1. |
Eiji Kume, Hiroyuki Ishii, Hiroyuki Hattori, Wen-Hsin Chang, Mutsuo Ogura, Haruich Kanaya, Tanemasa Asano, Tatsuro Maeda, InAs MOS-HEMT power detector for 1.0 THz on quartz glass, 2017 IEEE Electron Devices Technology and Manufacturing Conference, 2017.03. |
2. |
Akihiro Ikeda, Daichi Marui, Rikuho Sumina, Hiroshi Ikenoue, Tanemasa Asano, Increased Doping Depth of Al in Wet-chemical Laser Doping of 4H-SiC by Expanding Laser Puls, 7th International Symposium on Control of Semiconductor Interfaces and International SiGe Technology and Device Meeting 2016, 2016.06. |
3. |
Akihiro Ikeda, Rikuho Sumina, Ryota Tsutsui, Hiroshi Ikenoue, Tanemasa Asano, Low Cost Fabrication of 4H-SiC Junction Barrier Schottky Diode Using Excimer-Laser Doping from Molten Al, 2016 42nd International Conference on Micro and Nano Engineering, 2016.09. |
4. |
Akihiro Ikeda, Ryota Tsutsui, Rikuho Sumina, Hiroshi Ikenoue, Tanemasa Asano, Effects of Substrate Heating on Al Doping Performed by Irradiating Laser Beam to Al Film on 4H-SiC, 2016 European Conference on Silicon Carbide & Related Materials, 2016.09. |
5. |
Li Li, Akihiro Ikeda, Tanemasa Asano, Enhanced Oxidation of 4H-SiC Using SrTi1-xMgxO3-δ Catalyst, 2016 European Conference on Silicon Carbide & Related Materials, 2016.09. |
6. |
Li Li, Akihiro Ikeda, Tanemasa Asano, Enhanced thermal oxidation using SrTi_{1-x}Mg_{x}O_{3-d} catalyst and its application to 4H-SiC, 2016 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices, 2016.07. |
7. |
Kyosuke Sekiguchi, Yuichi Mukai, Yuki Miyaji, Akihiro Ikeda, Haruichi Kanaya, Tanemasa Asano, Investigation of sensitivity of square-law detectors for radio wave imaging, 2016 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices, 2016.07. |
8. |
Rikuho Sumina, Akihiro Ikeda, Hiroshi Ikenoue, Tanemasa Asano, Thickness dependence of doping characateristic in Al doping into 4H-SiC by laser irradiation to deposited Al film, 2016 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices, 2016.07. |
9. |
Tanemasa Asano, 3D Integration Technology - Past, Present, and Future-, 2016 Asia-Pacific Workshop on Fundamentals and Application of Advanced Semiconductor Devices, 2016.07. |
10. |
Kenichi Nakadozono, Keiichiro Iwanabe, Tanemasa Asano, Sensing Local Dynamic Strain and Temperature Evolution During Ultrasonic Bonding of Microbumps, 2016 6th Electronic System-Integration Technology Conference, 2016.09. |
11. |
Li Li, A. Ikeda, Tanemasa Asano, Enhanced Thermal Oxidation of 4H-SiC Using SrTi_{1-x}Mg_{x]O_{3-delta} Catalyst, 27th International Microprocesses and Nanotechnology Conference, 2016.09. |
12. |
Keiichiro Iwanabe, Kenichi Nakadozono, Tanemasa Asano, Dynamics of Ultrasonic Cu Ball Bonding Measured in-situ by Using Piezoresistive Linear Array Sensors, 2016 Int'l. Conf. Solid State Devices and Materials, 2016.09. |
13. |
Keiichiro Iwanabe, Kenichi Nakadozono, Yosuke Senda, Tanemasa Asano, In-situ Strain Measurement of Ultrasonic Ball Bonding, 2016 6th Electronic System-Integration Technology Conference, 2016.09. |