particle diameter and their dispersion at each peak in a liquid. Dynamic Light Scattering (DLS), that is one of a typical nanoparticle sizing method, has difficulty to determine the several peaks in the PSD for the poly-dispersed particles. On the other hand, Image analysis methods (IA) can distinguish the peak for both the primary particle and secondary particle in the PSD of poly-dispersed particles accurately. However, IA is a time-consuming method and it is difficult to apply the measurement of the PSD due to the requirement of measuring the large number of particles, one by one. The particles in the liquid are transferred to a substrate in air when observing the particle to measure their size and the size distribution. In this procedure, some particles usually aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in liquid and that of the particles on the substrate. In this study, we suggest a novel particle sizing method using “Nanoparticle chip”, that is nanoparticles grid on the substrate to maintain the poly-dispersed condition in the liquid, to develop IA for measuring the poly-dispersed particles in liquid. The dispersed condition of the particle on Nanoparticle chip can be kept from the condition in liquid when the particles are transferred to the substrate in air. Therefore, measuring the PSD on Nanoparticle chip is equal to measure the PSD in the liquid. In this paper, in order to verify the feasibility of the nanoparticle sizing using Nanoparticle chip to measure the PSD for poly-dispersed particles in the liquid, we performed a fundamental experiment to fabricate the Nanoparticle chip and to determine the PSD for poly-dispersed particles. In this report, it is reported that the PSD for the poly-dispersed particles, which is the mixture of 152nm particle and 498nm particle, using Nanoparticle chip.

    DOI: https://doi.org/10.1299/transjsme.20-00220

  • Nanoparticle sizing method based on fluorescence anisotropy analysis Reviewed International journal

    Terutake Hayashi

    Measurement   vol. 59   382 - 388   2015.1

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    Language:English   Publishing type:Research paper (scientific journal)  

  • 蛍光偏光法を用いたナノ粒子粒径計測に関する研究(第2 報)-DNA プローブの回転拡散係数評価に基づく粒径計測手法の提案- Reviewed

    林 照剛, 石崎佑樹, 道畑正岐, 高谷裕浩, 田中慎一

    精密工学会   80 ( 10 )   956 - 960   2014.10

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    Language:Japanese   Publishing type:Research paper (scientific journal)  

    The nanoparticle is key materials in the area of nanotechnology, and there is a strong demand to measure the particle size accurately and easily. We proposed a novel nanoparticle sizing method based on fluorescence polarization analysis, and constructed the rotational diffusion coefficient measurement system using fluorescent DNA probe (fl-DNA). Nano particle sizing is achieved by measuring the rotational diffusion coefficient of fl-DNA, which is labeled to nanoparticle. In this report, we investigate the relation between the rotational diffusion coefficient of fl-DNA and the size of the nano particles standard. The rotational diffusion coefficients of gold nanoparticles of diameters from 6 nm to 20 nm were measured using
    the proposed method.

  • 蛍光偏光法を用いたナノ粒子粒径計測に関する研究(第1報)-蛍光DNAプローブを用いた回転拡散係数測定システムの開発- Reviewed

    石崎佑樹,林 照剛,道畑正岐,高谷裕浩

    精密工学会   80 ( 3 )   214 - 219   2014.9

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    Language:Japanese   Publishing type:Research paper (scientific journal)  

  • Measurement of probe-stylus sphere diameter for micro-CMM based on spectral fingerprint of whispering gallery modes Reviewed International journal

    Masaki Michihata, Terutake Hayashi, Atushi Adachi, Yasuhiro Takaya

    CIRP   63 ( 1 )   469 - 472   2014.8

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    Language:English   Publishing type:Research paper (scientific journal)  

  • ポリグリセロール修飾ナノダイヤモンドを用いた銅膜の平坦化加工に関する研究 Reviewed

    村井亮太,高谷裕浩,林 照剛,道畑正岐,小松直樹

    砥粒加工学会   58 ( 2 )   97 - 102   2014.2

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    Language:Japanese   Publishing type:Research paper (scientific journal)  

  • パルストレインビームを用いたコヒーレントフォノン励起加工に関する研究(第一報) ーコヒーレントフォノン励起加工システムの構築と加工基礎実験ー Reviewed

    林 照剛, 福田悠介, 道畑正岐, 高谷裕浩

    精密工学会   80 ( 9 )   867 - 872   2014.2

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    Language:Japanese   Publishing type:Research paper (scientific journal)  

  • Development of nanoparticle sizing system using fluorescence polarization Reviewed International journal

    Terutake Hayashi, Masaki Michihata, Yasuhiro Takaya, and Kok Fonog Lee

    ACTA IMEKO   2 ( 2 )   67 - 72   2013.12

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Development of an Optical Heterogeneity Evaluation System Using Phase-Shift Digital Holography Reviewed International journal

    Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Key Engineering Materials   523-524   865 - 870   2012.11

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Development of a Novel Surface Processing System Using Femtosecond Pulse Train Reviewed International journal

    Yusuke FUKUTA, Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Key Engineering Materials   523-524   220 - 225   2012.11

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    Language:English   Publishing type:Research paper (scientific journal)  

  • A Novel Batch Fabrication of Micro Parts Using DNA Pattern Recognition Reviewed International journal

    Masafumi YASUDA, Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Key Engineering Materials   523-524   598 - 603   2012.11

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Evaluation of Optical Heterogeneity Using Phase-Shift Digital Holography Reviewed International journal

    Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    International Journal of Nanomanufacturing   8 ( 5-6 )   508 - 521   2012.8

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Development of Nanoparticle Sizing System Integrated with Optical Microscopy Using Fluorescence Polarization Reviewed International journal

    Terutake HAYASHI, Yasuhiro TAKAYA, and Masaki MICHIHATA

    International Journal of Nanomanufacturing   8 ( 1-2 )   54 - 66   2012.1

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Chemical Mechanical Polishing of Patterned Copper Wafer Surface Using Water-Soluble Fullerenol Slurry Reviewed International journal

    Yasuhiro TAKAYA, Hirotaka KISHIDA, Terutake HAYASHI, Masaki MICHIHATA, and Ken KOKUBO

    CIRP   60 ( 1 )   567 - 570   2011.8

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Total Angle-Resolved Scattering: Characterization of Microlens Mold Surface Reviewed International journal

    Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Procedia Engineering   19   132 - 137   2011.1

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Investigation of surface excitation effect for ablation of 4H-SiC substrate using double-pulse beam Reviewed International journal

    Keigo Matsunaga, Terutake Hayashi, Syuhei Kurokawa, Hideaki Yokoo, Masaharu Nishikino, Noboru Hasegawa, Takayuki Kumada, Tomohito Otobe, Yasuhiro Takaya

    Springer Proceedings in Physics: X-Ray Lasers 2016/ICXRL 2016   2017.7

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip Reviewed International journal

    @Jiaqing Zhu, #Terutake Hayashi, #Syuhei Kurokawa

    International Journal of Automation Technology   Vol.74 ( March 2022 )   460 - 468   2017.7

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: https://doi.org/10.1016/j.precisioneng.2021.08.008

  • Particle Size Distribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe Reviewed International journal

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    International Conference on Planarization/CMP Technology (ICPT2016)   Vol.11 ( No.4 )   2017.7

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    Language:English   Publishing type:Research paper (international conference proceedings)  

  • A Novel Particle Sizing Method for Nano Abrasives in CMP Slurry by Using Fluorescent Nano Probe Reviewed International journal

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    International Journal of Automation Technology   Vol.11 ( No.4 )   2017.7

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Study on low power laser processing technique with instant surface excitation using femtosecond double pulse Reviewed International journal

    Keigo Matsunaga, Terutake Hayashi, Syuhei Kurokawa, Hideaki Yokoo, Masaharu Nishikino, Noboru Hasegawa, Takayuki Kumada, Tomohito Otobe, Yasuhiro Takaya

    Proceedings of 16th International conference of Precision Engineering   C305-8183-1 - C305-8183-4   2016.11

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    Language:English   Publishing type:Research paper (international conference proceedings)  

  • Planarization for Translucent Polycrystalline Alumina by Surface Polishing Technique Reviewed International journal

    Syuhei Kurokawa, Leo Hirashima, Terutake Hayashi, Keiichiro WATANABE, Hiroyuki TSUJI, Tomoki NAGAE

    Proceedings of 16th International conference of Precision Engineering   C111-8207-1 - C111-8207-4   2016.11

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    Language:English   Publishing type:Research paper (international conference proceedings)  

  • Planarization for Translucent Polycrystalline Alumina by Surface Polishing Technique Reviewed International journal

    Keigo Matsunaga, Terutake Hayashi, Syuhei Kurokawa, Hideaki Yokoo, Masaharu Nishikino, Noboru Hasegawa, Takayuki Kumada, Tomohito Otobe, Yasuhiro Takaya

    Proceedings of 16th International conference of Precision Engineering   C111-8207-1 - C111-8207-4   2016.11

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    Language:English   Publishing type:Research paper (international conference proceedings)  

  • Dynamics of spallation during femtosecond laser ablation studied by time-resolved reflectivity with double pump pulses Reviewed International journal

    Takayuki Kumada, Tomohito Otobe, Masaharu Nishikino, Noboru Hasegawa, Terutake Hayashi

    Applied Physics Letters   ( 108 )   011102-1 - 011102-4   2016.1

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    Language:English   Publishing type:Research paper (scientific journal)  

    DOI: 10.1063/1.4939231

  • Study on Nanoparticle Sizing Using Fluorescent Polarization Method with DNA Fluorescent Probe Reviewed International journal

    Terutake Hayashi, Yuki Ishizaki, Masaki Michihata, Yasuhiro Takaya, Shin-ichi Tanaka

    International Journal of Automation Technology   vol. 9 ( no. 5, )   534 - 540   2015.5

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Wide-Range Axial Position Measurement for Jumping Behavior of Optically Trapped Microsphere Near Surface Using Chromatic Confocal Sensor Reviewed International journal

    Terutake Hayashi

    International Journal of Optomechatronics   vol. 9 ( no. 2, )   131 - 140   2015.2

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Study on chemical interaction analysis of reactive fullerenol molecules in Cu-CMP using high-sensitive Raman spectroscopy Reviewed International journal

    Terutake Hayashi

    Key Engineering Materials   vol. 625   332 - 338   2015.1

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Surface Analysis of the Chemical Polishing Process Using a Fullerenol Slurry by Raman Spectroscopy under Surface Plasmon Excitation Reviewed International journal

    Yasuhiro TAKAYA, Masaki MICHIHATA, Terutake HAYASHI, Ryota MURAI, and Kazumasa KANO

    CIRP   62 ( 1 )   571 - 574   2013.8

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    Language:English   Publishing type:Research paper (scientific journal)  

  • New Technique of Single-Beam Gradient-Force Laser Trapping in Air Condition Reviewed International journal

    Masaki MICHIHATA, Tadaaki YOSHIKANE, Terutake HAYASHI, and Yasuhiro TAKAYA

    International Journal of Optomechatronics   7   46 - 59   2013.7

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Dimensional Measurement of Microform with High Aspect Ratio Using an Optically Controlled Particle with Standing Wave Scale Sensing Reviewed International journal

    Yasuhiro TAKAYA, Masaki MICHIHATA, Terutake HAYASHI, and Taisuke WASHITANI

    CIRP   61 ( 1 )   479 - 482   2012.8

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Improvement of Laser Trapping Based Microprobe in Laser Shaded Condition Reviewed International journal

    Masaki MICHIHATA, Yasuhiro TAKAYA, and Terutake HAYASHI

    Journal of Advanced Mechanical Design, Systems, and Manufacturing   6 ( 6 )   764 - 770   2012.6

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    Language:English   Publishing type:Research paper (scientific journal)  

  • Scanning Type Microprobe for Displacement Measurement Based on Standing Wave Detection Using an Optically Trapped Particle Reviewed International journal

    Yasuhiro TAKAYA, Masaki MICHIHATA, and Terutake HAYASHI

    International Journal of Automation Technology   5 ( 3 )   395 - 402   2011.3

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    Language:English   Publishing type:Research paper (scientific journal)  

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Books

  • よくわかる実験技術・学術用語「マイクロ光造形」

    林 照剛( Role: Joint author)

