Updated on 2025/06/11

Information

 

写真a

 
HAYASHI TERUTAKE
 
Organization
Faculty of Engineering Department of Mechanical Engineering Associate Professor
School of Engineering （Concurrent）
Graduate School of Engineering Department of Mechanical Engineering（Concurrent）
Title
Associate Professor
Contact information
メールアドレス
Homepage
External link

Research Areas

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Manufacturing and production engineering

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Measurement engineering

Degree

  • Ph.D (Engineering) （ 2001.3 Osaka University ）

Education

  • Osaka University   工学研究科   産業機械工学専攻博士後期課程

    1998.4 - 2001.3

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    Country：Japan

  • Osaka University   工学研究科   産業機械工学専攻博士前期課程

    1996.4 - 1998.3

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    Country：Japan

  • Osaka University   工学部   産業機械工学科

    1992.4 - 1996.3

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    Country：Japan

Research Interests・Research Keywords

  • Research theme： Number based particle sizing for nanoparitcle using Nano particle chip

    Keyword： nano particle chip, particle sizing, nano particle

    Research period： 2020.4

  • Research theme： Low power femto second laser processing with surface excitation using double pulse beam

    Keyword： laser ablation, femto second laser processing

    Research period： 2009.9

  • Research theme： Study on nano particle sizing based on brownian diffusion evaluation by using fluorescence nano probe.

    Keyword： fluorescence polarization, rotational diffusion coefficient, nano particle, particle sizing

    Research period： 2004.4

Awards

  • 砥粒加工学会賞論文賞

    2015.3   公益社団法人 砥粒加工学会   ポリグリセロール修飾ナノダイヤモンドを用いた同膜の平坦化加工に関する研究が砥粒加工学会賞論文賞を受賞した． 砥粒加工学会賞論文賞は,砥粒加工学会誌の過去1年間に掲載された論文を対象とし,内容が優 秀と認められるものに対して,砥粒加工およびその関連分野に関する学術を奨励し,砥 粒加工学の発展を促進することを目的として贈賞する.贈賞は原則として2件以内とし,該当する論文がない場合には,その年度は贈賞しない. 本年度は44編の論文から2編が受賞．

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    近年の半導体デバイスは多層構造と配線の微細化による高集積化に伴い高性能化しており，配線のさらなる多層化を行うためには各層間の十分な平坦化が必要となる．そこで平坦化加工技術として, 筆者らはポリグリセロールで修飾したナノダイヤモンド（Polyglycerol-functionalized Diamond Nanoparticles; ND-PG）を研磨砥粒とした新たな化学機械研磨（CMP）技術を提案している. ND-PGは，粒径が小さい，水分散性が良い, 金属元素を含まないなど，CMP研磨砥粒として望ましい性質を持っている. 本研究ではND-PGを用いたスラリーを試作し，配線金属の銅に対して研磨実験を行い，ND-PG砥粒を用いた研磨によってナノメートルオーダの平坦度・平滑面を実現した.

  • 精密工学会沼田記念論文賞

    2015.3   公益社団法人精密工学会   蛍光偏光法を用いたナノ粒子粒径計測に関する研究（第一報）ー蛍光DNAプローブを用いた回転拡散係数測定システムの開発ー　が精密工学会沼田記念論文賞を受賞した 本会に精密工学会沼田記念論文賞は,計測関連分野および加工・制御関連分野で,独創性のある論文を公表した著者を対象 とし,その努力と精進に報いるとともに,旺盛な研究意欲を高揚させることを目的として贈賞する．本賞の審査対象論文は,前年の1月1日以降12月31日までに発行された「精密工学会誌」お よび「Precision Engineering 誌」に掲載された計測関連分野および加工・制御関連分野の論文等(以下「論文」という)とする. 贈賞は,原則として毎年2分野につきそれぞれ1件以内とする.

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    本研究では，蛍光偏光法を用いたナノ粒子の粒径計測法を提案している．提案手法では，ナノ粒子に蛍光プローブを標識し，その蛍光信号の偏光状態から粒子の回転拡散係数本報を測定し，その値から粒径を評価する．本報では，提案手法の実現可能性を開発した回転拡散係数測定システムを用いて検証している．基礎実験として金ナノ粒子サンプルの回転拡散係数の測定を行った結果，提案手法よりナノ粒子の粒径を測定できる可能性が示された．

Papers

  • Measurement of number-weighted particle size distribution for CMP slurry using nanoparticle chip Reviewed International journal

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    Precision Engineering   86   203 - 212   2024.3

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    Language：English   Publishing type：Research paper (scientific journal)  

    Chemical mechanical polishing/planarization (CMP) slurry contains mainly abrasive grains (primary particles) with few aggregations (secondary particles). Measuring the particle size distribution (PSD) of CMP slurry is crucial for improving the productivity of the CMP process. For the quality management of CMP slurry, it is necessary to evaluate both the sizes and quantities of both the primary and secondary particles. Conventional PSD analysis methods, except for image analysis, face challenges in identifying primary and secondary particles for PSD measurements. For image analysis, the particles must be transferred from a suspension to a substrate using the conventional sampling method; however, this creates aggregates, resulting in a change in the PSD of the particles on the substrate compared to that in suspension under poly-dispersed conditions. Thus, this study proposed a novel particle sizing method using nanoparticle chip (NPC) to assist in the image analysis of the PSD. The NPC can pick up a single particle in a small volume droplet to avoid aggregation and maintain the poly-dispersed condition of the particles in suspension. The primary and secondary particles can be identified using scanning electron microscope (SEM) or atomic force microscope (AFM), and the PSD can be evaluated by measuring the area and height of the particles. Further, the quantities of both the primary and secondary particles can be counted from the substrate. This study presented a comparison of the diameter measurements using NPC and the conventional method. The results show that the NPC identified the primary and secondary particles and decreased the measurement error of the particle diameters. Consequently, the NPC proves to be superior to the conventional method for use in the PSD analysis of CMP slurry.

    DOI： https://doi.org/10.1016/j.precisioneng.2023.12.012

    Repository Public URL： https://hdl.handle.net/2324/7174463

  • Measurement of number-weighted particle size distribution for CMP slurry using nanoparticle chip Reviewed International coauthorship

    Zhu, JQ; Hayashi, T; Kurokawa, S

    Precision Engineering   86   203 - 212   2024.3   （ ISSN:0141-6359 eISSN:1873-2372 ）

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    Language：English   Publishing type：Research paper (scientific journal)   Publisher：Precision Engineering  

    Chemical mechanical polishing/planarization (CMP) slurry contains mainly abrasive grains (primary particles) with few aggregations (secondary particles). Measuring the particle size distribution (PSD) of CMP slurry is crucial for improving the productivity of the CMP process. For the quality management of CMP slurry, it is necessary to evaluate both the sizes and quantities of both the primary and secondary particles. Conventional PSD analysis methods, except for image analysis, face challenges in identifying primary and secondary particles for PSD measurements. For image analysis, the particles must be transferred from a suspension to a substrate using the conventional sampling method; however, this creates aggregates, resulting in a change in the PSD of the particles on the substrate compared to that in suspension under poly-dispersed conditions. Thus, this study proposed a novel particle sizing method using nanoparticle chip (NPC) to assist in the image analysis of the PSD. The NPC can pick up a single particle in a small volume droplet to avoid aggregation and maintain the poly-dispersed condition of the particles in suspension. The primary and secondary particles can be identified using scanning electron microscope (SEM) or atomic force microscope (AFM), and the PSD can be evaluated by measuring the area and height of the particles. Further, the quantities of both the primary and secondary particles can be counted from the substrate. This study presented a comparison of the diameter measurements using NPC and the conventional method. The results show that the NPC identified the primary and secondary particles and decreased the measurement error of the particle diameters. Consequently, the NPC proves to be superior to the conventional method for use in the PSD analysis of CMP slurry.

    DOI： 10.1016/j.precisioneng.2023.12.012

    Web of Science

    Scopus

  • Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip Reviewed International coauthorship

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    Precision Engineering   74   460 - 468   2022.3

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    Authorship：Corresponding author   Language：English   Publishing type：Research paper (scientific journal)  

    DOI： https://doi.org/10.1016/j.precisioneng.2021.08.008

  • ナノ粒子チップを用いた多分散ナノ粒子の粒度分布計測 Invited Reviewed International journal

    朱 家慶, 林 照剛, 黒河 周平

    日本機械学会論文集   86 ( 892 )   p. 20-00220 - p. 20-00220   2020.12

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    Language：Japanese   Publishing type：Research paper (scientific journal)  

    For poly-dispersed nanoparticles, which have more than two peaks on their particle size distribution (PSD), it is important to determine the mean particle diameter and their dispersion at each peak in a liquid. Dynamic Light Scattering (DLS), that is one of a typical nanoparticle sizing method, has difficulty to determine the several peaks in the PSD for the poly-dispersed particles. On the other hand, Image analysis methods (IA) can distinguish the peak for both the primary particle and secondary particle in the PSD of poly-dispersed particles accurately. However, IA is a time-consuming method and it is difficult to apply the measurement of the PSD due to the requirement of measuring the large number of particles, one by one. The particles in the liquid are transferred to a substrate in air when observing the particle to measure their size and the size distribution. In this procedure, some particles usually aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in liquid and that of the particles on the substrate. In this study, we suggest a novel particle sizing method using “Nanoparticle chip”, that is nanoparticles grid on the substrate to maintain the poly-dispersed condition in the liquid, to develop IA for measuring the poly-dispersed particles in liquid. The dispersed condition of the particle on Nanoparticle chip can be kept from the condition in liquid when the particles are transferred to the substrate in air. Therefore, measuring the PSD on Nanoparticle chip is equal to measure the PSD in the liquid. In this paper, in order to verify the feasibility of the nanoparticle sizing using Nanoparticle chip to measure the PSD for poly-dispersed particles in the liquid, we performed a fundamental experiment to fabricate the Nanoparticle chip and to determine the PSD for poly-dispersed particles. In this report, it is reported that the PSD for the poly-dispersed particles, which is the mixture of 152nm particle and 498nm particle, using Nanoparticle chip.

    DOI： https://doi.org/10.1299/transjsme.20-00220

  • Nanoparticle sizing method based on fluorescence anisotropy analysis Reviewed International journal

    Terutake Hayashi

    Measurement   vol. 59   382 - 388   2015.1

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    Language：English   Publishing type：Research paper (scientific journal)  

    Demand for applications of nanoparticles in electric architecture has been increasing. Nanoparticles provide new opportunities for improving circuit response. We discuss a novel method for evaluating nanoparticle sizes based on fluorescence anisotropy analysis. Particle size evaluation is possible through measurements of the rotational diffusion coef- ficient, which is sensitive to particle size. We develop a system for measuring rotational diffusion coefficients by using a fluorescent probe to label a particle. We report fundamen- tal experiments that verify the feasibility of the proposed method. The rotational diffusion coefficients of gold nanoparticles with diameters ranging 6–20 nm were measured using the proposed method. The measured rotational diffusion coefficients decrease with increasing particle size. This finding indicates that nanoparticles smaller than 15 nm can be measured with fine resolution.

