第２４回エレクトロニクス実装学会講演大会研究奨励賞

2011.8   Siプラットフォーム上にハイブリッド集積したLiNbO3光変調器のカップリング効率と変調特性

Investigation of interface between LiNbO3 and Si fabricated via room-temperature bonding method using activated Si nano layer Reviewed International journal

#Seigo Murakami, #Kaname Watanabe, Ryo Takigawa

Japanese Journal of Applied Physics   62   p.SG1041   2023.3

Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition Reviewed International journal

#Ryo Takakura, #Seigo Murakami, #Kaname Watanabe, Ryo Takigawa

Scientific Reports   13 ( 1 )   p.3581   2023.3

Surface activated bonding of ALD Al2O3 films Reviewed International journal

@Junsha Wang, Ryo Takigawa, @Tadatomo Suga

Japanese Journal of Applied Physics   62   p.SC1081   2023.2

Development of a microfluidic-based taste sensor using lipid polymer membrane Reviewed International journal

@Y Tahara, F Sassa, R Takigawa, @Y Kurihara

Japanese Journal of Applied Physics   62   p.SG1014   2023.1

Thin Circularly Polarized Slot Array Antenna for High-Band UWB Applications Reviewed International journal

Ryo Takigawa, #Shunsuke Kai, Haruichi Kanaya

Electronics   11 ( 7 )   1 - 12   2022.3

Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions Reviewed International journal

Takashi Matsumae, @Ryo Takigawa, Yuichi Kurashima, Hideki Takagi, Eiji Higurashi

Scientific Reports   11   １ - ７   2021.5

Bonding of LiNbO3 and Si wafers at room temperature using Si nanolayers Reviewed International journal

#Kaname Watanabe, @Ryo Takigawa

Japanese Journal of Applied Physics   60   SCCL14-1 - SCCL14-5   2021.4

Surface activated bonding of aluminum oxide films at room temperature Reviewed International journal

@Jun Utsumi, @Ryo Takigawa

Scripta Materialia   191   215 - 218   2021.1

Demonstration of GaN/LiNbO3 hybrid wafer using room-temperature surface activated bonding Reviewed International journal

@Ryo Takigawa, Michitaka Yamamoto, Eiji Higurashi, @Tanemasa Asano, @Haruichi Kanaya

ECS Journal of Solid State Science and Technology   9 ( 3 )   045005   2020.4

Direct bonding of LiNbO3 and SiC wafers at room temperature Reviewed International journal

@Ryo Takigawa, Jun Utsumi

Scripta Materialia   174   58 - 61   2020.1

Fabrication of bonded LNOI waveguide structure on Si substrate using ultra-precision cutting Invited Reviewed International journal

@Ryo Takigawa, Keigo Kamimura, Keiichi Nakamoto, Toru Tomimatsu, and @Tanemasa Asano

Japanese Journal of Applied Physics   59   SBBD03-1 - SBBD03-4   2020.1

Ultrathin adhesivelayer between LiNbO3 and SiO2 for bonded LNOI waveguide Reviewed International journal

@Ryo Takigawa, @Eiji Higurashi, @Tanemasa Asano

Japanese Journal of Applied Physics   58   SJJE06-1 - SJJE06-5   2019.8

Residual stress in Lithium Niobate film layer of LNOI/Si hybrid wafer fabricated using low-temperature bonding method Reviewed International journal

@Ryo Takigawa, @Toru Tomimatsu, @Eiji Higurashi, and @Tanamasa Asano

MICROMACHINES   10 ( 2 )   136   2019.2

Relationship between AC/DC Ratio and Light-blocking Structure for Reflective Photoplethysmographic Sensor Reviewed International journal

@Hirofumi Nogami, Wataru Iwasaki, Nobutomo Morita and @Ryo Takigawa

Sensors and Materials   30 ( 12 )   3021   2018.12

Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3 Reviewed International journal

Toru Tomimatsu, and @Ryo Takigawa

Sensors and Materials   30 ( 12 )   2881   2018.12

Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim Reviewed International journal

30 ( 12 )   2897   2018.12

Thin-film lithium niobate-on-insulator waveguides fabricated on silicon wafer by room-temperature bonding method with silicon nanoadhesive layer Reviewed International journal

@Ryo Takigawa and @Tanemasa Asano

Optics Express   26 ( 19 )   24413 - 24421   2018.9

Surface Activated Bonding of LiNbO3 and GaN at Room Temperature Reviewed International journal