    日本実験力学会  2008.9 

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    Responsible for pages:pp. 114-115   Language:Japanese   Book type:Scholarly book

  • CMP用超親水性フラーレン研磨スラリーの研磨特性

    林 照剛( Role: Joint author)

    技術情報協会  2006.2 

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    Responsible for pages:pp. 91-103   Language:Japanese   Book type:Scholarly book

Presentations

  • Measurement of number-weighted particle size distribution for poly-dispersed particles using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    The 19th International Conference on Precision Engineering (ICPE2022 in Nara)  2022.11 

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    Event date: 2022.11 - 2022.12

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Nanoparticle sizing for CMP slurry using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    The 10th International Conference on Leading Edge Manufacturing in 21st Center(LEM21)  2021.11 

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    Event date: 2021.11

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Measurement of molar concentration spectrum based on number-weighted particle size distribution for poly-dispersed particles using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    2021.11 

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    Event date: 2021.8 - 2021.9

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    18th International Conference on Precision Engineering  2020.11 

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    Event date: 2020.11

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Study on particle size distribution measurement using nanoparticle micro array International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    International Symposium on Measurement Technology and Intelligent Instruments  2020.7 

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    Event date: 2019.9

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • A novel nano particle characterizing method using nano particle micro array International conference

    Terutake Hayashi, Syuhei KUROKAWA and Zhu Jiaqing

    International conference on precision engineering 2018  2018.11 

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    Event date: 2018.11

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Dynamics of photo-excitation for the ablation of 4H-SiC substrate using femtosecond laser International conference

    Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masuhara NISHIKINO, Yoji MATSUKAWA

    the 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21)  2017.11 

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    Event date: 2017.11 - 2016.11

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • 周波数分解光ゲート法を用いた半導体ウェハ表面の非接触光計測に関する研究

    林 照剛, 黒河 周平, 横尾英昭, 王成武, 松川洋二

    日本機械学会生産加工部門 部門講演会  2014.11 

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    Event date: 2014.11

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:徳島大学   Country:Japan  

    We proposed a novel optical surface inspection method to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on a cross correlation frequency resolved optical gating method, is applied to evaluate the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Study on diffusion coefficient evaluation for free abrasives and chemicals by using fluorescent anisotropy analysis International conference

    2014.10 

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    Event date: 2014.10

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Taiwan Tech, Taipei, Taiwan   Country:Japan  

    CMP (Chemical Mechanical Polishing/ Planarization) for semiconductor production has become increasingly important to integrate the multi-layer circuits. CMP is a process of smoothing wafers surface with the both chemical reaction in slurry and mechanical polishing by using polishing pad and abrasives. In this research, we aim at the high-efficiency and high quality CMP of semiconductor wafer. We investigate fundamental property of CMP process in the aspect of polishing and alternation based on observing the diffusion of abrasive and chemicals. We consider the translational diffusion is related to the frequency of the contact for the free abrasives and chemicals on the surface of the material. Thus, the translational diffusion coefficient is considered to be related the change of the surface integrity and the material processing properties, such as removal rate, surface roughness, and flatness. In this paper, we suggest a novel measurement method for the translational diffusion coefficient based on the measurement of the fluidity of the slurry. The fluidity of slurry is measured by using fluorescence anisotropy analysis. We develop a system for measuring fluidity of slurry by using a fluorescent probe. The fundamental experiments are performed to verify the feasibility of the proposed method.

  • Double pulse laser processing for carbon coated SiO2 target using near IR beam International conference

    Terutake Hayashi, Yuki Hirotsu, Syuhei Kurokawa, Keigo Matsunaga, Noboru Hasegawa,Masaharu Nishikino

    Optics & Photonics International Congresss 2019  2019.4 

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    Event date: 2020.4

    Language:English   Presentation type:Symposium, workshop panel (public)  

    Country:Japan  

  • フェムト秒レーザを用いたダブルパルスビームによる励起状態面の表面加工に関する研究(第九報)―加工変質層の元素組成評価―

    松永啓伍 林照剛 黒河周平 廣津佑紀 松川洋二

    2018年度精密工学会春期全国大会  2018.3 

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    Event date: 2018.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京理科大学 野田キャンパス   Country:Japan  

  • Investigation of surface excitation effect for ablation of 4H-SiC substrate using double-pulse beam International conference

    ICXRL 2016  2017.5 

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    Event date: 2017.5

    Language:English  

    Country:Japan  

  • Study on low power laser processing technique with instant surface excitation using femtosecond double pulse

    Terutake Hayashi

    16th International conference of Precision Engineering  2016.11 

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    Event date: 2016.11

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Particle Size Distribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe

    International Conference on Planarization/CMP Technology (ICPT2016)  2016.10 

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    Event date: 2016.10 - 2017.5

    Language:English   Presentation type:Oral presentation (general)  

    Country:China  

  • 細胞機能解析のためのナノニードル搭載型バイオプローブの開発(第 13 報) ―細胞内 TERS イメージングによる生体分子のダイナミクス観察―

    伊藤康治, 宮崎 剛, 林 照剛, 永井萌土, 柴田隆行

    2016年度精密工学会春期全国大会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京理科大学 野田キャンパス   Country:Japan  

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究(第3報)-表面励起効果の検討-

    林 照剛, 横尾 英昭, 松永 啓伍, 松川洋二, 王 成武, 黒河 周平

    2016年度精密工学会春期全国大会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京理科大学 野田キャンパス   Country:Japan  

  • 蛍光ナノプローブを用いたブラウン運動解析に基づくナノ粒子粒径計測

    世利俊樹, 林 照剛, 黒河 周平

    2016年度精密工学会春期全国大会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京理科大学 野田キャンパス   Country:Japan  

  • 先端的難加工基板の高効率精密加工法の研究(第 6 報) -fs レーザ照射による疑似ラジカル場形成基板表面の CMP 研磨特性-

    黒河 周平, 王 成武, 土肥 俊郎, 佐野 泰久, 會田 英雄, 大山 幸希, 林 照剛, 吹春昇

    2016年度精密工学会春期全国大会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京理科大学 野田キャンパス   Country:Japan  