  • 蛍光偏光法を用いたナノ粒子粒径計測に関する研究（第2 報）－DNA プローブの回転拡散係数評価に基づく粒径計測手法の提案－ Reviewed

    林 照剛, 石崎佑樹, 道畑正岐, 高谷裕浩, 田中慎一

    精密工学会   80 ( 10 )   956 - 960   2014.10

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    Language：Japanese   Publishing type：Research paper (scientific journal)  

    The nanoparticle is key materials in the area of nanotechnology, and there is a strong demand to measure the particle size　accurately and easily. We proposed a novel nanoparticle sizing method based on fluorescence polarization analysis, and　constructed the rotational diffusion coefficient measurement system using fluorescent DNA probe (fl-DNA). Nano particle sizing is achieved by measuring the rotational diffusion coefficient of fl-DNA, which is labeled to nanoparticle. In this　report, we investigate the relation between the rotational diffusion coefficient of fl-DNA and the size of the nano particles　standard. The rotational diffusion coefficients of gold nanoparticles of diameters from 6 nm to 20 nm were measured using
    the proposed method.

  • 蛍光偏光法を用いたナノ粒子粒径計測に関する研究（第１報）－蛍光DNAプローブを用いた回転拡散係数測定システムの開発－ Reviewed

    石崎佑樹，林　照剛，道畑正岐，高谷裕浩

    精密工学会   80 ( 3 )   214 - 219   2014.9

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    Language：Japanese   Publishing type：Research paper (scientific journal)  

  • Measurement of probe-stylus sphere diameter for micro-CMM based on spectral fingerprint of whispering gallery modes Reviewed International journal

    Masaki Michihata, Terutake Hayashi, Atushi Adachi, Yasuhiro Takaya

    CIRP   63 ( 1 )   469 - 472   2014.8

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    Language：English   Publishing type：Research paper (scientific journal)  

    Probe calibration contributes to the measurement uncertainty of micro-coordinate measuring machines (micro-CMMs). This study proposes a new method of measuring stylus sphere diameters for micro-CMMs based on the analysis of whispering gallery modes (WGMs). Depending on the incident wavelength, different WGMs will be excited in the probe stylus, resulting in a wavelength spectral fingerprint that is related to the sphere diameter. In this paper, the diameter of the microprobe stylus sphere was determined with a least-squares method using theoretical and measured spectra of WGMs.
    The measurement results showed that the precision of the proposed method was nm.

  • ポリグリセロール修飾ナノダイヤモンドを用いた銅膜の平坦化加工に関する研究 Reviewed

    村井亮太，高谷裕浩，林 照剛，道畑正岐，小松直樹

    砥粒加工学会   58 ( 2 )   97 - 102   2014.2

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    Language：Japanese   Publishing type：Research paper (scientific journal)  

  • パルストレインビームを用いたコヒーレントフォノン励起加工に関する研究(第一報) ーコヒーレントフォノン励起加工システムの構築と加工基礎実験ー Reviewed

    林 照剛, 福田悠介, 道畑正岐, 高谷裕浩

    精密工学会   80 ( 9 )   867 - 872   2014.2

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    Language：Japanese   Publishing type：Research paper (scientific journal)  

  • Development of nanoparticle sizing system using fluorescence polarization Reviewed International journal

    Terutake Hayashi, Masaki Michihata, Yasuhiro Takaya, and Kok Fonog Lee

    ACTA IMEKO   2 ( 2 )   67 - 72   2013.12

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Development of an Optical Heterogeneity Evaluation System Using Phase-Shift Digital Holography Reviewed International journal

    Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Key Engineering Materials   523-524   865 - 870   2012.11

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Development of a Novel Surface Processing System Using Femtosecond Pulse Train Reviewed International journal

    Yusuke FUKUTA, Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Key Engineering Materials   523-524   220 - 225   2012.11

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    Language：English   Publishing type：Research paper (scientific journal)  

  • A Novel Batch Fabrication of Micro Parts Using DNA Pattern Recognition Reviewed International journal

    Masafumi YASUDA, Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Key Engineering Materials   523-524   598 - 603   2012.11

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Evaluation of Optical Heterogeneity Using Phase-Shift Digital Holography Reviewed International journal

    Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    International Journal of Nanomanufacturing   8 ( 5-6 )   508 - 521   2012.8

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Development of Nanoparticle Sizing System Integrated with Optical Microscopy Using Fluorescence Polarization Reviewed International journal

    Terutake HAYASHI, Yasuhiro TAKAYA, and Masaki MICHIHATA

    International Journal of Nanomanufacturing   8 ( 1-2 )   54 - 66   2012.1

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Chemical Mechanical Polishing of Patterned Copper Wafer Surface Using Water-Soluble Fullerenol Slurry Reviewed International journal

    Yasuhiro TAKAYA, Hirotaka KISHIDA, Terutake HAYASHI, Masaki MICHIHATA, and Ken KOKUBO

    CIRP   60 ( 1 )   567 - 570   2011.8

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Total Angle-Resolved Scattering: Characterization of Microlens Mold Surface Reviewed International journal

    Terutake HAYASHI, Masaki MICHIHATA, and Yasuhiro TAKAYA

    Procedia Engineering   19   132 - 137   2011.1

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Clarification of Polishing Mechanism Focusing on Polishing Pad in CMP

    Takahashi Toya, Kurokawa Syuhei, Hayasi Terutake, Wada Yutaka, Hiyama Hirokuni, Yasuda Hozumi, Hayashi Syuntaro, Handa Naoyuki

    Proceedings of JSPE Semestrial Meeting   2023A ( 0 )   677 - 678   2023.8

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    Language：Japanese   Publisher：The Japan Society for Precision Engineering  

    <p>As a clue to the clarification of the polishing principle of CMP, the surface topography of the polishing pad was observed using a confocal microscope. It was confirmed that pad surface protrusions, which are thought to contact wafers during polishing and contribute to polishing, are formed mainly at the upstream portion of the pore edge in the flow direction. In this paper, the relationship between the projection shapes formed on the pore edges and the pore depths is discussed.</p>

    DOI： 10.11522/pscjspe.2023a.0_677

    CiNii Research

  • Research on multiscale texturing for optimal surfaces for cell adhesion and proliferation

    Izuno Yu, Kurokawa Syuhei, Hayashi Terutake, Kurata Kosaku, Hisazumi Sho

    Proceedings of JSPE Semestrial Meeting   2023A ( 0 )   766 - 767   2023.8

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    Language：Japanese   Publisher：The Japan Society for Precision Engineering  

    <p>生体適合材料には，生体組織と素早く・安定な界面を構築することを目的とした表面テクスチャリングが施されることが多い．しかし，最適な表面性状は分かっていない．そこで，本研究では生体材料である純チタン（Ti）に水・油仕様ワイヤ放電加工を用いて表面テクスチャリングを施した．このチタン表面を評価，観察および表面に骨芽細胞を播種し，細胞数の計測，動態を観察することで，細胞の初期動態に及ぼす表面性状の影響を検討した．</p>

    DOI： 10.11522/pscjspe.2023a.0_766

    CiNii Research

  • Effect of tooth surface texture on running performance of gears―Fatigue life test of polish-grinding gears with low-viscosity lubricating oil―

    Konishi Yuki, Kurikawa Shuhei, Hayashi Terutake, Ikeda Ren, Matsukawa Yoji

    Proceedings of JSPE Semestrial Meeting   2023A ( 0 )   226 - 227   2023.8

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    Language：Japanese   Publisher：The Japan Society for Precision Engineering  

    <p>The purpose of this study is to clarify the working surface properties and operating performance of polish-grinding gears. In previous studies, fatigue life tests of polish-grinding gears were performed, and the operating performance was investigated. This time, to further investigate the load capacity of polish-grinding grinding gears, fatigue life tests were performed using low-viscosity lubricating oils. This report is presented from the viewpoint of surface roughness and damage status.</p>

    DOI： 10.11522/pscjspe.2023a.0_226

    CiNii Research

  • Measurement of Particle Size Distribution for Poly-Dispersed Particles Using Nanoparticle Chip

    ZHU Jiaqing, HAYASHI Terutake

    Hosokawa Powder Technology Foundation ANNUAL REPORT   30 ( 0 )   120 - 124   2023.5   （ eISSN:21894663 ）

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    Language：Japanese   Publisher：Hosokawa Powder Technology Foundation  

    <p>Particle Size Distribution (PSD) analysis for nanoparticle is important for productivity improvement in Chemical Mechanical Polishing (CMP) process. CMP slurry, which consists of nanoparticles in suspension, contains multi-modal PSD due to particle aggregation. In this study, we suggested a novel particle sizing method using nanoparticle chip (NPC). NPC can maintain the aggregation condition of particles to transfer the particles from suspension to the substrate. In this report, a fundamental experiment was performed to investigate the evaluation method of equivalent height diameter using NPC.</p>

    DOI： 10.14356/hptf.21505

    CiNii Research

  • Effects of Multiscale-texturing for cell adhesion with ELID grinding

    ORI Akihiro, KUROKAWA Syuhei, HAYASHI Terutake, KURATA Kosaku, OHMORI Hitoshi, IZUNO Yu

    The Proceedings of Conference of Kyushu Branch   2023.76 ( 0 )   F25   2023   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2023.76.f25

    CiNii Research

  • Gear measurement using a non-contact laser probe

    YAMAMOTO Kuniharu, KUROKAWA Syuhei, HAYASHI Terutake, Matsukawa Yoji, YAMAMOTO Koutaro, AHN Hyunjoon

    The Proceedings of Conference of Kyushu Branch   2023.76 ( 0 )   H31   2023   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2023.76.h31

    CiNii Research

  • Effect of tooth surface texture on running performance of gears

    KONISHI Yuki, KUROKAWA Shuhei, HAYASHI Terutake, MATSUKAWA Yoji, Ikeda Ren

    The Proceedings of Conference of Kyushu Branch   2023.76 ( 0 )   H21   2023   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2023.76.h21

    CiNii Research

  • A Study on Machined Surface Properties and Operating Performance by a New Gear Machining Method