@Ryo Takigawa, Eiji Higurashi, @Tanemasa Asano

ECS transactions   86 ( 5 )   207 - 213   2018.7

Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method Invited Reviewed International journal

@Ryo Takigawa, @Eiji Higurashi, @Tanemasa Asano

Japanese Journal of Applied Physics   57   2018.5

Correlation between the local stress and the grain misorientation in the polycrystalline Al2O3 measured by near-field luminescence spectroscopy Reviewed International journal

@Toru Tomimatsu, @Ryo Takigawa

Japanese Journal of Applied Physics   57   2018.5

Room-temperature transfer bonding of lithium niobate thin film on micromachined silicon substrate with Au microbumps Reviewed International journal

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi

Sensors & Actuators: A. Physical   264 ( 1 )   274 - 281   2017.8

Investigation of the interface between LiNbO3 and Si wafers bonded by laser irradiation Reviewed International journal

Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano

JAPANESE JOURNAL OF APPLIED PHYSICS   56   088002-1 - 088002-3   2017.7

Demonstration of ultraprecision ductile-mode cutting for lithium niobate microring waveguides Reviewed International journal

Ryo Takigawa, Eiji Higurashi, Tetsuya Kawanishi, Tanemasa Asano

JAPANESE JOURNAL OF APPLIED PHYSICS   55 ( 11 )   2016.11

Bonding of lithium niobate to silicon in ambient air using laser irradiation Reviewed International journal

Hiroki Kawano, Ryo Takigawa, Hiroshi Ikenoue, Tanemasa Asano

JAPANESE JOURNAL OF APPLIED PHYSICS   55 ( 8 )   2016.8

Triple-walled gold surfaces with small-gaps for nonresonance surface enhanced Raman scattering of rhodamine 6G molecules Reviewed

Tatsuya Baba, Yaerim Lee, Ai Ueno, Reo Kometani, Etsuo Maeda, Ryo Takigawa

Journal of Vacuum Science & Technology B   34   011802-1 - 011802-4   2016.1

High-speed via hole filling using electrophoresis of Ag nanoparticles Reviewed International journal

Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano

TS5.4.1 - TS5.4.4   2015.9

強誘電体材料の切削加工によるリッジ型光導波路

多喜川 良

33 ( 2 )   31 - 36   2015.5

Lithium niobate ridged waveguides with smooth vertical sidewalls fabricated by an ultra-precision cutting method Reviewed International journal

Ryo Takigawa, Eiji HIgurashi, Tetsuya Kawanishi, Tanemasa Asano

Optics Express   22 ( 22 )   2014.11

Electrical pumping Fabry-Perot lasing of a III-V layer on a highly doped silicon micro rib Reviewed International journal

Linghan, Li, Takigawa Ryo, Akio Higo, Eiji Higurashi, Masakazu Sugiyama, Bingyao Liu, Yoshiaki Nakano

LASER PHYSICS LETTERS   11 ( 11 )   115807   2014.11

Heterogeneously integrated laser-induced fluorescence detection devices: Integration of an excitation source

Toshihiro Kamei, Keiko Sumitomo, Sachiko Ito, Ryo Takigawa, Tsujimura Noriyuki, Hisayuki Kato, Takeshi Kobayashi, Ryutaro Maeda

JAPANESE JOURNAL OF APPLIED PHYSICS   53 ( 6 )   2014.6

Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim Reviewed International journal

Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano

JAPANESE JOURNAL OF APPLIED PHYSICS   53   06JM05   2014.5

Room temperature bonding of metal films using flattening by thermal imprint process Reviewed International journal

Yuichi Kurashima, Atsuhiko Maeda, Takigawa Ryo, Hideki Takagi

Microelectronic Engineering   112   52 - 56   2013.12

Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates Invited Reviewed International journal

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi

OPTICS EXPRESS   19 ( 17 )   15739 - 15749   2011.8

Passive Alignment and Mounting of LiNbO3 Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au Invited Reviewed International journal

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS   17 ( 3 )   652 - 658   2011.5

環境調和型実装技術(エレクトロニクス実装技術の現状と展望) Invited Reviewed

竹沢由高, 重藤暁津, 赤池正剛, 多喜川良

エレクトロニクス実装学会誌   12 ( 1 )   34 - 38   2009.1

Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air Invited Reviewed International journal