  • コロイダルセリア砥粒による石英ガラス基板研磨―KOH添加による砥粒凝集状態と研磨レート調査

    外山 貴彬, 林 照剛, 黒河 周平

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • 三次元座標測定機能を有する歯車測定機の開発   ―はすば歯車の軸直角断面スキャニング測定手法の考案―

    寺岡 孝, 上杉健輔, 黒河 周平, 田口 哲也, 林 照剛, 松川 洋二

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • 高圧ジェットを用いたCMP用ソフトパッド表面の洗浄効果―回転速度と噴霧圧力による残留シリカ除去効果

    徳本勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • 静電誘引型スプレーを用いたTSV向けレジスト成膜に関する研究―対向電極を用いた成膜パターンの精密化

    内山雄介, 黒河 周平, 林 照剛, 宮地 計二, 小林 義典, 松尾 一壽

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • 蛍光プローブを用いたナノ粒子の粒径計測技術に関する研究

    世利俊樹, 林 照剛, 黒河 周平

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • フェムト秒レーザーを用いたダブルパルスビームによる励起状態面の半導体表面加工に関する研究

    横尾 英昭, 林 照剛, 松永 啓伍, 王 成武, 松川洋二, 黒河 周平

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • CMPハードパッドにおける高圧ジェット洗浄効果の定量評価―噴射圧力および噴射距離と洗浄効果

    北村 将, 徳本勇太, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • エンドミル工具摩耗のインプロセス検出に関する研究―ボールエンドミルにおける検出信号について

    鳥居徹也, Gouarir Amine, 村田光昭, 黒河 周平, 松川洋二, 林 照剛

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:熊本大学   Country:Japan  

  • フェムト秒レーザー励起を用いた表面ナノ加工に関する研究

    林 照剛, 横尾 英昭, 黒河 周平, 松永 啓伍, 王 成武, 松川洋二

    2016年度 日本機械学会 生産システム部門研究発表講演会  2016.3 

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    Event date: 2016.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東京理科大学 野田キャンパス   Country:Japan  

  • 蛍光プローブを用いた砥粒のブラウン運動評価に関する研究

    世利 俊樹, 黒河 周平, 林 照剛

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • 三次元座標測定機能を有する歯車測定機の開発―はすば歯車断面スキャニング測定の歯形誤差評価―

    寺岡 孝, 宇都宮 勇貴, 黒河 周平, 松川洋二, 林 照剛, 田口 哲也

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • CMPハードパッドにおける高圧ジェット洗浄効果の定量評価―定盤回転速度および洗浄時間と洗浄効果―

    北村 将, 徳本勇太, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • コロイダルセリア砥粒を用いた石英ガラス基板研磨~pH調整による高品位・高能率研磨~

    外山 貴彬, 黒河 周平, 林 照剛

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • エンドミル工具摩耗のインプロセス検出に関する研究―検出結果の切削速度非依存性について―

    鳥居徹也, Gouarir Amine, 黒河 周平, 松川洋二, 林 照剛, 村田光昭

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • フェムト秒レーザーを用いたダブルパルスビームによる表面励起現象を利用した表面加工に関する研究

    横尾 英昭, 松永 啓伍, 林 照剛, 王 成武, 黒河 周平, 松川洋二

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • 高圧ジェットを用いたCMP用ソフトパッド表面の洗浄効果―定盤の回転速度と噴霧圧力による洗浄効果―

    徳本勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • 静電誘引形スプレーを用いたレジスト成膜に関する研究―電圧切替によるレジスト膜の部分膜厚制御―

    内山雄介, 黒河 周平, 林 照剛, 宮地 計二, 小林 義典, 松尾 一壽

    2015年度 精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:九州工業大学   Country:Japan  

  • ダブルパルスビームを用いた時間分解表面励起加工に関する研究

    林 照剛, 横尾 英昭, 松永 啓伍, 王 成武, 松川洋二, 黒河 周平

    2015年度電気加工学会全国大会  2015.12 

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    Event date: 2015.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:四国大学交流プラザ(徳島)   Country:Japan  

  • A study on fluorescence polarization method for analyzing diffusional movement of abrasive grain in CMP slurry International conference

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    The 8th International Conference on Leading Edge Manufacturing in 21st Century  2015.10 

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    Event date: 2015.10

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet International conference

    Masashi Kitamura, Syuhei Kurokawa, Terutake Hayashi, Yuta Tokumoto, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh

    2015 International Conference on Planarization/CMP Technology (2015 ICPT)  2015.9 

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    Event date: 2015.9 - 2015.10

    Language:English   Presentation type:Oral presentation (general)  

    Country:United States  

  • Brownian diffusion analysis for nano-abrasives in CMP slurry by using fluorescence polarization method International conference

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    2015 International Conference on Planarization/CMP Technology (2015 ICPT)  2015.9 

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    Event date: 2015.9 - 2015.10

    Language:English   Presentation type:Oral presentation (general)  

    Country:United States  

  • A novel measurement method for Brownian diffusion of nano-abrasives in CMP slurry International conference

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    12th International Symposium on Measurement Technology and Intelligent Instruments  2015.9 

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    Event date: 2015.9

    Language:English   Presentation type:Oral presentation (general)  

    Country:Taiwan, Province of China  

  • Hollow-Nanoneedle-Based AFM Probe for Electrokinetic Intracellular Delivery and Intracellular TERS Imaging International conference

    Takayuki Shibata, Goh Miyazaki, Terutake Hayashi, Moeto Nagai

    41st international conference on micro- and nanofabrication and manufacturing using lithography and related techniques  2015.9 

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    Event date: 2015.9

    Language:English   Presentation type:Oral presentation (general)  

    Country:Netherlands  

  • 歯底・歯元を含めたはすば歯車の断面スキャニング測定 ―ねじれ角によるスタイラスの歯車軸方向変位の影響―

    寺岡 孝, 上杉健輔, 黒河 周平, 田口 哲也, 林 照剛, 松川 洋二

    日本機械学会2015年度年次大会  2015.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:北海道大学   Country:Japan  

  • フェムト秒レーザーを用いた半導体表面励起加工に関する研究

    林 照剛, 横尾英昭, 王成武, 松川 洋二, 黒河 周平

    日本機械学会2015年度年次大会  2015.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:北海道大学   Country:Japan  

    Recently, femtosecond laser ablation technique is widely appied to process the hard metal, tranparent materials without thermal effects. We consider the femtosecond laser ablation technique has possibility to process the surface limitation area of semiconducter material. Thus We construct the experimental setup to process the semiconductor surface and investigate a fundamental property for surface processing with surface excitation by using double pulse beam. In this report, we investigate the damage threshold on Si by varying the pulse duration.