    IKEDA Ren, KUROKAWA Shuhei, HAYASHI Terutake, KONISHI Yuki, MATSUKAWA Yoji

    The Proceedings of Conference of Kyushu Branch   2023.76 ( 0 )   H22   2023   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2023.76.h22

    CiNii Research

  • Raman spectra analysis for SiC target using femtosecond laser beam (2nd report)

    MURAKAMI Moe, HAYASHI Terutake, KUROKAWA Shuhei

    The Proceedings of Conference of Kyushu Branch   2023.76 ( 0 )   H34   2023   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2023.76.h34

    CiNii Research

  • Effects of multiscale-texturing for cell adhesion using wire electric discharge machining

    IZUNO Yu, KUROKAWA Syuhei, HAYASHI Terutake, KURATA Kosaku, ORI Akihiro

    The Proceedings of Conference of Kyushu Branch   2023.76 ( 0 )   H33   2023   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2023.76.h33

    CiNii Research

  • Nanoparticle sizing for poly-dispersed particles using nanoparticle chip (4th report)

    Zhu Jiaqing, Hayashi Terutake, Kurokawa Syuhei

    Proceedings of JSPE Semestrial Meeting   2022A ( 0 )   189 - 190   2022.8

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    Language：Japanese   Publisher：The Japan Society for Precision Engineering  

    <p>これまでに筆者らは，液中に分散するナノ粒子の粒度分布を測定するため，ナノ粒子チップを用いた粒度分布測定技術を提案している．提案手法では，液中に分散する一次粒子・二次粒子を規則的に配列することにより，各測定点で配置された粒子の凝集状態を液中にあるときと同様に保ったまま，ナノ粒子の粒径を計測できる．これまでに，100nm以上の粒子について，SEMを用いてその粒度分布を測定し，提案手法の妥当性を確認されている．100nm以下のような小さい粒子に対して，SEMによる画像解析法は，正確な粒径の測定が困難という問題点がある．本研究では，より精度が高いAFMを測定器として選択し，提案手法の測定できる粒径範囲を広げることを目指している．</p>

    DOI： 10.11522/pscjspe.2022a.0_189

    CiNii Research

  • Nanoparticle sizing for poly-dispersed particles using nanoparticle chip (3rd report)

    Zhu Jiaqing, Hayashi Terutake, Kurokawa Syuhei

    Proceedings of JSPE Semestrial Meeting   2022S ( 0 )   264 - 265   2022.3

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    Language：Japanese   Publisher：The Japan Society for Precision Engineering  

    <p>液中に分散するナノ粒子の粒度分布測定に対して，画像解析法では，粒子を液中から基板に固定する必要がある．従来，一般的なサンプル作成手法では，基板上に粒子の凝集が発生するため，基板上の粒子の粒度分布計測による液中の粒度分布を評価することが困難である．この問題を解決するため，筆者らはナノ粒子チップを用いた粒度分布測定技術を提案した．提案手法では，液中に分散する一次粒子・二次粒子を個別に基板上に固定することにより，粒子の分散状態を保ったまま，ナノ粒子の粒径を計測できる．本報告では，AFMを測定器として選択し，ナノ粒子チップを用いた高さ相当径の評価と一般的な液滴滴下方法と比較した．</p>

    DOI： 10.11522/pscjspe.2022s.0_264

    CiNii Research

  • 蛍光プローブを用いたナノ粒子粒径計測に関する研究

    Hirano Tomohiro, Hayashi Terutake, Kurokawa Shuhei

    Proceedings of JSPE Semestrial Meeting   2022S ( 0 )   199 - 200   2022.3

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    Language：Japanese   Publisher：The Japan Society for Precision Engineering  

    <p>本研究は液中のナノ粒子の粒径を正確に測定することを目標としている．精度よく粒径を測定するためには液中で粒子が受ける粘性抵抗を調査する必要があるため，粒子の並進ブラウン運動と回転ブラウン運動の両者を測定できる装置の開発を行った．本稿では，異なる粘度の溶媒中におけるナノ粒子のブラウン運動の拡散係数の変化について調査した結果を報告する．</p>

    DOI： 10.11522/pscjspe.2022s.0_199

    CiNii Research

  • Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip

    Zhu, JQ; Hayashi, T; Kurokawa, S

    PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY   74   460 - 468   2022.3   （ ISSN:0141-6359 eISSN:1873-2372 ）

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    Publisher：Precision Engineering  

    Particle size distribution (PSD) analysis for nanoparticle is important for quality management of CMP slurry, that used in chemical mechanical polishing (CMP) process. CMP slurry contains poly-dispersed particles, which consist of size-different primary particles and secondary particles in suspension. It is difficult to measure PSD for poly-dispersed particle using Dynamic Light Scattering, which is one of a typical method to evaluate PSD for mono-dispersed particles. The image analysis is also employed for PSD analysis. For image analysis, it needs to transfer the particles from suspension to a substrate before measurement. In this procedure, some particles aggregate with surrounding particles. It causes the difference between the PSD for dispersed particles in suspension and the PSD for observed particle using image analysis. In addition, concentration measurement is important for quality management of CMP slurry. Mass concentration is used in concentration evaluation for CMP slurry. However, it is difficult to identify the molar concentration for multi-modal particles, respectively. In this study, we suggested a method to define molar concentration spectra to express both a modal diameter and molar concentration for multi-modal nanoparticles to evaluate the CMP slurry. In order to measure the molar concentration spectra, we suggested a novel particle sizing method using nanoparticle chip (NPC) to measure number-weighted mean particle diameter, a variance of diameters, and molar concentration for every spectrum. Nanoparticles grid on a substrate to maintain the poly-dispersed condition in suspension to process NPC. NPC can assist the image analysis process to measure the PSD of particles in suspension. The number of particles, that aligned on the substrate, can be counted to measure the molar concentration. In this paper, a fundamental experiment was performed to investigate the feasibility of molar concentration spectra measurement. It is confirmed the molar concentration spectra for poly-dispersed particles can be measured by using NPC and it is considered that PSD with molar concentration spectra can give detail information of abrasive grain in suspension for quality management of CMP slurry.

    DOI： 10.1016/j.precisioneng.2021.08.008

    Web of Science

    Scopus

  • Measurement of the gear outline using a non-contact laser probe

    YAMAMOTO Kuniharu, KUROKAWA Syuhei, HAYASHI Terutake, Matsukawa Yoji, YAMAMOTO Koutaro, AHN Hyunjoon

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   H14   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.h14

    CiNii Research

  • Solid hobbing by ultra-high speed cutting

    GOTO Manami, KUROKAWA Syuhei, HAYASHI Terutake, MATSUKAWA Yoji, KOGANEMARU Takeshi, Ikeda Ren, YOSHIKAWA Keisuke, ISHIZU Kazuyuki

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   H15   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.h15

    CiNii Research

  • Multiscale-texturing for Biomaterials Aiming for the Optimum Surface for Cell Adhesion and Proliferation

    ORI Akihiro, KUROKAWA Syuhei, HAYASHI Terutake, KURATA Kosaku, OHMORI Hitoshi, IZUNO Yu

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   H16   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.h16

    CiNii Research

  • Effect of tooth surface texture on running performance of gears

    KOGANEMARU Takashi, KUROKAWA Syuhei, HAYASHI Terutake, MATSUKAWA Yoji, GOTO Manami

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   F11   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.f11

    CiNii Research

  • Raman spectra analysis for SiC target on the processed spot using femtosecond laser beam

    MURAKAMI Moe, HAYASHI Terutake, KUROKAWA Shuhei

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   H13   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.h13

    CiNii Research

  • Conformal Resist Coating Technique for TSV Manufacturing Process by Electrostatic Spray

    Kurokawa, S; Hotokebuchi, T; Uchiyama, Y; Miyachi, K; Kobayashi, Y; Hayashi, T; Matsuo, K

    PROCEEDINGS OF THE 38TH INTERNATIONAL MATADOR CONFERENCE   49 - 62   2022   （ ISBN:978-3-319-64942-9 ）

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  • Development of three-dimensional CNC gear measuring machine with High speed and High accuracy

    AHN Hyunjoon, KUROKAWA Syuhei, HAYASHI Terutake, YOJI Matsuoka, Yamamoto Kuniharu, KIRIHARA Syuhei, TAGUCHI Tetsuya, Horiuchi Masashi, Yang Di

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   F12   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.f12

    CiNii Research

  • Clarification of Polishing Mechanism Focusing on Abrasive Particle Behavior in CMP

    HAYASHI Syuntaro, KUROKAWA Syuhei, HAYASHI Terutake, HIYAMA Hirokuni, WADA Yutaka, HANDA Naoyuki

    The Proceedings of Conference of Kyushu Branch   2022.75 ( 0 )   H17   2022   （ eISSN:24242780 ）

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    Language：Japanese   Publisher：The Japan Society of Mechanical Engineers  

    DOI： 10.1299/jsmekyushu.2022.75.h17

    CiNii Research

  • Photocatalytic nanofabrication and intracellular Raman imaging of living cells with functionalized AFM probes Reviewed

    [004] Shibata Takayuki, Hiromi Furukawa, Yasuharu Ito, Masahiro Nagahama, Terutake Hayashi, Miho Ishii-Teshima, Moeto Nagai

    Micromachines   11 ( 5 )   171107 - 171107   2020.5

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    Language：English   Publishing type：Research paper (scientific journal)  

    DOI： https://doi.org/10.3390/mi11050495

  • Investigation of surface excitation effect for ablation of 4H-SiC substrate using double-pulse beam Reviewed International journal

    Keigo Matsunaga, Terutake Hayashi, Syuhei Kurokawa, Hideaki Yokoo, Masaharu Nishikino, Noboru Hasegawa, Takayuki Kumada, Tomohito Otobe, Yasuhiro Takaya

    Springer Proceedings in Physics: X-Ray Lasers 2016/ICXRL 2016   2017.7

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip Reviewed International journal

    @Jiaqing Zhu, #Terutake Hayashi, #Syuhei Kurokawa

    International Journal of Automation Technology   Vol.74 ( March 2022 )   460 - 468   2017.7

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    Language：English   Publishing type：Research paper (scientific journal)  

    DOI： https://doi.org/10.1016/j.precisioneng.2021.08.008

  • Particle Size Distribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe Reviewed International journal

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    International Conference on Planarization/CMP Technology (ICPT2016)   Vol.11 ( No.4 )   2017.7

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    Language：English   Publishing type：Research paper (international conference proceedings)  

  • A Novel Particle Sizing Method for Nano Abrasives in CMP Slurry by Using Fluorescent Nano Probe Reviewed International journal

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    International Journal of Automation Technology   Vol.11 ( No.4 )   2017.7