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

APPLIED PHYSICS EXPRESS   1 ( 11 )   2008.11

Low-temperature Au-to-Au bonding for LiNbO3/Si structure achieved in ambient air Reviewed International journal

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi

IEICE TRANSACTIONS ON ELECTRONICS   E90C ( 1 )   145 - 146   2007.1

Non-invasive heart rate measurement system using laser Doppler blood flowmetry for husbandry training of masked palm civet (parguma larvata) Reviewed International journal

@Nogami Hirofumi, #Ohgata Satoru, #Saito Aya, #Ban Kazuyuki, #Akiyama Terukazu, #Hiejima Takumi, @Takigawa Ryo, @Hosoya Tadatsugu

Japanese Journal of Applied Physics   60   SCCL13-1 - SCCL13-6   1900

常温ウエハ接合により Si 上に集積された低駆動電圧型LNOI 光変調器アレイ

#渡辺 要, @山口 祐也, @菅野 敦史, 多喜川 良

第39回「センサ・マイクロマシンと応用システム」  2022.11 

Modified surface activated bonding of InP and SiO2 at room temperature International conference

#Zhang Gufei, #Kaname Watanabe and Ryo Takigawa

35rd International Microprocesses and Nanotechnology Conference (MNC 2022)  2022.11 

Effect of Ar Fast Atom Beam irradiation on alpha-Al2O3 for surface activated room temperature bonding International conference

#Ryo Takakura, Ryo Takigawa

35rd International Microprocesses and Nanotechnology Conference (MNC 2022)  2022.11 

Fabrication of LiNbO3/Si bond interface using room temperature direct bonding International conference

#Seigo Murakami, #Kaname Watanabe, Ryo Takigawa

35rd International Microprocesses and Nanotechnology Conference (MNC 2022)  2022.11 

LNOI photonics fabricated on Si wafer by room temperature bonding International conference

#Kaname Watanabe, @Yuya Yamaguchi, @Kannno Atsushi, Ryo Takigawa

7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)  2021.10 

室温接合により作製されたSi上LN on insulator光変調器

#渡辺要、@山口祐也、@菅野敦史、多喜川良

エレクトロニクス実装学会　第36回春季講演大会  2022.3 

原子層堆積法で成膜した酸化アルミニウム極薄膜同士の常温接合

#高倉亮,#渡辺要,多喜川良

エレクトロニクス実装学会　第36回春季講演大会  2022.3 

表面活性化によるInPとSiCの室温ウェハ接合

#前川敏輝,#範云翰,#渡辺要,多喜川良

エレクトロニクス実装学会　第36回春季講演大会  2022.3 

Terahertz band on-chip one-sided directional wide band slot array antenna International conference

Kohei Tasaki, Ryo Takigawa, Haruichi Kanaya

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)  2021.12 

Surface activated bonding of Au thin microbumps using ultra-violet treatment International conference

#Toshiki Maekawa, #Kaname Watanabe, Hirofumi Nogami, Yuiichiro Kurokawa, RyoTakigawa

34rd International Microprocesses and Nanotechnology Conference (MNC 2021)  2021.10 

DEVELOPMENT OF MICROFLUIDIC-BASED TASTE SENSOR WITH LIPID POLYMER MEMBRANE International conference

Yuma Kurihara, Ryo Takigawa, Fumihiro Sassa and Yusuke Tahara

34rd International Microprocesses and Nanotechnology Conference (MNC 2021)  2021.10 

Non-invasive heart rate measurement system using Laser doppler flowmetry with body motion artifact noise reduction algorithm for Husbandry training International conference

#Takumi Hiejima, Hirofumi Nogami , Aya Saito ,Kazuyuki Ban, Ryo Takigawa and Jumpei Arata

34rd International Microprocesses and Nanotechnology Conference (MNC 2021)  2021.10 

Acceleration measurement in dental implants International conference

Hirofumi Nogami, #Takumi Hiejima, Ryo Takigawa and Yasuyuki Matsushita

34rd International Microprocesses and Nanotechnology Conference (MNC 2021)  2021.10 

Fabrication of InP/SiC structure using surface activated direct bonding International conference

#Y Fan, #T Maekawa, #K Watanabe, R Takigawa

7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)  2021.10 

Room temperature wafer bonding of LiNbO3 and Si using surface activation process with self sputtering International conference