  • 低照度フェムト秒レーザー照射後の半導体表面の光反射率変化の計測

    林 照剛,松永啓伍,黒河周平,松川洋二

    日本機械学会2018年度年次大会  2018.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:関西大学   Country:Japan  

  • CMP スラリー中のナノ粒子粒径評価に関する研究

    林 照剛,黒河 周平,草場 博喜,赤星 圭介,松川 洋二

    日本機械学会2018年度年次大会  2018.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:関西大学   Country:Japan  

  • フェムト秒レーザーを用いたダブルパルス照射による励起状態面の表面加工に関する研究

    横尾英昭, 林 照剛, 王成武, 松川 洋二, 黒河 周平

    精密工学会秋期全国大会  2015.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東洋大学   Country:Japan  

    We propose a novel surface processing method for semiconductor wafer by using femtosecond pulse laser. The double pulse within sub-picosecond duration is applied for instant stimulation for semiconductor surface. In this paper, we compare the processing thresholds for Ge wafer for both the double pulse irradiation within sub-picosecond duration and single pulses irradiation with 100 ms duration

  • 蛍光偏光法を用いたCMPスラリーの粘性係数測定による砥粒拡散現象評価

    世利俊樹, 林 照剛, 黒河 周平

    精密工学会秋期全国大会  2015.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東北大学   Country:Japan  

    We investigate the Brownian motion of abrasive grains in slurry for CMP process. We suggest a novel evaluation method of translational diffusion coefficient of Brownian motion by using florescence polarization method. In this paper, we verify the feasibility of the proposed method. We perform the fundamental experiment to measure the viscosity coefficient for both deionized water without the abrasive grains and the liquid with dispersing standard   particle are consistent with reference value.

  • 高圧ジェットを用いたCMP用ソフトパッド表面の洗浄効果

    徳元 勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    精密工学会秋期全国大会  2015.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東北大学   Country:Japan  

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究(第2報)-加工エネルギー閾値の検討-

    林 照剛, 横尾英昭, 王成武, 松川 洋二, 黒河 周平

    精密工学会秋期全国大会  2015.9 

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    Event date: 2015.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東北大学   Country:Japan  

    One of the unique aspects of femtosecond radiation is the excitation of coherent phonon in the pico-second order duration. We propose a surface processing method with excitation of coherent phonon by using femto pulse train beam. Currently, we are exploring the basic mechanisms of femtosecond laser processing with exicitation of coherent phonon. In this report, we investigate the damage threshold for surface processing on Si by using double pulse beam.

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究

    林 照剛, 黒河 周平

    精密工学会春期全国大会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東洋大学   Country:Japan  

    In ultrafast time domain, the laser processing with little thermal effect could be achieved by using repetitive exposure of femto second pulse. We propose a novel surface processing method with excitation of coherent phonon by using double pulse within ten pico second pulse duration. The coherent phonon is a synchronous phonon oscillation for multiple phonons. In this paper, we report the fundamental experiment to investigate the processing property of femto pulse train beam as compared to femto second single pulse.

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究

    林 照剛, 横尾英昭, 王成武, 松川 洋二, 黒河 周平

    精密工学会春期全国大会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:東洋大学   Country:Japan  

    In ultrafast time domain, the laser processing with little thermal effect could be achieved by using repetitive exposure of femto second pulse. We propose a novel surface processing method with excitation of coherent phonon by using double pulse within ten pico second pulse duration. The coherent phonon is a synchronous phonon oscillation for multiple phonons. In this paper, we report the fundamental experiment to investigate the processing property of femto pulse train beam as compared to femto second single pulse.

  • 加工雰囲気の違いによるSiCウエハの研磨特性

    張 吉, 黒河 周平, 林 照剛, 王 成武, 浅川 英志, 檜山 浩國

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 三次元座標測定機能を有する歯車測定機の開発ー歯車全周スキャニング測定のはすば歯車への応用ー

    寺岡 孝, 上杉 健輔, 田口 哲也, 黒河 周平, 林 照剛, 松川 洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 三次元座標測定機能を有する歯車測定機の開発ー歯車全周スキャニング測定のはすば歯車への応用ー

    寺岡 孝, 上杉 健輔, 田口 哲也, 黒河 周平, 林 照剛, 松川 洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 静電誘引形スプレーを用いたレジスト成膜に関する研究 マルチノズル形状による成膜の高効率化

    内山 雄介, 佛淵友彬, 黒河 周平, 林 照剛, 宮地 計二,小林 義典, 松尾 一壽

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 研磨用ソフトパッドの表面状態の観察および高圧ジェットの効果

    徳元 勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 福永 明, 檜山 浩國

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 異なる表面粗さを有する被測定物の高精度三次元測定機における スキャニング測定-スタイラスチップ挙動の繰り返し性評価-

    藤岡 拓寛, 黒河 周平, 林 照剛, 松川 洋二, 寺岡 孝

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 歯車全周スキャニング測定と作用歯面部の曲面形状解析 ―歯車のピッチ誤差計算における新評価手法の提案―

    上杉 健輔, 寺岡 孝, 田口 哲也, 黒河 周平, 林 照剛, 松川 洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 静電誘引形スプレーを用いたTSVおよびMEMS向けレジストパターンコーティングに関する研究

    佛淵友彬, 内山 雄介, 黒河 周平, 林 照剛, 宮地 計二,小林 義典, 松尾 一壽

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 歯車全周スキャニング測定と作用歯面部の曲面形状解析 ―歯車のピッチ誤差計算における新評価手法の提案―

    上杉 健輔, 寺岡 孝, 田口 哲也, 黒河 周平, 林 照剛, 松川 洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date: 2015.3

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:福岡工業大学   Country:Japan  

  • 異なる表面粗さを有する被測定物のスキャニング測定におけるスタイラスチップ挙動への影響

    藤岡拓寛, 黒河 周平, 林 照剛, 松川 洋二, 上杉健輔, 寺岡 孝

    精密工学会 九州支部講演会  2014.12 

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    Event date: 2014.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:鹿児島大学   Country:Japan  

    近年,高精度三次元測定の普及が高まり,それに伴い多種多様な被測定物に対する高精度測定の要求が高くなってきている.その中でも,異なる表面粗さを有する被測定物を測定する際に,表面粗さがスタイラスチップの挙動に影響を与えていると考えられる.そこで高精度三次元測定機のスキャニング測定において,測定物表面粗さによるスタイラスチップ挙動への影響を確認し,測定結果との関係を調査した.

