


DONG WANG | Last modified date:2023.11.28 |

Professor /
Department of Internationalization and Future Conception
Faculty of Engineering Sciences
Faculty of Engineering Sciences
Graduate School
Other Organization
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Homepage
https://kyushu-u.elsevierpure.com/en/persons/dong-wang
Reseacher Profiling Tool Kyushu University Pure
http://hyoka.ofc.kyushu-u.ac.jp/search/details/K004547/english.html
Kyushu University - Academic Staff Educational and Research Activities Database [Dong WANG (Associate Professor), Department of Internationalization and Future Conception, Faculty of Engineering Sciences ] .
https://www.gic.kyushu-u.ac.jp/functionaldevices/index_e.htm
Functional Device Engineering Laboratory, IGSES, Kyushu University .
Phone
092-583-7637
Academic Degree
PhD
Country of degree conferring institution (Overseas)
Yes Doctor
Field of Specialization
Electronic Materials Engineering, Semiconductor Materials Engineering, Optics
Total Priod of education and research career in the foreign country
02years05months
Outline Activities
After employed by Art, Science and Technology Center for Cooperative Research, he focused on the research on local-strain evaluation as well as the formation and characterization for SiGe on Insulator and Ge on Insulator.
From Feb. 2012, he worked at CAMPUS-Asia, Faculty of Engineering Sciences to promote the “Collaborative Graduate School Program for Global Human Resources Development in Energy and Environmental Science and Technology”.
From Mar. 2016, he have been affiliated to Department of Internationalization and Future Conception, Faculty of Engineering Sciences, and Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences. Besides doing research and education, he is also in charge of promoting campus globalization and international student affairs.
In recent years, he is focusing on establishment and implement of double-degree programs between IGSES and oversea institutes.
Recently, his research interest is the development of Ge-optoelectronics and Ge-CMOS related technologies.
He is a principle investigator of several scientific research funding, such as a two JSPS Grant-in-Aid (KAKENHI) for Scientific Research (B), two JSPS Grant-in-Aid (KAKENHI) for Young Scientists (B), and a Grant-in-Aid from the Marubun Research Promotion Foundation.
From Feb. 2012, he worked at CAMPUS-Asia, Faculty of Engineering Sciences to promote the “Collaborative Graduate School Program for Global Human Resources Development in Energy and Environmental Science and Technology”.
From Mar. 2016, he have been affiliated to Department of Internationalization and Future Conception, Faculty of Engineering Sciences, and Department of Applied Science for Electronics and Materials, Interdisciplinary Graduate School of Engineering Sciences. Besides doing research and education, he is also in charge of promoting campus globalization and international student affairs.
In recent years, he is focusing on establishment and implement of double-degree programs between IGSES and oversea institutes.
Recently, his research interest is the development of Ge-optoelectronics and Ge-CMOS related technologies.
He is a principle investigator of several scientific research funding, such as a two JSPS Grant-in-Aid (KAKENHI) for Scientific Research (B), two JSPS Grant-in-Aid (KAKENHI) for Young Scientists (B), and a Grant-in-Aid from the Marubun Research Promotion Foundation.
Research
Research Interests
Membership in Academic Society
- Evaluation and control of defects in group IV mixed crystals, establishment of low-temperature processes for group IV mixed crystal devices
keyword : GeSn, Defect, Low-temperature process, NIR photo detector
2021.10. - Technology development for Ge-CMOS compatible high-performance Ge-optoelectronics
keyword : Ge optoelectronics, CMOS, Functional electrical materials, Metal/Semiconductor contact, Local strain
2013.06. - Evaluation technique for crystal semiconductor thin film on insulator
keyword : SOI, SGOI, photoluminescence, DLTS
2001.12. - Strained Ge Technology
