|Terutake Hayashi||Last modified date：2021.06.14|
Associate Professor / Manufacturing Processes / Department of Mechanical Engineering / Faculty of Engineering
|Terutake Hayashi||Last modified date：2021.06.14|
|1.||Jiaqing Zhu, Terutake Hayashi, Syuhei Kurokawa, Study on particle size distribution measurement using nanoparticle micro array
, nternational Symposium on Measurement Technology and Intelligent Instruments, 2020.07, Nanoparticle is widely used in industrial production, such as biological sensor, pigment and slurry in CMP (Chemical Mechanical Polishing). Particle size distribution is used in the quality evaluation of nanoparticle. It is important to measure the particle size distribution of primary particle for the mixture solution of both primary and secondary particle. Image analysis method is able to accurately measure the geometric diameter of primary particle, even though secondary particle is present in solution. It is able to solve the problem that the result of DLS (Dynamic Light Scattering) is unreliable when secondary particle is present in solution. It is necessary that it takes a lot of time to observe thousands of particles. The aggregation of particles is also a problem during sample preparation from solution. It causes that it is difficult to confirm the presence of secondary particle in the solution. In this research, in order to accurately measure average diameter of primary particle and classify types of particle as primary particle or secondary particle, we suggest a new sample preparation method that called “nanoparticle micro array”. In this method, first nanoparticles are uniformly dispersed in solution. Then these nanoparticles are sampled one by one from the solution and arranged on silicon wafer in a high density and uniformly-spaced position. After the solution was evaporated, the sample is observed by SEM (Scanning Electron Microscope)/AFM (Atomic Force Microscope). And the geometric diameter of primary particle is measured from the SEM/AFM image. In this report, in order to verify the feasibility of particle characterization using “nanoparticle micro array”, we performed a fundamental experiment to classify particles and measure primary particle size distribution on a nanoparticle chip..
|2.||Terutake Hayashi, Yuki Hirotsu, Syuhei Kurokawa, Keigo Matsunaga, Noboru Hasegawa,Masaharu Nishikino, Double pulse laser processing for carbon coated SiO2 target using near IR beam, Optics & Photonics International Congresss 2019, 2019.04.|
|3.||Terutake Hayashi, Syuhei KUROKAWA and Zhu Jiaqing, A novel nano particle characterizing method using nano particle micro array, International conference on precision engineering 2018 , 2018.11.|
|4.||Keigo MATSUNAGA, Terutake HAYASHI, Syuhei KUROKAWA, Hideaki YOKOO, Noboru HASEGAWA, Masuhara NISHIKINO, Yoji MATSUKAWA, Dynamics of photo-excitation for the ablation of 4H-SiC substrate using femtosecond laser, the 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 2017.11.|
|5.||林 照剛, Particle Size Distribution Analysis for Nano-abrasives in CMP Slurry by Using Fluorescent Nano Probe, International Conference on Planarization/CMP Technology (ICPT2016), 2016.10.|
|6.||Terutake Hayashi, Study on low power laser processing technique with instant surface excitation using femtosecond double pulse, 16th International conference of Precision Engineering , 2016.11.|
|7.||林 照剛, Investigation of surface excitation effect for ablation of 4H-SiC substrate using double-pulse beam, ICXRL 2016, 2017.05.|
|8.||Takayuki Shibata, Goh Miyazaki, Terutake Hayashi, Moeto Nagai, Hollow-Nanoneedle-Based AFM Probe for Electrokinetic Intracellular Delivery and Intracellular TERS Imaging, 41st international conference on micro- and nanofabrication and manufacturing using lithography and related techniques, 2015.09.|
|9.||Masashi Kitamura, Syuhei Kurokawa, Terutake Hayashi, Yuta Tokumoto, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh, Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet, 2015 International Conference on Planarization/CMP Technology (2015 ICPT), 2015.09.|
|10.||Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, Brownian diffusion analysis for nano-abrasives in CMP slurry by using fluorescence polarization method, 2015 International Conference on Planarization/CMP Technology (2015 ICPT), 2015.09.|
|11.||Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, A novel measurement method for Brownian diffusion of nano-abrasives in CMP slurry, 12th International Symposium on Measurement Technology and Intelligent Instruments, 2015.09.|
|12.||Terutake Hayashi, Toshiki Seri, Syuhei Kurokawa, A study on fluorescence polarization method for analyzing diffusional movement of abrasive grain in CMP slurry , The 8th International Conference on Leading Edge Manufacturing in 21st Century, 2015.10.|
|13.||Syuhei Kurokawa, Terutake Hayashi, Processing Characteristics of SiC Wafer by Consideration of Oxidization Effect in Different Atomospheric Environment, International Conference on Planarization/CMP Technology, 2014.11.|
|14.||林 照剛, Development of gear measuring machine for whole scanning method of cylindrical gear outline and evaluation of tooth root and toot profile deviation
, The 18th International Conference On Mechatronics Technology, 2014.10, Measurement of tooth root and bottom profiles is very important to analyze bending fatigue of gear teeth. But, it is hard to measure those profiles with a conventional Gear Measuring Machine (GMM), because tooth root and bottom consists of free-formed surface and a conventional GMM is equipped with a probe to measure only one-axis displacement. Therefore the authors try to develop a new GMM which can accurately measure not only working flanks but also tooth root and bottom profiles by installing a 3D scanning probe, which results in multiple functions and time reduction measurement.