  • 高圧ジェットによるコンディショニングの評価

    徳元 勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 福永 明, 檜山 浩國

    精密工学会 九州支部講演会  2014.12 

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    Event date: 2014.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:鹿児島大学   Country:Japan  

    現在の研磨パッドコンディショニング技術であるダイヤモンドコンディショニングは表面を削り取る作用のためパッドの寿命が短い問題を抱えている.そこで超純水による高圧ジェットを用いたコンディショニングが考案された.研磨後の研磨パッドに高圧の純水を噴射し,その効果を検討するためにパッド表面の走査型電子顕微鏡(SEM)による観察をおこなった.コンディショニング前後の違いの観察により,高圧ジェットによるCMP研磨パッドのコンディショニング法としての有効性を示した.

  • 三次元測定機能を有する歯車測定機の開発 ―全周スキャニング測定における歯形誤差の繰り返し性評価―

    寺岡孝, 上杉健輔, 黒河 周平, 松川 洋二, 林 照剛, 田口哲也

    精密工学会 九州支部講演会  2014.12 

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    Event date: 2014.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:鹿児島大学   Country:Japan  

    歯車は様々な機械に幅広く用いられる機械要素であるため,その精度を保証する歯車測定技術は非常に重要である.本研究では,3Dスキャニングプローブを付加することで,従来では測定が困難であった歯元・歯底形状の測定ができる歯車測定機の開発を目的としている.加えて,従来機より高速・高機能でかつ汎用性の高い測定機を目指している.本稿では,開発機で測定した平歯車全周測定データから作用歯面の形状誤差の1つである歯形誤差を抽出し,繰り返し性について評価を行った.

  • 静電誘引形スプレーを用いたレジスト膜の部分膜厚制御に関する研究

    佛淵 友彬, 内山 雄介, 黒河 周平, 林 照剛, 宮地 計二,小林 義典, 松尾 一壽

    精密工学会 九州支部講演会  2014.12 

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    Event date: 2014.12

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:鹿児島大学   Country:Japan  

    電子システムの小型化に伴い,LSIチップやMEMSチップの異種デバイスを一体化する技術,特に基板の三次元実装技術の開発が急がれている.そこに不可欠なTSV(Trough-Silicon Via:貫通電極)作成のためのレジスト塗布において,立体構造に対して均一かつ高効率に成膜をする必要がある.本研究では,静電誘引形スプレーの印加電圧の外部制御機能を用いてフォトレジストのパターン成膜実験を行った.その中で,スプレー状態変化の観察や,電圧応答性の改善を確認することができた.

  • Processing Characteristics of SiC Wafer by Consideration of Oxidization Effect in Different Atomospheric Environment International conference

    Syuhei Kurokawa, Terutake Hayashi

    International Conference on Planarization/CMP Technology  2014.11 

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    Event date: 2014.11

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • 周波数分解光ゲート法を用いた半導体ウェハ表面の非接触光計測に関する研究

    林 照剛, 黒河 周平

    日本機械学会生産加工部門部門講演会  2014.11 

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    Event date: 2014.11

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:徳島大学   Country:Japan  

    We proposed a novel optical surface inspection method to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on a cross correlation frequency resolved optical gating method, is applied to evaluate the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Development of gear measuring machine  for whole scanning method of cylindrical gear outline and evaluation of tooth root and toot profile deviation International conference

    林 照剛

    2014.10 

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    Event date: 2014.10

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Taiwan Tech, Taipei, Taiwan   Country:Japan  

    Measurement of tooth root and bottom profiles is very important to analyze bending fatigue of gear teeth. But, it is hard to measure those profiles with a conventional Gear Measuring Machine (GMM), because tooth root and bottom consists of free-formed surface and a conventional GMM is equipped with a probe to measure only one-axis displacement. Therefore the authors try to develop a new GMM which can accurately measure not only working flanks but also tooth root and bottom profiles by installing a 3D scanning probe, which results in multiple functions and time reduction measurement.
    A new method for measurement is adopted into the developed GMM by scanning the whole shape of a gear outline without detaching a stylus tip from a gear surface in order to obtain the measuring data of whole gear outline including tooth flanks, tip, root and bottom profiles. The measured data are used to evaluate geometrically tooth root and profile deviations. The proposed method is verified by comparing the profile deviations with those measured by a conventional GMM.

  • Hybrid X-FROG法を用いたウェハ表面の非接触光計測技術に関する研究 International conference

    林 照剛, 黒河 周平

    精密工学会秋期全国大会  2014.9 

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    Event date: 2014.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:鳥取大学   Country:Japan  

    We proposed a novel optical surface inspection method for to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on cross correlation frequency resolved optical gating method, for the femto pulse reflected on the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Hybrid X-FROG法を用いたウェハ表面の非接触光計測技術に関する研究

    林 照剛, 黒河 周平

    2014年度 精密工学会 秋期全国大会  2014.9 

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    Event date: 2014.9

    Language:Japanese   Presentation type:Oral presentation (general)  

    Venue:鳥取大学   Country:Japan  

    We proposed a novel optical surface inspection method for to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on cross correlation frequency resolved optical gating method, for the femto pulse reflected on the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Study on nanoparticle sizing using fluorescent polarization method with DNA fluorescent probe International conference

    2014.9 

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    Event date: 2014.9

    Language:English   Presentation type:Oral presentation (general)  

    Venue:Tsukuba   Country:Japan  

    A fluorescent polarization method is well known for the detection of complementary base pairing of DNA in biological field. The fluorescent polarization method (FP) measures the rotational diffusion coefficient of Brownian motion of the fluorescent particle in the solution. The rotational diffusion coefficient is corresponding to inverse third power of diameter due to the Einstein Stokes Relation for nanoparticle as hard sphere.
    We develop a novel rotational diffusion coefficient measurement method by using a fluorescent probe with DNA spacer, which is connected to particle. We investigate the relation between the gold nanoparticle and the fluorescent probe in order to verify the feasibility of the proposed method. The rotational diffusion coefficients of gold nanoparticles, whose diameters are from 5 nm to 20 nm, are evaluated by using the developed system. In this paper we describe the method of fluorescent polarization method by using fluorescent DNA probe (fl-DNA).