keyword : strained-Ge, strained-SiGe, MOSFET, Back-Gate MOSFET, mobility Enhancement, Interface State Density, Ge condensation by Dry Oxidation, Local Ge condensation by Dry Oxidation
2009.10. - Strained Si Technology
keyword : Strained-Si, SiGe, SOI, MOS, minority carrier generation lifetime, DLTS, Interface State, Photoluminescence
2002.10. - Study on Fabrication Process for Ge-MISFET
keyword : Ge channel, Ge On Insulator, high-k On Ge, Metal Gate, S-D formation
2007.04. - Control of heavy metal impurities in Si wafer
keyword : solar cell, Si wafer, heavy metal impurity, gettering, DLTS
2001.12~2006.03. - Formation of High-K gate-stack structure
keyword : high-k, ECR plasma, SiO2. SiON, SiN, HfO2, stack structure, metal-gate
2001.12~2008.03.
- In this research, it covers up to the mid- and long-wave infrared bands of several μm that can achieve supervisual sensing, and has excellent crystal quality for infrared photonics with a view to integration on existing Si integrated platforms. We will construct a comprehensive integrated engineering of metastable narrow-gap group IV mixed crystal semiconductors and heterostructures. Specifically, the final goal is to “prototype and verify a multi-band infrared imaging integrated device/system for mid- and long-wave infrared” with the aim of applying it to a multi-band LiDAR system that realizes excellent environmental weather resistance. We aim to explore the material science of metastable group IV mixed crystal heterostructures and the development of integrated process and device engineering.
Reports
1. | [Strained Si wafer technology for high-speed LSI] Although Si-LSI technology has achieved high-speed and low-power-consumption devices by device shrinkage, there is a possibility that the device shrinkage will encounter difficulties. Thus, next-generation LSI technology requires an alternative method of achieving high-performance devices. A strained Si/SiGe heterostructure has a large potential, because Si on strain-relaxed SiGe receives tensile strain, causing the enhancement of carrier mobility. We have demonstrated a 200 mm strained-Si wafer fabrication technique. In this report, we introduce this fabrication technique and the electrical properties of the fabricated wafer. A test circuit was also fabricated to characterize the quality of the strained Si wafer. In addition, we introduce a technique of enhancing the strain relaxation of a SiGe virtual substrate on SiO2. , [URL]. |
Papers
Presentations
- The Japan Society of Applied Physics
Educational
Educational Activities
From 2012, he has worked for an international education program, CAMPUS-Asia EEST. Besides the establishment of a double degree system in Master Course among KU, SJTU, and PNU, he has also given lectures taught in English, such as a compulsory subject and Summer School subjects of CAMPUS-Asia EEST, and a common course in IGSES.
From 2016, he became in charge of international student affairs in IGSES. Besides promoting the CAMPUS-Asia EEST, he also works as the advisor of KU IGSES international student association (KIISA). In recent years, he is focusing on establishment and implement of double-degree programs between IGSES and oversea institutes. He also concurrently serves as a teacher of KU International Student Center.
Other Educational Activities
From 2016, he became in charge of international student affairs in IGSES. Besides promoting the CAMPUS-Asia EEST, he also works as the advisor of KU IGSES international student association (KIISA). In recent years, he is focusing on establishment and implement of double-degree programs between IGSES and oversea institutes. He also concurrently serves as a teacher of KU International Student Center.
- 2023.03.
- 2022.08.
- 2021.11.
- 2021.08.
- 2020.08.
- 2019.12.
- 2019.09.
- 2019.08.
- 2019.01.
- 2018.10.
- 2018.09.
- 2018.08.
- 2018.08.
- 2018.03.
- 2017.09.
- 2017.08.
- 2017.03.
- 2016.12.
- 2016.12.
- 2016.12.
- 2016.09.
- 2016.08.
- 2016.03.
- 2015.09.
- 2015.08.
- 2015.03.
- 2014.12.
- 2014.09.
- 2014.08.
- 2013.09.
- 2013.08.
- 2012.09.
- 2012.08.


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