A new method for measurement is adopted into the developed GMM by scanning the whole shape of a gear outline without detaching a stylus tip from a gear surface in order to obtain the measuring data of whole gear outline including tooth flanks, tip, root and bottom profiles. The measured data are used to evaluate geometrically tooth root and profile deviations. The proposed method is verified by comparing the profile deviations with those measured by a conventional GMM.
|15.||Terutake Hayashi, Syuhei Kurokawa, Study on diffusion coefficient evaluation for free abrasives and chemicals by using fluorescent anisotropy analysis, The 18th International Conference On Mechatronics Technology, 2014.10, CMP (Chemical Mechanical Polishing/ Planarization) for semiconductor production has become increasingly important to integrate the multi-layer circuits. CMP is a process of smoothing wafers surface with the both chemical reaction in slurry and mechanical polishing by using polishing pad and abrasives. In this research, we aim at the high-efficiency and high quality CMP of semiconductor wafer. We investigate fundamental property of CMP process in the aspect of polishing and alternation based on observing the diffusion of abrasive and chemicals. We consider the translational diffusion is related to the frequency of the contact for the free abrasives and chemicals on the surface of the material. Thus, the translational diffusion coefficient is considered to be related the change of the surface integrity and the material processing properties, such as removal rate, surface roughness, and flatness. In this paper, we suggest a novel measurement method for the translational diffusion coefficient based on the measurement of the fluidity of the slurry. The fluidity of slurry is measured by using fluorescence anisotropy analysis. We develop a system for measuring fluidity of slurry by using a fluorescent probe. The fundamental experiments are performed to verify the feasibility of the proposed method..|
|16.||Terutake Hayashi, Study on nanoparticle sizing using fluorescent polarization method with DNA fluorescent probe, 11th Laser Metrology for Precision Measurement and Inspection in Industry 2014, 2014.09, A fluorescent polarization method is well known for the detection of complementary base pairing of DNA in biological field. The fluorescent polarization method (FP) measures the rotational diffusion coefficient of Brownian motion of the fluorescent particle in the solution. The rotational diffusion coefficient is corresponding to inverse third power of diameter due to the Einstein Stokes Relation for nanoparticle as hard sphere.
We develop a novel rotational diffusion coefficient measurement method by using a fluorescent probe with DNA spacer, which is connected to particle. We investigate the relation between the gold nanoparticle and the fluorescent probe in order to verify the feasibility of the proposed method. The rotational diffusion coefficients of gold nanoparticles, whose diameters are from 5 nm to 20 nm, are evaluated by using the developed system. In this paper we describe the method of fluorescent polarization method by using fluorescent DNA probe (fl-DNA).
|17.||Terutake Hayashi, Surface Processing Using a Femtosecond Pulse Train Beam, The 15th International Conference on Precision Engineering (2014) , 2014.07, The coherent phonon is a synchronous phonon oscillation for multiple phonons. It is excited by the interaction of electrons and high latitude electric field1). We propose a novel surface processing method with excitation of coherent phonon by using pulse train beam. It is considered that the surface processing during coherent phonon oscillation enables to improve the processing rate of the femto second laser, because the phonon resonance causes nonlinear increase of the lattice temperature and electron temperature. In ultrafast time domain, the laser processing with little heat diffusion and little thermal damage could be achieved by using repetitive exposure of femto second pulse by using pulse train beam before dumping of the lattice vibration and losing the energy of oscillation as a thermal diffusion. In this paper, we report the fundamental experiment to investigate the processing property of femto pulse train beam as compared to femto second single pulse..|