  • Surface Processing Using a Femtosecond Pulse Train Beam International conference

    Terutake Hayashi

    The 15th International Conference on Precision Engineering (2014)  2014.7 

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    Event date: 2014.7

    Language:English   Presentation type:Oral presentation (general)  

    Country:Japan  

  • Study on surface processing by using femto-second pulse train beam with excitation of coherent phonon International conference

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    Event date: 2013.10

    Presentation type:Oral presentation (general)  

    Country:United States  

  • Development of nanoparticles sizing method based on fluorescence polarization International conference

    Y.Ishizaki, T.Hayashi, M.Michihata, Y.Takaya,

    ISMQC2013 

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    Event date: 2013.9

    Presentation type:Oral presentation (general)  

    Country:Poland  

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MISC

  • ダブルパルスビームを用いた低照度フェムト秒レーザー加工

    林 照剛, 黒河 周平

    塑性と加工   2016.11

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    Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (scientific journal)  

  • フェムト秒レーザーによるコヒーレントフォノン励起加工の可能性

    林 照剛, 黒河 周平, 高谷裕浩

    光アライアンス   2015.10

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    Language:Japanese   Publishing type:Article, review, commentary, editorial, etc. (scientific journal)  

Industrial property rights

Patent   Number of applications: 4   Number of registrations: 0
Utility model   Number of applications: 0   Number of registrations: 0
Design   Number of applications: 0   Number of registrations: 0
Trademark   Number of applications: 0   Number of registrations: 0

Professional Memberships

  • Japan Society of Mechanical Engineers

  • The Japan Society for Precision Engineering

  • The Japan Society for Abrasive Technology

  • 電気工学会

Committee Memberships

  • Steering committee member   Domestic

    2023.4 - 2024.3   

  • 日本機械学会九州支部   広報担当   Domestic

    2023.4 - 2024.3   

  • Organizer   Domestic

    2018.4 - 2019.3   

  • 精密工学会九州支部   庶務幹事   Domestic

    2018.4 - 2019.3   

  • Organizer   Domestic

    2016.4 - 2018.3   

  • 精密工学会九州支部   会計幹事   Domestic

    2016.4 - 2018.3   

  • Organizer   Domestic

    2016.4 - 2017.3   

  • 日本機械学会   生産加工・工作機械部門   Domestic

    2016.4 - 2017.3   

  • Organizer   Domestic

    2015.4 - 2017.3   

  • 日本機械学会   生産システム部門   Domestic

    2015.4 - 2017.3   

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Academic Activities

  • Screening of academic papers

    Role(s): Peer review

    2017

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    Type:Peer review 

    Number of peer-reviewed articles in foreign language journals:10

    Number of peer-reviewed articles in Japanese journals:7

    Proceedings of International Conference Number of peer-reviewed papers:3

  • 部門セッション企画委員(生産加工・工作機械部門,生産システム部門) International contribution

    機械学会年次大会  ( 九州大学 ) 2016.9

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    Type:Competition, symposium, etc. 

    Number of participants:2,000

  • セッションオーガナイザ International contribution

    精密工学会秋期全国大会  ( 茨城大学 ) 2016.9

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    Type:Competition, symposium, etc. 

    Number of participants:400

  • 座長(Chairmanship)

    精密工学会  ( 東洋大学 ) 2016.3

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    Type:Competition, symposium, etc. 

  • 座長(Chairmanship) International contribution

    2015.11 - 2013.11

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    Type:Competition, symposium, etc. 

  • 座長(Chairmanship)

    精密工学会  ( 東北大学 ) 2015.9

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    Type:Competition, symposium, etc. 

  • 座長(Chairmanship)

    精密工学会  ( 東洋大学 ) 2015.3

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    Type:Competition, symposium, etc. 

  • 座長(Chairmanship)

    機械学会九州支部 総会・講演会  ( 熊本大学 ) 2015.3

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    Type:Competition, symposium, etc. 

  • Publication Committee International contribution

    LMPMI2014  ( Epochal Esukuba Japan ) 2014.9

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    Type:Competition, symposium, etc. 

    Number of participants:200

  • 座長(Chairmanship)

    精密工学会  ( 東京大学 ) 2014.3

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    Type:Competition, symposium, etc. 

  • 座長(Chairmanship) International contribution

    2013.11

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    Type:Competition, symposium, etc. 

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Research Projects

  • アトグラム質点系のブラウン運動解析にもとづく高精度ナノ粒子粒度分布計測

    Grant number:19H02043  2019 - 2021

    日本学術振興会  科学研究費助成事業  基盤研究(B)

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    Authorship:Principal investigator  Grant type:Scientific research funding

  • フェムト秒レーザーを用いた光励起加工に関する研究

    2018.4 - 2019.3

    共同研究

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    Authorship:Principal investigator  Grant type:Other funds from industry-academia collaboration

  • フェムト秒レーザーを用いた光励起加工に関する研究

    2017.4 - 2018.3

    共同研究

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    Authorship:Principal investigator  Grant type:Other funds from industry-academia collaboration

  • フェムト秒レーザーを用いた光励起加工に関する研究

    2016.4 - 2017.3

    共同研究

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    Authorship:Principal investigator  Grant type:Other funds from industry-academia collaboration

  • 蛍光ナノプローブを用いたブラウン運動評価に基づく高精度ナノ粒子粒度分布解析

    Grant number:16H04249  2016 - 2018

    日本学術振興会  科学研究費助成事業  基盤研究(B)

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    Authorship:Principal investigator  Grant type:Scientific research funding

  • フェムト秒レーザーによる難加工性透明材料表面のダメージレス精密加工技術の開発

    2016 - 2017

    JST マッチングプランナー制度

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    Authorship:Principal investigator  Grant type:Contract research