#Kaname Watanabe, @Ryo Takigawa

33rd International Microprocesses and Nanotechnology Conference (MNC 2020)  2020.11 

大気中低温接合技術による光導波路チップ集積 Invited

多喜川良

レーザ学会546回研究会  2020.9 

テラヘルツ波検波のためのアレイアンテナチップの開発

@多喜川 良,#田崎 浩平,@浅野 種正,@金谷 晴一

エレクトロニクス実装学会  2020.3 

Room-temperature direct bonding of LiTaO3 and SiC wafers for future SAW filter International conference

@Ryo Takigawa, Jun Utsumi

45th International Conference on Micro & Nano Engineering  2019.9 

ニオブ酸リチウムと炭化シリコンの常温ウエハ接合

@多喜川良、内海淳

第29回 マイクロエレクトロニクスシンポジウム（MES2019）  2019.9 

常温接合による超高速フォトニクス実装（招待講演） Invited

@多喜川良

電子情報通信学会  2019.8 

Lithium niobate-on-insulator waveguide on Si substrate fabricated by room temperature bonding International conference

@Ryo Takigawa, Keigo Kamimura, Keiichi Nakamoto, @Tanemasa Asano

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)  2019.5 

接合中間層がLNOI光導波路特性に及ぼす影響調査

@多喜川良, 日暮栄治, @浅野種正

エレクトロニクス実装学会  2019.3 

[Invited]Low-temperature bonding for heterogeneous photonic integration Invited International conference

@Ryo Takigawa

6th K-J Joint Syposium  2019.2 

[Invited] Surface activated bonding of LiNbO3 and Si for optical microsystem Invited International conference

@Ryo Takigawa

31st International Microprocesses and Nanotechnology Conference(MNC)  2018.11 

[招待講演]Auを用いた大気中低温接合によるLiNbO3光デバイス実装 Invited

@多喜川良

電子情報通信学会マイクロ波・ミリ波フォトニクス研究会  2017.11 

Room-temperature bonding of LiNbO3 and SiO2 using surface activated bonding International conference

@Ryo Takigawa, @Eiji Higurashi, @Tanemasa Asano

30th International of Microprocesses and Nanotechnology Conference  2017.11 

SUBMICRON-RESOLUVED LUMINESCENCE IMAGING FOR DETECTION OF GRAIN ANISOTROPY INDUCED STRESS IN AL2O3 BY NEAR-FIELD SPECTROSCOPY International conference

@Toru Tomimatsu, @Ryo Takigawa

30th International of Microprocesses and Nanotechnology Conference  2017.11 

Room-temperature wafer bonding of LiNbO3 and SiO2 using sub-nanometer Fe films International conference

@Ryo Takigawa, Eiji Higurashi, @Tanemasa Asano,

23rd Microoptics Conference (MOC2018)  2018.10 

Siナノ密着層を利用したLiNbO3とSiO2の常温ウエハ接合と低損失LNOI光導波路への応用

@多喜川良、@浅野種正

第７9回応用物理学会秋季学術講演会  2018.9 

[Invited] Surface Micromachining Using Ultra-precision Ductile-mode Cutting Method for Strongly Confined Low-loss LiNbO3 Waveguides Invited International conference

@Ryo Takigawa, @Tetsuya Kawanishi, @Eiji Higurashi, and @Tanemasa Asano

Progress in Electromagnetics Research Symposium(PIERS) 2018  2018.8 

LN変調器向け小型0.18μm CMOS高速駆動回路

@久保木猛，@多喜川良，@加藤和利

第65回応用物理学会春季学術講演会  2018.3 

イオンビーム活性化接合法による Si上LNOI導波路の作製と光伝搬特性評価

@多喜川　良, @日暮　栄治, @浅野　種正

第65回応用物理学会春季学術講演会  2018.3 

切削加工によるSi基板上LNOI光導波路の作製検討

@多喜川良，@日暮栄治，@川西哲也，@浅野種正

第32回エレクトロニクス実装学会春季講演大会  2018.3 

表面活性化と低温熱処理を併用したLiNbO3ウェハと SiO2/Si ウェハの直接接合

多喜川　良, 日暮　栄治, 浅野　種正

第７８回応用物理学会秋季学術講演会  2017.9 

Surface activated wafer bonding of LiNbO3 and SiO2/Si for LNOI on Si International conference