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Study on low power laser processing technique with instant surface excitation using femtosecond double pulse Reviewed International journal

    Keigo Matsunaga, Terutake Hayashi, Syuhei Kurokawa, Hideaki Yokoo, Masaharu Nishikino, Noboru Hasegawa, Takayuki Kumada, Tomohito Otobe, Yasuhiro Takaya

    Proceedings of 16th International conference of Precision Engineering   C305-8183-1 - C305-8183-4   2016.11

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    Language：English   Publishing type：Research paper (international conference proceedings)  

  • Planarization for Translucent Polycrystalline Alumina by Surface Polishing Technique Reviewed International journal

    Syuhei Kurokawa, Leo Hirashima, Terutake Hayashi, Keiichiro WATANABE, Hiroyuki TSUJI, Tomoki NAGAE

    Proceedings of 16th International conference of Precision Engineering   C111-8207-1 - C111-8207-4   2016.11

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    Language：English   Publishing type：Research paper (international conference proceedings)  

  • Planarization for Translucent Polycrystalline Alumina by Surface Polishing Technique Reviewed International journal

    Keigo Matsunaga, Terutake Hayashi, Syuhei Kurokawa, Hideaki Yokoo, Masaharu Nishikino, Noboru Hasegawa, Takayuki Kumada, Tomohito Otobe, Yasuhiro Takaya

    Proceedings of 16th International conference of Precision Engineering   C111-8207-1 - C111-8207-4   2016.11

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    Language：English   Publishing type：Research paper (international conference proceedings)  

  • Dynamics of spallation during femtosecond laser ablation studied by time-resolved reflectivity with double pump pulses Reviewed International journal

    Takayuki Kumada, Tomohito Otobe, Masaharu Nishikino, Noboru Hasegawa, Terutake Hayashi

    Applied Physics Letters   ( 108 )   011102-1 - 011102-4   2016.1

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    Language：English   Publishing type：Research paper (scientific journal)  

    DOI： 10.1063/1.4939231

  • Study on Nanoparticle Sizing Using Fluorescent Polarization Method with DNA Fluorescent Probe Reviewed International journal

    Terutake Hayashi, Yuki Ishizaki, Masaki Michihata, Yasuhiro Takaya, Shin-ichi Tanaka

    International Journal of Automation Technology   vol. 9 ( no. 5, )   534 - 540   2015.5

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Wide-Range Axial Position Measurement for Jumping Behavior of Optically Trapped Microsphere Near Surface Using Chromatic Confocal Sensor Reviewed International journal

    Terutake Hayashi

    International Journal of Optomechatronics   vol. 9 ( no. 2, )   131 - 140   2015.2

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Study on chemical interaction analysis of reactive fullerenol molecules in Cu-CMP using high-sensitive Raman spectroscopy Reviewed International journal

    Terutake Hayashi

    Key Engineering Materials   vol. 625   332 - 338   2015.1

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Surface Analysis of the Chemical Polishing Process Using a Fullerenol Slurry by Raman Spectroscopy under Surface Plasmon Excitation Reviewed International journal

    Yasuhiro TAKAYA, Masaki MICHIHATA, Terutake HAYASHI, Ryota MURAI, and Kazumasa KANO

    CIRP   62 ( 1 )   571 - 574   2013.8

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    Language：English   Publishing type：Research paper (scientific journal)  

  • New Technique of Single-Beam Gradient-Force Laser Trapping in Air Condition Reviewed International journal

    Masaki MICHIHATA, Tadaaki YOSHIKANE, Terutake HAYASHI, and Yasuhiro TAKAYA

    International Journal of Optomechatronics   7   46 - 59   2013.7

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Dimensional Measurement of Microform with High Aspect Ratio Using an Optically Controlled Particle with Standing Wave Scale Sensing Reviewed International journal

    Yasuhiro TAKAYA, Masaki MICHIHATA, Terutake HAYASHI, and Taisuke WASHITANI

    CIRP   61 ( 1 )   479 - 482   2012.8

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Improvement of Laser Trapping Based Microprobe in Laser Shaded Condition Reviewed International journal

    Masaki MICHIHATA, Yasuhiro TAKAYA, and Terutake HAYASHI

    Journal of Advanced Mechanical Design, Systems, and Manufacturing   6 ( 6 )   764 - 770   2012.6

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    Language：English   Publishing type：Research paper (scientific journal)  

  • Scanning Type Microprobe for Displacement Measurement Based on Standing Wave Detection Using an Optically Trapped Particle Reviewed International journal

    Yasuhiro TAKAYA, Masaki MICHIHATA, and Terutake HAYASHI

    International Journal of Automation Technology   5 ( 3 )   395 - 402   2011.3

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    Language：English   Publishing type：Research paper (scientific journal)  

▼display all

Books

  • よくわかる実験技術・学術用語「マイクロ光造形」

    林 照剛（Role：Joint author）

    日本実験力学会  2008.9 

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    Responsible for pages：pp. 114-115   Language：Japanese   Book type：Scholarly book

  • CMP用超親水性フラーレン研磨スラリーの研磨特性

    林 照剛（Role：Joint author）

    技術情報協会  2006.2 

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    Responsible for pages：pp. 91-103   Language：Japanese   Book type：Scholarly book

Presentations

  • Measurement of number-weighted particle size distribution for poly-dispersed particles using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    The 19th International Conference on Precision Engineering (ICPE2022 in Nara)  2022.11 

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    Event date： 2022.11 - 2022.12

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Nara, Nara, Japan   Country：Japan  

  • Nanoparticle sizing for CMP slurry using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    The 10th International Conference on Leading Edge Manufacturing in 21st Center(LEM21)  2021.11 

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    Event date： 2021.11

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kokura, Fukuoka, Japan   Country：Japan  

  • Measurement of molar concentration spectrum based on number-weighted particle size distribution for poly-dispersed particles using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    XXIII IMEKO World Congress “Measurement: sparking tomorrow’s smart revolution”  2021.11 

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    Event date： 2021.8 - 2021.9

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Yokohama, Kanagawa, Japan   Country：Japan  

  • Measurement of molar concentration spectra for nanoparticle with multi-modal nanoparticle size distribution using nanoparticle chip International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    18th International Conference on Precision Engineering  2020.11 

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    Event date： 2020.11

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kobe, Hyougo, Japan   Country：Japan  

  • Study on particle size distribution measurement using nanoparticle micro array International conference

    Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa

    International Symposium on Measurement Technology and Intelligent Instruments  2020.7 

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    Event date： 2019.9

    Language：English   Presentation type：Oral presentation (general)  

    Venue：TOKI MESSE, Nagaoka, Niigata   Country：Japan  

    Nanoparticle is widely used in industrial production, such as biological sensor, pigment and slurry in CMP (Chemical Mechanical Polishing). Particle size distribution is used in the quality evaluation of nanoparticle. It is important to measure the particle size distribution of primary particle for the mixture solution of both primary and secondary particle. Image analysis method is able to accurately measure the geometric diameter of primary particle, even though secondary particle is present in solution. It is able to solve the problem that the result of DLS (Dynamic Light Scattering) is unreliable when secondary particle is present in solution. It is necessary that it takes a lot of time to observe thousands of particles. The aggregation of particles is also a problem during sample preparation from solution. It causes that it is difficult to confirm the presence of secondary particle in the solution. In this research, in order to accurately measure average diameter of primary particle and classify types of particle as primary particle or secondary particle, we suggest a new sample preparation method that called “nanoparticle micro array”. In this method, first nanoparticles are uniformly dispersed in solution. Then these nanoparticles are sampled one by one from the solution and arranged on silicon wafer in a high density and uniformly-spaced position. After the solution was evaporated, the sample is observed by SEM (Scanning Electron Microscope)/AFM (Atomic Force Microscope). And the geometric diameter of primary particle is measured from the SEM/AFM image. In this report, in order to verify the feasibility of particle characterization using “nanoparticle micro array”, we performed a fundamental experiment to classify particles and measure primary particle size distribution on a nanoparticle chip.

  • A novel nano particle characterizing method using nano particle micro array International conference

    Terutake Hayashi, Syuhei KUROKAWA and Zhu Jiaqing

    International conference on precision engineering 2018  2018.11 

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    Event date： 2018.11

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kamakura   Country：Japan  

  • Dynamics of photo-excitation for the ablation of 4H-SiC substrate using femtosecond laser International conference

    Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masuhara NISHIKINO, Yoji MATSUKAWA

    the 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21)  2017.11 

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    Event date： 2017.11 - 2016.11

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Hiroshima   Country：Japan  

  • 周波数分解光ゲート法を用いた半導体ウェハ表面の非接触光計測に関する研究

    林 照剛, 黒河 周平, 横尾英昭, 王成武, 松川洋二

    日本機械学会生産加工部門　部門講演会  2014.11 

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    Event date： 2014.11

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：徳島大学   Country：Japan  

    We proposed a novel optical surface inspection method to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on a cross correlation frequency resolved optical gating method, is applied to evaluate the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Study on diffusion coefficient evaluation for free abrasives and　chemicals by using fluorescent anisotropy analysis International conference

    Terutake Hayashi, Syuhei Kurokawa

    The 18th International Conference On Mechatronics Technology  2014.10 

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    Event date： 2014.10

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Taiwan Tech, Taipei, Taiwan   Country：Japan  

    CMP (Chemical Mechanical Polishing/ Planarization) for semiconductor production has become　increasingly important to integrate the multi-layer circuits. CMP is a process of smoothing wafers　surface with the both chemical reaction in slurry and mechanical polishing by using polishing pad　and abrasives. In this research, we aim at the high-efficiency and high quality CMP of　semiconductor wafer. We investigate fundamental property of CMP process in the aspect of　polishing and alternation based on observing the diffusion of abrasive and chemicals. We consider　the translational diffusion is related to the frequency of the contact for the free abrasives and　chemicals on the surface of the material. Thus, the translational diffusion coefficient is considered　to be related the change of the surface integrity and the material processing properties, such as　removal rate, surface roughness, and flatness. In this paper, we suggest a novel measurement　method for the translational diffusion coefficient based on the measurement of the fluidity of the　slurry. The fluidity of slurry is measured by using fluorescence anisotropy analysis. We develop a　system for measuring fluidity of slurry by using a fluorescent probe. The fundamental experiments　are performed to verify the feasibility of the proposed method.