  • フェムトパルストレインビームによるコヒーレントフォノン励起加工に関する研究

    2014

    レーザプロセッシング 一般研究開発助成(天田財団)

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    Authorship:Principal investigator  Grant type:Contract research

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Class subject

  • 加工プロセス演習

    2023.10 - 2024.3   Second semester

  • 精密加工学

    2023.10 - 2024.3   Second semester

  • 機械要素設計製図Ⅱ(B)

    2023.6 - 2023.8   Summer quarter

  • 機械工学実験第一

    2023.4 - 2023.9   First semester

  • 精密加工学

    2022.10 - 2023.3   Second semester

  • 加工プロセス演習

    2022.10 - 2023.3   Second semester

  • 機械工学実験第一

    2022.4 - 2022.9   First semester

  • 機械要素設計製図Ⅱ(B)

    2022.4 - 2022.6   Spring quarter

  • 精密加工学

    2021.10 - 2022.3   Second semester

  • 加工プロセス演習

    2021.10 - 2022.3   Second semester

  • 機械工学実験第一

    2021.4 - 2021.9   First semester

  • 機械要素設計製図Ⅱ(B)

    2021.4 - 2021.6   Spring quarter

  • 加工プロセス演習

    2020.10 - 2021.3   Second semester

  • 機械要素設計製図(B)

    2020.4 - 2021.3   Full year

  • 機械要素設計製図Ⅱ(Bクラス)

    2020.4 - 2020.6   Spring quarter

  • 機械要素設計製図Ⅱ(B)

    2020.4 - 2020.6   Spring quarter

  • 精密加工学

    2019.10 - 2020.3   Second semester

  • 加工プロセス演習

    2019.10 - 2020.3   Second semester

  • 創造設計

    2019.4 - 2019.9   First semester

  • 機械工学実験第一

    2019.4 - 2019.9   First semester

  • 機械要素設計製図Ⅱ

    2019.4 - 2019.6   Spring quarter

  • 機械要素設計製図Ⅰ(B)

    2018.12 - 2019.2   Winter quarter

  • 精密加工学

    2018.10 - 2019.3   Second semester

  • 加工プロセス演習

    2018.10 - 2019.3   Second semester

  • 精密加工学

    2018.10 - 2019.3   Second semester

  • 加工プロセス演習

    2018.10 - 2019.3   Second semester

  • 機械工学実験第一

    2018.4 - 2018.9   First semester

  • 機械工学実験第一

    2018.4 - 2018.9   First semester

  • 機械工学実験第一

    2018.4 - 2018.9   First semester

  • Mechanical and Aerospace Engineering Experiments Ⅰ

    2018.4 - 2018.6   Spring quarter

  • 加工プロセス演習

    2017.10 - 2018.3   Second semester

  • 機械要素設計製図

    2017.10 - 2018.3   Second semester

  • 創造設計

    2017.4 - 2017.9   First semester

  • 機械工学実験第一

    2017.4 - 2017.9   First semester

  • 機械工学実験第一

    2017.4 - 2017.9   First semester

  • 機械工学実験第一

    2017.4 - 2017.9   First semester

  • Mechanical and Aerospace EngineeringExperiments I

    2017.4 - 2017.6   Spring quarter

  • 精密加工学

    2016.10 - 2017.3   Second semester

  • 加工プロセス演習

    2016.10 - 2017.3   Second semester

  • 機械要素設計製図

    2016.10 - 2017.3   Second semester

  • 機械工学実験第一

    2016.4 - 2016.9   First semester

  • 日本語コミュニケーション

    2016.4 - 2016.9   First semester

  • 創造設計

    2016.4 - 2016.9   First semester

  • 加工プロセス演習

    2015.10 - 2016.3   Second semester

  • 精密加工学

    2015.10 - 2016.3   Second semester

  • 機械要素設計製図

    2015.10 - 2016.3   Second semester

  • 創造設計

    2015.4 - 2015.9   First semester

  • 機械工学実験第一

    2015.4 - 2015.9   First semester

  • 日本語コミュニケーション

    2015.4 - 2015.9   First semester

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FD Participation

  • 2024.1   Role:Participation   Title:機械工学部門FD 科研申請について気を付けていること

    Organizer:Undergraduate school department

  • 2023.11   Role:Participation   Title:機械工学部門FD 学生との関わりに活かすアサーション

    Organizer:Undergraduate school department

  • 2020.11   Role:Participation   Title:【機械系FD】学修目標を評価する意義と方法

    Organizer:University-wide

  • 2020.6   Role:Participation   Title:FD講演会「ルーブリックを活用した評価と授業改善」

    Organizer:[Undergraduate school/graduate school/graduate faculty]

  • 2017.6   Role:Participation   Title:機械工学部門前期FD

    Organizer:[Undergraduate school/graduate school/graduate faculty]

  • 2016.7   Role:Participation   Title:第一回工学部FD

    Organizer:[Undergraduate school/graduate school/graduate faculty]

  • 2015.7   Role:Participation   Title:機械工学部門前期FD

    Organizer:Undergraduate school department

  • 2014.4   Role:Participation   Title:第1回全学FD

    Organizer:University-wide

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Other educational activity and Special note

  • 2022  Class Teacher 

  • 2021  Class Teacher 

  • 2020  Class Teacher 

  • 2020  Class Teacher 

  • 2019  Class Teacher 

  • 2018  Class Teacher 

  • 2017  Class Teacher 

  • 2016  Class Teacher 

  • 2015  Class Teacher 

  • 2014  Class Teacher 

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Social Activities

  • 第12回 精密工学会九州支部 産学官技術交流セミナー

    精密工学会九州支部  福岡工業大学  2013.11

     More details

    Audience: General, Scientific, Company, Civic organization, Governmental agency

    Type:Lecture

  • ものづくり最前線2013

    日本機械学会生産加工部門,日本機械学会関西支部  大阪大学中之島センター  2013.11

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    Audience: General, Scientific, Company, Civic organization, Governmental agency

    Type:Lecture

    大学生,大学院生,高専生を対称とし,ものづくりの現場で活動する企業人の活動内容を紹介する.(2013年度は電気,材料,自動車,機械加工,計測)