| 1. |
Yuma Kurihara, Ryo Takigawa, Fumihiro Sassa and Yusuke Tahara, DEVELOPMENT OF MICROFLUIDIC-BASED TASTE SENSOR WITH LIPID POLYMER MEMBRANE, 34rd International Microprocesses and Nanotechnology Conference (MNC 2021), 2021.10. |
| 2. |
Takumi Hiejima, Hirofumi Nogami , Aya Saito ,Kazuyuki Ban, Ryo Takigawa and Jumpei Arata, Non-invasive heart rate measurement system using Laser doppler flowmetry with body motion artifact noise reduction algorithm for Husbandry training, 34rd International Microprocesses and Nanotechnology Conference (MNC 2021), 2021.10. |
| 3. |
Y Fan, T Maekawa, K Watanabe, R Takigawa, Fabrication of InP/SiC structure using surface activated direct bonding, 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021), 2021.10. |
| 4. |
Kaname Watanabe, Yuya Yamaguchi, Kannno Atsushi, Ryo Takigawa, LNOI photonics fabricated on Si wafer by room temperature bonding, 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021) , 2021.10. |
| 5. |
Ryo Takigawa, [Invited]Demonstration of strongly confined optical waveguides using ultra-precision ductile-mode cutting, The 5th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging, 2017.03. |
| 6. |
Kohei Nitta, Ryo Takigawa, A. Ikeda, M. Kumazawa, T. Hirai, M. Komatsu, Tanemasa Asano, Electroless Ni Plating of Seed Film of Electrophoresis of Ag Nanoparticles, 29th International Microprocesses and Nanotechnology Conference (MNC2016), 2016.11. |
| 7. |
Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, Tanemasa Asano, LiNbO3/Si Hybrid Wafer Bonded in Ambient Air Using Laser Irradiation, 29th International Microprocesses and Nanotechnology Conference (MNC2016), 2016.11. |
| 8. |
Ryo Takigawa, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano, High-speed via filling using electrophoresis of Ag nanoparticles, INC11, 2015.05. |
| 9. |
Keiichiro Iwanabe, Takanori Shuto, Ryo Takigawa, Tanemasa Asano, Softening of Metal Under Ultrasonic Application Observed in Bonding of Au Compliant Microbump, 27th International Microprocesses and Nanotechnology Conference, 2014.11. |
| 10. |
Tatsuya Baba, Y. Lee, Ai Ueno, Ryo Takigawa, J.-J. Delaunay, Reo Kometani, Etsuo Maeda, Triple-Walled Gold Structures with Nano-Gaps for Non-Resonance Surface Enhanced Raman Scattering of Rhodamine 6G Molecules, 27th International Microprocesses and Nanotechnology Conference, 2014.11. |
| 11. |
Ryo Takigawa, Hiroki Kawano, Yohei Aoki, Takanori Shuto, Keiichiro Iwanabe, Tanemasa Asano, Expanded Cavity Size of Room-Temperature Hermetic Sealing Using Au Compliant Rim for Microsystem Packaging, 27th International Microprocesses and Nanotechnology Conference, 2014.11. |
| 12. |
Ryo Takigawa, Hiroki Kawano, takanori Shuto, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano, Room-temperature vacuum packaging using ultrasonic bonding with Cu compliant rim, IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2014.07. |
| 13. |
Ryo Takigawa, Keiichiro Iwanabe, Takanori shuto, Takayuki Takao, Tanemasa Asano, Room-Temperature Bonding using Au Compliant Rim with Ultrasonic Assist and its Application to Hermetic Sealing, International Conference on Electronics Packaging, 2014.04. |
| 14. |
Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano, Room-temperature hermetic sealing using ultrasonic bonding with Au compliant rim
, 26th International Microprocesses and Nanotechnology Conference, 2013.11. |