  • Super-smooth processing technology of CVD-SiC with the combination of electrolytic in-process dressing （ELID） grinding and fixed softer-than-diamond abrasive grinding International conference

    Xuemei Ao, Syuhei Kurokawa, Terutake Hayashi

    the 10th International Conference on Manufacturing, Machine Design and Tribology (ICMDT 2025)  2025 

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    Event date： 2025

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Himeji, Hyogo   Country：Japan  

    p.214

  • Comparison of properties between Ga-Face and N-Face of Gallium Nitride and Semi-Finishing Planarization of Ga-Face International conference

    Chen Jia, Syuhei Kurokawa, Terutake Hayashi

    the 10th International Conference on Manufacturing, Machine Design and Tribology (ICMDT 2025)  2025 

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    Event date： 2025

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Himeji, Hyogo   Country：Japan  

    p218

  • Machined surface properties of forged gears -measurements of surface roughness using contact-type surface roughness measuring instrument- International conference

    Ryo Hinoguchi, Syuhei Kurokawa, Terutake Hayashi, Yasuki Kagata, Yoji Matsukawa, Kohei Yamada

    the 10th International Conference on Manufacturing, Machine Design and Tribology (ICMDT 2025),  2025 

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    Event date： 2025

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Himeji, Hyogo   Country：Japan  

    p.252

  • Super-smooth processing technology of CVD-SiC with the combination of Electrolytic In-process Dressing (ELID) grinding and fixed softer-than-diamond abrasive grinding International conference

    Xuemei Ao，Syuhei Kurokawa，Terutake Hayashi,

    the 26th International Symposium on Advances in Abrasive Technology, ISAAT2024,   2024 

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    Event date： 2024

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Portoroz, Slovenia   Country：Slovenia  

    p.1

  • Surface finishing of CVD-SiC with different grinding wheels International conference

    Xuemei Ao，Syuhei Kurokawa，Terutake Hayashi

    the 8th International Conference on Manufacturing Technologies, ICMT2024  2024 

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    Event date： 2024

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Bangkok, Thailand   Country：Thailand  

    p.1

  • Polishing mechanisms in CMP through slurry particle behavior and pad surface topography observation affecting polishing performance International conference

    Syuhei Kurokawa, Toya Takahashi, Terutake Hayashi, Shuntaro Hayashi, Yutaka Wada, Hozumi Yasuda, Hirokuni Hiyama,

    International Conference on Planarization/CMP Technology (ICPT2023)  2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kanazawa   Country：Japan  

    pp. P22-001-004

  • Reflected light distribution analysis for detection error prediction in triangulation line laser probe International conference

    Kotaro Yamamoto, Syuhei Kurokawa, Terutake Hayashi, Ren Ikeda, Masya Murata

    the 23rd International Symposium on Aerospace Technology & Manufacturing Process (ISATMP-23)  2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jinju, Korea,   Country：Korea, Republic of  

    p. 61

  • Nanoparticle size measurement using fluorescent probe International conference

    Keita Yoshioka, Terutake Hayashi, Syuhei Kurokawa

    the 23rd International Symposium on Aerospace Technology & Manufacturing Process (ISATMP-23)  2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jinju, Korea,   Country：Korea, Republic of  

    p. 62

  • Surface degradation mechanism and improvement in CVD-SiC planarization based on CMP processing International conference

    Chen Jia, Syuhei Kurokawa, Terutake Hayashi, Xuemei Ao, Honglin Li

    the 9th International Conference on Manufacturing, Machine Design and Tribology (ICMDT2023)  2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jeju, Korea,   Country：Korea, Republic of  

    p. 52

  • Multiscale texturing for optimal surfaces for cell adhesion and proliferation International conference

    Yu Izuno, Syuhei Kurokawa, Terutake Hayashi, Kosaku Kurata, Sho Hisazumi

    the 23rd International Symposium on Aerospace Technology & Manufacturing Process (ISATMP-23)  2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jinju, Korea,   Country：Korea, Republic of  

    p. 60

  • Semi-finishing planarization of gallium nitride using different crystalline substrates International conference

    Honglin Li, Syuhei Kurokawa, Terutake Hayashi, Xuemei Ao, Chen Jia

    the 9th International Conference on Manufacturing, Machine Design and Tribology (ICMDT2023),   2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jeju, Korea   Country：Korea, Republic of  

    p. 53

  • Ultra-high speed hobbing of gears in high accuracy –Influence of ultra-high speed machining on tooth surface– International conference

    Syuhei Kurokawa, Manami Goto, Terutake Hayashi, Ren Ikeda, Kazuyuki Ishizu, Noriyuki Sakurai

    the 23rd International Symposium on Aerospace Technology & Manufacturing Process (ISATMP-23),   2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jinju, Korea,   Country：Korea, Republic of  

    p. 59

  • Pre-processing of CVD-SiC by super-smooth Electrolytic In-process Dressing (ELID) grinding International conference

    Xuemei Ao, Syuhei Kurokawa, Terutake Hayashi, Honglin Li, Chen Jia, Hitoshi Ohmori

    the 9th International Conference on Manufacturing, Machine Design and Tribology (ICMDT2023),  2023 

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    Event date： 2023

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Jeju, Korea   Country：Korea, Republic of  

    p. 54

  • Double pulse laser processing for carbon coated SiO2 target using near IR beam International conference

    Terutake Hayashi, Yuki Hirotsu, Syuhei Kurokawa, Keigo Matsunaga, Noboru Hasegawa,Masaharu Nishikino

    Optics & Photonics International Congresss 2019  2019.4 

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    Event date： 2020.4

    Language：English   Presentation type：Symposium, workshop panel (public)  

    Venue：Yokohama, Kanagawa   Country：Japan  

  • フェムト秒レーザを用いたダブルパルスビームによる励起状態面の表面加工に関する研究（第九報）―加工変質層の元素組成評価―

    松永啓伍　林照剛　黒河周平　廣津佑紀　松川洋二

    2018年度精密工学会春期全国大会  2018.3 

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    Event date： 2018.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東京理科大学　野田キャンパス   Country：Japan  

  • Investigation of surface excitation effect for ablation of 4H-SiC substrate using double-pulse beam International conference

    林 照剛

    ICXRL 2016  2017.5 

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    Event date： 2017.5

    Language：English  

    Country：Japan  

  • Study on low power laser processing technique with instant surface excitation using femtosecond double pulse

    Terutake Hayashi

    16th International conference of Precision Engineering  2016.11 

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    Event date： 2016.11

    Language：English   Presentation type：Oral presentation (general)  

    Country：Japan  

  • Particle Size Distribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe

    林 照剛

    International Conference on Planarization/CMP Technology (ICPT2016)  2016.10 

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    Event date： 2016.10 - 2017.5

    Language：English   Presentation type：Oral presentation (general)  

    Country：China  

  • 細胞機能解析のためのナノニードル搭載型バイオプローブの開発(第 13 報) ―細胞内 TERS イメージングによる生体分子のダイナミクス観察―

    伊藤康治, 宮崎 剛, 林 照剛, 永井萌土, 柴田隆行

    2016年度精密工学会春期全国大会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東京理科大学　野田キャンパス   Country：Japan  

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究（第3報）-表面励起効果の検討-

    林 照剛, 横尾 英昭, 松永 啓伍, 松川洋二, 王　成武, 黒河 周平

    2016年度精密工学会春期全国大会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東京理科大学　野田キャンパス   Country：Japan  

  • 蛍光ナノプローブを用いたブラウン運動解析に基づくナノ粒子粒径計測

    世利俊樹, 林 照剛, 黒河 周平

    2016年度精密工学会春期全国大会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東京理科大学　野田キャンパス   Country：Japan  

  • 先端的難加工基板の高効率精密加工法の研究(第 6 報)　-fs レーザ照射による疑似ラジカル場形成基板表面の CMP 研磨特性-

    黒河 周平, 王　成武, 土肥 俊郎, 佐野 泰久, 會田 英雄, 大山 幸希, 林 照剛, 吹春昇

    2016年度精密工学会春期全国大会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東京理科大学　野田キャンパス   Country：Japan  

  • コロイダルセリア砥粒による石英ガラス基板研磨―KOH添加による砥粒凝集状態と研磨レート調査

    外山 貴彬, 林 照剛, 黒河 周平

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • 三次元座標測定機能を有する歯車測定機の開発　　　―はすば歯車の軸直角断面スキャニング測定手法の考案―

    寺岡　孝, 上杉健輔, 黒河 周平, 田口　哲也, 林 照剛, 松川　洋二

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • 高圧ジェットを用いたCMP用ソフトパッド表面の洗浄効果―回転速度と噴霧圧力による残留シリカ除去効果

    徳本勇太, 北村　将, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • 静電誘引型スプレーを用いたTSV向けレジスト成膜に関する研究―対向電極を用いた成膜パターンの精密化

    内山雄介, 黒河 周平, 林 照剛, 宮地 計二, 小林 義典, 松尾　一壽

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • 蛍光プローブを用いたナノ粒子の粒径計測技術に関する研究

    世利俊樹, 林 照剛, 黒河 周平

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • フェムト秒レーザーを用いたダブルパルスビームによる励起状態面の半導体表面加工に関する研究

    横尾 英昭, 林 照剛, 松永 啓伍, 王　成武, 松川洋二, 黒河 周平

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • CMPハードパッドにおける高圧ジェット洗浄効果の定量評価―噴射圧力および噴射距離と洗浄効果

    北村　将, 徳本勇太, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • エンドミル工具摩耗のインプロセス検出に関する研究―ボールエンドミルにおける検出信号について

    鳥居徹也, Gouarir Amine, 村田光昭, 黒河 周平, 松川洋二, 林 照剛

    日本機械学会九州支部 第69期総会講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：熊本大学   Country：Japan  

  • フェムト秒レーザー励起を用いた表面ナノ加工に関する研究

    林 照剛, 横尾 英昭, 黒河 周平, 松永 啓伍, 王　成武, 松川洋二

    2016年度　日本機械学会　生産システム部門研究発表講演会  2016.3 

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    Event date： 2016.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東京理科大学　野田キャンパス   Country：Japan  

  • 蛍光プローブを用いた砥粒のブラウン運動評価に関する研究

    世利 俊樹, 黒河 周平, 林 照剛

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • 静電誘引形スプレーを用いたレジスト成膜に関する研究―電圧切替によるレジスト膜の部分膜厚制御―

    内山雄介, 黒河 周平, 林 照剛, 宮地 計二, 小林 義典, 松尾　一壽

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • 高圧ジェットを用いたCMP用ソフトパッド表面の洗浄効果―定盤の回転速度と噴霧圧力による洗浄効果―

    徳本勇太, 北村　将, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • 三次元座標測定機能を有する歯車測定機の開発―はすば歯車断面スキャニング測定の歯形誤差評価―

    寺岡　孝, 宇都宮 勇貴, 黒河 周平, 松川洋二, 林 照剛, 田口 哲也

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • CMPハードパッドにおける高圧ジェット洗浄効果の定量評価―定盤回転速度および洗浄時間と洗浄効果―