Ryo Takigawa, Eiji Higurashi, Tanemasa Asano

IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB2017)  2017.5 

無電解めっきを用いた電気泳動によるTSV埋め込み用シード膜の成膜

新田航平, 多喜川　良, 池田 晃裕, 熊澤 光章, 平井 俊明, 小松 通郎, 浅野 種正

第63回応用物理学会春季学術講演会  2016.3 

[Invited]Demonstration of strongly confined optical waveguides using ultra-precision ductile-mode cutting Invited International conference

Ryo Takigawa

The 5th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging  2017.3 

Electroless Ni Plating of Seed Film of Electrophoresis of Ag Nanoparticles International conference

Kohei Nitta, Ryo Takigawa, A. Ikeda, M. Kumazawa, T. Hirai, M. Komatsu, Tanemasa Asano

29th International Microprocesses and Nanotechnology Conference (MNC2016)  2016.11 

LiNbO3/Si Hybrid Wafer Bonded in Ambient Air Using Laser Irradiation International conference

Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano

29th International Microprocesses and Nanotechnology Conference (MNC2016)  2016.11 

[招待講演]ハイブリッド集積型光マイクロシステムに向けた大気中低温接合 Invited

多喜川 良

日本学術振興会接合界面創成技術１９１委員会第７回研究会  2016.10 

電気泳動法によるSi貫通電極埋込用シード膜の無電解めっきによる形成

新田 航平, 多喜川 良, 池田 晃裕, 熊澤光章, 平井俊晴, 小松通郎, 浅野 種正

応用物理学会九州支部学術講演会  2015.12 

High-speed via hole filling using electrophoresis of Ag nanoparticles International conference

Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa aSANO

IEEE 2015 International 3D Systems Integration Conference  2015.9 

[招待講演]強誘電体材料の切削加工によるリッジ型光導波路 Invited

多喜川 良

応用物理学会 微小光学研究会「材料を創る・活かす−適材適所の微小光学−」  2015.5 

High-speed via filling using electrophoresis of Ag nanoparticles International conference

Ryo Takigawa, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano

INC11  2015.5 

切削加工によるニオブ酸リチウム微細光回路の作製と光学特性の評価

多喜川 良, 日暮栄治, 川西哲也, 浅野 種正

第29回 エレクトロニクス実装学会講演大会  2015.3 

超音波加振によるAu先鋭バンプの常温接合過程に関する考察

岩鍋圭一郎, 首藤高徳, 多喜川 良, 浅野 種正

第29回 エレクトロニクス実装学会講演大会  2015.3 

Low-temperature vacuum packaging using Au narrow compliant rim International conference

Ryo Takigawa, Yohei Aoki, Hiroki Kawano, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano

2015.2 

先鋭マイクロバンプを用いた強誘電体薄膜の Si 基板上への大気中常温転写

河野宏貴, 多喜川 良, 浅野 種正

2014年度応用物理学会九州支部学術講演会  2014.12 

Softening of Metal Under Ultrasonic Application Observed in Bonding of Au Compliant Microbump International conference

Keiichiro Iwanabe, Takanori Shuto, Ryo Takigawa, Tanemasa Asano

27th International Microprocesses and Nanotechnology Conference  2014.11 

Expanded Cavity Size of Room-Temperature Hermetic Sealing Using Au Compliant Rim for Microsystem Packaging International conference

Ryo Takigawa, Hiroki Kawano, Yohei Aoki, Takanori Shuto, Keiichiro Iwanabe, Tanemasa Asano

27th International Microprocesses and Nanotechnology Conference  2014.11 

Triple-Walled Gold Structures with Nano-Gaps for Non-Resonance Surface Enhanced Raman Scattering of Rhodamine 6G Molecules International conference

Tatsuya Baba, Y. Lee, Ai Ueno, Ryo Takigawa, J.-J. Delaunay, Reo Kometani, Etsuo Maeda

