Kyushu University Academic Staff Educational and Research Activities Database
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Takigawa Ryo Last modified date:2020.10.09



Graduate School
Undergraduate School


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Homepage
https://kyushu-u.pure.elsevier.com/en/persons/ryo-takigawa
 Reseacher Profiling Tool Kyushu University Pure
Phone
092-802-3740
Fax
092-802-3740
Academic Degree
Ph.D
Country of degree conferring institution (Overseas)
No
Field of Specialization
Electronics and Photonics packaging, Room-temperature bonding, 3D hetero-integration, MEMS packaging, 3D microsensor
Total Priod of education and research career in the foreign country
00years00months
Research
Research Interests
  • ・Packaging
    ・Room-temperature bonding
    ・3D integration/stacking
    ・Hetero integration
    ・3D MEMS device
    keyword : ・Packaging ・Room-temperature bonding ・3D integration ・Hetero integration ・3D Photonics and Optical MEMS
    2013.04.
Academic Activities
Papers
1. Ryo Takigawa, Michitaka Yamamoto, Eiji Higurashi, Tanemasa Asano, Haruichi Kanaya, Demonstration of GaN/LiNbO3 hybrid wafer using room-temperature surface activated bonding, ECS Journal of Solid State Science and Technology, 9, 3, 045005, 2020.04.
2. Ryo Takigawa, Jun Utsumi, Direct bonding of LiNbO3 and SiC wafers at room temperature, Scripta Materialia, 174, 58-61, 2020.01.
3. Ryo Takigawa, Keigo Kamimura, Keiichi Nakamoto, Toru Tomimatsu, and Tanemasa Asano, Fabrication of bonded LNOI waveguide structure on Si substrate using ultra-precision cutting, Japanese Journal of Applied Physics, 59, SBBD03-1-SBBD03-4, 2020.01.
4. Ryo Takigawa, Eiji Higurashi, Tanemasa Asano, Ultrathin adhesivelayer between LiNbO3 and SiO2 for bonded LNOI waveguide, Japanese Journal of Applied Physics, 58, SJJE06-1-SJJE06-5, 2019.08.
5. Ryo Takigawa, Toru Tomimatsu, Eiji Higurashi, and Tanamasa Asano, Residual stress in Lithium Niobate film layer of LNOI/Si hybrid wafer fabricated using low-temperature bonding method, MICROMACHINES, 10, 2, 136, 2019.02.
6. Ryo Takigawa and Tanemasa Asano, Thin-film lithium niobate-on-insulator waveguides fabricated on silicon wafer by room-temperature bonding method with silicon nanoadhesive layer, Optics Express, 26, 19, 24413-24421, 2018.09, Lithium niobate-on-insulator (LNOI) waveguides fabricated on a silicon wafer using a room-temperature bonding method have potential application as Si-based high-density photonic integrated circuits. A surface-activated bonding method using a Si nanoadhesive layer was found to produce a strong bond between LN and SiO2/Si at room temperature, which is sufficient to withstand both the wafer-thinning (LN thickness <5 μm) and surface micromachining processes used to form the strongly confined waveguides. In addition, the bond quality and optical propagation characteristics of the resulting LNOI waveguides were investigated, and the applicability of this bonding method to low-loss LNOI waveguide fabrication is discussed. The propagation loss for the ridged waveguide was approximately 2 dB/cm at a wavelength of 1550 nm, which was sufficiently low for device application. The results of the present study will be of significant use in the development of fabrication techniques for waveguides with any bonded materials using this room-temperature bonding method and not only LN core/SiO2 cladding waveguides..
7. Hirofumi Nogami, Wataru Iwasaki, Nobutomo Morita and Ryo Takigawa, Relationship between AC/DC Ratio and Light-blocking Structure for Reflective Photoplethysmographic Sensor, Sensors and Materials, 30, 12, 3021, 2018.12.
8. Ryo Takigawa, Eiji Higurashi, Tanemasa Asano, Surface Activated Bonding of LiNbO3 and GaN at Room Temperature, ECS transactions, 86, 5, 207-213, 2018.07.
9. Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano, Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim, Sensors and Materials, 30, 12, 2897, 2018.12.
10. Toru Tomimatsu, and Ryo Takigawa, Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3, Sensors and Materials, 30, 12, 2881, 2018.12.
11. Ryo Takigawa, Eiji Higurashi, Tanemasa Asano, Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method, Japanese Journal of Applied Physics, 57, 2018.05.
12. Toru Tomimatsu, Ryo Takigawa, Correlation between the local stress and the grain misorientation in the polycrystalline Al2O3 measured by near-field luminescence spectroscopy, Japanese Journal of Applied Physics, 57, 2018.05.
13. Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi, Room-temperature transfer bonding of lithium niobate thin film on micromachined silicon substrate with Au microbumps, Sensors & Actuators: A. Physical, 264, 1, 274-281, 2017.08.
14. Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano, Investigation of the interface between LiNbO3 and Si wafers bonded by laser irradiation, JAPANESE JOURNAL OF APPLIED PHYSICS, 56, 088002-1-088002-3, 2017.07.
15. Ryo Takigawa, Eiji Higurashi, Tetsuya Kawanishi, Tanemasa Asano, Demonstration of ultraprecision ductile-mode cutting for lithium niobate microring waveguides, JAPANESE JOURNAL OF APPLIED PHYSICS, 10.7567/JJAP.55.110304, 55, 11, 2016.11.