    北村　将, 徳本勇太, 黒河 周平, 林 照剛, 和田 雄高, 檜山 浩國, 高東 智佳子

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • コロイダルセリア砥粒を用いた石英ガラス基板研磨～pH調整による高品位・高能率研磨～

    外山 貴彬, 黒河 周平, 林 照剛

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • エンドミル工具摩耗のインプロセス検出に関する研究―検出結果の切削速度非依存性について―

    鳥居徹也, Gouarir Amine, 黒河 周平, 松川洋二, 林 照剛, 村田光昭

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • フェムト秒レーザーを用いたダブルパルスビームによる表面励起現象を利用した表面加工に関する研究

    横尾 英昭, 松永 啓伍, 林 照剛, 王　成武, 黒河 周平, 松川洋二

    2015年度　精密工学会九州支部 飯塚地方講演会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：九州工業大学   Country：Japan  

  • ダブルパルスビームを用いた時間分解表面励起加工に関する研究

    林 照剛, 横尾 英昭, 松永 啓伍, 王　成武, 松川洋二, 黒河 周平

    2015年度電気加工学会全国大会  2015.12 

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    Event date： 2015.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：四国大学交流プラザ（徳島）   Country：Japan  

  • A study on fluorescence polarization method for analyzing diffusional movement of abrasive grain in CMP slurry International conference

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    The 8th International Conference on Leading Edge Manufacturing in 21st Century  2015.10 

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    Event date： 2015.10

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kyoko Research Park, Kyoto, Japan   Country：Japan  

  • Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet International conference

    Masashi Kitamura, Syuhei Kurokawa, Terutake Hayashi, Yuta Tokumoto, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh

    2015 International Conference on Planarization/CMP Technology (2015 ICPT)  2015.9 

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    Event date： 2015.9 - 2015.10

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Wild Horse Pass Hotel and Casino, Chandler, Arizona, USA   Country：United States  

  • Brownian diffusion analysis for nano-abrasives in CMP slurry by using fluorescence polarization method International conference

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    2015 International Conference on Planarization/CMP Technology (2015 ICPT)  2015.9 

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    Event date： 2015.9 - 2015.10

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Wild Horse Pass Hotel and Casino, Chandler, Arizona, USA   Country：United States  

  • A novel measurement method for Brownian diffusion of nano-abrasives in CMP slurry International conference

    Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa

    12th International Symposium on Measurement Technology and Intelligent Instruments  2015.9 

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    Event date： 2015.9

    Language：English   Presentation type：Oral presentation (general)  

    Venue：GIS NTU International Center, Taipei, Taiwan   Country：Taiwan, Province of China  

  • Hollow-Nanoneedle-Based AFM Probe for Electrokinetic Intracellular Delivery and Intracellular TERS Imaging International conference

    Takayuki Shibata, Goh Miyazaki, Terutake Hayashi, Moeto Nagai

    41st international conference on micro- and nanofabrication and manufacturing using lithography and related techniques  2015.9 

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    Event date： 2015.9

    Language：English   Presentation type：Oral presentation (general)  

    Venue：World Forum in　Hague, Netherlands.   Country：Netherlands  

  • 歯底・歯元を含めたはすば歯車の断面スキャニング測定 ―ねじれ角によるスタイラスの歯車軸方向変位の影響―

    寺岡　孝, 上杉健輔, 黒河 周平, 田口　哲也, 林 照剛, 松川　洋二

    日本機械学会2015年度年次大会  2015.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：北海道大学   Country：Japan  

  • フェムト秒レーザーを用いた半導体表面励起加工に関する研究

    林 照剛, 横尾英昭, 王成武, 松川　洋二, 黒河 周平

    日本機械学会2015年度年次大会  2015.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：北海道大学   Country：Japan  

    Recently, femtosecond laser ablation technique is widely appied to process the hard metal, tranparent materials without thermal effects. We consider the femtosecond laser ablation technique has possibility to process the surface limitation area of semiconducter material. Thus We construct the experimental setup to process the semiconductor surface and investigate a fundamental property for surface processing with surface excitation by using double pulse beam. In this report, we investigate the damage threshold on Si by varying the pulse duration.

  • 低照度フェムト秒レーザー照射後の半導体表面の光反射率変化の計測

    林 照剛，松永啓伍，黒河周平，松川洋二

    日本機械学会2018年度年次大会  2018.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：関西大学   Country：Japan  

  • CMP スラリー中のナノ粒子粒径評価に関する研究

    林 照剛，黒河 周平，草場 博喜，赤星 圭介，松川 洋二

    日本機械学会2018年度年次大会  2018.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：関西大学   Country：Japan  

  • フェムト秒レーザーを用いたダブルパルス照射による励起状態面の表面加工に関する研究

    横尾英昭, 林 照剛, 王成武, 松川　洋二, 黒河 周平

    精密工学会秋期全国大会  2015.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東洋大学   Country：Japan  

    We propose a novel surface processing method for semiconductor wafer by using femtosecond pulse laser. The double pulse within sub-picosecond duration is applied for instant stimulation for semiconductor surface. In this paper, we compare the processing thresholds for Ge wafer for both the double pulse irradiation within sub-picosecond duration and single pulses irradiation with 100 ms duration

  • 蛍光偏光法を用いたCMPスラリーの粘性係数測定による砥粒拡散現象評価

    世利俊樹, 林 照剛, 黒河 周平

    精密工学会秋期全国大会  2015.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東北大学   Country：Japan  

    We investigate the Brownian motion of abrasive grains in slurry for CMP process. We suggest a novel evaluation method of translational diffusion coefficient of Brownian motion by using florescence polarization method. In this paper, we verify the feasibility of the proposed method. We perform the fundamental experiment to measure the viscosity coefficient for both deionized water without the abrasive grains and the liquid with dispersing standard 　　particle are consistent with reference value.

  • 高圧ジェットを用いたCMP用ソフトパッド表面の洗浄効果

    徳元　勇太, 北村 将, 黒河 周平, 林 照剛, 和田　雄高, 檜山　浩國, 高東　智佳子

    精密工学会秋期全国大会  2015.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東北大学   Country：Japan  

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究（第2報）-加工エネルギー閾値の検討-

    林 照剛, 横尾英昭, 王成武, 松川　洋二, 黒河 周平

    精密工学会秋期全国大会  2015.9 

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    Event date： 2015.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東北大学   Country：Japan  

    One of the unique aspects of femtosecond radiation is the excitation of coherent phonon in the pico-second order duration. We propose a surface processing method with excitation of coherent phonon by using femto pulse train beam. Currently, we are exploring the basic mechanisms of femtosecond laser processing with exicitation of coherent phonon. In this report, we investigate the damage threshold for surface processing on Si by using double pulse beam.

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究

    林 照剛, 黒河 周平

    精密工学会春期全国大会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東洋大学   Country：Japan  

    In ultrafast time domain, the laser processing with little thermal effect could be achieved by using repetitive exposure of femto second pulse. We propose a novel surface processing method with excitation of coherent phonon by using double pulse within ten pico second pulse duration. The coherent phonon is a synchronous phonon oscillation for multiple phonons. In this paper, we report the fundamental experiment to investigate the processing property of femto pulse train beam as compared to femto second single pulse.

  • フェムト秒レーザーを用いた半導体ウェハ表面のコヒーレントフォノン励起加工に関する研究

    林 照剛, 横尾英昭, 王成武, 松川　洋二, 黒河 周平

    精密工学会春期全国大会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：東洋大学   Country：Japan  

    In ultrafast time domain, the laser processing with little thermal effect could be achieved by using repetitive exposure of femto second pulse. We propose a novel surface processing method with excitation of coherent phonon by using double pulse within ten pico second pulse duration. The coherent phonon is a synchronous phonon oscillation for multiple phonons. In this paper, we report the fundamental experiment to investigate the processing property of femto pulse train beam as compared to femto second single pulse.

  • 加工雰囲気の違いによるSiCウエハの研磨特性

    張 吉, 黒河 周平, 林 照剛, 王 成武, 浅川 英志, 檜山 浩國

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 三次元座標測定機能を有する歯車測定機の開発ー歯車全周スキャニング測定のはすば歯車への応用ー

    寺岡　孝, 上杉　健輔, 田口　哲也, 黒河 周平, 林 照剛, 松川　洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 三次元座標測定機能を有する歯車測定機の開発ー歯車全周スキャニング測定のはすば歯車への応用ー

    寺岡　孝, 上杉　健輔, 田口　哲也, 黒河 周平, 林 照剛, 松川　洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 静電誘引形スプレーを用いたレジスト成膜に関する研究 マルチノズル形状による成膜の高効率化

    内山 雄介, 佛淵友彬, 黒河 周平, 林 照剛, 宮地 計二，小林 義典, 松尾 一壽

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 研磨用ソフトパッドの表面状態の観察および高圧ジェットの効果

    徳元　勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 福永 明, 檜山 浩國

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 異なる表面粗さを有する被測定物の高精度三次元測定機における スキャニング測定-スタイラスチップ挙動の繰り返し性評価-

    藤岡　拓寛, 黒河 周平, 林 照剛, 松川　洋二, 寺岡　孝

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 歯車全周スキャニング測定と作用歯面部の曲面形状解析 ―歯車のピッチ誤差計算における新評価手法の提案―

    上杉　健輔, 寺岡　孝, 田口　哲也, 黒河 周平, 林 照剛, 松川　洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 静電誘引形スプレーを用いたTSVおよびMEMS向けレジストパターンコーティングに関する研究

    佛淵友彬, 内山 雄介, 黒河 周平, 林 照剛, 宮地 計二，小林 義典, 松尾 一壽

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 歯車全周スキャニング測定と作用歯面部の曲面形状解析 ―歯車のピッチ誤差計算における新評価手法の提案―

    上杉　健輔, 寺岡　孝, 田口　哲也, 黒河 周平, 林 照剛, 松川　洋二

    日本機械学会九州支部総会・講演会  2015.3 

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    Event date： 2015.3

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：福岡工業大学   Country：Japan  

  • 異なる表面粗さを有する被測定物のスキャニング測定におけるスタイラスチップ挙動への影響

    藤岡拓寛, 黒河 周平, 林 照剛, 松川　洋二, 上杉健輔, 寺岡　孝

    精密工学会　九州支部講演会  2014.12 

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    Event date： 2014.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：鹿児島大学   Country：Japan  

    近年，高精度三次元測定の普及が高まり，それに伴い多種多様な被測定物に対する高精度測定の要求が高くなってきている．その中でも，異なる表面粗さを有する被測定物を測定する際に，表面粗さがスタイラスチップの挙動に影響を与えていると考えられる．そこで高精度三次元測定機のスキャニング測定において，測定物表面粗さによるスタイラスチップ挙動への影響を確認し，測定結果との関係を調査した．

  • 高圧ジェットによるコンディショニングの評価

    徳元 勇太, 北村 将, 黒河 周平, 林 照剛, 和田 雄高, 福永 明, 檜山 浩國

    精密工学会　九州支部講演会  2014.12 

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    Event date： 2014.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：鹿児島大学   Country：Japan  

    現在の研磨パッドコンディショニング技術であるダイヤモンドコンディショニングは表面を削り取る作用のためパッドの寿命が短い問題を抱えている.そこで超純水による高圧ジェットを用いたコンディショニングが考案された.研磨後の研磨パッドに高圧の純水を噴射し,その効果を検討するためにパッド表面の走査型電子顕微鏡(SEM)による観察をおこなった.コンディショニング前後の違いの観察により,高圧ジェットによるCMP研磨パッドのコンディショニング法としての有効性を示した.