27th International Microprocesses and Nanotechnology Conference  2014.11 

強誘電体材料の精密機械加工によるリッジ型光導波路の検討

多喜川 良, 日暮栄治, 川西哲也, 浅野 種正

2014年度応用物理学会秋季大会学術講演会  2014.9 

先鋭バンプの超音波接合による常温接合機構の調査

青木洋平, 多喜川 良, 岩鍋圭一郎, 首藤高徳, 浅野 種正

2014年度応用物理学会秋季大会学術講演会  2014.9 

先鋭バンプの超音波接合による常温接合機構の調査

岩鍋圭一郎, 首藤高徳, 多喜川 良, 浅野 種正

2014年度応用物理学会秋季大会学術講演会  2014.9 

[招待講演]Agナノ粒子の電気泳動法によるTSVの高速埋込みの試み Invited

多喜川 良

TSV応用研究会  2014.8 

Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim International conference

Ryo Takigawa, Hiroki Kawano, takanori Shuto, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano

IEEE International Workshop on Low Temperature Bonding for 3D Integration  2014.7 

Room-Temperature Bonding using Au Compliant Rim with Ultrasonic Assist and its Application to Hermetic Sealing International conference

Ryo Takigawa, Keiichiro Iwanabe, Takanori shuto, Takayuki Takao, Tanemasa Asano

International Conference on Electronics Packaging  2014.4 

金属ナノ粒子の電気泳動によるTSVへの高速埋め込みの基礎検討

多喜川 良, 仲原清顕, 首藤　高徳, 池田 晃裕, 浅野 種正

2014年度応用物理学会春季大会学術講演会  2014.3 

金先鋭リムを用いた常温•高速封止接合技術の開発

多喜川 良, 岩鍋　圭一郎, 首藤　高徳, 高尾隆之, 浅野 種正

第28回エレクトロニクス実装学会春季講演大  2014.3 

先鋭バンプの微細化による常温CoC接合の低荷重化

青木洋平, 多喜川 良, 岩鍋圭一郎, 首藤高徳, 浅野 種正

2013年度応用物理学会九州支部学術講演会  2013.11 

Agナノ粒子の電気泳動による貫通ビアの高速埋め込み

仲原　清顕, 多喜川 良, 首藤　高徳, 池田 晃裕, 浅野 種正

2013年度応用物理学会九州支部学術講演会  2013.11 

Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim International conference

Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano

26th International Microprocesses and Nanotechnology Conference  2013.11 

[招待講演]大気中低温接合による光素子実装技術 Invited

@多喜川良

計装学会  2019.1 

LiNbO₃ /SiO₂ 常温接合界面の原子スケール解析とLiNbO₃ on Insulator/Si超高速光変調器の実証

#村上誠悟、#森友健留、山口祐也、坂本高秀、@多喜川良

第84回 応用物理学会 秋季学術講演会  2023.9 

Investigation of surface activation of Si wafer for room temperature direct bonding International conference

#Seigo Murakami and @Ryo Takigawa

36th International Microprocesses and Nanotechnology Conference (MNC 2023)  2023.11 

Room temperature bonding of InP wafers using an activated Si atomic layer International conference

#Zhang Gufei, #Murakami Seigo and @Ryo Takigawa

36th International Microprocesses and Nanotechnology Conference (MNC 2023)  2023.11 

Surface-activated wafer bonding of ALD Al2O3 ultrathin films International conference

#Kenji Uno and @Ryo Takigawa

36th International Microprocesses and Nanotechnology Conference (MNC 2023)  2023.11 

Surface activated bonding of Lithium Niobate wafers International conference

#Takeru Moritomo and @Ryo Takigawa,

36th International Microprocesses and Nanotechnology Conference (MNC 2023)  2023.11 

InP/InP室温接合界面の原子スケール解析

第38回エレクトロニクス実装学会春季講演大会  2024.3 

常温ウエハ接合によりSi上に形成された薄膜LNOI光変調器の特性評価

#村上誠悟、山口祐也、坂本高秀、@多喜川良

第38回エレクトロニクス実装学会春季講演大会  2024.3 

論文委員 International contribution

2017.11

論文委員 International contribution

2016.7

論文委員 International contribution

2015.11

異種材料集積化に向けた活性化透明極薄膜による大気中室温接合への挑戦

Grant number：21K18729  2021 - 2023

日本学術振興会  科学研究費助成事業  挑戦的研究（萌芽）

大気室温接合に向けた活性化透明中間層形成のための探索的研究

2021

QRわかばチャレンジ

科学研究費助成事業：基盤研究(B)

2020.4

日本 

低温ナノ接合界面における光学機能発現と集積フォトニクス応用

Grant number：20H02207  2020 - 2022

日本学術振興会  科学研究費助成事業  基盤研究(B)