16. Hiroki Kawano, Ryo Takigawa, Hiroshi Ikenoue, Tanemasa Asano, Bonding of lithium niobate to silicon in ambient air using laser irradiation, JAPANESE JOURNAL OF APPLIED PHYSICS, 10.7567/JJAP.55.08RB09, 55, 8, 2016.08.
17. Tatsuya Baba, Yaerim Lee, Ai Ueno, Reo Kometani, Etsuo Maeda, Ryo Takigawa, Triple-walled gold surfaces with small-gaps for nonresonance surface enhanced Raman scattering of rhodamine 6G molecules, Journal of Vacuum Science & Technology B, 34, 011802-1-011802-4, 2016.01.
18. Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano, High-speed via hole filling using electrophoresis of Ag nanoparticles, IEEE 3D-IC, TS5.4.1-TS5.4.4, 2015.09.
19. Ryo Takigawa, Eiji HIgurashi, Tetsuya Kawanishi, Tanemasa Asano, Lithium niobate ridged waveguides with smooth vertical sidewalls fabricated by an ultra-precision cutting method, Optics Express, 10.1364/OE.22.027733, 22, 22, 27733-27738, 2014.11.
20. Linghan, Li, Takigawa Ryo, Akio Higo, Eiji Higurashi, Masakazu Sugiyama, Bingyao Liu, Yoshiaki Nakano, Electrical pumping Fabry-Perot lasing of a III-V layer on a highly doped silicon micro rib, LASER PHYSICS LETTERS, 11, 11, 115807, 2014.11.
21. Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano, Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim
, JAPANESE JOURNAL OF APPLIED PHYSICS, 53, 06JM05, 2014.05.
22. Toshihiro Kamei, Keiko Sumitomo, Sachiko Ito, Ryo Takigawa, Tsujimura Noriyuki, Hisayuki Kato, Takeshi Kobayashi, Ryutaro Maeda, Heterogeneously integrated laser-induced fluorescence detection devices: Integration of an excitation source, JAPANESE JOURNAL OF APPLIED PHYSICS, 10.7567/JJAP.53.06JL02, 53, 6, 2014.06.
23. Yuichi Kurashima, Atsuhiko Maeda, Takigawa Ryo, Hideki Takagi, Room temperature bonding of metal films using flattening by thermal imprint process, Microelectronic Engineering, 112, 52-56, 2013.12.
24. Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi, Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates, OPTICS EXPRESS, 10.1364/OE.19.015739, 19, 17, 15739-15749, 2011.08.
25. Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi, Passive Alignment and Mounting of LiNbO3 Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au, IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 10.1109/JSTQE.2010.2093871, 17, 3, 652-658, 2011.05.
26. Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air, APPLIED PHYSICS EXPRESS, 10.1143/APEX.1.112201, 1, 11, 2008.11.
27. Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi, Low-temperature Au-to-Au bonding for LiNbO3/Si structure achieved in ambient air, IEICE TRANSACTIONS ON ELECTRONICS, 10.1093/ietele/e90-c.1.145, E90C, 1, 145-146, 2007.01.
Presentations
1. Ryo Takigawa, [Invited]Demonstration of strongly confined optical waveguides using ultra-precision ductile-mode cutting, The 5th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging, 2017.03.
2. Kohei Nitta, Ryo Takigawa, A. Ikeda, M. Kumazawa, T. Hirai, M. Komatsu, Tanemasa Asano, Electroless Ni Plating of Seed Film of Electrophoresis of Ag Nanoparticles, 29th International Microprocesses and Nanotechnology Conference (MNC2016), 2016.11.
3. Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano, LiNbO3/Si Hybrid Wafer Bonded in Ambient Air Using Laser Irradiation, 29th International Microprocesses and Nanotechnology Conference (MNC2016), 2016.11.
4. Ryo Takigawa, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano, High-speed via filling using electrophoresis of Ag nanoparticles, INC11, 2015.05.
5. Keiichiro Iwanabe, Takanori Shuto, Ryo Takigawa, Tanemasa Asano, Softening of Metal Under Ultrasonic Application Observed in Bonding of Au Compliant Microbump, 27th International Microprocesses and Nanotechnology Conference, 2014.11.
6. Tatsuya Baba, Y. Lee, Ai Ueno, Ryo Takigawa, J.-J. Delaunay, Reo Kometani, Etsuo Maeda, Triple-Walled Gold Structures with Nano-Gaps for Non-Resonance Surface Enhanced Raman Scattering of Rhodamine 6G Molecules, 27th International Microprocesses and Nanotechnology Conference, 2014.11.
7. Ryo Takigawa, Hiroki Kawano, Yohei Aoki, Takanori Shuto, Keiichiro Iwanabe, Tanemasa Asano, Expanded Cavity Size of Room-Temperature Hermetic Sealing Using Au Compliant Rim for Microsystem Packaging, 27th International Microprocesses and Nanotechnology Conference, 2014.11.
8. Ryo Takigawa, Hiroki Kawano, takanori Shuto, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano, Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim, IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2014.07.
9. Ryo Takigawa, Keiichiro Iwanabe, Takanori shuto, Takayuki Takao, Tanemasa Asano, Room-Temperature Bonding using Au Compliant Rim with Ultrasonic Assist and its Application to Hermetic Sealing, International Conference on Electronics Packaging, 2014.04.
10. Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano, Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim
, 26th International Microprocesses and Nanotechnology Conference, 2013.11.