  • 三次元測定機能を有する歯車測定機の開発 ―全周スキャニング測定における歯形誤差の繰り返し性評価―

    寺岡孝, 上杉健輔, 黒河 周平, 松川　洋二, 林 照剛, 田口哲也

    精密工学会　九州支部講演会  2014.12 

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    Event date： 2014.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：鹿児島大学   Country：Japan  

    歯車は様々な機械に幅広く用いられる機械要素であるため，その精度を保証する歯車測定技術は非常に重要である．本研究では，3Dスキャニングプローブを付加することで，従来では測定が困難であった歯元・歯底形状の測定ができる歯車測定機の開発を目的としている．加えて，従来機より高速・高機能でかつ汎用性の高い測定機を目指している．本稿では，開発機で測定した平歯車全周測定データから作用歯面の形状誤差の1つである歯形誤差を抽出し，繰り返し性について評価を行った．

  • 静電誘引形スプレーを用いたレジスト膜の部分膜厚制御に関する研究

    佛淵 友彬, 内山 雄介, 黒河 周平, 林 照剛, 宮地 計二，小林 義典, 松尾 一壽

    精密工学会　九州支部講演会  2014.12 

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    Event date： 2014.12

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：鹿児島大学   Country：Japan  

    電子システムの小型化に伴い，LSIチップやMEMSチップの異種デバイスを一体化する技術，特に基板の三次元実装技術の開発が急がれている．そこに不可欠なTSV(Trough-Silicon Via:貫通電極)作成のためのレジスト塗布において，立体構造に対して均一かつ高効率に成膜をする必要がある．本研究では，静電誘引形スプレーの印加電圧の外部制御機能を用いてフォトレジストのパターン成膜実験を行った．その中で，スプレー状態変化の観察や，電圧応答性の改善を確認することができた．

  • Processing Characteristics of SiC Wafer by Consideration of Oxidization Effect in Different Atomospheric Environment International conference

    Syuhei Kurokawa, Terutake Hayashi

    International Conference on Planarization/CMP Technology  2014.11 

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    Event date： 2014.11

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kobe, Hyougo   Country：Japan  

  • 周波数分解光ゲート法を用いた半導体ウェハ表面の非接触光計測に関する研究

    林 照剛, 黒河 周平

    日本機械学会生産加工部門部門講演会  2014.11 

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    Event date： 2014.11

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：徳島大学   Country：Japan  

    We proposed a novel optical surface inspection method to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on a cross correlation frequency resolved optical gating method, is applied to evaluate the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Development of gear measuring machine 　for whole scanning method of cylindrical gear outline and　evaluation of tooth root and toot profile deviation International conference

    林 照剛

    The 18th International Conference On Mechatronics Technology  2014.10 

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    Event date： 2014.10

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Taiwan Tech, Taipei, Taiwan   Country：Japan  

    Measurement of tooth root and bottom profiles is very important to analyze bending fatigue of gear teeth. But, it is hard to measure those profiles with a conventional Gear Measuring Machine (GMM), because tooth root and bottom consists of free-formed surface and a conventional GMM is equipped with a probe to measure only one-axis displacement. Therefore the authors try to develop a new GMM which can accurately measure not only working flanks but also tooth root and bottom profiles by installing a 3D scanning probe, which results in multiple functions and time reduction measurement.
    A new method for measurement is adopted into the developed GMM by scanning the whole shape of a gear outline without detaching a stylus tip from a gear surface in order to obtain the measuring data of whole gear outline including tooth flanks, tip, root and bottom profiles. The measured data are used to evaluate geometrically tooth root and profile deviations. The proposed method is verified by comparing the profile deviations with those measured by a conventional GMM.

  • Hybrid X-FROG法を用いたウェハ表面の非接触光計測技術に関する研究 International conference

    林 照剛, 黒河 周平

    精密工学会秋期全国大会  2014.9 

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    Event date： 2014.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：鳥取大学   Country：Japan  

    We proposed a novel optical surface inspection method for to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on cross correlation frequency resolved optical gating method, for the femto pulse reflected on the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Hybrid X-FROG法を用いたウェハ表面の非接触光計測技術に関する研究

    林 照剛, 黒河 周平

    2014年度　精密工学会　秋期全国大会  2014.9 

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    Event date： 2014.9

    Language：Japanese   Presentation type：Oral presentation (general)  

    Venue：鳥取大学   Country：Japan  

    We proposed a novel optical surface inspection method for to investigate the surface defects of semiconductor wafer. A novel phase characterizing method, which is based on cross correlation frequency resolved optical gating method, for the femto pulse reflected on the surface nano structure of semiconductor wafer. In this paper, we describe the principle of the method and the component of originally developed equipment to evaluate the nano surface texture by using hybrid X-FROG method.

  • Study on nanoparticle sizing using fluorescent　polarization method with DNA fluorescent probe International conference

    Terutake Hayashi

    11th Laser Metrology for Precision Measurement and Inspection in Industry 2014  2014.9 

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    Event date： 2014.9

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Tsukuba   Country：Japan  

    A fluorescent polarization method is well known for the detection of complementary base pairing of DNA in biological field. The fluorescent polarization method (FP) measures the rotational diffusion coefficient of Brownian motion of the fluorescent particle in the solution. The rotational diffusion coefficient is corresponding to inverse third power of diameter due to the Einstein Stokes Relation for nanoparticle as hard sphere.
    We develop a novel rotational diffusion coefficient measurement method by using a fluorescent probe with DNA spacer, which is connected to particle. We investigate the relation between the gold nanoparticle and the fluorescent probe in order to verify the feasibility of the proposed method. The rotational diffusion coefficients of gold nanoparticles, whose diameters are from 5 nm to 20 nm, are evaluated by using the developed system. In this paper we describe the method of fluorescent polarization method by using fluorescent DNA probe (fl-DNA).

  • Surface Processing Using a Femtosecond Pulse Train Beam International conference

    Terutake Hayashi

    The 15th International Conference on Precision Engineering (2014)  2014.7 

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    Event date： 2014.7

    Language：English   Presentation type：Oral presentation (general)  

    Venue：Kanazawa, Ishikawa   Country：Japan  

    The coherent phonon is a synchronous phonon oscillation for multiple phonons. It is excited by the interaction of electrons and high latitude electric field1). We propose a novel surface processing method with excitation of coherent phonon by using pulse train beam. It is considered that the surface processing during coherent phonon oscillation enables to improve the processing rate of the femto second laser, because the phonon resonance causes nonlinear increase of the lattice temperature and electron temperature. In ultrafast time domain, the laser processing with little heat diffusion and little thermal damage could be achieved by using repetitive exposure of femto second pulse by using pulse train beam before dumping of the lattice vibration and losing the energy of oscillation as a thermal diffusion. In this paper, we report the fundamental experiment to investigate the processing property of femto pulse train beam as compared to femto second single pulse.

  • Study on surface processing by using femto-second pulse train beam with excitation of coherent phonon International conference

    Ｔerutake Hayashi, Yusuke Fukuta, Masaki Michihata, and Yasuhiro Takaya,

    28th Annual Meeting　of the　American Society for Precision Engineering, (ASPE2013) 

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    Event date： 2013.10

    Presentation type：Oral presentation (general)  

    Venue：St. Paul, Minnesota   Country：United States  

  • Development of nanoparticles sizing method based on fluorescence polarization International conference

    Y.Ishizaki, T.Hayashi, M.Michihata, Y.Takaya,

    ISMQC2013 

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    Event date： 2013.9

    Presentation type：Oral presentation (general)  

    Venue：University　Cracow   Country：Poland  

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MISC

  • ダブルパルスビームを用いた低照度フェムト秒レーザー加工

    林 照剛, 黒河 周平

    塑性と加工   2016.11

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    Language：Japanese   Publishing type：Article, review, commentary, editorial, etc. (scientific journal)  

  • フェムト秒レーザーによるコヒーレントフォノン励起加工の可能性

    林 照剛, 黒河 周平, 高谷裕浩

    光アライアンス   2015.10

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    Language：Japanese   Publishing type：Article, review, commentary, editorial, etc. (scientific journal)  

Industrial property rights

Patent   Number of applications: 4   Number of registrations: 0
Utility model   Number of applications: 0   Number of registrations: 0
Design   Number of applications: 0   Number of registrations: 0
Trademark   Number of applications: 0   Number of registrations: 0

Professional Memberships

  • Japan Society of Mechanical Engineers

  • The Japan Society for Precision Engineering

  • The Japan Society for Abrasive Technology

  • 電気工学会

Committee Memberships

  • 日本機械学会九州支部   Steering committee member   Domestic

    2023.4 - 2024.3   

  • 日本機械学会九州支部   広報担当   Domestic

    2023.4 - 2024.3   

  • 精密工学会九州支部   Organizer   Domestic

    2018.4 - 2019.3   

  • 精密工学会九州支部   庶務幹事   Domestic

    2018.4 - 2019.3   

  • 精密工学会九州支部   Organizer   Domestic

    2016.4 - 2018.3   

  • 精密工学会九州支部   会計幹事   Domestic

    2016.4 - 2018.3   

  • 日本機械学会   Organizer   Domestic

    2016.4 - 2017.3   

  • 日本機械学会   生産加工・工作機械部門   Domestic

    2016.4 - 2017.3   

  • 日本機械学会   Organizer   Domestic

    2015.4 - 2017.3   

  • 日本機械学会   生産システム部門   Domestic

    2015.4 - 2017.3   

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Academic Activities

  • Screening of academic papers

    Role(s)： Peer review

    2017

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    Type：Peer review 

    Number of peer-reviewed articles in foreign language journals：10

    Number of peer-reviewed articles in Japanese journals：7

    Proceedings of International Conference Number of peer-reviewed papers：3

  • 部門セッション企画委員（生産加工・工作機械部門，生産システム部門） International contribution

    機械学会年次大会  （ Japan ） 2016.9

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    Type：Competition, symposium, etc. 