JST A-STEP機能検証フェーズ試験研究タイプ

2019.9 - 2020.8

日本 

次世代3次元積層を見据えた極薄絶縁膜の新たな常温接合技術の確立

2019 - 2020

JST A-STEP機能検証フェーズ試験研究タイプ

低損失光導波路集積に向けた酸化物低温接合技術の開発

2019

QRわかばチャレンジ

科学研究費助成事業：挑戦的研究（萌芽）, 「異種材料光集積化に向けた大気開放・局所活性化雰囲気における常温接合の実現」

2018.6

日本 

異種材料光集積化に向けた大気開放・局所活性化雰囲気における常温接合の実現

Grant number：18K18863  2018 - 2020

日本学術振興会  科学研究費助成事業  挑戦的研究（萌芽）

科学研究費助成事業：若手研究(Ａ), 「切削加工と常温接合によるヘテロフォトニクスチップに関する研究」

2017.4

日本 

切削加工と常温接合によるヘテロフォトニクスチップに関する研究

Grant number：17H04925  2017 - 2019

科学研究費助成事業  若手研究(A)

光素子の大気中低温接合

2016

ｼｽﾃﾑ情報科学研究院・ｽﾀｰﾄｱｯﾌﾟ支援経費

科学研究費助成事業：若手研究(B), 「切削加工によるニオブ酸リチウム細線光導波路の作製」

2015.4 - 2017.3

切削加工によるニオブ酸リチウム細線光導波路の作製

Grant number：15K18055  2015 - 2016

科学研究費助成事業  若手研究(B)

科学研究費助成事業：基盤研究(A), 「低温ナノ接合界面における光電子機能創成と革新的ヘテロ集積デバイス技術基盤への展開」

日本 

電気情報工学実験Ⅰ

2022.4 - 2022.9   First semester

電気情報工学基礎実験

2022.4 - 2022.9   First semester

電気工学基礎Ⅰ･Ⅱ

2022.4 - 2022.9   First semester

実装工学特論

2021.10 - 2022.3   Second semester

信号とシステム

2021.10 - 2022.3   Second semester

実装工学特論

2020.10 - 2021.3   Second semester

電気情報工学実験Ⅱ

2020.10 - 2021.3   Second semester

電気情報工学基礎実験

2020.10 - 2021.3   Second semester

電気情報工学実験Ⅰ

2020.4 - 2020.9   First semester

電気情報工学基礎実験

2019.10 - 2020.3   Second semester

電気情報工学実験Ⅱ

2019.10 - 2020.3   Second semester

電気情報工学実験Ⅰ

2019.4 - 2019.9   First semester

電気情報工学基礎実験

2018.10 - 2019.3   Second semester

電気情報工学実験Ⅱ

2018.10 - 2019.3   Second semester

電気情報工学実験Ⅰ

2018.4 - 2018.9   First semester

電気情報工学実験Ⅱ

2017.10 - 2018.3   Second semester

電気情報工学実験Ⅱ

2017.10 - 2018.3   Second semester

電気情報工学基礎実験

2017.10 - 2018.3   Second semester

電気情報工学実験Ⅰ

2017.4 - 2017.9   First semester

電気情報工学基礎実験

2016.10 - 2017.3   Second semester

電気情報工学実験Ⅱ

2016.10 - 2017.3   Second semester

電気情報工学実験Ⅰ

2016.4 - 2016.9   First semester

電気情報工学基礎実験

2015.10 - 2016.3   Second semester

電気情報工学実験Ⅱ

2015.10 - 2016.3   Second semester

電気情報工学実験Ⅰ

2015.4 - 2015.9   First semester

電気情報工学実験Ⅱ

2014.10 - 2015.3   Second semester

電気情報工学基礎実験

2014.10 - 2015.3   Second semester

電気情報工学実験Ⅰ

2014.4 - 2014.9   First semester

電気情報工学基礎実験

2013.10 - 2014.3   Second semester

電気情報工学基礎実験

2013.10 - 2014.3   Second semester

2018.1   Role：Participation   Title：研究分析ツール「SciVal」及び研究者プロファイリングツール 「Pure」に関する説明会（応用編）

Organizer：University-wide

2017.9   Role：Participation   Title：「英語による教授能力」向上のためのFDプログラム

Organizer：University-wide