    Number of participants：2,000

  • セッションオーガナイザ International contribution

    精密工学会秋期全国大会  （ Japan ） 2016.9

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    Type：Competition, symposium, etc. 

    Number of participants：400

  • 座長（Chairmanship）

    精密工学会  （ Japan ） 2016.3

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    Type：Competition, symposium, etc. 

  • 座長（Chairmanship） International contribution

    The 8th International Conference on Leading Edge Manufacturing in 21st Century  （ Kyoto, Kyoto Japan ） 2015.11 - 2013.11

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    Type：Competition, symposium, etc. 

  • 座長（Chairmanship）

    精密工学会  （ Japan ） 2015.9

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    Type：Competition, symposium, etc. 

  • 座長（Chairmanship）

    精密工学会  （ Japan ） 2015.3

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    Type：Competition, symposium, etc. 

  • 座長（Chairmanship）

    機械学会九州支部　総会・講演会  （ Japan ） 2015.3

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    Type：Competition, symposium, etc. 

  • Publication Committee International contribution

    LMPMI2014  （ Epochal Esukuba Japan ） 2014.9

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    Type：Competition, symposium, etc. 

    Number of participants：200

  • 座長（Chairmanship）

    精密工学会  （ Japan ） 2014.3

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    Type：Competition, symposium, etc. 

  • 座長（Chairmanship） International contribution

    The 7th International Conference on Leading Edge Manufacturing in 21st Century  （ Matsushima, Miyagi Japan ） 2013.11

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    Type：Competition, symposium, etc. 

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Research Projects

  • アトグラム質点系のブラウン運動解析にもとづく高精度ナノ粒子粒度分布計測

    Grant number：19H02043  2019 - 2021

    Japan Society for the Promotion of Science  Grants-in-Aid for Scientific Research  Grant-in-Aid for Scientific Research (B)

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    Authorship：Principal investigator  Grant type：Scientific research funding

  • フェムト秒レーザーを用いた光励起加工に関する研究

    2018.4 - 2019.3

    Joint research

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    Authorship：Principal investigator  Grant type：Other funds from industry-academia collaboration

  • フェムト秒レーザーを用いた光励起加工に関する研究

    2017.4 - 2018.3

    Joint research

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    Authorship：Principal investigator  Grant type：Other funds from industry-academia collaboration

  • フェムト秒レーザーを用いた光励起加工に関する研究

    2016.4 - 2017.3

    Joint research

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    Authorship：Principal investigator  Grant type：Other funds from industry-academia collaboration

  • 蛍光ナノプローブを用いたブラウン運動評価に基づく高精度ナノ粒子粒度分布解析

    Grant number：16H04249  2016 - 2018

    Japan Society for the Promotion of Science  Grants-in-Aid for Scientific Research  Grant-in-Aid for Scientific Research (B)

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    Authorship：Principal investigator  Grant type：Scientific research funding

  • フェムト秒レーザーによる難加工性透明材料表面のダメージレス精密加工技術の開発

    2016 - 2017

    JST　マッチングプランナー制度

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    Authorship：Principal investigator  Grant type：Contract research

  • フェムトパルストレインビームによるコヒーレントフォノン励起加工に関する研究

    2014

    レーザプロセッシング 一般研究開発助成（天田財団）

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    Authorship：Principal investigator  Grant type：Contract research

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Educational Activities

  • 機械工学実験第一　歯車，光学測定　機械要素設計製図II
    日本語コミュニケーション
    精密加工学（大学院）
    加工プロセス演習（大学院）

Award for Educational Activities

  • 日本工学教育協会　業績賞

    2005.9   日本工学教育協会  

    Award-winner：（連名受賞）

    児童のための機械的・工学的ものづくり教育プログラムの実践

Class subject

  • 加工プロセス演習

    2024.10 - 2025.3   Second semester

  • 精密加工学

    2024.10 - 2025.3   Second semester

  • 機械要素設計製図Ⅱ（B）

    2024.6 - 2024.8   Summer quarter

  • 機械工学実験第一

    2024.4 - 2024.9   First semester

  • 加工プロセス演習

    2023.10 - 2024.3   Second semester

  • 精密加工学

    2023.10 - 2024.3   Second semester

  • 機械要素設計製図Ⅱ（B）

    2023.6 - 2023.8   Summer quarter

  • 機械工学実験第一

    2023.4 - 2023.9   First semester

  • 精密加工学

    2022.10 - 2023.3   Second semester

  • 加工プロセス演習

    2022.10 - 2023.3   Second semester

  • 機械工学実験第一

    2022.4 - 2022.9   First semester

  • 機械要素設計製図Ⅱ（B）

    2022.4 - 2022.6   Spring quarter

  • 精密加工学

    2021.10 - 2022.3   Second semester

  • 加工プロセス演習

    2021.10 - 2022.3   Second semester

  • 機械工学実験第一

    2021.4 - 2021.9   First semester

  • 機械要素設計製図Ⅱ（B）

    2021.4 - 2021.6   Spring quarter

  • 加工プロセス演習

    2020.10 - 2021.3   Second semester

  • 機械要素設計製図（B）

    2020.4 - 2021.3   Full year

  • 機械要素設計製図Ⅱ（Bクラス）

    2020.4 - 2020.6   Spring quarter

  • 機械要素設計製図Ⅱ（B）

    2020.4 - 2020.6   Spring quarter

  • 精密加工学

    2019.10 - 2020.3   Second semester

  • 加工プロセス演習

    2019.10 - 2020.3   Second semester

  • 創造設計

    2019.4 - 2019.9   First semester

  • 機械工学実験第一

    2019.4 - 2019.9   First semester

  • 機械要素設計製図Ⅱ

    2019.4 - 2019.6   Spring quarter

  • 機械要素設計製図Ⅰ(B)

    2018.12 - 2019.2   Winter quarter

  • 精密加工学

    2018.10 - 2019.3   Second semester

  • 加工プロセス演習

    2018.10 - 2019.3   Second semester

  • 精密加工学

    2018.10 - 2019.3   Second semester

  • 加工プロセス演習

    2018.10 - 2019.3   Second semester

  • 機械工学実験第一

    2018.4 - 2018.9   First semester

  • 機械工学実験第一

    2018.4 - 2018.9   First semester

  • 機械工学実験第一

    2018.4 - 2018.9   First semester

  • Mechanical and Aerospace Engineering Experiments Ⅰ

    2018.4 - 2018.6   Spring quarter

  • 加工プロセス演習

    2017.10 - 2018.3   Second semester

  • 機械要素設計製図

    2017.10 - 2018.3   Second semester

  • 創造設計

    2017.4 - 2017.9   First semester

  • 機械工学実験第一

    2017.4 - 2017.9   First semester

  • 機械工学実験第一

    2017.4 - 2017.9   First semester

  • 機械工学実験第一

    2017.4 - 2017.9   First semester

  • Mechanical and Aerospace EngineeringExperiments I

    2017.4 - 2017.6   Spring quarter

  • 精密加工学

    2016.10 - 2017.3   Second semester

  • 加工プロセス演習

    2016.10 - 2017.3   Second semester

  • 機械要素設計製図

    2016.10 - 2017.3   Second semester

  • 機械工学実験第一

    2016.4 - 2016.9   First semester

  • 日本語コミュニケーション

    2016.4 - 2016.9   First semester

  • 創造設計

    2016.4 - 2016.9   First semester

  • 加工プロセス演習

    2015.10 - 2016.3   Second semester

  • 精密加工学

    2015.10 - 2016.3   Second semester

  • 機械要素設計製図

    2015.10 - 2016.3   Second semester

  • 創造設計

    2015.4 - 2015.9   First semester

  • 機械工学実験第一

    2015.4 - 2015.9   First semester

  • 日本語コミュニケーション

    2015.4 - 2015.9   First semester

▼display all

FD Participation

  • 2024.10   Role：Planning   Title：学生とのかかわり方や学生の不登校に関すること

    Organizer：Undergraduate school department

  • 2024.1   Role：Participation   Title：機械工学部門FD　科研申請について気を付けていること

    Organizer：Undergraduate school department

  • 2023.11   Role：Participation   Title：機械工学部門FD　学生との関わりに活かすアサーション

    Organizer：Undergraduate school department

  • 2020.11   Role：Participation   Title：【機械系FD】学修目標を評価する意義と方法

    Organizer：University-wide

  • 2020.6   Role：Participation   Title：FD講演会「ルーブリックを活用した評価と授業改善」

    Organizer：[Undergraduate school/graduate school/graduate faculty]

  • 2017.6   Role：Participation   Title：機械工学部門前期FD

    Organizer：[Undergraduate school/graduate school/graduate faculty]

  • 2016.7   Role：Participation   Title：第一回工学部ＦＤ

    Organizer：[Undergraduate school/graduate school/graduate faculty]

  • 2015.7   Role：Participation   Title：機械工学部門前期FD

    Organizer：Undergraduate school department

  • 2014.4   Role：Participation   Title：第１回全学ＦＤ

    Organizer：University-wide

▼display all

Other educational activity and Special note

  • 2025  Class Teacher  学部

    　詳細を見る

    学部2年生　クラス担任

  • 2024  Class Teacher  学部

  • 2023  Class Teacher  学部

  • 2022  Class Teacher  学部

  • 2021  Class Teacher  学部

  • 2020  Class Teacher  学部

  • 2020  Class Teacher  学部

  • 2019  Class Teacher  学部

  • 2018  Class Teacher  学部

  • 2017  Class Teacher  全学

  • 2016  Class Teacher  全学

  • 2015  Class Teacher  全学

  • 2014  Class Teacher  全学

▼display all

Social Activities

  • 第12回 精密工学会九州支部 産学官技術交流セミナー

    精密工学会九州支部  福岡工業大学  2013.11

    　More details

    Audience：General,　Scientific,　Company,　Civic organization,　Governmental agency

    Type：Lecture

  • ものづくり最前線2013

    日本機械学会生産加工部門，日本機械学会関西支部  大阪大学中之島センター  2013.11

    　More details

    Audience：General,　Scientific,　Company,　Civic organization,　Governmental agency

    Type：Lecture

    大学生，大学院生，高専生を対称とし，ものづくりの現場で活動する企業人の活動内容を紹介する．（2013年度は電気，材料，自動車，機械加工，計測）